CN106298758B - A kind of SMD power device integrated morphology applied to electric car electric control product - Google Patents
A kind of SMD power device integrated morphology applied to electric car electric control product Download PDFInfo
- Publication number
- CN106298758B CN106298758B CN201610727751.2A CN201610727751A CN106298758B CN 106298758 B CN106298758 B CN 106298758B CN 201610727751 A CN201610727751 A CN 201610727751A CN 106298758 B CN106298758 B CN 106298758B
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- power device
- copper
- pcb
- heat dissipation
- cold plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85238—Applying energy for connecting using electric resistance welding, i.e. ohmic heating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Air-Conditioning For Vehicles (AREA)
Abstract
The invention discloses a kind of SMD power device Integrated Solutions applied to electric car electric control product, it is related to technical field of new energy, using being embedded in or fill the thick copper PCB of multiple copper billets as main circuit carrier, SMD power device is welded on the copper billet, bus capacitor is welded on the thick copper PCB, the thickness copper PCB is crimped on heat dissipation cold plate, and insulating heat-conductive gasket is equipped between thickness copper PCB and the heat dissipation cold plate.SMD power device is welded on copper billet, transmits heat using the high thermal conductivity of copper, at the same time, the thermal capacitance of thick copper billet can effectively improve peak impact ability；It is equipped with insulating heat-conductive gasket between thick copper PCB and heat dissipation cold plate, realizes thermal-conduction resistance extremely low between power device and heat dissipation cold plate.
Description
Technical field
The present invention relates to technical field of new energy, especially a kind of patch type applied to electric car electric control product
Power device integrated morphology.
Background technique
In the prior art, more used aluminum substrate or other metal substrates (hereinafter referred to as aluminum substrate), aluminum substrate by
The aluminium layer composition of the layers of copper on surface, intermediate thermally conductive insulating layer and bottom surface predominantly uses thick and big with the difference of common pcb board
Metal layer instead of FR4 material, to obtain preferable thermal conductivity；But via hole cannot be arranged in aluminum substrate, generally require with
The pcb board of the other multiple bus capacitors of a block welding is docked by a large amount of screws, then passes through Surface Mount in the metal pedestal of pcb board
It is crimped with aluminum substrate, realizes high current conduction, the electrical connection of component is realized using the single layer cabling on surface layer.
Above-mentioned technical proposal there are the problem of have: 1. metal substrates are difficult to bear the thermal shock of automotive grade application, are easy to stick up
It is bent；2.PCB plate and aluminum substrate rebuilding, are electrically connected by a large amount of screws, applied in the high vibration environment of automobile,
There are certain risks；3. metal substrate can not integrate bus capacitor, need to carry out screw company with the pcb board of welding bus capacitor
It connects, complex process；4. the PCB plate of welding bus capacitor is fixed on above power single tube, fever is serious, the very big influence capacitor longevity
Life；5. metal substrate single layer cabling, fever is serious and parasitic inductance is big, it is difficult to meet low system parasitic inductance requirement in automobile；
6. the instantaneous thermal resistance of metal substrate is high, it is difficult to meet the frequent output of peak power in short-term demand in automobile application.
Summary of the invention
In view of the above-mentioned problems, to provide a kind of SMD power device applied to electric car electric control product integrated by the present invention
Structure.
A kind of SMD power device integrated morphology applied to electric car electric control product, it is multiple using being embedded in or filling
As main circuit carrier, SMD power device is welded on the copper billet the thick copper PCB of copper billet, and bus capacitor is welded in described
On thick copper PCB, the thickness copper PCB is crimped on heat dissipation cold plate, and insulation is equipped between thickness copper PCB and the heat dissipation cold plate and is led
Heat pad piece.
Further, the power device includes upper half-bridge power single tube and lower half-bridge power single tube, the upper and lower half-bridge
Power single tube is interspersed, while being arranged by the positive and negative busbar intersecting of pcb board.
Further, the bus capacitor is set to nearby around the upper and lower half-bridge power single tube being interspersed.
Further, the bus capacitor is arranged downwards, is placed between the thick copper pcb board and the heat dissipation cold plate
In individual cavity.
Beneficial effects of the present invention: SMD power device is welded on copper billet, transmits heat using the high thermal conductivity of copper,
At the same time, the thermal capacitance of thick copper billet can effectively improve peak impact ability；Insulation is equipped between thick copper PCB and heat dissipation cold plate
Heat-conducting pad realizes thermal-conduction resistance extremely low between power device and heat dissipation cold plate；The bus capacitor is set to the friendship nearby
It around the upper and lower half-bridge power single tube of mistake distribution, while being arranged by the positive and negative busbar intersecting of pcb board, shortens the change of current and return
Road realizes the extra low inductance of system, reduces parasitic capacitance to greatest extent, eliminates the pcb board and aluminum substrate of welding bus capacitor
Complicated connection, reduce costs, while improving seismic behavior.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention one；
Fig. 2 is structural schematic diagram two of the invention.
Specific embodiment
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.The embodiment of the present invention is
It is provided for the sake of example and description, and is not exhaustively or to limit the invention to disclosed form.Very much
Modifications and variations are obvious for the ordinary skill in the art.Selection and description embodiment are in order to more preferable
Illustrate the principle of the present invention and practical application, and makes those skilled in the art it will be appreciated that the present invention is suitable to design
In the various embodiments with various modifications of special-purpose.
Embodiment 1
A kind of SMD power device integrated morphology applied to electric car electric control product, it is shown as shown in Figure 1, Figure 2, it adopts
Use the thick copper PCB 101 for being embedded in or filling multiple copper billets as main circuit carrier, SMD power device is welded in the copper billet
On, bus capacitor 105 is welded on the thick copper PCB 101, and the thickness copper PCB 101 is crimped on heat dissipation cold plate 103, described
Insulating heat-conductive gasket 104 is equipped between thick copper PCB 101 and the heat dissipation cold plate 103.
SMD power device is welded on copper billet, transmits heat, at the same time, thick copper billet using the high thermal conductivity of copper
Thermal capacitance can effectively improve peak impact ability；It is equipped with insulating heat-conductive gasket between thick copper PCB and heat dissipation cold plate, realizes power device
Extremely low thermal-conduction resistance between part and heat dissipation cold plate.
The power device includes upper half-bridge power single tube 1021 and lower half-bridge power single tube 1022, the upper and lower half-bridge
Power single tube is interspersed, while being arranged by the positive and negative busbar intersecting of pcb board, shortens commutation circuit, realizes system
Extra low inductance.
The bus capacitor 105 is set to nearby around the upper and lower half-bridge power single tube being interspersed, to greatest extent
Parasitic capacitance is reduced, the pcb board of welding bus capacitor is eliminated and the complicated of aluminum substrate connects, reduce costs, improve simultaneously
Seismic behavior.
The bus capacitor 105 is arranged downwards, is placed in only between the thick copper PCB 101 and the heat dissipation cold plate 103
In vertical cavity, it is isolated from the high heating region of power single tube.
Obviously, described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, this field and those of ordinary skill in the related art institute without creative labor
The every other embodiment obtained, all should belong to the scope of protection of the invention.
Claims (2)
1. a kind of SMD power device integrated morphology applied to electric car electric control product, it is characterised in that: using insertion
Or the thick copper PCB of the multiple copper billets of landfill, as main circuit carrier, SMD power device is welded on the copper billet, bus capacitor
It is welded on the thick copper PCB, the thickness copper PCB is crimped on heat dissipation cold plate, between thickness copper PCB and the heat dissipation cold plate
Equipped with insulating heat-conductive gasket；
The power device includes upper half-bridge power single tube and lower half-bridge power single tube, and the upper and lower half-bridge power single tube interlocks
Distribution, while being arranged by the positive and negative busbar intersecting of pcb board, the bus capacitor are set to described be interspersed nearby
Around upper and lower half-bridge power single tube.
2. the SMD power device integrated morphology according to claim 1 applied to electric car electric control product, special
Sign is: the bus capacitor is arranged downwards, is placed in the individual cavity between the thick copper pcb board and the heat dissipation cold plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610727751.2A CN106298758B (en) | 2016-08-26 | 2016-08-26 | A kind of SMD power device integrated morphology applied to electric car electric control product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610727751.2A CN106298758B (en) | 2016-08-26 | 2016-08-26 | A kind of SMD power device integrated morphology applied to electric car electric control product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106298758A CN106298758A (en) | 2017-01-04 |
| CN106298758B true CN106298758B (en) | 2019-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610727751.2A Active CN106298758B (en) | 2016-08-26 | 2016-08-26 | A kind of SMD power device integrated morphology applied to electric car electric control product |
Country Status (1)
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108093567A (en) * | 2017-12-22 | 2018-05-29 | 珠海市航达科技有限公司 | A kind of thickness copper method for manufacturing printed circuit board |
| CN108055812B (en) * | 2017-12-27 | 2019-12-17 | 陕西航空电气有限责任公司 | Heat radiation system of board-mounted power device |
| CN108282967A (en) * | 2018-01-25 | 2018-07-13 | 鹤山市中富兴业电路有限公司 | A kind of locally thickness copper PCB and its manufacture craft |
| US11350519B2 (en) | 2020-01-22 | 2022-05-31 | Delta Electronics (Shanghai) Co., Ltd. | Power module |
| EP3855488A1 (en) | 2020-01-22 | 2021-07-28 | Delta Electronics (Shanghai) Co., Ltd. | Power module |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0285277A1 (en) * | 1987-03-31 | 1988-10-05 | Amp Incorporated | Chip carrier with energy storage means |
| CN101593707A (en) * | 2009-07-03 | 2009-12-02 | 无锡友达电子有限公司 | The method for packing that is used for high-power integrated circuit |
| CN102333414A (en) * | 2011-09-02 | 2012-01-25 | 深圳创动科技有限公司 | Heat dissipation structure, manufacturing method for the same and electronic device with the same |
| CN104465552A (en) * | 2014-12-26 | 2015-03-25 | 苏州旭创科技有限公司 | Packaging structure and optical module |
| CN204408745U (en) * | 2015-02-13 | 2015-06-17 | 杭州创迅科技有限公司 | Novel patch encapsulating structure |
| CN204696102U (en) * | 2015-07-02 | 2015-10-07 | 常熟开关制造有限公司(原常熟开关厂） | A kind of heat radiating installation construction of power device |
| CN105682345A (en) * | 2011-09-29 | 2016-06-15 | 华为技术有限公司 | Printed board assembly and processing method thereof |
| CN105813435A (en) * | 2015-01-20 | 2016-07-27 | Zf腓德烈斯哈芬股份公司 | Control electronic device |
-
2016
- 2016-08-26 CN CN201610727751.2A patent/CN106298758B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0285277A1 (en) * | 1987-03-31 | 1988-10-05 | Amp Incorporated | Chip carrier with energy storage means |
| CN101593707A (en) * | 2009-07-03 | 2009-12-02 | 无锡友达电子有限公司 | The method for packing that is used for high-power integrated circuit |
| CN102333414A (en) * | 2011-09-02 | 2012-01-25 | 深圳创动科技有限公司 | Heat dissipation structure, manufacturing method for the same and electronic device with the same |
| CN105682345A (en) * | 2011-09-29 | 2016-06-15 | 华为技术有限公司 | Printed board assembly and processing method thereof |
| CN104465552A (en) * | 2014-12-26 | 2015-03-25 | 苏州旭创科技有限公司 | Packaging structure and optical module |
| CN105813435A (en) * | 2015-01-20 | 2016-07-27 | Zf腓德烈斯哈芬股份公司 | Control electronic device |
| CN204408745U (en) * | 2015-02-13 | 2015-06-17 | 杭州创迅科技有限公司 | Novel patch encapsulating structure |
| CN204696102U (en) * | 2015-07-02 | 2015-10-07 | 常熟开关制造有限公司(原常熟开关厂） | A kind of heat radiating installation construction of power device |
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| Publication number | Publication date |
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| CN106298758A (en) | 2017-01-04 |
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