CN218830048U

CN218830048U - Semiconductor mobile phone heat dissipation shell

Info

Publication number: CN218830048U
Application number: CN202222611881.3U
Authority: CN
Inventors: 李郁; 王敏; 王洋; 葛一博; 赖清林
Original assignee: Xi'an Mingde Institute Of Technology
Current assignee: Xi'an Mingde Institute Of Technology
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2023-04-07
Anticipated expiration: 2032-09-30

Abstract

The utility model discloses a semiconductor mobile phone heat dissipation shell, which comprises a mobile phone shell body, wherein four angular points of the mobile phone shell body are fixedly connected with a fin baffle and a rear shell through bolts, the fin baffle is positioned between the mobile phone shell body and the rear shell, one surface of the mobile phone shell body, which is fixed with the fin baffle, is provided with a groove, and a semiconductor group, a motor and a circuit board are fixedly arranged in the groove of the mobile phone shell body; the fan blades are fixedly arranged between the rib partition plate and the rear shell, a shaft is fixedly arranged at the center of the motor, and the shaft sequentially penetrates through the rib partition plate and the fan blades. The utility model provides a pair of semiconductor mobile phone heat dissipation shell, its circuit is simple, and the principle is simple, and equipment is less, compact structure, and portable still possesses good refrigeration effect when increasing the use travelling comfort, convenient processing, its manufacturing procedure is few and add man-hour degree of automation higher, and convenient to use can the energy saving.

Description

Semiconductor mobile phone heat dissipation shell

Technical Field

The utility model belongs to the technical field of the mobile phone cooling device, concretely relates to semiconductor mobile phone heat dissipation shell.

Background

With the continuous development of science and technology, the functions of the mobile phone are more and more, and the mobile phone plays a more important role in our life. However, when the functions of the mobile phone are increased, the heat dissipation problem of the mobile phone should be considered, and because the mobile phone can be ensured to be in a better working state only by better solving the heat dissipation problem of the mobile phone, and meanwhile, the mobile phone can have a longer service life, it is very important to increase auxiliary equipment for heat dissipation when the internal structure of the mobile phone cannot be changed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a semiconductor mobile phone heat dissipation shell has solved the problem that leads to the cell-phone to damage and the file is lost because of the cell-phone is overheated.

The technical scheme adopted by the utility model is that, a semiconductor mobile phone heat dissipation shell, including the mobile phone shell body, four angular points of the mobile phone shell body are fixedly connected with a fin baffle and a back shell through bolts, the fin baffle is positioned between the mobile phone shell body and the back shell, one side of the mobile phone shell body fixing the fin baffle is provided with a groove, and a semiconductor group, a motor and a circuit board are fixedly arranged in the groove of the mobile phone shell body;

the fan blade is fixedly arranged between the rib partition plate and the rear shell, the shaft is fixedly arranged at the center of the motor, and the shaft sequentially penetrates through the rib partition plate and the fan blade.

The semiconductor group is connected with the motor through a wire, and the circuit board is connected with the motor through a wire.

Semiconductor unit and motor bond in the recess of cell-phone shell body, and the circuit board passes through bolt fixed connection in the recess of cell-phone shell body, and fixed mounting has the baffle between semiconductor unit and the motor, and fixed mounting has the baffle between semiconductor unit and the circuit board.

The fin partition board is fixedly provided with a plurality of fins along the length direction, the length direction of the fins is consistent with the length direction of the fin partition board, and grooves matched with the fan blades are formed in one surface of the fin partition board, which is provided with the fins.

The rear shell is provided with a ventilation hole, the ventilation hole is circular, the ventilation hole is composed of a plurality of hexagonal holes, and the position of the ventilation hole corresponds to the fan sheet.

The utility model has the advantages that: the utility model discloses the circuit is simple, and the principle is simple, compact structure, and equipment is light, uses portably, has good refrigeration effect, the processing of being convenient for moreover, the energy saving. Secondly, a plurality of semiconductors can fully cover the area with more mobile phone heating phenomena, and the interaction of the rib partition plates, the air inlets, the air outlets and the fan can enhance the convection heat transfer and quickly dissipate heat.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an exploded view of the overall structure of the present invention;

fig. 3 is a schematic structural view of the mobile phone case body of the present invention;

FIG. 4 is a schematic view of the structure of the rib partition of the present invention;

fig. 5 is a schematic view of the rear housing structure of the present invention.

In the figure, 1, a mobile phone shell body, 2, a rib partition, 3, a rear shell, 4, a semiconductor group, 5, a motor, 6, a circuit board, 7, a fan sheet and 8, a ventilation hole.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1-5, the technical scheme adopted by the utility model is that, the heat dissipation shell for the semiconductor mobile phone comprises a mobile phone shell body 1, four angular points of the mobile phone shell body 1 are fixedly connected with a fin baffle 2 and a rear shell 3 through bolts, the fin baffle 2 is positioned between the mobile phone shell body 1 and the rear shell 3, one surface of the mobile phone shell body 1 for fixing the fin baffle 2 is provided with a groove, and a semiconductor group 4, a motor 5 and a circuit board 6 are fixedly arranged in the groove of the mobile phone shell body 1;

a fan blade 7 is fixedly arranged between the rib partition plate 2 and the rear shell 3, a shaft is fixedly arranged at the central position of the motor 5, and the shaft sequentially penetrates through the rib partition plate 2 and the fan blade 7.

The semiconductor group 4 is connected with the motor 5 through a lead, and the circuit board 6 is connected with the motor 5 through a lead.

Semiconductor unit 4 and motor 5 bond in the recess of cell-phone shell body 1, and circuit board 6 passes through bolt fixed connection in the recess of cell-phone shell body 1, and fixed mounting has the baffle between semiconductor unit 4 and the motor 5, and fixed mounting has the baffle between semiconductor unit 4 and the circuit board 6.

The fin partition plate 2 is fixedly provided with a plurality of fins along the length direction, the length direction of the fins is consistent with the length direction of the fin partition plate 2, and grooves matched with the fan blades 7 are formed in the surface, provided with the fins, of the fin partition plate 2.

The rear shell 3 is provided with a ventilation hole 8, the ventilation hole 8 is circular, the ventilation hole 8 is composed of a plurality of hexagonal holes, and the position of the ventilation hole 8 corresponds to the fan sheet 7.

The mobile phone shell body 1, the fin partition plate 2 are made of 7075 aluminum, the fan blades 7 and the rear shell 3 are made of PLA materials, the semiconductor group is made of semiconductor materials (including electronic semiconductors and cavity semiconductors), and the circuit board 6 is a PCB circuit board.

Cell-phone shell body 1, fin baffle 2 adopt digit control machine tool processing, fan 7 and bolt to adopt 3D to print, circuit board 6 needs welding electronic component, and its electronic component includes: transformers, diodes, capacitors, etc.

The working principle of the utility model is as follows:

1. the thermoelectric refrigeration principle, utilize two kinds of different semiconductor materials of type N (electron type) and type P (cavity type) to link into a loop promptly, inject the direct current in the loop, one end of junction point of two kinds of materials becomes cold, one end becomes hot; therefore, by using thermoelectric cooling, the temperature between the semiconductor package 4 and the mobile phone is offset by the heat generated by the mobile phone through the heat conduction of the mobile phone case body 1, and the heat is transferred to the fin side of the fin spacer 2 through the heat conduction at the hot end (the contact end with the fin spacer 2) of the semiconductor package 4.

2. According to the principle of heat convection, the fin partition plate 2 is designed into fins, so that the heat exchange area is increased, the heat conduction is enhanced, meanwhile, the fan blades 7 rotate under the driving of the motor 5, the air flow is accelerated, forced heat convection is achieved, the heat exchange capability is enhanced, and the heat loss of the fin partition plate 2 is accelerated.

The utility model discloses a workflow is, when the high temperature of cell-phone, it is arranged in cell-phone shell main part 1 to place, it is connected through the data line with circuit board 6 to charge precious, 6 circular telegrams of circuit board, because semiconductor unit 4 and circuit board 6 loop through the wire and establish ties with motor 5, the circular telegram of motor 5 is rotated, the refrigeration begins, cell-phone one side temperature reduces, 2 temperature rising of fin baffle, when motor 5 switches on, rotate through axle transmission fan piece 7, fan piece 7 drives the interior air flow of backshell 3, admit air (normal atmospheric temperature) by the air inlet in the backshell 3, the gas outlet is given vent to anger (steam). When refrigeration is not needed, the data line is pulled out, the equipment is powered off, and refrigeration is finished.

The utility model provides a semiconductor mobile phone heat dissipation shell, its circuit is simple, and the principle is simple, and equipment is less, compact structure, and portable still possesses good refrigeration effect when increasing to use the travelling comfort, convenient processing, its manufacturing procedure is few and add man-hour degree of automation higher, convenient to use can the energy saving.

Claims

1. The semiconductor mobile phone radiating shell is characterized by comprising a mobile phone shell body (1), wherein four angular points of the mobile phone shell body (1) are fixedly connected with fin partition plates (2) and a rear shell (3) through bolts, the fin partition plates (2) are positioned between the mobile phone shell body (1) and the rear shell (3), one surface, fixed with the fin partition plates (2), of the mobile phone shell body (1) is provided with a groove, and a semiconductor group (4), a motor (5) and a circuit board (6) are fixedly arranged in the groove of the mobile phone shell body (1);

fixed mounting has fan blade (7) between fin baffle (2) and backshell (3), motor (5) central point puts fixed mounting has the axle, the axle passes in proper order fin baffle (2) and fan blade (7).

2. The heat dissipation case of a semiconductor mobile phone according to claim 1, wherein the semiconductor group (4) is connected to the motor (5) through a wire, and the circuit board (6) is connected to the motor (5) through a wire.

3. The heat dissipation housing for the semiconductor mobile phone, according to claim 1, wherein the semiconductor assembly (4) and the motor (5) are adhered to a groove of the mobile phone housing body (1), the circuit board (6) is fixedly connected to the groove of the mobile phone housing body (1) through a bolt, a partition is fixedly installed between the semiconductor assembly (4) and the motor (5), and a partition is fixedly installed between the semiconductor assembly (4) and the circuit board (6).

4. The heat dissipation casing of the semiconductor mobile phone according to claim 1, wherein the fin partition (2) is fixedly provided with a plurality of fins along the length direction thereof, the length direction of the fins is consistent with the length direction of the fin partition (2), and the side of the fin partition (2) provided with the fins is provided with grooves matched with the fan blades (7).

5. The heat dissipation housing of a semiconductor handset as defined in claim 1, wherein the rear housing (3) is formed with a ventilation hole (8), the ventilation hole (8) is circular, the ventilation hole (8) is formed by a plurality of hexagonal holes, and the ventilation hole (8) is located corresponding to the fan (7).