CN108882504A - A kind of radiator - Google Patents
A kind of radiator Download PDFInfo
- Publication number
- CN108882504A CN108882504A CN201810728286.3A CN201810728286A CN108882504A CN 108882504 A CN108882504 A CN 108882504A CN 201810728286 A CN201810728286 A CN 201810728286A CN 108882504 A CN108882504 A CN 108882504A
- Authority
- CN
- China
- Prior art keywords
- sub
- chip
- radiating groove
- heating column
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 57
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 239000006071 cream Substances 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000010276 construction Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application discloses a kind of radiator, which is used to radiate to the IC chip of setting on circuit boards, which includes：The multiple chips of circuit board and setting on circuit boards pre-install position；Chip prepackage position includes mounting base and the pad that mounting base periphery is arranged in, and radiating groove and heating column are provided in mounting base, and heating column and radiating groove interval are arranged；Pad is used to weld the pin of IC chip, and generated heat when heating column is for conducting IC chip work, radiating groove is used to distribute the heat in circuit board and IC chip.The construction for heat radiating device is simple, good heat dissipation effect.
Description
Technical field
This application involves circuit board technology field more particularly to a kind of radiators.
Background technique
IC chip under the prior art is all directly welded in circuit board, and the heat that IC chip distributes later is dissipated by circuit board
Out, when IC chip power is larger, big calorimetric can be generated, ordinary circuit board heat-sinking capability is inadequate, will cause IC chip mistake
Heat and reduce efficiency or damage, the distance between adjacent IC chip is excessively close, and the heat between IC chip can be overlapped mutually, therefore holds very much
" tropical island effect " easily is formed, therefore, it is necessary to the heat dissipations of arrangement and pcb board to powerful IC chip to improve.
Summary of the invention
Mainly solving the technical problems that providing a kind of radiator, which is used to be arranged in circuit the application
IC chip on plate radiates, and the construction for heat radiating device is simple, and good heat dissipation effect.
To solve the above problems, the technical solution of the application is：A kind of radiator is provided, the radiator is used
It radiates in the IC chip of setting on circuit boards, the radiator includes：Circuit board and setting are on the circuit board
Multiple chips pre-install position；Chip prepackage position includes mounting base and the pad that the mounting base periphery is arranged in, described
Radiating groove and heating column are provided in mounting base, the heating column and the radiating groove interval are arranged；The pad is for welding
The pin of the IC chip, generated heat, the radiating groove are used when the heating column is for conducting IC chip work
In distributing the heat in the circuit board and the IC chip.
Preferably, the radiating groove include the first sub- radiating groove and the second sub- radiating groove, the first sub- radiating groove with
There is preset interval between the second sub- radiating groove；The first sub- radiating groove and the second sub- radiating groove are described in
Mounting base wherein the pad of side distribution arrangement extend.
Preferably, the heating column includes the first sub- heating column, the second sub- heating column and the sub- heating column of third；Described
One sub- radiating groove is arranged between the described first sub- heating column and the second sub- heating column and the second sub- radiating groove is set
It sets between the described second sub- heating column and the sub- heating column of the third.
Preferably, the corresponding packet of the described first sub- heating column, the second sub- heating column and the sub- heating column of the third
Multiple thermally conductive pole units are included, extension directional spreding of the thermally conductive pole unit in each sub- heating column along the described first sub- radiating groove.
Preferably, the thermally conductive pole unit is copper post.
Preferably, the thermally conductive pole unit is detachably connected with circuit board formation.
Preferably, it is provided with threaded hole in the mounting base, is provided on the thermally conductive pole unit and the threaded hole phase
Matched screw thread, the thermally conductive pole unit are detachably connected by the threaded hole and circuit board formation, and described thermally conductive
Height of the thermally conductive pole unit relative to the mounting base is adjusted by the threaded hole in pole unit.
Preferably, the radiator further includes thermally conductive tin cream, the thermally conductive tin cream be filled in the heating column with it is described
Between the pin of IC chip.
Preferably, the multiple chip prepackage position is arranged on the circuit board in Z-shaped.
Preferably, the pad is metal pad.
The beneficial effect of the application：It is different from the prior art, the radiator of the application includes：Circuit board and setting exist
Multiple chips on circuit board pre-install position；Chip prepackage position includes mounting base and the pad that mounting base periphery is arranged in, installation
Radiating groove and heating column are provided on seat, heating column and radiating groove interval are arranged；Pad is used to weld the pin of IC chip, thermally conductive
Generated heat when column is for conducting IC chip work, radiating groove are used to distribute the heat in circuit board and IC chip.This
The radiator of application is conducted heat caused by IC chip to circuit board by heating column, then passes through dissipating on circuit board
Heat channel goes out heat Quick diffusing, and then effectively promotes the radiating efficiency of powerful IC chip.
Detailed description of the invention
Fig. 1 is the main view of one embodiment of the application radiator；
Fig. 2 is the enlarged diagram in Fig. 1 at A；
Fig. 3 is the partial cutaway schematic in Fig. 1；
Fig. 4 is the arrangement schematic diagram of chip prepackage one embodiment of position of the radiator of the application；
Fig. 5 is the arrangement schematic diagram of the chip prepackage another embodiment in position of the radiator of the application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, to the skill of each exemplary embodiment provided herein
Art scheme is clearly and completely described.In the absence of conflict, the feature in following each embodiments and embodiment can
To be combined with each other.
Also referring to FIG. 1 to FIG. 3, as shown in Figure 1, present embodiment provides a kind of radiator, which is used
It radiates in the IC chip 3 of setting on the circuit card 1, which specifically includes：Circuit board 1 and setting are in circuit board 1
On multiple chips pre-install position 2, wherein on same circuit board 1 chip prepackage 2 size of position can not be identical, concrete foundation is each
Depending on the size for the IC chip 3 for preparing installation on chip prepackage position 2.Wherein, the material and the number of plies of circuit board 1 can be according to realities
Depending on the situation of border, in a preferred embodiment, the material of circuit board 1 has preferable heat dissipation performance.
Referring to Fig. 2, chip prepackage position 2 includes mounting base 21 and the pad 22 that 21 periphery of mounting base is arranged in.Wherein,
Pad 22 is used to weld the pin 31 of IC chip 3.Specifically, the distribution situation and 22 size of pad of pad 22 are according to IC core
Depending on piece 3, it is however generally that, 22 size of pad and the pin 31 of IC chip 3 match, for the ease of upper tin, the size of pad 22
It is more bigger than the pin 31 of IC chip 3.In order to preferably radiate, pad 22 is metal pad, and is correspondingly arranged on pad 22
There are multiple through-holes, wherein the diameter very little of aforementioned through-hole.
In one of them embodiment, mounting base 21 on the circuit card 1 be projected as square or rectangular, pad
22 are arranged in the opposite two sides of mounting base 21.In another embodiment, mounting base 21 on the circuit card 1 be projected as pros
Shape or rectangle, the setting of pad 22 is in circumferential four sides of mounting base 21.
Further, radiating groove 23 and heating column 24 are provided in mounting base 21, wherein between heating column 24 and radiating groove 23
Every being arranged alternately.Wherein, heating column 24 is for conducting generated heat when IC chip 3 works, and radiating groove 23 is for distributing electricity
Heat on road plate 1 and IC chip 3, to guarantee that heat caused by IC chip 3 can be distributed effectively, to guarantee
IC chip 3 can preferably work.
In specific application scenarios, radiating groove 23 includes the first sub- radiating groove 231 and the second sub- radiating groove 232, the
There is preset interval between one sub- radiating groove 231 and the second sub- radiating groove 232, meanwhile, the first sub- radiating groove 231 and second
Sub- radiating groove 232 along mounting base 21 wherein the pad 22 of side distribution arrangement extend.Wherein, the first sub- radiating groove 231 and
Interval between two sub- radiating grooves 232 is according to depending on actual conditions.In a preferred embodiment, the first sub- radiating groove 231 with
The intermediate region of mounting base 21 is arranged in second sub- radiating groove 232.Certainly, the number for the sub- radiating groove that radiating groove 23 is included is not
It is specifically limited, according to depending on actual conditions.In general, 3 size of IC chip is larger or the operating power of IC chip 3 is biggish
When, the number of sub- radiating groove can be increased.
In a preferred embodiment, for the ease of wiring, the sub- radiating groove to extend in the same direction can not have to continuous
Setting, it can be understood as, sub- radiating groove can also be made of multiple sub- radiating groove units, the electricity between every sub- radiating groove unit
Road plate 1 is not open, and can be used for line layout.
Meanwhile heating column 24 includes the first sub- heating column 241, the second sub- heating column 242 and the sub- heating column 243 of third,
And first sub- radiating groove 231 be arranged between the first sub- heating column 241 and the second sub- heating column 242 and the second sub- radiating groove
232 are arranged between the second sub- heating column 242 and the sub- heating column 243 of third, so that heating column 24 and 23 alternate intervals of radiating groove
Setting.
Specifically, the first sub- heating column 241, the second sub- heating column 242 and the sub- heating column 243 of third correspondence include
Multiple thermally conductive pole units 244, the thermally conductive pole unit 244 in each sub- heating column is along the extension direction of the first sub- radiating groove 231 point
Cloth, and the interval between thermally conductive pole unit 244 is according to depending on actual conditions.Wherein, thermally conductive pole unit 244 be copper post or iron prop or
The material of aluminium column, thermally conductive pole unit 244 is not specifically limited, and guarantees thermally conductive pole unit 244 thermal coefficient with higher,
To guarantee the heat derives that thermally conductive pole unit 244 can timely generate IC chip 3.
In one of them embodiment, thermally conductive pole unit 244 is detachably connected with the formation of circuit board 1.Specifically, pacify
It is provided with threaded hole on dress seat 21, the screw thread to match with threaded hole, thermally conductive pole unit 244 are provided on thermally conductive pole unit 244
It is detachably connected by threaded hole and the formation of circuit board 1, and thermally conductive pole unit is adjusted by threaded hole in thermally conductive pole unit 244
244 height relative to mounting base 21, to adapt to different types of IC chip 3.
In the actual production process, after the pin 31 of IC chip 3 and pad 22 weld, the surface of thermally conductive pole unit 244
It is contacted with IC chip 3, thermally conductive pole unit 244 quickly conducts the heat that IC chip 3 generates to circuit board 1, then by dissipating
23 Quick diffusing of heat channel is gone out.But IC chip 3 has part of the surface not contact with thermally conductive pole unit 244, then corresponding geothermal flow
What is distributed is relatively slow, and in order to solve this problem, radiator further includes thermally conductive tin cream 25, thermally conductive tin cream 25 be filled in heating column 25 with
Between the pin 31 of IC chip 3, so that the part of the surface of IC chip 3 is contacted with thermally conductive tin cream 25, thermally conductive tin cream 25 is by IC chip 3
The heat of generation is quickly conducted to circuit board 1.As shown in figure 3, thermally conductive tin cream 25 is filled in pin 31 and thermally conductive pole unit
Between 244, thermally conductive tin cream 25 is contacted with the surface of IC chip 3, then thermally conductive pole unit 244 cooperates jointly with thermally conductive tin cream 25 by IC
The heat that chip 3 generates quickly is conducted to circuit board 1, is then gone out, be can achieve more by 23 Quick diffusing of radiating groove again
Good heat dissipation effect.In alternative embodiments, thermally conductive tin cream 25 can also be replaced with thermally conductive mud, heat-conducting block or heat conductive silica gel
It changes, is selected according to actual conditions, be not specifically limited herein.
In a preferred embodiment, radiating groove 23 is through slot, and radiating groove 23 runs through circuit board 1, that is, the first sub- radiating groove
231 and second sub- radiating groove 232 correspond to through slot, the first sub- radiating groove 231 and the second sub- radiating groove 232 run through circuit board 1,
It designs by this method, using cross-ventilated effect, accelerated heat is distributed, the further radiating efficiency for promoting IC chip 3.
In practical application scene, when the IC chip 3 being arranged on circuit board 1 is more, between adjacent IC chip 3
Heat can be overlapped mutually, it is easy to form tropical island effect.In order to solve this problem, the application is set by the way of irregularly arranging
IC chip 3 is set, the space of circuit board 3 can not only be made full use of, and the spacing between IC chip 3 can be adjusted to most
Greatly.In one of them embodiment, as shown in figure 4, multiple chips prepackage position 2 is arranged in Z-shaped on the circuit card 1, into
And IC chip 3 is distributed in Z-shaped on the circuit card 1, when arranging in this manner, with a line between adjacent IC chip 3
Distance can be set relatively large, do not go together between the distance between IC chip 3 can be set it is relatively small, in this way,
The distance between each IC chip 3 IC chip 3 adjacent thereto is larger, the heat synergistic effect between different IC chips 3 compared with
It is small, and then guarantee that IC chip 3 works normally.
Herein, it should be noted that the arrangement of chip prepackage position 2 on the circuit card 1 is not limited to Z-shaped arrangement, can also
Other staggered modes are thought, so that the arrangement of IC chip 3 on the circuit card 1 is irregular.As shown in figure 5, another
In one embodiment, to avoid tropical island effect, the adjacent chip prepackage position 2 that do not go together shifts to install on the circuit card 1, in turn
So that adjacent 3 arranged in dislocation of IC chip that do not go together is on the circuit card 1, increase the distance between different IC chips 3, and then reduce
The effect that heat is superimposed between different IC chips 3.In practical application scene, chip pre-installs the arrangement side of position 2 on the circuit card 1
Formula is according to depending on actual conditions.
It is different from the prior art, the radiator of the application includes：The multiple cores of circuit board and setting on circuit boards
Piece pre-installs position；It includes mounting base and the pad that mounting base periphery is arranged in that chip, which pre-installs position, is provided with radiating groove in mounting base
And heating column, heating column and radiating groove interval are arranged；Pad is used to weld the pin of IC chip, and heating column is for conducting IC chip
Generated heat when work, radiating groove are used to distribute the heat in circuit board and IC chip.The radiator of the application is logical
It crosses heating column to conduct heat caused by IC chip to circuit board, then is quickly dissipated heat by the radiating groove on circuit board
It sends out, and then effectively promotes the radiating efficiency of powerful IC chip.
Illustrate again, above is only an example of the present application, is not intended to limit the scope of the patents of the application, it is all
It is special using technology between equivalent structure or equivalent flow shift made by present specification and accompanying drawing content, such as each embodiment
Sign be combined with each other, be applied directly or indirectly in other relevant technical fields, similarly include the application patent protect
It protects in range.
Claims (10)
1. a kind of radiator, the radiator is used to radiate to the IC chip of setting on circuit boards, which is characterized in that packet
It includes：Circuit board and the multiple chips being arranged on the circuit board pre-install position；
Chip prepackage position includes mounting base and the pad that the mounting base periphery is arranged in, and is provided in the mounting base
Radiating groove and heating column, the heating column and the radiating groove interval are arranged；
The pad is used to weld the pin of the IC chip, produced when the heating column is for conducting IC chip work
Heat, the radiating groove is used to distribute heat in the circuit board and the IC chip.
2. radiator according to claim 1, which is characterized in that the radiating groove includes the first sub- radiating groove and the
Two sub- radiating grooves have preset interval between the first sub- radiating groove and the second sub- radiating groove；
The pad distribution arrangement of the first sub- radiating groove and the second sub- radiating groove along the mounting base wherein side prolongs
Exhibition.
3. radiator according to claim 2, which is characterized in that the heating column includes the first sub- heating column, second
Sub- heating column and the sub- heating column of third；The first sub- radiating groove setting is led in the described first sub- heating column and second son
Between plume and the second sub- radiating groove is arranged between the described second sub- heating column and the sub- heating column of the third.
4. radiator according to claim 3, which is characterized in that the first sub- heating column, second son are thermally conductive
It includes multiple thermally conductive pole units that column and the sub- heating column of the third, which correspond to, and the thermally conductive pole unit in each sub- heating column is along institute
State the extension directional spreding of the first sub- radiating groove.
5. radiator according to claim 4, which is characterized in that the thermally conductive pole unit is copper post.
6. radiator according to claim 4, which is characterized in that the thermally conductive pole unit and circuit board formation can
Dismantling connection.
7. radiator according to claim 6, which is characterized in that threaded hole is provided in the mounting base, it is described to lead
The screw thread to match with the threaded hole is provided on plume unit, the thermally conductive pole unit passes through the threaded hole and the electricity
Plate formation in road is detachably connected, and the thermally conductive pole unit is adjusted relative to institute by the threaded hole in the thermally conductive pole unit
State the height of mounting base.
8. radiator according to claim 1, which is characterized in that the radiator further includes thermally conductive tin cream, described
Thermally conductive tin cream is filled between the heating column and the pin of the IC chip.
9. radiator according to claim 1, which is characterized in that the multiple chip prepackage position is on the circuit board
It arranges in Z-shaped.
10. radiator according to claim 1, which is characterized in that the pad is metal pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810728286.3A CN108882504B (en) | 2018-07-05 | 2018-07-05 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810728286.3A CN108882504B (en) | 2018-07-05 | 2018-07-05 | Heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108882504A true CN108882504A (en) | 2018-11-23 |
| CN108882504B CN108882504B (en) | 2023-11-21 |
Family
ID=64299390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810728286.3A Active CN108882504B (en) | 2018-07-05 | 2018-07-05 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108882504B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620089A (en) * | 2019-08-15 | 2019-12-27 | 安徽国晶微电子有限公司 | Power chip packaging structure |
| CN112752395A (en) * | 2020-12-16 | 2021-05-04 | 深圳市诚之益电路有限公司 | Heat radiation structure and smart machine of circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020014351A1 (en) * | 2000-06-01 | 2002-02-07 | Murata Manufacturing Co., Ltd. | Module-mounting motherboard device |
| CN102074518A (en) * | 2009-11-11 | 2011-05-25 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and conductive trace |
| CN103179781A (en) * | 2013-01-06 | 2013-06-26 | 中国电子科技集团公司第十研究所 | Method for improving thermal conduction capability of printed board of surface-mounted device |
| CN108112169A (en) * | 2018-01-31 | 2018-06-01 | 深圳市德彩光电有限公司 | A kind of circuit board radiating device for IC chip |
| CN208338005U (en) * | 2018-07-05 | 2019-01-04 | 深圳市德彩光电有限公司 | A kind of radiator |
-
2018
- 2018-07-05 CN CN201810728286.3A patent/CN108882504B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020014351A1 (en) * | 2000-06-01 | 2002-02-07 | Murata Manufacturing Co., Ltd. | Module-mounting motherboard device |
| CN102074518A (en) * | 2009-11-11 | 2011-05-25 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and conductive trace |
| CN103179781A (en) * | 2013-01-06 | 2013-06-26 | 中国电子科技集团公司第十研究所 | Method for improving thermal conduction capability of printed board of surface-mounted device |
| CN108112169A (en) * | 2018-01-31 | 2018-06-01 | 深圳市德彩光电有限公司 | A kind of circuit board radiating device for IC chip |
| CN208338005U (en) * | 2018-07-05 | 2019-01-04 | 深圳市德彩光电有限公司 | A kind of radiator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620089A (en) * | 2019-08-15 | 2019-12-27 | 安徽国晶微电子有限公司 | Power chip packaging structure |
| CN112752395A (en) * | 2020-12-16 | 2021-05-04 | 深圳市诚之益电路有限公司 | Heat radiation structure and smart machine of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108882504B (en) | 2023-11-21 |
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