CN106211550A - A kind of flexible circuit board of top heat radiation - Google Patents
A kind of flexible circuit board of top heat radiation Download PDFInfo
- Publication number
- CN106211550A CN106211550A CN201610570226.4A CN201610570226A CN106211550A CN 106211550 A CN106211550 A CN 106211550A CN 201610570226 A CN201610570226 A CN 201610570226A CN 106211550 A CN106211550 A CN 106211550A
- Authority
- CN
- China
- Prior art keywords
- upper cover
- cover layer
- middle line
- circuit board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses the flexible circuit board of a kind of top heat radiation, including: upper cover layer, middle line layer and undercloak, described middle line layer is arranged between upper cover layer and undercloak, described upper cover layer is provided with fin, described upper cover layer be provided above several respectively with the element of middle line layer linearly connected, the fabrication hole being positioned at below element it is provided with on described fin, it is provided through fabrication hole in described upper cover layer and points to the through hole of middle line layer, described upper cover layer upper surface indent is provided with the louvre pointing to fin.By the way, the flexible circuit board of top of the present invention heat radiation, utilize fin to take away the heat of middle line layer and element, heat-transfer rate is fast, it is to avoid the problem of hot-spot, and the radiating rate of louvre is fast, improve the stability of use, flexible for installation, applied widely.
Description
Technical field
The present invention relates to wiring board art, particularly relate to the flexible circuit board of a kind of top heat radiation.
Background technology
Along with the progress of production technology, the volume of part digital equipment is more and more less, such as mobile phone, flat board and notebook electricity
Brain is just towards lightening development.Due to reduced space, installing space is limited, generally uses flexible circuit board to replace in digital equipment
Hardboard for parts of traditional.
Flexible circuit board space availability ratio is high, flexible arrangement, and the digital equipment being suitable for narrow space uses, but thermal diffusivity
Difference, particularly in narrow space, heat conduction is slow, easy hot-spot and damage.
Summary of the invention
The technical problem that present invention mainly solves is to provide the flexible circuit board of a kind of top heat radiation, promotes table on wiring board
The heat conduction in face and heat dispersion.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide the flexibility dispelled the heat in a kind of top
Wiring board, including: upper cover layer, middle line layer and undercloak, described middle line layer is arranged on upper cover layer
And between undercloak, described upper cover layer being provided with fin, described upper cover layer is provided above several points
Not and the element of middle line layer linearly connected, described fin is provided with the fabrication hole being positioned at below element, described top
Being provided through fabrication hole on cover layer and point to the through hole of middle line layer, described upper cover layer upper surface indent is provided with
Point to the louvre of fin.
In a preferred embodiment of the present invention, described upper cover layer is arranged on the top of middle line layer.
In a preferred embodiment of the present invention, between described upper cover layer and middle line layer, it is provided with the first bonding
Layer is connected.
In a preferred embodiment of the present invention, between described middle line layer and undercloak, it is provided with the second bonding
Layer is connected.
In a preferred embodiment of the present invention, described fin is Copper Foil or aluminium foil, described upper cover layer and under
Portion's cover layer is respectively polyimides soft board.
The invention has the beneficial effects as follows: the flexible circuit board of a kind of top heat radiation that the present invention points out, utilize fin strip
Walking the heat of middle line layer and element, heat-transfer rate is fast, it is to avoid the problem of hot-spot, and the radiating rate of louvre is fast, carries
Rise the stability used, flexible for installation, applied widely.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in embodiment being described below required for make
Accompanying drawing be briefly described, it should be apparent that, below describe in accompanying drawing be only some embodiments of the present invention, for
From the point of view of those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other according to these accompanying drawings
Accompanying drawing, wherein:
Fig. 1 is the structural representation of flexible circuit board one preferred embodiment of a kind of top of present invention heat radiation.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection
Enclose.
Referring to Fig. 1, the embodiment of the present invention includes:
A kind of flexible circuit board of top heat radiation, including upper cover layer 1, middle line layer 4 and undercloak 6, described in
Between line layer 4 be arranged between upper cover layer 1 and undercloak 6, described upper cover layer 1 is arranged on middle line layer 4
Top, described upper cover layer 1 be provided above several respectively with the element 7 of middle line layer 4 linearly connected, can be simultaneously
Multiple element 7 is installed, easy to use.
Described upper cover layer 1 is provided with fin 2, described fin 2 is provided with the technique being positioned at below element 7
Hole 21, described upper cover layer 1 is provided through the through hole 11 of fabrication hole 21, facilitates the linear of element 7 and middle line layer 4
Connect, conduction upper cover layer 1 and the heat of element 7, it is to avoid the problem of hot-spot, the stability in use of lift elements 7.
Described upper cover layer 1 upper surface indent is provided with the louvre 12 pointing to fin 2.Louvre 12 accelerates scattered
The air cooling effect of backing 2, radiating rate is faster.
It is provided with the first tack coat 3 between described upper cover layer 1 and middle line layer 4 to be connected, described middle line
Being provided with the second tack coat 5 between layer 4 and undercloak 6 to be connected, be connected firmly, overall pliability is good, and frivolous,
Take up room little.
Described fin 2 is the good heat conduction effect of Copper Foil or aluminium foil, Copper Foil and aluminium foil, rapid heat dissipation, and quality is soft,
It is easy to bend winding displacement.
Described upper cover layer 1 and undercloak 6 are respectively polyimides soft board, good insulating, and can bend,
Pliability is good, uses flexibly, takes up room little.
In sum, the flexible circuit board of a kind of top heat radiation that the present invention points out, flexible, it is simple to install and connect up,
Taking up room little, the speed of heat conduction and heat radiation is fast, uses flexibly.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck
Territory, is the most in like manner included in the scope of patent protection of the present invention.
Claims (5)
1. a flexible circuit board for top heat radiation, including upper cover layer, middle line layer and undercloak, described in
Between line layer be arranged between upper cover layer and undercloak, it is characterised in that described upper cover layer is provided with scattered
Backing, described upper cover layer be provided above several respectively with the element of middle line layer linearly connected, on described fin
It is provided with the fabrication hole being positioned at below element, described upper cover layer is provided through fabrication hole and points to middle line layer
Through hole, described upper cover layer upper surface indent is provided with the louvre pointing to fin.
The flexible circuit board of top the most according to claim 1 heat radiation, it is characterised in that described upper cover layer is arranged on
The top of middle line layer.
The flexible circuit board of top the most according to claim 1 heat radiation, it is characterised in that described upper cover layer and centre
It is provided with the first tack coat between line layer to be connected.
The flexible circuit board of top the most according to claim 1 heat radiation, it is characterised in that described middle line layer and bottom
It is provided with the second tack coat between cover layer to be connected.
Top the most according to claim 1 heat radiation flexible circuit board, it is characterised in that described fin be Copper Foil or
Aluminium foil, described upper cover layer and undercloak are respectively polyimides soft board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610570226.4A CN106211550A (en) | 2016-07-20 | 2016-07-20 | A kind of flexible circuit board of top heat radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610570226.4A CN106211550A (en) | 2016-07-20 | 2016-07-20 | A kind of flexible circuit board of top heat radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106211550A true CN106211550A (en) | 2016-12-07 |
Family
ID=57494353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610570226.4A Pending CN106211550A (en) | 2016-07-20 | 2016-07-20 | A kind of flexible circuit board of top heat radiation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106211550A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101035407A (en) * | 2006-03-10 | 2007-09-12 | 三星电机株式会社 | Printed circuit board having metal core |
| CN201373278Y (en) * | 2009-01-14 | 2009-12-30 | 北京巨数数字技术开发有限公司 | LED light decoration |
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| CN203104941U (en) * | 2012-12-30 | 2013-07-31 | 东莞市合通电子有限公司 | A double-surface aluminum core circuit board |
| CN203219607U (en) * | 2013-04-03 | 2013-09-25 | 东莞市天禧光电科技有限公司 | High-heat-conduction flexible LED lead plate |
-
2016
- 2016-07-20 CN CN201610570226.4A patent/CN106211550A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101035407A (en) * | 2006-03-10 | 2007-09-12 | 三星电机株式会社 | Printed circuit board having metal core |
| CN201373278Y (en) * | 2009-01-14 | 2009-12-30 | 北京巨数数字技术开发有限公司 | LED light decoration |
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| CN203104941U (en) * | 2012-12-30 | 2013-07-31 | 东莞市合通电子有限公司 | A double-surface aluminum core circuit board |
| CN203219607U (en) * | 2013-04-03 | 2013-09-25 | 东莞市天禧光电科技有限公司 | High-heat-conduction flexible LED lead plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |
|
| RJ01 | Rejection of invention patent application after publication |