CN202425193U - Aluminium-based circuit board - Google Patents
Aluminium-based circuit board Download PDFInfo
- Publication number
- CN202425193U CN202425193U CN2012200136633U CN201220013663U CN202425193U CN 202425193 U CN202425193 U CN 202425193U CN 2012200136633 U CN2012200136633 U CN 2012200136633U CN 201220013663 U CN201220013663 U CN 201220013663U CN 202425193 U CN202425193 U CN 202425193U
- Authority
- CN
- China
- Prior art keywords
- layer
- copper foil
- foil layer
- circuit board
- based circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses an aluminium-based circuit board. The aluminium-based circuit board comprises a circuit layer, an insulating layer and an aluminum substrate which are sequentially stacked; the circuit layer is composed of a first copper foil layer, a second copper foil layer and a ceramic material layer, and the ceramic material layer is arranged between the first copper foil layer and the second copper foil layer; the electric connection between the first copper foil layer and the second copper foil layer is realized through a via hole; and the insulating layer is a PP (polypropylene) layer. The aluminium-based circuit board is good in heat-dissipation effect.
Description
Technical field
The utility model belongs to the wiring board technical field, relates to a kind of aluminum-based circuit board.
Background technology
The existing line plate, after mounting components and parts, its heat radiation leans on natural heat dissipation and insulating barrier heat conduction to realize that radiating effect is not good.
The utility model content
The utility model technical problem to be solved is the deficiency that overcomes prior art, and a kind of aluminum-based circuit board is provided, and this aluminum-based circuit board radiating effect is good.
The technical solution of utility model is following:
A kind of aluminum-based circuit board comprises the line layer, insulating barrier and the aluminium base that stack gradually, line layer by first copper foil layer, second copper foil layer and be arranged on first copper foil layer and second copper foil layer between the ceramic bed of material form; First copper foil layer and second copper foil layer are realized being electrically connected through via.
Described insulating barrier is the PP layer.
PP layer main component is epoxy resin+aluminium nitride, has high thermal conduction characteristic.
Beneficial effect:
This practical aluminum-based circuit board owing to adopt the PP layer and the ceramic bed of material to insulate, adopts aluminium base to dispel the heat, and not only good heat dissipation effect also has the good insulation performance effect.
Description of drawings
Fig. 1 is the structural representation of the aluminum-based circuit board of the utility model.
Label declaration: 1-first copper foil layer, the 2-pottery bed of material, 3-second copper foil layer, 4-PP layer, 5-aluminium base, 6-via.
Embodiment
Below will combine accompanying drawing and specific embodiment that the utility model is explained further details:
As shown in Figure 1, a kind of aluminum-based circuit board comprises the line layer, insulating barrier and the aluminium base that stack gradually, line layer by first copper foil layer, second copper foil layer and be arranged on first copper foil layer and second copper foil layer between the ceramic bed of material form; First copper foil layer and second copper foil layer are realized being electrically connected through via.Described insulating barrier is the PP layer.
Between line layer and the aluminium base by high heat conduction PP material interval.By ceramic material at interval, need the network using boring of conducting and the heavy copper (being via) of going up to connect between two-layer between line layer and the line layer, in the hole in by high heat conduction PP material filling.
Claims (2)
1. an aluminum-based circuit board is characterized in that, comprises the line layer, insulating barrier and the aluminium base that stack gradually, line layer by first copper foil layer, second copper foil layer and be arranged on first copper foil layer and second copper foil layer between the ceramic bed of material form; First copper foil layer and second copper foil layer are realized being electrically connected through via.
2. aluminum-based circuit board according to claim 1 is characterized in that, described insulating barrier is the PP layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200136633U CN202425193U (en) | 2012-01-12 | 2012-01-12 | Aluminium-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200136633U CN202425193U (en) | 2012-01-12 | 2012-01-12 | Aluminium-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202425193U true CN202425193U (en) | 2012-09-05 |
Family
ID=46749912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200136633U Expired - Lifetime CN202425193U (en) | 2012-01-12 | 2012-01-12 | Aluminium-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202425193U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918405A (en) * | 2015-06-17 | 2015-09-16 | 安徽达胜电子有限公司 | Environment-friendly circuit board capable of quickly dissipating heat |
| US10939563B2 (en) | 2016-09-27 | 2021-03-02 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Flame retardant structure for component carrier |
-
2012
- 2012-01-12 CN CN2012200136633U patent/CN202425193U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918405A (en) * | 2015-06-17 | 2015-09-16 | 安徽达胜电子有限公司 | Environment-friendly circuit board capable of quickly dissipating heat |
| US10939563B2 (en) | 2016-09-27 | 2021-03-02 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Flame retardant structure for component carrier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120905 |
|
| CX01 | Expiry of patent term |