CN205029961U - High -capacity aluminum base circuit board - Google Patents
High -capacity aluminum base circuit board Download PDFInfo
- Publication number
- CN205029961U CN205029961U CN201520832166.XU CN201520832166U CN205029961U CN 205029961 U CN205029961 U CN 205029961U CN 201520832166 U CN201520832166 U CN 201520832166U CN 205029961 U CN205029961 U CN 205029961U
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- layer
- pad
- base layer
- lug
- circuit board
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Abstract
The utility model discloses a high -capacity aluminum base circuit board, including aluminium base layer, line layer and the setting insulating layer between aluminium base layer and line layer, be equipped with circuit and pad on the line layer, be equipped with the heat dissipation through -hole on the insulating layer that the pad corresponds, be equipped with the lug that stretches into heat dissipation through -hole department on the aluminium base layer, it has high heat -conduction insulation layer to fill between lug and the pad. The utility model discloses an aluminium base layer is equipped with the lug that stretches into in the heat dissipation through -hole, further improves the radiating efficiency. Open circuit for avoiding, be equipped with high heat -conduction insulation layer between lug and the pad. The circuit board during operation, the heat that electronic component produced passes through pad transmission to high heat -conduction insulation layer, lug and finally reachs aluminium base layer, has higher radiating efficiency. The utility model discloses still has simultaneously small advantage.
Description
Technical field
The utility model relates to a kind of wiring board, is specifically related to a kind of high capacity aluminum-based circuit board.
Background technology
Because existing electronic product power improves further, on electronic product wiring board, the load of circuit also progressively promotes.Along with the raising of load, on wiring board, the caloric value of element also significantly increases, and this has higher requirement to the heat dispersion of wiring board.Prior art generally improves wiring board heat dispersion by methods such as additional heat abstractor, increase wiring board area of dissipations.But these methods will increase the volume of electronic product, be unfavorable for the control of small product size.Prior art also has the matrix adopting aluminium alloy as wiring board, improves the heat dispersion of wiring board itself.But be provided with insulating barrier between aluminum base layer and line layer, the heat item aluminum base layer intercepting line layer is transmitted, and radiating efficiency is lower.
Utility model content
In view of this, the utility model discloses that a kind of volume is little, radiating efficiency is high, can bear the aluminum-based circuit board of high capacity.
The purpose of this utility model is achieved through the following technical solutions: a kind of high capacity aluminum-based circuit board, the insulating barrier comprising aluminum base layer, line layer and be arranged between aluminum base layer and line layer, described line layer is provided with circuit and pad, and the insulating barrier that described pad is corresponding is provided with thermal vias; Aluminum base layer is provided with the projection stretching into thermal vias place.
The utility model arranges thermal vias for the pad position that radiating requirements is maximum, reduces this position insulating barrier to the restriction of heat transfer efficiency.Meanwhile, aluminum base layer of the present utility model is provided with the projection stretched in thermal vias, improves radiating efficiency further.During wiring board work, the heat that electronic component produces is passed to thermal vias by pad, projection also finally arrives aluminum base layer, has higher radiating efficiency.The utility model also has the little advantage of volume simultaneously.
Further, connected between adjacent thermal vias by heat radiating metal silk, the end of heat radiating metal silk embeds projection upper end.
During larger electric current current through line, circuit also easily produces heat.Embedding heat radiating metal silk is in a insulating layer conducive to the heat dispersion improving insulating barrier, and is finally delivered on aluminium base by heat by projection.
Accompanying drawing explanation
Fig. 1 is profile of the present utility model.
Embodiment
The utility model to be described in further detail below in conjunction with accompanying drawing and embodiment for the ease of it will be appreciated by those skilled in the art that:
Embodiment 1
The present embodiment provides a kind of high capacity aluminum-based circuit board, as Fig. 1, comprise aluminum base layer 1, line layer and be arranged on the insulating barrier 2 between aluminum base layer and line layer, described line layer is provided with circuit (not show) and pad 3, and the insulating barrier of described pad 3 correspondence is provided with thermal vias 4; Aluminum base layer 1 is provided with the projection 5 stretching into thermal vias 4 place.
In the present embodiment, aluminum base layer, line layer, insulating barrier all can select prior art to make.
Further, connected between adjacent thermal vias by heat radiating metal silk 7, the end of heat radiating metal silk embeds projection 5 upper end.
Be more than wherein specific implementation of the present utility model, it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these apparent replacement forms all belong to protection range of the present utility model.
Claims (2)
1. a high capacity aluminum-based circuit board, the insulating barrier comprising aluminum base layer, line layer and be arranged between aluminum base layer and line layer, described line layer is provided with circuit and pad, it is characterized in that: the insulating barrier that described pad is corresponding is provided with thermal vias; Aluminum base layer is provided with the projection stretching into thermal vias place.
2. high capacity aluminum-based circuit board according to claim 1, be is characterized in that: connected by heat radiating metal silk between adjacent thermal vias, and the end of heat radiating metal silk embeds projection upper end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520832166.XU CN205029961U (en) | 2015-10-26 | 2015-10-26 | High -capacity aluminum base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520832166.XU CN205029961U (en) | 2015-10-26 | 2015-10-26 | High -capacity aluminum base circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205029961U true CN205029961U (en) | 2016-02-10 |
Family
ID=55262460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520832166.XU Active CN205029961U (en) | 2015-10-26 | 2015-10-26 | High -capacity aluminum base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205029961U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925029A (en) * | 2018-07-30 | 2018-11-30 | 景旺电子科技(龙川)有限公司 | A kind of method and aluminium base printed board and preparation method thereof improving aluminium base printed board heat dissipation effect |
| CN109922596A (en) * | 2019-03-19 | 2019-06-21 | 珠海市航达科技有限公司 | A kind of thermally conductive printed circuit board of IGBT and processing method |
-
2015
- 2015-10-26 CN CN201520832166.XU patent/CN205029961U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925029A (en) * | 2018-07-30 | 2018-11-30 | 景旺电子科技(龙川)有限公司 | A kind of method and aluminium base printed board and preparation method thereof improving aluminium base printed board heat dissipation effect |
| CN109922596A (en) * | 2019-03-19 | 2019-06-21 | 珠海市航达科技有限公司 | A kind of thermally conductive printed circuit board of IGBT and processing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |