CN205921824U

CN205921824U - Heat -dissipation printed circuit board (PCB)

Info

Publication number: CN205921824U
Application number: CN201620984199.0U
Authority: CN
Inventors: 王鹏
Original assignee: Suzhou Base Electronic Technology Co Ltd
Current assignee: Suzhou Base Electronic Technology Co Ltd
Priority date: 2016-08-30
Filing date: 2016-08-30
Publication date: 2017-02-01
Anticipated expiration: 2026-08-30

Abstract

The utility model discloses a heat -dissipation printed circuit board (PCB), its packet of rubbing board body and metal frame, the metal frame sets up around the plate body, the plate body divide into copper foil layer, heat dissipation layer and substrate layer, copper foil layer, heat dissipation layer and substrate layer from the top down set gradually, the copper foil layer upper surface is equipped with the bump, the heat dissipation in situ evenly is equipped with a plurality of heat abstractor, the metal frame links to each other with the copper foil layer. The utility model discloses metal frame design laterally, make being wrapped up by the metal frame all around of PCB board, the heat radiating area of PCB board has been enlarged, and can contact with the installation metalwork, thereby the faster heat conduction with PCB distributes away to the installed part, and jointly use with heat abstractor in the heat dissipation layer, make the PCB board heat conducting quicker, and simultaneously, certain guard action is played in circuit district to the and gate layer, the anti ESD ability of PCB board and the whole electrical property of product have been improved, the life of PCB board has been prolonged, the reliability of PCB board work has been strengthened greatly.

Description

A kind of radiating pcb plate

Technical field

This utility model is related to technical field of electronic components, specially a kind of radiating pcb plate.

Background technology

Pcb(printed circuit board), Chinese is printed circuit board, also known as printed circuit board (PCB), printing Wiring board, is important electronic unit, is the supporter of electronic devices and components, developing rapidly with electron trade, electronic product The trend of miniaturization is increasingly apparent, and in addition to fixing various little electronic components, its major function is also provided with various one block of pcb plate Being electrically connected to each other of electronic component, with the development of information technology, electronic equipment also becomes increasingly complex, and pcb plate also obtains Extensively apply, in prior art, pcb plate is widely used it is commonly known that electronic component is to produce heat in the course of the work , so the thermal diffusivity of pcb plate is an important index, existing pcb plate is mainly radiated by the heat dissipating layer of bottom, and Heat dissipating layer is mostly made up of homogenous materials such as aluminium sheet, potteries, and the lateral thermal conductivity of these materials can be poor, and this frequently results in first device Immediately below part, the heat dissipating layer temperature of corresponding region is high, but the temperature outside this region is low, and particularly multiple components and parts are divided with array During cloth, the heat of the several components and parts of middle that often therefore cannot come out well, leads to the components and parts can not Normal work, finally shortens the service life of whole electronic product, and also in need being marked using labelling point scribbles tin cream Position, and in use, being layered easily occurs in the edge of pcb plate.

The pcb panel products that traditional handicraft is made on the market at present, its heat conduction and heat radiation function relies primarily on the substrate of pcb Material or additional radiating fin sandwich type element or fan are realizing.This radiator structure by the support plate that can radiate is although energy Enough play certain radiating effect, but because its volume is larger, the circuit board demand of improper miniaturization, and above-mentioned dissipating Heat structure haves such problems as to install complicated and high cost.

Content of the invention

The purpose of this utility model is to provide a kind of radiating pcb plate, to solve the problems, such as to propose in above-mentioned background technology.

For achieving the above object, this utility model provides a kind of following technical scheme: radiating pcb plate, it include plate body and Metal edge frame, described metal edge frame is arranged on the surrounding of plate body, and described plate body is divided into copper foil layer, heat dissipating layer and substrate layer, described Copper foil layer, heat dissipating layer and substrate layer set gradually from top to bottom, and described copper foil layer upper surface is provided with salient point, in described heat dissipating layer all Even be provided with some heat abstractors, described metal edge frame is connected with copper foil layer.

Preferably, described heat abstractor be shaped as tree-shaped, material be copper, described heat abstractor include core branch, core bar and Core root.

Preferably, described core branch and core root are symmetricly set on the upper and lower ends of core bar, and described core branch and core root shape are all Umbrella shape.

Preferably, described core branch is connected with substrate layer bottom, and described core root is connected with copper foil layer bottom.

Preferably, described metal edge frame is copper facing frame.

Preferably, the material of described substrate layer is plastics or pottery.

Compared with prior art, the beneficial effects of the utility model are: this utility model is in the metal edge frame of side surrounding Design, so that the surrounding of pcb plate is wrapped up by metal edge frame, expands the area of dissipation of pcb plate, and can be with installation metal Part contacts, and faster the heat of pcb is transmitted on installed part thus distributing, and combines with the heat abstractor in heat dissipating layer Using so that pcb plate conduction of heat more rapid, meanwhile, certain protective effect is played to the line areas with line layer, improves The anti-esd ability of pcb plate and the overall performance electrical performance of product, extend the service life of pcb plate, greatly strengthen the work of pcb plate Reliability.

Brief description

Fig. 1 is a kind of this utility model radiating pcb plate structure schematic diagram；

Fig. 2 is a kind of this utility model radiating pcb plate top view；

In figure: 1, plate body；2nd, metal edge frame；3rd, copper foil layer；4th, heat dissipating layer；5th, substrate layer；6th, salient point；7th, heat abstractor； 8th, core branch；9th, core bar；10th, core root.

Specific embodiment

Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out Clearly and completely description is it is clear that described embodiment is only a part of embodiment of this utility model rather than whole Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of making creative work The every other embodiment being obtained, broadly falls into the scope of this utility model protection.

Refer to Fig. 1-2, this utility model provides a kind of technical scheme: a kind of radiating pcb plate, it includes plate body 1 and gold Belong to frame 2, described metal edge frame 2 is arranged on the surrounding of plate body 1, and described plate body 1 is divided into copper foil layer 3, heat dissipating layer 4 and substrate layer 5, Described copper foil layer 3, heat dissipating layer 4 and substrate layer 5 set gradually from top to bottom, and described copper foil layer 3 upper surface is provided with salient point 6, described It is uniformly provided with some heat abstractors 7, described metal edge frame 2 is connected with copper foil layer 3 in heat dissipating layer 4.

Being shaped as of described heat abstractor 7 is tree-shaped, and material is copper, and described heat abstractor 7 includes core branch 8, core bar 9 and core root 10, described core branch 8 and core root 10 are symmetricly set on the upper and lower ends of core bar 9, and described core branch 8 and core root 10 shape are all umbrella shape, Described core branch 8 is connected with substrate layer 5 bottom, and described core root 10 is connected with copper foil layer 3 bottom, both can improve substrate layer 5 and radiating The steadiness of layer 4 combination, can be fully absorbed the heat in substrate layer 5 again, pass to core root 10 by core bar 9 by core branch 8, then To act as a go-between, heat is directly quickly and evenly diffused to each corner of heat dissipating layer 4 by the mode of linear transmission, improves radiating Speed, described metal edge frame 2 is copper facing frame, increased area of dissipation and protects the circuit of line layer, described substrate layer 5 Material is plastics or pottery.

When using, by arranging copper tree-shaped heat abstractor 7 in heat dissipating layer 4, core branch 8 fully absorbs this utility model Heat in substrate layer 5, passes to core root 10 by core bar 9, then to act as a go-between, the mode of linear transmission is directly fast by heat Speed equably diffuses to each corner of heat dissipating layer 4, improves speed, and the copper foil layer 3 being arranged on heat dissipating layer 5 bottom is located at core root 10 Underface and metal edge frame 2, both increased area of dissipation, shortened the distance that heat leaks again, further improve radiating effect Really.

While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art, It is appreciated that these embodiments can be carried out with multiple changes in the case of without departing from principle of the present utility model and spirit, repair Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.

Claims

1. a kind of radiating pcb plate, it include plate body (1) and metal edge frame (2) it is characterised in that: described metal edge frame (2) is arranged In the surrounding of plate body (1), described plate body (1) is divided into copper foil layer (3), heat dissipating layer (4) and substrate layer (5), described copper foil layer (3), Heat dissipating layer (4) and substrate layer (5) set gradually from top to bottom, and described copper foil layer (3) upper surface is provided with salient point (6), described radiating It is uniformly provided with some heat abstractors (7), described metal edge frame (2) is connected with copper foil layer (3) in layer (4).

2. a kind of radiating pcb plate according to claim 1 it is characterised in that: being shaped as of described heat abstractor (7) is set Shape, material is copper, and described heat abstractor (7) includes core branch (8), core bar (9) and core root (10).

3. a kind of radiating pcb plate according to claim 2 it is characterised in that: described core branch (8) and core root (10) symmetrically set Put the upper and lower ends in core bar (9), described core branch (8) and core root (10) shape are all umbrella shape.

4. a kind of radiating pcb plate according to claim 2 it is characterised in that: described core branch (8) and substrate layer (5) bottom It is connected, described core root (10) is connected with copper foil layer (3) bottom.

5. a kind of radiating pcb plate according to claim 1 it is characterised in that: described metal edge frame (2) is copper facing frame.

6. a kind of radiating pcb plate according to claim 1 it is characterised in that: the material of described substrate layer (5) be plastics or Pottery.