CN207235199U - A kind of new high radiating circuit plate - Google Patents
A kind of new high radiating circuit plate Download PDFInfo
- Publication number
- CN207235199U CN207235199U CN201721289570.2U CN201721289570U CN207235199U CN 207235199 U CN207235199 U CN 207235199U CN 201721289570 U CN201721289570 U CN 201721289570U CN 207235199 U CN207235199 U CN 207235199U
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- insulating layer
- layer
- soft insulating
- heat dissipating
- heat
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Abstract
A kind of new high radiating circuit plate is the utility model is related to, including：Line layer, upper soft insulating layer and lower soft insulating layer, the line layer is arranged between soft insulating layer and lower soft insulating layer, heat dissipating layer is provided with the upper soft insulating layer, lower heat dissipating layer is provided with the lower soft insulating layer, several heat sinks being distributed in the horizontal direction are both provided with the upper heat dissipating layer and lower heat dissipating layer, the upper heat emission hole of several distributions corresponding with heat sink is provided with the upper heat dissipating layer, the lower heat emission hole of several distributions corresponding with heat sink is provided with the lower heat dissipating layer, the line layer, upper soft insulating layer is connected with lower soft insulating layer by several soft insulating columns vertically set.By the above-mentioned means, new high radiating circuit plate provided by the utility model, has superpower heat dissipation performance again while wiring board flexibility is lifted.
Description
Technical field
The present invention relates to wiring board art, more particularly to a kind of new high radiating circuit plate.
Background technology
Base electronic element of the wiring board as electronic product, is widely used in the process of manufacture of electronic product,
Higher and higher with the integrated level of electronic product, volume is less and less, since generally use is flexible in the limited electron product of space
Wiring board make it that the component caloric value on wiring board is increasing to replace traditional hardboard in narrow space, heat
Aggregation and the problem of be difficult to radiate, be easy to cause hot-spot and damage.
The content of the invention
The invention mainly solves the technical problem of providing a kind of new high radiating circuit plate, flexible in lifting wiring board
There is superpower heat dissipation performance again at the same time.
In order to solve the above technical problems, one aspect of the present invention is：A kind of new high radiating circuit is provided
Plate, including：Line layer, upper soft insulating layer and lower soft insulating layer, it is soft with that the line layer is arranged on soft insulating layer
Between matter insulating layer, heat dissipating layer is provided with the upper soft insulating layer, lower heat dissipation is provided with the lower soft insulating layer
Layer, it is both provided with several heat sinks being distributed in the horizontal direction, the upper heat dissipating layer in the upper heat dissipating layer and lower heat dissipating layer
On be provided with the upper heat emission holes of several distributions corresponding with heat sink, be provided with several and heat sink pair on the lower heat dissipating layer
The lower heat emission hole that should be distributed, if the line layer, upper soft insulating layer and lower soft insulating layer are by vertically setting
Dry soft insulating column connection.
The present invention one is preferably implemented in example, and the upper soft insulating layer and lower soft insulating layer are polyimides material
Matter.
The present invention one is preferably implemented in example, and the heat sink has copper alloy or aluminium alloy.
The present invention one is preferably implemented in example, and the upper soft insulating layer is consistent with lower soft insulating layer thickness.
The beneficial effects of the invention are as follows：A kind of new high radiating circuit plate that the present invention points out, it is flexible in lifting wiring board
While there is superpower heat dissipation performance again.
Brief description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, wherein：
Fig. 1 is a kind of structure diagram of new high one preferred embodiment of radiating circuit plate of the present invention；
Shown in figure：1st, line layer, 2, upper soft insulating layer, 3, lower soft insulating layer, 4, upper heat dissipating layer, 5, lower heat dissipation
Layer, 6, heat sink, 7, upper heat emission hole, 8, lower heat emission hole, 9, soft insulating column.
Embodiment
The technical solution in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only the part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this area is common
All other embodiment that technical staff is obtained without making creative work, belongs to the model that the present invention protects
Enclose.
Referring to Fig. 1, the embodiment of the present invention includes：
A kind of new high radiating circuit plate, including：Line layer 1, upper soft insulating layer 2 and lower soft insulating layer 3, the line
Road floor 1 is arranged between soft insulating floor 2 and lower soft insulating floor 3, and heat dissipating layer is provided with the upper soft insulating layer 2
4, lower heat dissipating layer 5 is provided with the lower soft insulating layer 3, is both provided with the upper heat dissipating layer 4 and lower heat dissipating layer 5 along level
Several heat sinks 6 of directional spreding, the upper heat dissipation of several distributions corresponding with heat sink 6 is provided with the upper heat dissipating layer 4
Hole 7, is provided with the lower heat emission hole 8 of several distributions corresponding with heat sink 6 on the lower heat dissipating layer 5, the line layer 1, upper soft
Matter insulating layer 2 and lower soft insulating layer 3 are connected by several soft insulating columns 9 vertically set.
The upper soft insulating layer 1 and lower soft insulating layer 2 are polyimides material, and insulation effect is good and softness is easy to
Bending.
The heat sink 6 has copper alloy or aluminium alloy, and heat-transfer rate is fast.
The upper heat emission hole 7 and lower heat emission hole 8, effectively improve heat dissipation effect.
In conclusion a kind of new high radiating circuit plate that the present invention points out, has again while wiring board flexibility is lifted
There is superpower heat dissipation performance.
The foregoing is merely the embodiment of the present invention, is not intended to limit the scope of the invention, every to utilize this hair
The equivalent structure or equivalent flow shift that bright description is made, is directly or indirectly used in other relevant technology necks
Domain, is included within the scope of the present invention.
Claims (4)
1. a kind of new high radiating circuit plate, including：Line layer, upper soft insulating layer and lower soft insulating layer, the line layer
It is arranged between soft insulating layer and lower soft insulating layer, it is characterised in that be provided with and dissipate in the upper soft insulating layer
Thermosphere, is provided with lower heat dissipating layer in the lower soft insulating layer, is both provided with the upper heat dissipating layer and lower heat dissipating layer along level
Several heat sinks of directional spreding, the upper heat emission hole of several distributions corresponding with heat sink is provided with the upper heat dissipating layer,
The lower heat emission hole of several distributions corresponding with heat sink, the line layer, upper soft insulating layer are provided with the lower heat dissipating layer
Connected with lower soft insulating layer by several soft insulating columns vertically set.
2. new high radiating circuit plate according to claim 1, it is characterised in that the upper soft insulating layer is soft with
Insulating layer is polyimides material.
3. new high radiating circuit plate according to claim 1, it is characterised in that the heat sink has copper alloy or aluminium
Alloy.
4. new high radiating circuit plate according to claim 1, it is characterised in that the upper soft insulating layer is soft with
Thickness of insulating layer is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721289570.2U CN207235199U (en) | 2017-10-09 | 2017-10-09 | A kind of new high radiating circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721289570.2U CN207235199U (en) | 2017-10-09 | 2017-10-09 | A kind of new high radiating circuit plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207235199U true CN207235199U (en) | 2018-04-13 |
Family
ID=61850071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721289570.2U Active CN207235199U (en) | 2017-10-09 | 2017-10-09 | A kind of new high radiating circuit plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207235199U (en) |
-
2017
- 2017-10-09 CN CN201721289570.2U patent/CN207235199U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000 189 Jinfeng Road, high tech Zone, Suzhou City, Jiangsu Province Patentee after: Fulaiying Electronics Co.,Ltd. Address before: 215100 No.189, Jinfeng Road, high tech Zone, Suzhou City, Jiangsu Province Patentee before: FOREWIN FPC (SUZHOU) Co.,Ltd. |