CN214046473U - Novel circuit board radiator structure - Google Patents
Novel circuit board radiator structure Download PDFInfo
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- CN214046473U CN214046473U CN202022946669.3U CN202022946669U CN214046473U CN 214046473 U CN214046473 U CN 214046473U CN 202022946669 U CN202022946669 U CN 202022946669U CN 214046473 U CN214046473 U CN 214046473U
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- circuit board
- mos tube
- mos
- heat dissipation
- tube
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 10
- 239000007769 metal material Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model discloses a novel circuit board radiator structure, which comprises a circuit board, wherein a heat dissipation structure is arranged above the circuit board, and a first MOS tube, a second MOS tube, a third MOS tube and a fourth MOS tube are sequentially arranged between the circuit board and the heat dissipation structure; the pin that the liner and heat dissipation metal liner one end fixed connection have, first MOS pipe, the second MOS pipe, third MOS pipe and fourth MOS pipe have the same structure each other, it uses as the heavy current conductor on heat radiation structure to fix the heat dissipation metal liner with the MOS pipe, the heavy current return circuit length has been shortened, the problem that the circuit board generates heat the high temperature has effectively been solved, on the basis of traditional welding of keeping flat the SMD MOS pipe on the circuit board simultaneously, the upright welding mode has been increased, the size of circuit board has been reduced, the space utilization is improved, simple structure has been realized, the radiating effect is good, advantages such as small.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to novel circuit board radiator structure.
Background
The functional structure of the present electronic device is more complex, a plurality of surface mount type packaged MOS tubes are generally needed, the MOS tubes are high-current power devices, the working current is high, the heat generation is high during the working, the vertical direct insertion type structure is difficult to meet the high current due to the large current contact pin, so the MOS tubes of the present traditional controller are flatly welded on a circuit board in the mounting process, and meanwhile, the circuit board is provided with a copper bar conductor for expanding the current so as to meet the requirement of the high current; meanwhile, the MOS tube is cooled by welding the MOS tube cooling metal substrate on the circuit board, so that a large number of MOS tubes occupy the space of the circuit board, the size of the circuit board is difficult to shrink along with the increase of the amount of the MOS tubes, the heat generated by the MOS tubes cannot be effectively dissipated, and the temperature of other components on the circuit board is increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a novel circuit board radiator structure just in order to solve above-mentioned problem, have simple structure, the radiating effect is good, advantage such as occupation space is little, see the explanation below for details.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a novel circuit board radiator structure, which comprises a circuit board, wherein a heat dissipation structure is arranged above the circuit board, and a first MOS tube, a second MOS tube, a third MOS tube and a fourth MOS tube are sequentially arranged between the circuit board and the heat dissipation structure;
the second MOS tube comprises a heat dissipation metal lining body and pins fixedly connected with one end of the heat dissipation metal lining body, the first MOS tube, the second MOS tube, the third MOS tube and the fourth MOS tube have the same structure, the heat dissipation metal lining bodies of the first MOS tube, the second MOS tube, the third MOS tube and the fourth MOS tube are connected to the heat dissipation structure, and the pins of the first MOS tube, the second MOS tube, the third MOS tube and the fourth MOS tube are connected to the circuit board;
wherein the stitch of second MOS pipe and third MOS pipe is the type of cutting straightly, and the stitch of first MOS pipe and fourth MOS pipe is right angle bending type.
Preferably, four supporting fasteners distributed in an array manner are arranged between the circuit board and the heat dissipation structure, the lower ends of the four supporting fasteners are fixedly connected to the circuit board, and the upper ends of the four supporting fasteners are connected with the heat dissipation structure through bolts.
Preferably, the heat dissipation metal linings of the first MOS transistor, the second MOS transistor, the third MOS transistor and the fourth MOS transistor are all fixedly connected to the heat dissipation structure through pipe fasteners.
Preferably, four groups of channels are formed in the heat dissipation structure, so that two groups of first MOS tubes and four groups of fourth MOS tubes can be horizontally fixed and two groups of second MOS tubes and three groups of third MOS tubes can be vertically fixed.
Preferably, pins of the first MOS transistor, the second MOS transistor, the third MOS transistor and the fourth MOS transistor are all fixed on the circuit board in a welding mode.
Preferably, the number of the pins is more than three, and the three pins are fixedly connected to the heat dissipation metal lining body in a parallel distribution mode. The heat dissipation structure is made of metal materials.
Preferably, the heat dissipation structure is made of a metal material.
Has the advantages that: through fixing the heat dissipation metal lining body with the MOS pipe and using as heavy current conductor on heat radiation structure, reduced heavy current return circuit length, effectively solved the too high problem of temperature that generates heat of circuit board, on the basis of the welding on the circuit board is kept flat with SMD MOS pipe to the tradition simultaneously, increased upright welding mode, reduced the circuit board size, improved space utilization, realized simple structure, the radiating effect is good, advantages such as small.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of the present invention;
figure 2 is a left side view of figure 1 of the present invention;
figure 3 is a perspective view of figure 1 of the present invention;
fig. 4 is a perspective view of a first MOS transistor of the present invention.
The reference numerals are explained below: 1. a circuit board; 2. supporting a fastener; 3. a first MOS transistor; 4. a heat dissipation structure; 5. a pipe fastener; 6. a second MOS transistor; 601. a heat dissipating metal liner; 602. a stitch; 7. a third MOS transistor; 8. and a fourth MOS transistor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a novel circuit board heat sink structure, which includes a circuit board 1, a heat sink structure 4 disposed above the circuit board 1, and a first MOS transistor 3, a second MOS transistor 6, a third MOS transistor 7 and a fourth MOS transistor 8 disposed between the circuit board 1 and the heat sink structure 4 in sequence; the second MOS tube 6 comprises a heat dissipation metal liner 601 and a pin 602 fixedly connected to one end of the heat dissipation metal liner 601, the first MOS tube 3, the second MOS tube 6, the third MOS tube 7 and the fourth MOS tube 8 have the same structure, the heat dissipation metal liners 601 of the first MOS tube 3, the second MOS tube 6, the third MOS tube 7 and the fourth MOS tube 8 are all connected to the heat dissipation structure 4, and the pins 602 of the first MOS tube 3, the second MOS tube 6, the third MOS tube 7 and the fourth MOS tube 8 are connected to the circuit board 1; pins 602 of the second MOS transistor 6 and the third MOS transistor 7 are in a straight insertion type, and pins 602 of the first MOS transistor 3 and the fourth MOS transistor 8 are in a right-angle bending type.
Four supporting fasteners 2 distributed in an array mode are arranged between the circuit board 1 and the heat dissipation structure 4, the lower ends of the four supporting fasteners 2 are fixedly connected to the circuit board 1, and the upper ends of the four supporting fasteners 2 are connected with the heat dissipation structure 4 through bolts.
The heat dissipation metal liners 601 of the first MOS transistor 3, the second MOS transistor 6, the third MOS transistor 7 and the fourth MOS transistor 8 are all fixedly connected to the heat dissipation structure 4 through the pipe fasteners 5.
The heat radiation structure 4 is internally provided with four groups of channels which can horizontally fix two groups of first MOS tubes 3 and fourth MOS tubes 8 and vertically fix two groups of second MOS tubes 6 and third MOS tubes 7, wherein the MOS tubes of each channel can be arranged in a plurality of MOS tubes, and the MOS tubes are arranged in an array mode.
More than three pins 602 are provided, and the three pins 602 are fixedly connected to the heat dissipation metal lining 601 in a parallel distribution manner. The heat dissipation structure 4 is made of a metal material.
The heat dissipation structure 4 is made of a metal material. For facilitating heat dissipation to the heat dissipating metal liner 601.
Adopt above-mentioned structure, at first weld the stitch 602 of the first MOS pipe 3 of MOS pipe, second MOS pipe 6, third MOS pipe 7 and fourth MOS pipe 8 on circuit board 1, there are several screw holes on heat radiation structure 4, the heat dissipation metal lining body 601 of MOS pipe passes through pipe fastener 5 to be fixed it on heat radiation structure 4 through the screw hole, heat radiation structure 4's inside has 4 group's passageways and can divide into 2 groups of formula of keeping flat fixed and 2 groups of vertical fixed with the MOS pipe.
The utility model has the advantages that: through fixing the heat dissipation metal lining body 601 with the MOS pipe on heat radiation structure 4 and using as the heavy current conductor, reduced heavy current return circuit length, effectively solved the too high problem of temperature that generates heat of circuit board 1, on the basis of the welding on the circuit board is kept flat with SMD MOS pipe to the tradition simultaneously, increased upright welding mode, reduced the circuit board size, improved space utilization, realized simple structure, the radiating effect is good, advantages such as small.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. The utility model provides a novel circuit board radiator structure which characterized in that: the circuit board comprises a circuit board (1), wherein a heat dissipation structure (4) is arranged above the circuit board (1), and a first MOS tube (3), a second MOS tube (6), a third MOS tube (7) and a fourth MOS tube (8) are sequentially arranged between the circuit board (1) and the heat dissipation structure (4);
the second MOS tube (6) comprises a heat dissipation metal lining body (601) and pins (602) fixedly connected with one end of the heat dissipation metal lining body (601), the first MOS tube (3), the second MOS tube (6), the third MOS tube (7) and the fourth MOS tube (8) have the same structure, the heat dissipation metal lining bodies (601) of the first MOS tube (3), the second MOS tube (6), the third MOS tube (7) and the fourth MOS tube (8) are connected to the heat dissipation structure (4), and the pins (602) of the first MOS tube (3), the second MOS tube (6), the third MOS tube (7) and the fourth MOS tube (8) are connected to the circuit board (1);
pins (602) of the second MOS tube (6) and the third MOS tube (7) are in a direct insertion type, and pins (602) of the first MOS tube (3) and the fourth MOS tube (8) are in a right-angle bending type.
2. The novel circuit board heat sink structure of claim 1, wherein: four supporting fasteners (2) distributed in an array mode are arranged between the circuit board (1) and the heat dissipation structure (4), the lower ends of the four supporting fasteners (2) are fixedly connected to the circuit board (1), and the upper ends of the four supporting fasteners (2) are connected with the heat dissipation structure (4) through bolts.
3. The novel circuit board heat sink structure of claim 1, wherein: and the heat dissipation metal lining bodies (601) of the first MOS tube (3), the second MOS tube (6), the third MOS tube (7) and the fourth MOS tube (8) are fixedly connected to the heat dissipation structure (4) through tube fasteners (5).
4. The novel circuit board heat sink structure of claim 1, wherein: four groups of channels are formed inside the heat dissipation structure (4) and can horizontally fix two groups of first MOS tubes (3) and fourth MOS tubes (8) and vertically fix two groups of second MOS tubes (6) and third MOS tubes (7).
5. The novel circuit board heat sink structure of claim 1, wherein: pins (602) of the first MOS tube (3), the second MOS tube (6), the third MOS tube (7) and the fourth MOS tube (8) are all fixed on the circuit board (1) in a welding mode.
6. The novel circuit board heat sink structure of claim 1, wherein: more than three pins (602) are arranged, and the three pins (602) are fixedly connected to the heat dissipation metal lining body (601) in a parallel distribution mode.
7. The novel circuit board heat sink structure of claim 1, wherein: the heat dissipation structure (4) is made of metal materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022946669.3U CN214046473U (en) | 2020-12-11 | 2020-12-11 | Novel circuit board radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022946669.3U CN214046473U (en) | 2020-12-11 | 2020-12-11 | Novel circuit board radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214046473U true CN214046473U (en) | 2021-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022946669.3U Active CN214046473U (en) | 2020-12-11 | 2020-12-11 | Novel circuit board radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214046473U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114476095A (en) * | 2022-03-18 | 2022-05-13 | 中航(成都)无人机系统股份有限公司 | Power supply nacelle switching beam, power supply control system and unmanned aerial vehicle |
-
2020
- 2020-12-11 CN CN202022946669.3U patent/CN214046473U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114476095A (en) * | 2022-03-18 | 2022-05-13 | 中航(成都)无人机系统股份有限公司 | Power supply nacelle switching beam, power supply control system and unmanned aerial vehicle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A New Circuit Board Heat Sink Structure Effective date of registration: 20231008 Granted publication date: 20210824 Pledgee: Xi'an innovation financing Company limited by guarantee Pledgor: Xi'an Nova Electronic Technology Co.,Ltd. Registration number: Y2023980060236 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |