CN105934080A - Double-side heat dissipation flexible printed circuit board - Google Patents
Double-side heat dissipation flexible printed circuit board Download PDFInfo
- Publication number
- CN105934080A CN105934080A CN201610570245.7A CN201610570245A CN105934080A CN 105934080 A CN105934080 A CN 105934080A CN 201610570245 A CN201610570245 A CN 201610570245A CN 105934080 A CN105934080 A CN 105934080A
- Authority
- CN
- China
- Prior art keywords
- insulating layer
- layer
- soft insulating
- heat dissipation
- soft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
Abstract
The invention discloses a double-side heat dissipation flexible printed circuit board which comprises a circuit layer, a first soft insulating layer and a second soft insulating layer. A first heat dissipation layer is arranged in the first soft insulating layer, a second heat dissipation layer is arranged in the second soft insulating layer, first heat dissipation holes which point to the first heat dissipation layer are formed in the first soft insulating layer, second heat dissipation holes which point to the second heat dissipation layer are formed in the second soft insulating layer, a component which is linearly connected with the circuit layer is arranged on the upper side of the first soft insulating layer, and a mounting hole which points to the circuit layer is formed in the first soft insulating layer and is formed in a position below the component. Owing to the mode, the double-side heat dissipation flexible printed circuit board has the advantages that the double-side heat dissipation flexible printed circuit board is soft in texture, the heat conducting properties of the first soft insulating layer and the second soft insulating layer can be enhanced by the first heat dissipation layer and the second heat dissipation layer, accordingly, the problem of local overheating due to a large quantity of heat generated by partial components can be solved, and the service stability and safety can be enhanced.
Description
Technical field
The present invention relates to field of circuit boards, particularly relate to the FPC of a kind of two sides heat radiation.
Background technology
Along with the progress of production technology, the volume of part digital equipment is more and more less, and such as mobile phone, flat board and notebook computer are just towards lightening development.Due to reduced space, installing space is limited, generally uses FPC to carry out the hardboard that Substitute For Partial is traditional in digital equipment.
FPC space availability ratio is high, flexible arrangement, and the digital equipment being suitable for narrow space uses, but due to limited space, the heat that element produces is assembled and is difficult to dispel the heat, and easily causes hot-spot and the problem damaged.
Summary of the invention
The technical problem that present invention mainly solves is to provide the FPC of a kind of two sides heat radiation, promotes the thermal diffusivity of FPC upper and lower surface.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide the FPC dispelled the heat in a kind of two sides, including: line layer, first soft insulating layer and the second soft insulating layer, described line layer is arranged between the first soft insulating layer and the second soft insulating layer, described first soft insulating layer is provided with the first heat dissipating layer, described second soft insulating layer is provided with the second heat dissipating layer, the first louvre pointing to the first heat dissipating layer it is provided with on described first soft insulating layer, the second louvre pointing to the second heat dissipating layer it is provided with on described second soft insulating layer, described first soft insulating layer is provided above and the element of line layer linearly connected, the installing hole pointing to line layer being positioned at below element it is provided with on described first soft insulating layer.
In a preferred embodiment of the present invention, described first soft insulating layer and the second soft insulating layer are respectively polyimides soft board.
In a preferred embodiment of the present invention, between described line layer and the first soft insulating layer, it is provided with the first tack coat.
In a preferred embodiment of the present invention, between described line layer and the second soft insulating layer, it is provided with the second tack coat.
In a preferred embodiment of the present invention, described first heat dissipating layer and the second heat dissipating layer are respectively Copper Foil or aluminium foil, and described first heat dissipating layer is provided with the fabrication hole concentric with installing hole, and the diameter of described fabrication hole is more than the diameter of installing hole.
The invention has the beneficial effects as follows: the FPC of a kind of two sides heat radiation that the present invention points out, quality is soft, it is easy to arrangement, first heat dissipating layer and the second heat dissipating layer improve the first soft insulating layer and the heat conductivility of the second soft insulating layer, first louvre and the second louvre improve the first soft insulating layer and the radiating effect of the second soft insulating layer, two sides synchronizes heat radiation, it is to avoid the hot-spot problem that subelement quantity of heat production causes greatly, improves stability in use and security.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in describing embodiment below, the required accompanying drawing used is briefly described, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of FPC one preferred embodiment of a kind of two sides of present invention heat radiation.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
Referring to Fig. 1, the embodiment of the present invention includes:
A kind of FPC of two sides heat radiation, including: line layer the 3, first soft insulating layer 1 and the second soft insulating layer 2, described line layer 3 is arranged between the first soft insulating layer 1 and the second soft insulating layer 2, it is provided with the first tack coat 4 between described line layer 3 and the first soft insulating layer 1, it is provided with the second tack coat 5 between described line layer 3 and the second soft insulating layer 2, is connected firmly.
Described first soft insulating layer 1 and the second soft insulating layer 2 respectively polyimides soft board, good insulating, ageing-resistant, and also soft, it is simple to bending arrangement.
Being provided with the first heat dissipating layer 11 in described first soft insulating layer 1, be provided with the second heat dissipating layer 21 in described second soft insulating layer 2, described first heat dissipating layer 11 and the second heat dissipating layer 21 are respectively Copper Foil or aluminium foil, quality is frivolous, flexible, heat-transfer rate is fast, it is to avoid the problem of hot-spot.
The first louvre 14 pointing to the first heat dissipating layer it is provided with on described first soft insulating layer 1, it is provided with the second louvre 22 pointing to the second heat dissipating layer 21 on described second soft insulating layer 2, improves the first soft insulating layer 1 and radiating effect of the second soft insulating layer 2.
Described first soft insulating layer 1 is provided above and the element 6 of line layer 3 linearly connected, the installing hole 13 pointing to line layer 3 being positioned at below element 6 it is provided with on described first soft insulating layer 1, the connection facilitating element 6 is installed, it is provided with the fabrication hole 12 concentric with installing hole 13 on described first heat dissipating layer 11, the diameter of described fabrication hole 12 is more than the diameter of installing hole 13, it is to avoid short circuit problem.
In sum, the FPC of a kind of two sides heat radiation that the present invention points out, flexible, it is simple to install, good heat dissipation effect, use more stable.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the invention content to be made or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical field, the most in like manner it is included in the scope of patent protection of the present invention.
Claims (5)
1. the FPC of a two sides heat radiation, including: line layer, first soft insulating layer and the second soft insulating layer, described line layer is arranged between the first soft insulating layer and the second soft insulating layer, it is characterized in that, described first soft insulating layer is provided with the first heat dissipating layer, described second soft insulating layer is provided with the second heat dissipating layer, the first louvre pointing to the first heat dissipating layer it is provided with on described first soft insulating layer, the second louvre pointing to the second heat dissipating layer it is provided with on described second soft insulating layer, described first soft insulating layer is provided above and the element of line layer linearly connected, the installing hole pointing to line layer being positioned at below element it is provided with on described first soft insulating layer.
The FPC of two sides the most according to claim 1 heat radiation, it is characterised in that described first soft insulating layer and the second soft insulating layer are respectively polyimides soft board.
The FPC of two sides the most according to claim 1 heat radiation, it is characterised in that be provided with the first tack coat between described line layer and the first soft insulating layer.
The FPC of two sides the most according to claim 1 heat radiation, it is characterised in that be provided with the second tack coat between described line layer and the second soft insulating layer.
The FPC of two sides the most according to claim 1 heat radiation, it is characterized in that, described first heat dissipating layer and the second heat dissipating layer are respectively Copper Foil or aluminium foil, and described first heat dissipating layer is provided with the fabrication hole concentric with installing hole, and the diameter of described fabrication hole is more than the diameter of installing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610570245.7A CN105934080A (en) | 2016-07-20 | 2016-07-20 | Double-side heat dissipation flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610570245.7A CN105934080A (en) | 2016-07-20 | 2016-07-20 | Double-side heat dissipation flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105934080A true CN105934080A (en) | 2016-09-07 |
Family
ID=56828096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610570245.7A Pending CN105934080A (en) | 2016-07-20 | 2016-07-20 | Double-side heat dissipation flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105934080A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11665816B2 (en) | 2019-03-28 | 2023-05-30 | Huawei Technologies Co., Ltd. | Circuit board, method for manufacturing circuit board, and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101035407A (en) * | 2006-03-10 | 2007-09-12 | 三星电机株式会社 | Printed circuit board having metal core |
| CN201373278Y (en) * | 2009-01-14 | 2009-12-30 | 北京巨数数字技术开发有限公司 | LED light decoration |
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| CN203104941U (en) * | 2012-12-30 | 2013-07-31 | 东莞市合通电子有限公司 | A double-surface aluminum core circuit board |
| CN203219607U (en) * | 2013-04-03 | 2013-09-25 | 东莞市天禧光电科技有限公司 | High-heat-conduction flexible LED lead plate |
-
2016
- 2016-07-20 CN CN201610570245.7A patent/CN105934080A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101035407A (en) * | 2006-03-10 | 2007-09-12 | 三星电机株式会社 | Printed circuit board having metal core |
| CN201373278Y (en) * | 2009-01-14 | 2009-12-30 | 北京巨数数字技术开发有限公司 | LED light decoration |
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| CN203104941U (en) * | 2012-12-30 | 2013-07-31 | 东莞市合通电子有限公司 | A double-surface aluminum core circuit board |
| CN203219607U (en) * | 2013-04-03 | 2013-09-25 | 东莞市天禧光电科技有限公司 | High-heat-conduction flexible LED lead plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11665816B2 (en) | 2019-03-28 | 2023-05-30 | Huawei Technologies Co., Ltd. | Circuit board, method for manufacturing circuit board, and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160907 |