CN103687450B - Wiring board heat transfer for aeronautical product optimizes module - Google Patents
Wiring board heat transfer for aeronautical product optimizes module Download PDFInfo
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- CN103687450B CN103687450B CN201310683766.XA CN201310683766A CN103687450B CN 103687450 B CN103687450 B CN 103687450B CN 201310683766 A CN201310683766 A CN 201310683766A CN 103687450 B CN103687450 B CN 103687450B
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Abstract
There is provided a kind of wiring board heat transfer for aeronautical product to optimize module, between high-power high heater members and pcb board, be provided with heat-conducting plate.The present invention directly increases by one piece of heat-conducting plate on pcb board, considerably increase area of dissipation, in the middle of high-power high heater members and aluminum heat conducting plate, add soft silica gel conducting strip simultaneously, to eliminate air gap, reduce the contact heat resistance between device and aluminum heat conducting plate, the heat that device is produced passes to rapidly on aluminum heat conducting plate; Aluminum heat conducting plate top increases the T-shaped structure in a heat conduction and radiation heat transfer face, and the upper surface of T-type structure connects as one with box sealing lid after installing soft silica gel conducting strip additional, effectively conducts heat to tank surface, adds area of dissipation; Adopt wedge shape hold-down mechanism, increase the contact area of aluminum heat conducting plate and casing, effectively achieve heat transfer, reduce electronic device surface temperature fast, raising product useful life.
Description
Technical field
The invention belongs to aeronautical product thermal design technical field, be specifically related to a kind of wiring board heat transfer for aeronautical product and optimize module.
Background technology
Along with the development of electronic product and the continuous enhancing of each subsystem integrated level, system power dissipation constantly increases, and box volume constantly reduces, and causes wiring board device to generate heat and continues to increase, the direct usefulness affecting device, thus cause the reduction of life of product, reliability.In addition, because airborne aeronautical product high ambient temperatures General Requirements is at 70 DEG C, and product box interior temperature is far away higher than ambient temperature, and temperature is constantly increased along with the accumulation of operating time, if can not be shed by product box interior temperature fast, function and the performance of product directly will be affected.Current existing large power supply wiring board heat radiation is mainly through realizing with under type: one is nature cooling means, is cooled by the combination of the dry independent role or two or more heat exchange form that realize free convection and radiation heat transfer; Two is direct liquid cooling methods, electronic component is made to be immersed in the liquid of not influential system electrical operation, by conduction and convection, heat is directly passed to liquid, be applicable to the higher electronic devices and components of volumetric power density or parts, be also applicable to those and must work under high ambient conditions and the very little again parts of temperature gradient between components and parts and cooled surface; Three is evaporating and cooling methods, and liquid boiling is produced steam and releases heat by the heat that electronic component dissipates, and is applicable to the very high components and parts of volumetric power density or parts; Four is thermoelectric cooling methods, the change of potential energy when crossing semiconductor node by carrier flow and the energy transferring caused, and is applicable to not need exterior power and the Refrigeration Technique producing negative thermal resistance; Five is hot pipe techniques, owing to have employed phase-change heat transfer, is therefore the heat-transfer device that a kind of heat transfer efficiency is very high, and when heat pipe uses, key reduces the thermal resistance on the contact interface of two ends.Current airborne aeronautical product constantly requires miniaturization, lightweight, anti-high and low-temp, wet-heat resisting and high strength, this just determines cabinet and is necessary for sealed machine box, natural wind cooling, directly the realizability difference of liquid cools, evaporating and cooling method, thermoelectric cooling method and hot pipe technique cooling means maybe can not meet heat radiation needs, are therefore necessary to improve.
Summary of the invention
The technical problem that the present invention solves: provide a kind of wiring board heat transfer for aeronautical product to optimize module, object reduces high heater members surface temperature, thus reduce box house ambient temperature, improves Product environment adaptability, extends life of product.
The technical solution used in the present invention: the wiring board heat transfer for aeronautical product optimizes module, is provided with heat-conducting plate between high-power high heater members and pcb board.
Wherein, described heat-conducting plate is made up of insulating barrier, aluminum heat conducting plate and wedge shape hold-down mechanism, described aluminum heat conducting plate is arranged on pcb board upper end and is provided with the insulating barrier of isolation pcb board and aluminum heat conducting plate between the two, described aluminum heat conducting plate reserves the circular hole installing high-power high heater members according to pcb board pad locations, the pin of described high-power high heater members is arranged on pcb board by circular hole, and described wedge shape hold-down mechanism is set directly at upper surface, aluminum heat conducting plate both sides to be played and lock and conduction of heat with casing.
Further, be also provided with between described high-power high heater members and aluminum heat conducting plate and can increase heat conducting soft silica gel conducting strip.
Wherein, described wedge shape hold-down mechanism is made up of screw rod, upper wedge shape part, middle wedge shape part and lower wedge shape part, vee is formed between described upper wedge shape part and lower wedge shape part, described middle wedge shape part is inverted triangle and includes in vee, and screw rod screws through upper wedge shape part, middle wedge shape part and the lower wedge shape part that is fixed on aluminum heat conducting plate upper surface and is integrated.
Further, the T-shaped structure in top of described aluminum heat conducting plate, and the upper surface of T-type structure connects as one with box sealing lid after installing soft silica gel conducting strip additional.
Further, the position that described aluminum heat conducting plate upper surface does not arrange high-power high heater members is shaped with multiple " work " type radiator.
The present invention's advantage compared with prior art:
1, the present invention directly increases by one piece of heat-conducting plate on pcb board, and considerably increasing area of dissipation, is a kind of heat dissipating method of mixing heat-exchange;
2, add soft silica gel conducting strip in the middle of high-power high heater members of the present invention and aluminum heat conducting plate, to eliminate air gap, reduce the contact heat resistance between device and aluminum heat conducting plate further, the heat that device is produced passes to rapidly on aluminum heat conducting plate;
3, the present invention increases the T-shaped structure in a heat conduction and radiation heat transfer face at aluminum heat conducting plate top, and the upper surface of T-type structure connects as one with box sealing lid after installing soft silica gel conducting strip additional, effectively conduct heat to tank surface, add area of dissipation;
4, the installation of the present invention to pcb board tightens up and has carried out Curve guide impeller, for making aluminum heat conducting plate and cabinet wall close contact, junction between aluminum heat conducting plate and cabinet wall is optimized, and adopt wedge shape hold-down mechanism, increase the contact area of aluminum heat conducting plate and casing, effectively achieve heat transfer;
5, by using FLOTHERM thermal analyses simulation software to carry out simulation analysis to the heat conduction conduction device of optimal design under box house high temperature 85 DEG C of conditions, Finite Volume Method for Air is utilized to carry out fluid calculation, can obtain thermo parameters method cloud atlas, high-power high heater members surface temperature is the highest is no more than 87 DEG C;
6, aluminum heat conducting plate design and optimize to temperature rise control have reasonable improvement, improve the reliability of electronic equipment;
7, " work " type radiator designed on aluminum heat conducting plate, is conducive to thermal radiation, reduces electronic device surface temperature fast;
8, relative to not installing aluminum heat conducting plate additional, between aluminum heat conducting plate and high-power high heater members, do not install soft silica gel conducting strip or the inadequate heat exchange pattern of heat transfer area additional, substantially improve device ambient temperature, improve the useful life of electronic device.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is end view of the present invention;
Fig. 3 is aluminum heat conducting plate structural representation of the present invention;
Fig. 4 is that wedge shape of the present invention compresses mechanism structure schematic diagram;
Fig. 5 is wedge shape hold-down mechanism of the present invention structural representation when contacting with casing.
Embodiment
Below in conjunction with accompanying drawing 1-5, a kind of embodiment of the present invention is described.
Wiring board heat transfer for aeronautical product optimizes module, between high-power high heater members 1 and pcb board 2, be provided with heat-conducting plate 3.Described heat-conducting plate 3 is made up of insulating barrier 4, aluminum heat conducting plate 5 and wedge shape hold-down mechanism 7, concrete, described wedge shape hold-down mechanism 7 is made up of screw rod 12, upper wedge shape part 13, middle wedge shape part 14 and lower wedge shape part 15, vee is formed between described upper wedge shape part 13 and lower wedge shape part 15, described middle wedge shape part 14 is in inverted triangle and include in vee, and screw rod 12 to screw with the lower wedge shape part 15 being fixed on aluminum heat conducting plate 5 upper surface through upper wedge shape part 13, middle wedge shape part 14 and is integrated.Described aluminum heat conducting plate 5 is arranged on pcb board 2 upper end and is provided with the insulating barrier 4 of conductivity between isolation pcb board 2 and aluminum heat conducting plate 5 between the two, described aluminum heat conducting plate 5 reserves the circular hole 8 installing high-power high heater members 1 according to pcb board 2 pad locations, the pin of described high-power high heater members 1 is arranged on pcb board 2 by circular hole 8, and described wedge shape hold-down mechanism 7 is set directly at upper surface, aluminum heat conducting plate 5 both sides to be played and lock and conduction of heat with casing 9.Also be provided with between described high-power high heater members 1 and aluminum heat conducting plate 5 and can increase heat conducting soft silica gel conducting strip 6.The T-shaped structure in top 10 of described aluminum heat conducting plate 5, and the upper surface 11 of T-type structure connects as one with casing 9 seal cover after installing soft silica gel conducting strip 6 additional.The position that described aluminum heat conducting plate 5 upper surface does not arrange high-power high heater members 1 is shaped with multiple " work " type radiator.
Lower mask body is done to elaborate to each parts: maybe can not meet this situation of heat radiation needs for improving the cooling of current natural wind, directly the realizability difference of liquid cools, evaporating and cooling method, thermoelectric cooling method and hot pipe technique cooling means, proposing the method adding heat-conducting plate 3 in the middle of high-power high heater members 1 with pcb board 2.
One, the composition of heat-conducting plate 3 and installation
Heat-conducting plate 3 is primarily of insulating barrier 4, aluminum heat conducting plate 5 and wedge shape hold-down mechanism 7 three part composition, and insulating barrier 4, for isolating pcb board 2 with the conductivity between aluminum heat conducting plate 5, is installed between aluminum heat conducting plate 5 and pcb board 2.Aluminum heat conducting plate 5 is mainly used in the heat of conduction and high power height heater members 1, aluminum heat conducting plate 5 simultaneously direct and insulating barrier 4 is fitted, and the circular hole 8 of installing device is reserved according to pcb board 2 pad locations, device pin is installed on pcb board 2 by this circular hole 8, between high-power high heater members 1 and aluminum heat conducting plate 5, add soft silica gel conducting strip 6, increase heat transfer; Wedge shape hold-down mechanism 7 is directly installed on aluminum heat conducting plate 5 both sides, plays and locks and conduction of heat with casing.The T-shaped structure in top 10 of aluminum heat conducting plate 5, connects as one with casing 9 seal cover after the upper surface 11 of T-type structure installs soft silica gel conducting strip 6 additional, increases area of dissipation.
Two, aluminum heat conducting plate 5 designs
Aluminium is the material typically for radiator or heat diffuser, because it has high heat conductance, and the feature that light weight and being easy to is processed, the aluminum heat conducting plate 5 designed in the technical program adopts aluminum; For ensureing good pyroconductivity, design is optimized to aluminum heat conducting plate 5.Aluminum heat conducting plate 5 top is with box cover close contact, expand area of dissipation, aluminum heat conducting plate 5 does not have the vacant place of high-power high heater members 1 made " work " type radiator, enhance thermal radiation, by emulation can determine that the rib of " work " type radiator is high, rib is long, rib is thick, fin number, fin shape, thus reach heat conduction, heat radiation thermal resistance minimum.
Three, the mounting design of aluminum heat conducting plate 5 and high-power high heater members 1
Aluminum heat conducting plate 5 is mainly used in the heat of conduction and high power height heater members 1, aluminum heat conducting plate 5 simultaneously direct and insulating barrier 4 is fitted, high-power high heater members 1 pin welds with pcb board 2 through aluminum heat conducting plate 5, soft silica gel conducting strip 6 is filled between aluminum heat conducting plate 5 and high-power high heater members 1, this soft silica gel conducting strip 6 can fill any irregular space at linkage interface place, and effectively can reduce the thermal resistance of interface, the parameter such as thickness, hardness, thermal conductivity coefficient of soft silica gel conducting strip 6 can be selected as required.
Four, the structure of wedge shape hold-down mechanism 7 and installation
The effect of installing and tightening up also is considered in the design of aluminum heat conducting plate 5, and the installation between aluminum heat conducting plate 5 and casing 9 is tightened up by wedge shape hold-down mechanism 7, not only serves fixing and locking effect, also serves conduction of heat simultaneously.Wedge shape hold-down mechanism 7 is made up of screw rod 12, upper wedge shape part 13, middle wedge shape part 14 and lower wedge shape part 15, vee is formed between upper wedge shape part 13 and lower wedge shape part 15, middle wedge shape part 14 is in inverted triangle and include in vee, and screw rod 12 to screw with the lower wedge shape part 15 being fixed on aluminum heat conducting plate 5 upper surface through upper wedge shape part 13, middle wedge shape part 14 and is integrated.By rotating screw bolt 12, upper wedge shape part 13 is extruded downwards, thus make middle wedge shape part 14 moves to withstand cabinet wall, realize two heat loss through conduction approach: heater element one heat-conducting plate/wedge shape hold-down mechanism one cabinet wall.
Practicality:
1, this structure is applicable to the heat transfer to the high-power high heater members 1 on wiring board;
2, the heat exchange pattern designed in this method is easy to realize, and reduces and carries out heat transfer, thermal-radiating designing requirement to pcb board 2;
3, use this structure relative to use red copper template heat abstractor, saved cost, and aluminium sheet hardness is moderate, is easy to processing.
Above-described embodiment, just preferred embodiment of the present invention, is not used for limiting the scope of the present invention, therefore all equivalence changes done with content described in the claims in the present invention, all should be included within the claims in the present invention scope.
Claims (4)
1. the wiring board heat transfer for aeronautical product optimizes module, it is characterized in that: between high-power high heater members (1) and pcb board (2), be provided with heat-conducting plate (3), described heat-conducting plate (3) is by insulating barrier (4), aluminum heat conducting plate (5) and wedge shape hold-down mechanism (7) are formed, described aluminum heat conducting plate (5) is arranged on pcb board (2) upper end and is provided with the insulating barrier (4) of conductivity between isolation pcb board (2) and aluminum heat conducting plate (5) between the two, described aluminum heat conducting plate (5) reserves the circular hole (8) installing high-power high heater members (1) according to pcb board (2) pad locations, the pin of described high-power high heater members (1) is arranged on pcb board (2) by circular hole (8), described wedge shape hold-down mechanism (7) is set directly at aluminum heat conducting plate (5) upper surface, both sides and plays and lock and conduction of heat with casing (9), described wedge shape hold-down mechanism (7) is made up of screw rod (12), upper wedge shape part (13), middle wedge shape part (14) and lower wedge shape part (15), vee is formed between described upper wedge shape part (13) and lower wedge shape part (15), described middle wedge shape part (14) is in inverted triangle and include in vee, and screw rod (12) screws through upper wedge shape part (13), middle wedge shape part (14) and the lower wedge shape part (15) that is fixed on aluminum heat conducting plate (5) upper surface and is integrated.
2. the wiring board heat transfer for aeronautical product according to claim 1 optimizes module, it is characterized in that: being also provided with between described high-power high heater members (1) and aluminum heat conducting plate (5) to increase heat conducting soft silica gel conducting strip (6).
3. the wiring board heat transfer for aeronautical product according to claim 1 and 2 optimizes module, it is characterized in that: top (10) the T-shaped structure of described aluminum heat conducting plate (5), and the upper surface of T-type structure (11) install additional soft silica gel conducting strip (6) afterwards same casing (9) seal cover connect as one.
4. the wiring board heat transfer for aeronautical product according to claim 3 optimizes module, it is characterized in that: the position that described aluminum heat conducting plate (5) upper surface does not arrange high-power high heater members (1) is shaped with multiple " work " type radiator.
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| CN201310683766.XA CN103687450B (en) | 2013-12-13 | 2013-12-13 | Wiring board heat transfer for aeronautical product optimizes module |
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| CN201310683766.XA CN103687450B (en) | 2013-12-13 | 2013-12-13 | Wiring board heat transfer for aeronautical product optimizes module |
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| CN103687450B true CN103687450B (en) | 2016-02-03 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270921A (en) * | 2014-09-26 | 2015-01-07 | 中国南方电网有限责任公司电网技术研究中心 | Miniaturized high protection level microcomputer protection device |
| CN107949236B (en) * | 2017-10-27 | 2019-09-27 | 中国船舶重工集团公司第七二三研究所 | A kind of synthesis heat-exchanger rig based on conduction |
| CN108055812B (en) * | 2017-12-27 | 2019-12-17 | 陕西航空电气有限责任公司 | Heat radiation system of board-mounted power device |
| CN109948290A (en) * | 2019-04-01 | 2019-06-28 | 山东浪潮云信息技术有限公司 | A kind of laboratory power supply optimizing thermal solution method based on Flotherm |
| CN113301762B (en) * | 2020-05-22 | 2023-02-28 | 西安黄河机电有限公司 | Heat abstractor and phased array radar structure |
| CN111740298B (en) * | 2020-06-22 | 2021-09-03 | 中国科学院长春光学精密机械与物理研究所 | Aviation laser |
| CN112492862B (en) * | 2021-01-05 | 2021-04-23 | 四川赛狄信息技术股份公司 | High-power printed circuit board |
| CN113286466B (en) * | 2021-05-21 | 2022-05-31 | 中国电子科技集团公司第二十九研究所 | Integrated locking and heat conducting structure of low-profile electronic module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101106886A (en) * | 2006-07-12 | 2008-01-16 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN101115376A (en) * | 2006-07-25 | 2008-01-30 | 富士通株式会社 | Electronic apparatus |
| US7495915B2 (en) * | 2006-11-29 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation system |
-
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- 2013-12-13 CN CN201310683766.XA patent/CN103687450B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101106886A (en) * | 2006-07-12 | 2008-01-16 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN101115376A (en) * | 2006-07-25 | 2008-01-30 | 富士通株式会社 | Electronic apparatus |
| US7495915B2 (en) * | 2006-11-29 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation system |
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