CN107949156A - A kind of double-sided wiring board - Google Patents
A kind of double-sided wiring board Download PDFInfo
- Publication number
- CN107949156A CN107949156A CN201711399883.8A CN201711399883A CN107949156A CN 107949156 A CN107949156 A CN 107949156A CN 201711399883 A CN201711399883 A CN 201711399883A CN 107949156 A CN107949156 A CN 107949156A
- Authority
- CN
- China
- Prior art keywords
- heat
- wiring board
- layer
- hole
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of double-sided wiring board, including metallic plate, lower surface is equipped with insulating layer on a metal plate, circuit layer is equipped with the outer surface of two insulating layers, metallic plate, insulating layer and circuit layer are equipped with the mounting hole and heat emission hole of perforation wiring board, and the inner wall of mounting hole is equipped with the metal layer of connection upper and lower circuit layer, heat-conducting glue is filled with each heat emission hole, the upper and lower end face of heat emission hole is provided with heat sink, and the both ends of the heat-conducting glue are connected with heat sink, and radiating fin is evenly equipped with heat sink；Lower surface is equipped with insulating layer and circuit layer successively on a metal plate, and connects two circuit layers, it can be achieved that wiring board two sides mount at the same time or inserting electronic component by metal layer；Metal-plate radiating performance is good, makes the thermal conductivity factor of wiring board high, good heat dissipation effect；Heat emission hole is by filling heat-conducting glue and setting heat sink to discharge heat up and down, therefore the peripheral direction of whole wiring board has good heat dissipation effect.
Description
Technical field
The present invention relates to printed wiring board field, more particularly to a kind of double-sided wiring board.
Background technology
As electronic product develops to multifunction, short thin light small direction, for carrying the printed circuit of electronic product
The design space of plate (PCB) is more and more intensive, and the requirement of signal frequency and transmission rate is also higher and higher, used electronics member
The power of device, chip arithmetic speed are also increasing, and the big portion of the electric energy of these electronic components or chip during operation
Point changing into heat distributes, this necessarily proposes the requirement of higher to the heat dissipation performance of wiring board.
Double-sided wiring board can lay area by the interior circuit that greatly increases in a limited space, lift integrated level；At the same time,
With the increase of integrated level and power consumption, the finished product of double-sided wiring board, weight, heat dissipation capacity are all in increase trend, existing to open up merely
The design of heat emission hole, it is impossible to high efficiency and heat radiation；At the same time, the upper and lower conductive layers of existing double-sided wiring board are to pass through external connection
Device is connected with each other conducting, and the design of external connection device is relative complex, also occupies space, existing defects.
The content of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides one kind to improve wiring board heat dissipation performance, performance
More stablize, the longer double-sided wiring board of service life.
To achieve these goals, the technical solution adopted by the present invention is：
A kind of double-sided wiring board, including metallic plate, on a metal plate lower surface be equipped with insulating layer, in the outer of two insulating layers
Surface is equipped with circuit layer, and metallic plate, insulating layer and circuit layer are equipped with the mounting hole and heat emission hole of perforation wiring board, mounting hole
Inner wall be equipped with the metal layer of connection upper and lower circuit layer, heat-conducting glue be filled with each heat emission hole, the upper and lower end face of heat emission hole is pacified
Equipped with heat sink, the both ends of the heat-conducting glue are connected with heat sink, are evenly equipped with radiating fin on heat sink, the heat-conducting glue it is upper
Under be provided at both ends with location hole, the lower surface of the heat sink is provided with the locating piece being connected with location hole.
Further as such scheme is improved, and there are gap between the through hole on the metal layer and metallic plate.
Further as such scheme is improved, and insulation tree is provided between the through hole on the metal layer and metallic plate
Fat.
Further as such scheme is improved, the thermal coefficient of expansion of the insulating resin and the thermal coefficient of expansion of metallic plate
It is close.
Further as such scheme is improved, and the insulating layer is hot setting adhesive layer.
Beneficial effects of the present invention：
A kind of double-sided wiring board of the present invention, lower surface is equipped with insulating layer and circuit layer successively on a metal plate, and passes through gold
Belong to layer and connect two circuit layers, it can be achieved that wiring board two sides mount at the same time or inserting electronic component；Metal-plate radiating performance is good,
Make the thermal conductivity factor of wiring board high, good heat dissipation effect；Heat emission hole is by filling heat-conducting glue and setting heat sink to arrange heat up and down
Go out, therefore the peripheral direction of whole wiring board has good heat dissipation effect.
Brief description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described.Obviously, described attached drawing is the part of the embodiment of the present invention, rather than is all implemented
Example, without creative efforts, other that can also be obtained according to these attached drawings are set those skilled in the art
Meter scheme and attached drawing：
Fig. 1 is present pre-ferred embodiments sectional view.
Embodiment
Carried out clearly below with reference to the technique effect of the design of embodiment and attached drawing to the present invention, concrete structure and generation
Chu, be fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this hair
Bright part of the embodiment, rather than whole embodiments, based on the embodiment of the present invention, those skilled in the art is not paying
The other embodiment obtained on the premise of creative work, belongs to the scope of protection of the invention.
With reference to Fig. 1, a kind of double-sided wiring board includes metallic plate 1, insulating layer 2 is equipped with 1 upper and lower surface of metallic plate, described
Insulating layer 2 is hot setting adhesive layer, good heat conductivity, excellent in heat dissipation effect.Circuit layer is equipped with the outer surface of two insulating layers 2
3, metallic plate 1, insulating layer 2 and circuit layer 3 are equipped with the mounting hole 4 and heat emission hole 5 of perforation wiring board, and the inner wall of mounting hole 4 is set
There is the metal layer 6 of connection upper and lower circuit layer 3, be equipped with insulating layer 2 and circuit layer 3 successively in 1 upper and lower surface of metallic plate, and pass through gold
Belong to layer 6 and connect two circuit layers 3, it can be achieved that wiring board two sides mount at the same time or inserting electronic component.Metallic plate 1 selects aluminium sheet
Perfect heat-dissipating, makes the thermal conductivity factor of wiring board high, good heat dissipation effect.
Heat-conducting glue 7 is filled with each heat emission hole 5, the upper and lower end face of heat emission hole 5 is provided with heat sink 8, the heat-conducting glue 7
Both ends be connected with heat sink 8, radiating fin 9 is evenly equipped with heat sink 8.Heat emission hole 5 is radiated by filling heat-conducting glue 7 and setting
Plate 8 discharges heat up and down, and the radiating fin 9 set on heat sink 8 increases the contact area with air so that whole circuit
The peripheral direction of plate has good heat dissipation effect.
The upper and lower ends of the heat-conducting glue 7 are provided with location hole 10, and the lower surface of the heat sink 8 is provided with and location hole
10 locating pieces 11 being connected, location hole 10 and locating piece 11 coordinate installation so that heat sink 8 is easier for installation, is not easy
Come off.
There are gap or insulating resin 12 is provided between through hole on the metal layer 6 and metallic plate 1, the insulation
The thermal coefficient of expansion of resin 12 and the similar thermal expansion coefficient of metallic plate 1.The thermal coefficient of expansion of the insulating resin 12 used and gold
It is close to belong to plate 1, when being heated this guarantees assist side, the insulating resin 12 for playing insulation left and right will not fall off.
Above is presently preferred embodiments of the present invention is illustrated, but the invention is not limited to the implementation
Example, those skilled in the art can also make a variety of equivalent modifications on the premise of without prejudice to spirit of the invention or replace
Change, these equivalent modifications or replacement are all contained in the application claim limited range.
Claims (5)
- A kind of 1. double-sided wiring board, it is characterised in that：Including metallic plate, lower surface is equipped with insulating layer on a metal plate, two The outer surface of insulating layer is equipped with circuit layer, and metallic plate, insulating layer and circuit layer are equipped with the mounting hole of perforation wiring board and dissipate Hot hole, the inner wall of mounting hole are equipped with the metal layer of connection upper and lower circuit layer, heat-conducting glue are filled with each heat emission hole, heat emission hole Upper and lower end face is provided with heat sink, and the both ends of the heat-conducting glue are connected with heat sink, and radiating fin is evenly equipped with heat sink, described The upper and lower ends of heat-conducting glue are provided with location hole, and the lower surface of the heat sink is provided with the positioning being connected with location hole Block.
- 2. double-sided wiring board according to claim 1, it is characterised in that：Through hole on the metal layer and metallic plate it Between there are gap.
- 3. double-sided wiring board according to claim 1 or 2, it is characterised in that：The metal layer and the perforation on metallic plate Insulating resin is provided between hole.
- 4. double-sided wiring board according to claim 3, it is characterised in that：The thermal coefficient of expansion and metal of the insulating resin The similar thermal expansion coefficient of plate.
- 5. double-sided wiring board according to claim 1, it is characterised in that：The insulating layer is hot setting adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711399883.8A CN107949156A (en) | 2017-12-22 | 2017-12-22 | A kind of double-sided wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711399883.8A CN107949156A (en) | 2017-12-22 | 2017-12-22 | A kind of double-sided wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107949156A true CN107949156A (en) | 2018-04-20 |
Family
ID=61942166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711399883.8A Pending CN107949156A (en) | 2017-12-22 | 2017-12-22 | A kind of double-sided wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107949156A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112332551A (en) * | 2020-10-22 | 2021-02-05 | 许继电源有限公司 | Heat dissipation structure of wireless charging coil and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036476A (en) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | Two-sided metal based circuit board and production method thereof |
| CN202111936U (en) * | 2011-07-07 | 2012-01-11 | 浙江万正电子科技有限公司 | Double-sided aluminum core circuit board with plughole resin |
| CN203748105U (en) * | 2014-03-31 | 2014-07-30 | 昆山万正电路板有限公司 | Double-face circuit board |
| CN206542629U (en) * | 2017-03-14 | 2017-10-03 | 深圳市瑞邦创建电子有限公司 | A kind of two-sided PCB |
-
2017
- 2017-12-22 CN CN201711399883.8A patent/CN107949156A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036476A (en) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | Two-sided metal based circuit board and production method thereof |
| CN202111936U (en) * | 2011-07-07 | 2012-01-11 | 浙江万正电子科技有限公司 | Double-sided aluminum core circuit board with plughole resin |
| CN203748105U (en) * | 2014-03-31 | 2014-07-30 | 昆山万正电路板有限公司 | Double-face circuit board |
| CN206542629U (en) * | 2017-03-14 | 2017-10-03 | 深圳市瑞邦创建电子有限公司 | A kind of two-sided PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112332551A (en) * | 2020-10-22 | 2021-02-05 | 许继电源有限公司 | Heat dissipation structure of wireless charging coil and manufacturing method thereof |
| CN112332551B (en) * | 2020-10-22 | 2022-06-24 | 许继电源有限公司 | Heat dissipation structure of wireless charging coil and manufacturing method thereof |
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