CN204634147U - A kind of concentrated cooling circuit board - Google Patents

A kind of concentrated cooling circuit board Download PDF

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Publication number
CN204634147U
CN204634147U CN201520144964.3U CN201520144964U CN204634147U CN 204634147 U CN204634147 U CN 204634147U CN 201520144964 U CN201520144964 U CN 201520144964U CN 204634147 U CN204634147 U CN 204634147U
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CN
China
Prior art keywords
circuit board
heating panel
protruding
heat radiation
cooling circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520144964.3U
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Chinese (zh)
Inventor
刘亚
杨海林
Original Assignee
刘亚
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Filing date
Publication date
Application filed by 刘亚 filed Critical 刘亚
Priority to CN201520144964.3U priority Critical patent/CN204634147U/en
Application granted granted Critical
Publication of CN204634147U publication Critical patent/CN204634147U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

A kind of concentrated cooling circuit board, comprise substrate, described substrate covers one deck heating panel, described heating panel has at least one heat radiation protruding, described heating panel covers a layer circuit board, on described circuit board, corresponding position protruding with the heat radiation of described heating panel has thermal vias, the hole wall of thermal vias scribbles heat-conducting silicone grease, concentrated cooling circuit board of the present utility model can make the radiating efficiency of circuit board be greatly improved, and improve radiating efficiency by effectively reducing dust, and then greatly increase the useful life of circuit board.

Description

A kind of concentrated cooling circuit board
Technical field
The utility model relates to field of circuit boards, particularly relates to a kind of concentrated cooling circuit board.
Background technology
Circuit board generally can be arranged and be provided with several functions parts, when these functional part work, all produce large calorimetric, along with the further raising of current integrated technology, also harsher to the cooling requirements of circuit board.Current employing arranges heating panel under circuit board, on heating panel and circuit board, all have louvre simultaneously, although radiating effect increases, but due to the easy dust stratification of heat radiation Long-Time Service on collecting plate, radiating effect is caused to decline gradually, affect the useful life of circuit board, and the radiating efficiency of louvre is limited.
Utility model content
The utility model is the problems referred to above solving prior art existence, provides a kind of radiating efficiency and better concentrates cooling circuit board.
For achieving the above object, the utility model provides a kind of concentrated cooling circuit board, comprise substrate, described substrate covers one deck heating panel, described heating panel has at least one heat radiation protruding, described heating panel covers a layer circuit board, on described circuit board, corresponding position protruding with the heat radiation of described heating panel has thermal vias, and the hole wall of thermal vias scribbles heat-conducting silicone grease.
Further preferably, described heating panel has two heat radiations protruding, described circuit board has corresponding two thermal vias protruding with the heat radiation on described heating panel.
Further preferably, the material of described heating panel is aluminium alloy, brass or bronze, and one-body molded.
Further preferably, described heating panel has cavity, and it is protruding that this cavity extends to heat radiation, and be connected with cooling fluid in this cavity.
Further preferably, the height that described heat radiation is protruding is more than or equal to the thickness of heating panel.
Concentrated cooling circuit board of the present utility model, by comprising substrate, described substrate covers one deck heating panel, described heating panel has at least one heat radiation protruding, described heating panel covers a layer circuit board, on described circuit board, corresponding position protruding with the heat radiation of described heating panel has thermal vias, the hole wall of thermal vias scribbles heat-conducting silicone grease, the radiating efficiency of circuit board is greatly improved, and improve radiating efficiency by effectively reducing dust, and then greatly increase the useful life of circuit board.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment that the utility model concentrates cooling circuit board to provide;
Fig. 2 is the exploded view of Fig. 1.
Reference numeral:
1, substrate; 2, heating panel; 3, circuit board; 4, heat radiation is protruding; 5, thermal vias.
Embodiment
Below in conjunction with accompanying drawing 1 and accompanying drawing 2, concentrated cooling circuit board of the present utility model is described in detail.
As shown in Figure 1, Figure 2, concentrated cooling circuit board comprises substrate 1, described substrate 1 covers one deck heating panel 2, described heating panel 2 have two heat radiations protruding 4, described heating panel 2 covers a layer circuit board 3, position corresponding with the heat radiation projection 4 of described heating panel 2 on described circuit board 3 has two thermal vias 5, the hole wall of thermal vias 5 scribbles heat-conducting silicone grease, this embodiment makes the radiating efficiency of circuit board 3 be greatly improved, and improve radiating efficiency by effectively reducing dust, and then greatly increase the useful life of circuit board 3.
Be understandable that, the number of heat radiation projection 4, thermal vias 5 is more, and the heat radiation of circuit board 3 is better, but also can affect the area of circuit board 3, and therefore, the number of described heat radiation projection 4, thermal vias 5 comprehensively can be determined by designer.
In concrete enforcement, the material of described heating panel 2 can be aluminium alloy, brass or bronze, certainly the material of radiating effect can also be had for other, in addition, described heating panel 2 and its heat radiation of having protruding 4 one-body molded, the heat that circuit board 3 produces can better be allowed like this to pass to heating panel 2 and heat radiation protruding 4.
Preferably, in order to dispel the heat to circuit board 3 better, described heating panel 2 has cavity, and this cavity extends to heat radiation protruding 4, and is connected with cooling fluid in this cavity, and described cooling fluid regularly replaces by pump.
In concrete enforcement, the height of described heat radiation protruding 4 is more than or equal to the thickness of heating panel 2, and thermal vias 5 and protruding 4 interference fit of heat radiation.
Although the foregoing describe embodiment of the present utility model; but those skilled in the art are to be understood that; these only illustrate; various changes or modifications can be made to present embodiment; and not deviating from principle of the present utility model and essence, protection range of the present utility model is only defined by the appended claims.

Claims (5)

1. a concentrated cooling circuit board, it is characterized in that, comprise substrate, described substrate covers one deck heating panel, described heating panel has at least one heat radiation protruding, described heating panel covers a layer circuit board, on described circuit board, corresponding position protruding with the heat radiation of described heating panel has thermal vias, and the hole wall of thermal vias scribbles heat-conducting silicone grease.
2. concentrated cooling circuit board according to claim 1, is characterized in that, described heating panel has two heat radiations protruding, described circuit board has corresponding two thermal vias protruding with the heat radiation on described heating panel.
3. concentrated cooling circuit board according to claim 2, is characterized in that, the material of described heating panel is aluminium alloy, brass or bronze, and one-body molded.
4. concentrated cooling circuit board according to claim 3, is characterized in that, described heating panel has cavity, and it is protruding that this cavity extends to heat radiation, and be connected with cooling fluid in this cavity.
5. one according to claim 4 concentrates cooling circuit board, it is characterized in that, the height of described heat radiation projection is more than or equal to the thickness of heating panel.
CN201520144964.3U 2015-03-13 2015-03-13 A kind of concentrated cooling circuit board Expired - Fee Related CN204634147U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520144964.3U CN204634147U (en) 2015-03-13 2015-03-13 A kind of concentrated cooling circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520144964.3U CN204634147U (en) 2015-03-13 2015-03-13 A kind of concentrated cooling circuit board

Publications (1)

Publication Number Publication Date
CN204634147U true CN204634147U (en) 2015-09-09

Family

ID=54053123

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520144964.3U Expired - Fee Related CN204634147U (en) 2015-03-13 2015-03-13 A kind of concentrated cooling circuit board

Country Status (1)

Country Link
CN (1) CN204634147U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105172337A (en) * 2015-09-14 2015-12-23 无锡市羊尖华强塑料彩印有限公司 Printing mold plate with heat dissipation structure
CN106255313A (en) * 2016-08-30 2016-12-21 无锡市同步电子制造有限公司 The preparation of a kind of circuit board heat dissipation cold plate and adhering method
CN107734839A (en) * 2017-11-21 2018-02-23 生益电子股份有限公司 A kind of PCB

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105172337A (en) * 2015-09-14 2015-12-23 无锡市羊尖华强塑料彩印有限公司 Printing mold plate with heat dissipation structure
CN106255313A (en) * 2016-08-30 2016-12-21 无锡市同步电子制造有限公司 The preparation of a kind of circuit board heat dissipation cold plate and adhering method
CN106255313B (en) * 2016-08-30 2018-10-02 无锡市同步电子制造有限公司 A kind of preparation of circuit board heat dissipation cold plate and adhering method
CN107734839A (en) * 2017-11-21 2018-02-23 生益电子股份有限公司 A kind of PCB

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Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150909

Termination date: 20160313

CF01 Termination of patent right due to non-payment of annual fee