CN212660464U - Self-adaptive heat dissipation structure - Google Patents
Self-adaptive heat dissipation structure Download PDFInfo
- Publication number
- CN212660464U CN212660464U CN202020877473.0U CN202020877473U CN212660464U CN 212660464 U CN212660464 U CN 212660464U CN 202020877473 U CN202020877473 U CN 202020877473U CN 212660464 U CN212660464 U CN 212660464U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- circuit board
- heat conducting
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to a self-adaptation heat radiation structure, include: the bearing main body comprises a frame body, a heat conducting seat, a heat conducting fin and a plurality of radiating fins; the heat conducting fin comprises a base part, a side wing and an abutting part; and a circuit assembly connected to the carrier body; the circuit assembly comprises a first circuit board and a heating element arranged at one end of the first circuit board; the first circuit board is mounted on one surface of the frame body, the heating element is opposite to the heat conducting fin and arranged at an interval, and the abutting part is used for abutting against the heating element. The self-adaptive heat dissipation structure is simple in structure, the heat conducting fins and the heating elements are arranged at intervals, and the heat conducting fins are abutted to the heating elements after being heated and deformed, so that heat is effectively transferred to the heat conducting seat and the heat dissipation fins for heat dissipation, and the heat dissipation efficiency is greatly improved; meanwhile, the heat conducting fin can adapt to heating elements with different thicknesses, and adaptability and universality are improved.
Description
Technical Field
The utility model relates to a servo motor driver heat dissipation technical field especially relates to a self-adaptation heat radiation structure.
Background
The servo motor driver is also called servo controller and servo amplifier, and is one controller for controlling servo motor, similar to frequency converter acting on common AC motor, and belongs to the field of servo system. The servo motor is generally controlled by three modes of position, speed and moment, so that the high-precision positioning of a transmission system is realized, and the servo motor is a high-end product of a transmission technology at present.
The servo motor driver contains a plurality of electronic components, and the electronic components can emit a large amount of heat when working. For the heat dissipation design, a heat sink is generally added, and the heat sink is abutted to a heating element through a heat conducting fin so as to transfer heat to the heat sink for dissipation. However, since the thicknesses of the components are different, the heat-conducting sheets with different thicknesses are required to be used for different components, and the heat-conducting sheets need to be frequently replaced during production and assembly, which results in poor universality.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model provides a self-adaptation heat radiation structure, simple structure, the heat conduction piece is heated the deformation back butt on heating element, dispels the heat with heat transfer to heat conduction seat and fin, has improved the radiating efficiency greatly.
In order to realize the utility model discloses a purpose, the utility model discloses a following technical scheme:
an adaptive heat dissipation structure, comprising:
the bearing main body comprises a frame body, a heat conducting seat connected to one end of the frame body, a heat conducting fin arranged on one surface of the heat conducting seat, and a plurality of radiating fins connected to the other surface of the heat conducting seat at intervals; the heat conducting fin comprises a base part, side wings connected to two opposite sides of the base part, and abutting parts respectively connected to one ends of the side wings far away from the base part; and
a circuit assembly connected to the carrier body; the circuit assembly comprises a first circuit board and a heating element arranged at one end of the first circuit board; the first circuit board is mounted on one surface of the frame body, the heating element is opposite to the heat conducting fin and arranged at an interval, and the abutting part is used for abutting against the heating element.
The self-adaptive heat dissipation structure is simple in structure, the heat conducting fins and the heating elements are arranged at intervals, and the heat conducting fins are abutted to the heating elements after being heated and deformed, so that heat is effectively transferred to the heat conducting seat and the heat dissipation fins for heat dissipation, and the heat dissipation efficiency is greatly improved; meanwhile, the heat conducting fin can adapt to heating elements with different thicknesses, and adaptability and universality are improved.
In one embodiment, the thickness of the base is less than the thickness of the side flap.
In one embodiment, the base is made of a copper-based shape memory alloy material.
In one embodiment, the heat conducting sheet is made of copper-based shape memory alloy material.
In one embodiment, the adaptive heat dissipation structure further comprises a fan mounted at one end of the bearing main body; the fan is characterized in that a mounting cavity is formed in the middle of one surface of the heat conducting seat, the radiating fins are located on two opposite sides of the mounting cavity, and the mounting cavity is used for accommodating and mounting the fan.
In one embodiment, the abutting part is arranged in a ring shape, and the outer surface of the abutting part is arranged in a smooth curved surface.
In one embodiment, the circuit assembly further comprises a second circuit board, wherein the second circuit board is mounted on the surface of the frame body, which faces away from the first circuit board; the second circuit board is disposed adjacent to the heat sink.
In one embodiment, the adaptive heat dissipation structure further includes a housing covering two opposite sides of the carrier body; the shell comprises a first shell covering one surface of the bearing main body and a second shell covering the other surface of the bearing main body; the first circuit board is arranged on the first shell in a covering mode, the second circuit board is arranged on the second shell in a covering mode, and the second shell and the radiating fins are arranged adjacently.
In one embodiment, a plurality of first heat dissipation holes are arranged on the first shell at intervals; a plurality of second heat dissipation holes are formed in the second shell at intervals.
Drawings
Fig. 1 is a schematic perspective view of an adaptive heat dissipation structure according to an embodiment of the present invention;
fig. 2 is an exploded view of the adaptive heat dissipation structure shown in fig. 1;
fig. 3 is a perspective view of another perspective view of the carrier body in the adaptive heat dissipation structure shown in fig. 2;
fig. 4 is a schematic perspective view of a heat conducting sheet in the adaptive heat dissipation structure shown in fig. 3;
fig. 5 is a sectional view of the adaptive heat dissipation structure shown in fig. 1;
FIG. 6 is an enlarged schematic view taken at circle A of FIG. 5;
fig. 7 is a schematic view illustrating a deformed state of the heat conducting sheet in the adaptive heat dissipation structure shown in fig. 6.
Reference is made to the accompanying drawings in which:
10-bearing main body, 11-frame body, 12-heat conducting seat, 13-heat conducting fin, 14-heat radiating fin, 15-base, 16-side wing and 17-abutting part;
20-circuit components, 21-first circuit board, 22-heating elements, 23-second circuit board;
30-shell, 31-first shell, 32-second shell, 33-first heat dissipation hole, 34-second heat dissipation hole;
40-a fan.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 7, a self-adaptive heat dissipation structure according to an embodiment of the present invention includes a main carrier 10, a circuit module 20 connected to the main carrier 10, a housing 30 covering two opposite sides of the main carrier 10, and a fan 40 installed at one end of the main carrier 10.
The main body 10 includes a frame 11, a heat conducting base 12 connected to one end of the frame 11, a heat conducting fin 13 mounted on one surface of the heat conducting base 12, and a plurality of heat dissipating fins 14 connected to the other surface of the heat conducting base 12 at uniform intervals. The heat conducting sheet 13 is disposed at a distance from the circuit assembly 20, and the heat conducting sheet 13 is used for abutting against a part of the circuit assembly 20. Air passages are formed between adjacent fins 14 for the flow of air therethrough.
The heat-conducting sheet 13 includes a base portion 15, side flaps 16 connected to opposite sides of the base portion 15, and abutting portions 17 connected to respective ends of the side flaps 13 remote from the base portion 15; the thickness of the base 15 is less than the thickness of the wings 16.
In the present embodiment, the base portion 15 is made of a shape memory alloy material, or the entire heat conductive sheet 13 is made of a shape memory alloy material. Preferably, in this embodiment, the base 15 or the heat conducting plate 13 is made of a copper-based shape memory alloy material, which has good heat conducting property, and can effectively transfer the heat generated by the circuit assembly 20 to the heat sink 14 on the heat conducting base 12 for dissipation, thereby further improving the heat dissipation efficiency; meanwhile, the copper-based shape memory alloy has low cost and strong economy, and the overall cost of the servo motor driver cannot be excessively increased.
Specifically, in the present embodiment, a mounting cavity (not shown) is formed in a middle portion of one side of the heat conducting base 12, and the heat dissipation fins 14 are located at two opposite sides of the mounting cavity, and the mounting cavity is used for accommodating the mounting fan 40.
The circuit assembly 20 includes a first circuit board 21, a heating element 22 mounted on one end of the first circuit board 21, and a second circuit board 23. The first circuit board 21 is mounted on one surface of the frame 11, one end of the first circuit board 21 on which the heating element 22 is mounted is disposed opposite to the heat conduction seat 12, specifically, the heating element 22 is disposed opposite to and spaced from the heat conduction sheet 13, and the abutting portion 17 is used for abutting against the heating element 22. It is understood that the heat generating component 22 may be a chip, a power diode, or other electronic component that is prone to heat generation. The second circuit board 22 is mounted on a surface of the frame 11 facing away from the first circuit board 21, and the second circuit board 22 is disposed adjacent to the heat sink 14.
During operation, the heat that heating element 22 produced piles up gradually, after the temperature around heating element 22 is high to a certain degree, conducting strip 13 heat absorption back, flank 16 takes place to warp along basal portion 15 and takes place the bending, as shown in fig. 7, butt portion 17 butt heating element 22 to the heat that heating element 22 produced is dispelled the heat on conducting seat 12 and fin 14 through conducting strip 13 transmission, in addition fan 40 starts, bloies heat conducting seat 12, can give off the heat fast, can improve the radiating efficiency greatly. Because be the interval setting between conducting strip 13 and the heating element 22, conducting strip 13 can butt heating element 22 after being heated the bending, and conducting strip 13 can adapt to the heating element 22 of different thickness in a flexible way, compare traditional conducting strip structure, the utility model discloses a self-adaptation heat radiation structure obviously has higher adaptability and commonality.
In the present embodiment, in order to prevent the contact portion 17 from damaging the outer surface of the heat generating element 22, the contact portion 17 is provided in a substantially annular shape, and the outer surface of the contact portion 17 is provided in a smooth curved surface.
The housing 30 includes a first housing 31 covering one surface of the main body 10 and a second housing 32 covering the other surface of the main body 10. The first circuit board 21 is covered on the first casing 31, the second circuit board 32 is covered on the second casing, and the second casing 32 is disposed adjacent to the heat sink 14, that is, the heat sink 14 is not covered on the second casing 32, and the heat sink 14 is exposed to the outside and contacts with the air to dissipate heat.
In order to improve the heat dissipation effect, the first housing 31 is provided with a plurality of first heat dissipation holes 33 at intervals, and the second housing 32 is provided with a plurality of second heat dissipation holes 34 at intervals.
The self-adaptive heat dissipation structure is simple in structure, the heat conducting fins 13 and the heating elements 22 are arranged at intervals, the heat conducting fins 13 are abutted to the heating elements 22 after being heated and deformed, heat is effectively transferred to the heat conducting seat 12 and the heat dissipation fins 14 for heat dissipation, and heat dissipation efficiency is greatly improved; meanwhile, the heat conducting sheet 13 can adapt to heating elements 22 with different thicknesses, so that the adaptability and the universality are improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (9)
1. An adaptive heat dissipation structure, comprising:
the bearing main body comprises a frame body, a heat conducting seat connected to one end of the frame body, a heat conducting fin arranged on one surface of the heat conducting seat, and a plurality of radiating fins connected to the other surface of the heat conducting seat at intervals; the heat conducting fin comprises a base part, side wings connected to two opposite sides of the base part, and abutting parts respectively connected to one ends of the side wings far away from the base part; and
a circuit assembly connected to the carrier body; the circuit assembly comprises a first circuit board and a heating element arranged at one end of the first circuit board; the first circuit board is mounted on one surface of the frame body, the heating element is opposite to the heat conducting fin and arranged at an interval, and the abutting part is used for abutting against the heating element.
2. The adaptive heat dissipation structure of claim 1, wherein the thickness of the base is less than the thickness of the wings.
3. The adaptive heat dissipation structure of claim 1, wherein the base is made of a copper-based shape memory alloy material.
4. The adaptive heat dissipation structure of claim 1, wherein the heat conductive sheet is made of a copper-based shape memory alloy material.
5. The adaptive heat dissipation structure of claim 1, further comprising a fan mounted at one end of the carrier body; the fan is characterized in that a mounting cavity is formed in the middle of one surface of the heat conducting seat, the radiating fins are located on two opposite sides of the mounting cavity, and the mounting cavity is used for accommodating and mounting the fan.
6. The adaptive heat dissipation structure of claim 1, wherein the abutting portion is disposed in a ring shape, and an outer surface of the abutting portion is disposed in a smooth curved surface.
7. The adaptive heat dissipation structure of claim 1, wherein the circuit assembly further comprises a second circuit board, the second circuit board being mounted on a surface of the frame body facing away from the first circuit board; the second circuit board is disposed adjacent to the heat sink.
8. The adaptive heat dissipation structure of claim 7, further comprising a housing covering opposite sides of the carrier body; the shell comprises a first shell covering one surface of the bearing main body and a second shell covering the other surface of the bearing main body; the first circuit board is arranged on the first shell in a covering mode, the second circuit board is arranged on the second shell in a covering mode, and the second shell and the radiating fins are arranged adjacently.
9. The adaptive heat dissipation structure of claim 8, wherein the first housing has a plurality of first heat dissipation holes spaced apart from each other; a plurality of second heat dissipation holes are formed in the second shell at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020877473.0U CN212660464U (en) | 2020-05-22 | 2020-05-22 | Self-adaptive heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020877473.0U CN212660464U (en) | 2020-05-22 | 2020-05-22 | Self-adaptive heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212660464U true CN212660464U (en) | 2021-03-05 |
Family
ID=74747532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020877473.0U Active CN212660464U (en) | 2020-05-22 | 2020-05-22 | Self-adaptive heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212660464U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347855A (en) * | 2021-06-04 | 2021-09-03 | 苏州艾控电子科技有限公司 | Industrial personal computer |
| CN114252964A (en) * | 2021-12-02 | 2022-03-29 | 昂纳信息技术（深圳）有限公司 | Chip heat dissipation device, chip module and electronic equipment |
-
2020
- 2020-05-22 CN CN202020877473.0U patent/CN212660464U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347855A (en) * | 2021-06-04 | 2021-09-03 | 苏州艾控电子科技有限公司 | Industrial personal computer |
| CN114252964A (en) * | 2021-12-02 | 2022-03-29 | 昂纳信息技术（深圳）有限公司 | Chip heat dissipation device, chip module and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212660464U (en) | Self-adaptive heat dissipation structure | |
| US8462508B2 (en) | Heat sink with surface-formed vapor chamber base | |
| KR20100055262A (en) | High capacity ptc heater | |
| CN215987101U (en) | Server | |
| CN205232671U (en) | Heat conduction shell fragment and install heat -generating body of this heat conduction shell fragment | |
| CN206743752U (en) | A kind of heat radiating type convertible frequency air-conditioner control panel | |
| WO2020088595A1 (en) | Electronic device, heat dissipation means thereof, and vehicle device | |
| CN211653594U (en) | Server of special integrated circuit chip | |
| KR101030869B1 (en) | Pulse Width Modulation Control Type High Capacity PTC Heater | |
| CN210555610U (en) | Unmanned aerial vehicle's heat radiation structure | |
| CN217283820U (en) | Power supply with air cooling and liquid cooling device | |
| CN215496843U (en) | Unmanned aerial vehicle battery heat radiation structure and unmanned aerial vehicle | |
| CN211981547U (en) | Wireless charging seat | |
| CN220359599U (en) | Heat radiation structure applied to EHC controller | |
| CN218830048U (en) | Semiconductor mobile phone heat dissipation shell | |
| CN212660463U (en) | Servo motor driver heat radiation structure | |
| KR200235545Y1 (en) | a cooling sash for a PCB | |
| CN220208185U (en) | Improved chassis radiating module and structure | |
| CN217693829U (en) | Circuit board module, camera and electronic equipment | |
| CN220383446U (en) | Heat abstractor and remote controller | |
| JPH1092990A (en) | Cooling structure | |
| CN218103935U (en) | Radiating assembly of pod | |
| CN219478423U (en) | Heat radiation structure for servo driver | |
| CN219246036U (en) | Computer radiator | |
| CN218920007U (en) | Mobile power supply |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221025 Address after: A0513, Building 2#, Skyworth Innovation Valley, No. 8, Tangtou No. 1 Road, Tangtou Community, Shiyan Street, Baoan District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Depuxin Technology Co.,Ltd. Address before: 523000 1st floor, building 1, No.17 Zhifu Road, Mowu community, Wanjiang street, Dongguan City, Guangdong Province Patentee before: DONGGUAN DOPSON AUTOMATION EQUIPMENT Co.,Ltd. |
|
| TR01 | Transfer of patent right |