CN108055812B - Heat radiation system of board-mounted power device - Google Patents

Heat radiation system of board-mounted power device Download PDF

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Publication number
CN108055812B
CN108055812B CN201711438827.0A CN201711438827A CN108055812B CN 108055812 B CN108055812 B CN 108055812B CN 201711438827 A CN201711438827 A CN 201711438827A CN 108055812 B CN108055812 B CN 108055812B
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Prior art keywords
power device
cold plate
heat dissipation
heat
board
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CN201711438827.0A
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CN108055812A (en
Inventor
周萌
王晓波
胡锦
姜宇
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Shaanxi Aero Electric Co Ltd
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Shaanxi Aero Electric Co Ltd
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Priority to CN201711438827.0A priority Critical patent/CN108055812B/en
Publication of CN108055812A publication Critical patent/CN108055812A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a heat dissipation system of a board-mounted power device, which comprises a radiator, a cold plate, a shell and a fan, wherein the cold plate is arranged on the shell; the bottom of the power device is additionally provided with a heat conduction insulating gasket, the power device is arranged on a PCB (printed Circuit Board) through a cold plate, and the cold plate is connected with the shell during installation to form a heat conduction mode for heat dissipation; the PCB printed board is a single-sided bonding pad, so that the short circuit phenomenon between a cold plate and the bonding pad is prevented; a radiator is additionally arranged on the top of the power device to form heat radiation; the fan provides the forced air supply perpendicular to PCB printed board installation direction, forms the heat dissipation of thermal convection mode. The invention adopts a method of combining conduction, convection and radiation to realize good heat dissipation of the onboard power device, so that the system has the advantages of good heat dissipation, high working efficiency, high reliability, long service life and the like.

Description

heat radiation system of board-mounted power device
Technical Field
The invention belongs to the technical field of component heat dissipation, and relates to a heat dissipation system of an onboard power device.
Background
At present, along with the increase of power devices, the contradiction between power and heat dissipation increasingly becomes an important technical problem for assembling power electronic components. Generally, a significant portion of the electrical energy consumed by a power device during operation is converted to heat. In order to keep the operating temperature of the power device within a reasonable range, the operating environment temperature of the power device must be kept within the reasonable range, and the power device must be subjected to heat dissipation treatment. In a heat dissipation system for a component, heat transfer generally adopts three ways: conduction, convection, radiation. In order to ensure good heat dissipation performance of a power device, the power device is mostly directly mounted on a radiator at present, and the radiator is designed according to the heat productivity of the device during operation. However, in some design situations, the power device itself has a small volume, and if the power device is directly mounted on the heat dissipation plate, the product has a large volume and a heavy weight.
Disclosure of Invention
In order to improve the heat dissipation effect of the power device, no matter which heat dissipation mode is adopted, the problem of how to efficiently and quickly transfer heat from a heat source to a heat dissipation body is solved.
the technical scheme of the invention is as follows:
The heat dissipation system of the board-mounted power device is characterized in that: comprises a radiator, a cold plate, a shell and a fan;
The bottom of the power device is additionally provided with a heat conduction insulating gasket, the power device is arranged on a PCB (printed Circuit Board) through a cold plate, and the cold plate is connected with the shell during installation to form a heat conduction mode for heat dissipation; the PCB printed board is a single-sided bonding pad, so that the short circuit phenomenon between a cold plate and the bonding pad is prevented;
A radiator is additionally arranged on the top of the power device to form heat radiation;
The fan provides the forced air supply perpendicular to PCB printed board installation direction, forms the heat dissipation of thermal convection mode.
when the power device works, heat is continuously emitted, on one hand, the heat is dissipated in a heat radiation mode through a radiator at the top of the power device, on the other hand, the heat is conducted to the shell in a heat conduction mode through a cold plate in close contact with the power device, and finally, the heat is sent away through forced ventilation of a fan. Thus, three heat transfer modes of conduction, convection and radiation are combined, and the whole heat dissipation process comprises 4 links: the first is a power device, i.e. a heat source generator; the second is a radiator and a cold plate, i.e. a heat conductor; third is the fan, namely the medium for increasing heat conduction and directing heat conduction; and fourth is the final flow direction of the air, i.e. heat exchange.
Advantageous effects
The invention has the beneficial effects that: the method of combining conduction, convection and radiation is adopted to realize good heat dissipation of the onboard power device, so that the system has the advantages of good heat dissipation, high working efficiency, high reliability, long service life and the like.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of implementing heat dissipation for an on-board power device. Wherein, 1 is a radiator; 2-power tube; 3-cold plate; 4-printed board; 5-the shell.
Detailed Description
the following detailed description of embodiments of the invention is intended to be illustrative, and not to be construed as limiting the invention.
Fig. 1 depicts a schematic heat dissipation diagram of a board-mounted power device. The system comprises a power tube, a radiator, a cold plate, a shell, a fan and the like.
Firstly, install heat conduction insulating pad additional with the whole bottom of power tube to install on PCB printed board through the cold drawing, here PCB printed board's system during, make the PCB board into the single face pad, prevent that cold drawing and pad from taking place the short circuit phenomenon. The top of the power tube is additionally provided with a radiator to increase the radiating area, and the cold plate is finally connected with the shell of the product when being installed. Finally, the heat is conveyed away by a fan. Thus, three heat transfer modes of heat conduction, heat radiation and convection are combined.
according to the basic formula of heat conduction, Q is K × a × Δ T/, where Q represents heat, K is the heat conduction coefficient of the material, Δ T represents the temperature difference between the two ends, and Δ L is the distance between the two ends. Therefore, from the formula, it can be found that the magnitude of heat transfer is proportional to the heat transfer coefficient and the heat transfer area and inversely proportional to the distance. Therefore, by selecting a material having a high heat transfer coefficient, increasing the heat transfer area, and shortening the transfer distance, the higher the energy of heat transfer, the easier it is to carry away heat.
The formula Q for conduction of heat radiation, where Q represents the capacity for heat radiation to be exchanged, is E × S × F × Δ (Ta-Tb), and E is the coefficient of heat radiation of the object surface. In practice, when the object is metal and the surface is smooth, the emissivity is relatively low, and when the metal surface is anodized and colored black, the surface emissivity is increased. S is the surface area of the object, F is a function of the angle of radiative heat exchange and the surface, and Δ (Ta-Tb) is the temperature difference between surface a and surface b. Therefore, the emissivity, the surface area of the object and the temperature are all in direct proportion.
the invention adopts a method of combining conduction, convection and radiation to realize good heat dissipation of the onboard power device, so that the system has the advantages of good heat dissipation, high working efficiency, high reliability, long service life and the like.
although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.

Claims (1)

1. A heat dissipation system of a board-mounted power device is characterized in that: comprises a radiator, a cold plate, a shell and a fan;
The bottom of the power device is additionally provided with a heat conduction insulating gasket, the power device is arranged on a PCB (printed Circuit Board) through a cold plate, and the cold plate is connected with the shell during installation to form a heat conduction mode for heat dissipation; the PCB printed board is a single-sided bonding pad, so that the short circuit phenomenon between a cold plate and the bonding pad is prevented;
A plurality of power devices are arranged on a single cold plate, and a radiator is additionally arranged at the top of each power device to form heat radiation;
The fan provides the forced air supply perpendicular to PCB printed board installation direction, forms the heat dissipation of thermal convection mode.
CN201711438827.0A 2017-12-27 2017-12-27 Heat radiation system of board-mounted power device Active CN108055812B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711438827.0A CN108055812B (en) 2017-12-27 2017-12-27 Heat radiation system of board-mounted power device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711438827.0A CN108055812B (en) 2017-12-27 2017-12-27 Heat radiation system of board-mounted power device

Publications (2)

Publication Number Publication Date
CN108055812A CN108055812A (en) 2018-05-18
CN108055812B true CN108055812B (en) 2019-12-17

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CN201711438827.0A Active CN108055812B (en) 2017-12-27 2017-12-27 Heat radiation system of board-mounted power device

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CN (1) CN108055812B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2884809Y (en) * 2006-01-17 2007-03-28 斯比泰电子(深圳)有限公司 Radiator of power element
CN201894041U (en) * 2010-12-02 2011-07-06 保定市金源科技有限公司 Heat dissipation structure for multi-power device
CN202652802U (en) * 2012-05-11 2013-01-02 中国电子科技集团公司第十四研究所 Enclosed air-cooled cabinet
CN103021877A (en) * 2012-12-22 2013-04-03 中国船舶重工集团公司第七0九研究所 High-density chip radiating method by dual-path heat transfer
CN103687450A (en) * 2013-12-13 2014-03-26 陕西宝成航空仪表有限责任公司 Circuit board heat conduction optimization design structure for onboard aviation product

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106298758B (en) * 2016-08-26 2019-02-26 王文杰 A kind of SMD power device integrated morphology applied to electric car electric control product

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2884809Y (en) * 2006-01-17 2007-03-28 斯比泰电子(深圳)有限公司 Radiator of power element
CN201894041U (en) * 2010-12-02 2011-07-06 保定市金源科技有限公司 Heat dissipation structure for multi-power device
CN202652802U (en) * 2012-05-11 2013-01-02 中国电子科技集团公司第十四研究所 Enclosed air-cooled cabinet
CN103021877A (en) * 2012-12-22 2013-04-03 中国船舶重工集团公司第七0九研究所 High-density chip radiating method by dual-path heat transfer
CN103687450A (en) * 2013-12-13 2014-03-26 陕西宝成航空仪表有限责任公司 Circuit board heat conduction optimization design structure for onboard aviation product

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