CN207410588U - A kind of copper base of perfect heat-dissipating - Google Patents
A kind of copper base of perfect heat-dissipating Download PDFInfo
- Publication number
- CN207410588U CN207410588U CN201721402239.7U CN201721402239U CN207410588U CN 207410588 U CN207410588 U CN 207410588U CN 201721402239 U CN201721402239 U CN 201721402239U CN 207410588 U CN207410588 U CN 207410588U
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- Prior art keywords
- substrate
- copper base
- layer
- dissipating
- perfect heat
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- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a kind of copper bases of perfect heat-dissipating, including substrate (10), substrate (10) upper surface is equipped with insulating layer (20), insulating layer (20) upper surface is equipped with circuit layer (30), and circuit layer (30) upper surface is equipped with film layer (40)；Described substrate (10) upper surface is extended with the horizontal stripe (11) for stretching into insulating layer (20), and the lower surface of substrate (10) is equipped with vertical slot (12).The utility model has the characteristics that perfect heat-dissipating and structural strength are high.
Description
Technical field
The utility model is related to a kind of copper bases, particularly a kind of copper base of perfect heat-dissipating.
Background technology
As the density of component on wiring board is increasing, signaling rate is gradually accelerated, the power of wiring board
Increase therewith, at the same it is higher and higher to the high frequency requirements of wiring board.Metal substrate, especially copper base, due to good
Capability of electromagnetic shielding has been more and more widely used in printed wiring board.Since copper base is often larger applied to power
Equipment, therefore generate heat into influencing the problem of maximum.Existing copper base causes its service life since heat dissipation performance is general
It is undesirable with stability.In addition existing copper substrate structure intensity is poor, and bending resistance is general.
Utility model content
The purpose of this utility model is that provide a kind of copper base of perfect heat-dissipating.The utility model has thermal diffusivity
The characteristics of energy is well and structural strength is high.
The technical solution of the utility model：A kind of copper base of perfect heat-dissipating, including substrate, upper surface of base plate is equipped with exhausted
Edge layer, insulating layer upper surface are equipped with circuit layer, and circuit layer upper surface is equipped with film layer；The upper surface of base plate, which is extended with, to be stretched into
The horizontal stripe of insulating layer, the lower surface of substrate are equipped with vertical slot.
In a kind of copper base of foregoing perfect heat-dissipating, the horizontal stripe is mutually perpendicular to vertical slot.
In a kind of copper base of foregoing perfect heat-dissipating, the circuit layer is equipped with lacking for arranging electronic element
Mouthful, heat conductive pad is equipped in notch.
In a kind of copper base of foregoing perfect heat-dissipating, it is additionally provided on the copper base in the perforative peace of thickness direction
Hole is filled, the base lower surface is equipped with mounting platform corresponding with mounting hole.
In a kind of copper base of foregoing perfect heat-dissipating, the inner wall of the hole installing is equipped with cured layer.
In a kind of copper base of foregoing perfect heat-dissipating, the lower surface of the substrate is equipped with Gold plated Layer
Compared with prior art, the upper surface of base plate of the utility model is extended with the horizontal stripe for going deep into insulating layer, and lower surface is set
There is vertical slot.Copper base is again to the heat loss through conduction of copper base, therefore the utility model is set on substrate from circuit layer to insulating layer
Structure can effectively improve heat loss through conduction efficiency at two put, expand heat dissipation area, improve whole heat-sinking capability.Meanwhile horizontal stripe
The bending resistance of substrate in one direction can be improved, vertical slot can improve the bending resistance of substrate in the other directions,
Thus substrate and whole structural strength are improved.
Further, horizontal stripe is mutually perpendicular to vertical slot, and being arranged such can make the structural strength of substrate reach maximum.
Further, the heat that the utility model is generated electronic component using heat conductive pad quickly exports to insulation
Layer accelerates heat dissipation.
Further, the utility model is equipped with mounting platform corresponding with mounting hole, mounting platform in base lower surface
It can ensure the mounting stability of the utility model.
Further, the Gold plated Layer of the utility model improves substrate in the preceding raising for not influencing substrate heat dissipation performance
Wear-resisting property, while can also prevent copper oxidation from reducing heat dissipation effect.
To sum up, the utility model has the characteristics that perfect heat-dissipating and structural strength are high.In addition, the utility model installation is steady
Gu wear-resisting property is preferable.
Description of the drawings
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is the bottom view of the utility model.
Reference numeral：10- substrates, 11- horizontal stripes, 12- vertical slots, 13- mounting platforms, 20- insulating layers, 30- circuit layers, 31-
Notch, 40- film layers, 50- mounting holes, 51- cured layers, 60- Gold plated Layers, 70- heat conductive pads, 200- electronic components.
Specific embodiment
With reference to embodiment, the utility model is described in further detail, but be not intended as to the utility model limitation according to
According to.
Embodiment：A kind of copper base of perfect heat-dissipating is formed as shown in Figure 1, including substrate 10,10 upper surface of substrate is set
There is insulating layer 20,20 upper surface of insulating layer is equipped with circuit layer 30, and 30 upper surface of circuit layer is equipped with film layer 40；The substrate 10
Upper surface is extended with the horizontal stripe 11 for stretching into insulating layer 20, and the lower surface of substrate 10 is equipped with vertical slot 12.
It is clear that the substrate 10 of the utility model is copper；The insulating layer 20 is generally using alundum (Al2O3), silica flour
With the mixture of epoxy resin composition；Epoxy resin insulating varnish can be used in the film layer 40, and the main function of this layer is to carry
For insulation protection and weaken 30 oxidation effect of circuit layer.
The horizontal stripe 11 is mutually perpendicular to vertical slot 12.
The circuit layer 30 is equipped with the notch 31 for arranging electronic element 200, and heat conductive pad 70 is equipped in notch 31.Institute
Heat conductive silica gel can be used in the heat conductive pad 70 stated.The feature that described 200 non-the utility model of electronic component includes.
Be additionally provided on the copper base in the perforative mounting hole 50 of thickness direction, 10 lower surface of substrate be equipped with
50 corresponding mounting platform 13 of mounting hole, as shown in Figure 2.50 inner wall of mounting hole is equipped with cured layer 51.The curing
Furan no-bake resin can be used in layer 51.Common line plate is installed using substrate itself tap out, hard in itself yet with substrate
Degree is inadequate, and this screw thread cannot be used for multiple times.Therefore the utility model is provided with the protection installation screw thread of cured layer 51, makes copper base
It can repeatedly install.
The lower surface of the substrate 10 is equipped with Gold plated Layer 60.
Operation principle：10 upper surface of substrate of the utility model is extended with the horizontal stripe 11 for going deep into insulating layer 20, and lower surface is set
There is vertical slot 12.Copper base is therefore the utility model again to the heat loss through conduction of copper substrate 10 from circuit layer 30 to insulating layer 20
Structure can effectively improve heat loss through conduction efficiency at two set on the substrate 10, expand heat dissipation area, improve whole heat radiation energy
Power.The heat that electronic component generates quickly additionally is exported into insulating layer 20 using heat conductive pad 70, accelerates heat dissipation.Together
When, horizontal stripe 11 can improve the bending resistance of substrate 10 in one direction, and vertical slot 12 can improve substrate 20 in another direction
On bending resistance, it is and best to the structural strengthening effect of substrate 10 when horizontal stripe 11 and vertical slot 12 are mutually perpendicular to.
Further, since 10 lower surface of the utility model substrate is due to the not flat bed of vertical slot 12, in mounting hole 50 in following table
The face place of being pierced by is equipped with mounting platform, ensures the stability of installation.Meanwhile the utility model set in 10 lower surface of substrate it is gold-plated
Layer 60 is used to improve the wear-resisting property of substrate and prevents copper oxidation reduction heat dissipation effect.
Claims (6)
1. a kind of copper base of perfect heat-dissipating, it is characterised in that：Including substrate (10), substrate (10) upper surface is equipped with insulating layer
(20), insulating layer (20) upper surface is equipped with circuit layer (30), and circuit layer (30) upper surface is equipped with film layer (40)；The substrate
(10) upper surface is extended with the horizontal stripe (11) for stretching into insulating layer (20), and the lower surface of substrate (10) is equipped with vertical slot (12).
2. a kind of copper base of perfect heat-dissipating according to claim 1, it is characterised in that：The horizontal stripe (11) is with erecting
Slot (12) is mutually perpendicular to.
3. a kind of copper base of perfect heat-dissipating according to claim 1, it is characterised in that：The circuit layer (30) is set
The notch (31) of arranging electronic element (200) is useful for, heat conductive pad (70) is equipped in notch (31).
4. a kind of copper base of perfect heat-dissipating according to Claims 2 or 3, it is characterised in that：On the copper base
It is additionally provided in the perforative mounting hole of thickness direction (50), the substrate (10) lower surface is equipped with peace corresponding with mounting hole (50)
Assembling platform (13).
5. a kind of copper base of perfect heat-dissipating according to claim 4, it is characterised in that：In the mounting hole (50)
Wall is equipped with cured layer (51).
6. a kind of copper base of perfect heat-dissipating according to claim 1, it is characterised in that：Under the substrate (10)
Surface is equipped with Gold plated Layer (60).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721402239.7U CN207410588U (en) | 2017-10-27 | 2017-10-27 | A kind of copper base of perfect heat-dissipating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721402239.7U CN207410588U (en) | 2017-10-27 | 2017-10-27 | A kind of copper base of perfect heat-dissipating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207410588U true CN207410588U (en) | 2018-05-25 |
Family
ID=62408916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721402239.7U Active CN207410588U (en) | 2017-10-27 | 2017-10-27 | A kind of copper base of perfect heat-dissipating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207410588U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI700019B (en) * | 2018-10-26 | 2020-07-21 | 大陸商業成科技（成都）有限公司 | Printed circuit board and manufacturing method thereof |
-
2017
- 2017-10-27 CN CN201721402239.7U patent/CN207410588U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI700019B (en) * | 2018-10-26 | 2020-07-21 | 大陸商業成科技（成都）有限公司 | Printed circuit board and manufacturing method thereof |
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