CN218675396U - Heat dissipation formula photovoltaic module - Google Patents

Abstract

The utility model relates to the technical field of photoelectric modules, in particular to a heat dissipation type photoelectric module, which comprises a module main body, wherein other accessories are assembled through the module main body to form the photoelectric module as an external structure of the module; a semiconductor refrigerator installed at the bottom of the module body; the combined fan is arranged at the bottom of the semiconductor refrigerator, and through the arrangement of the semiconductor refrigerator and the combined fan, the temperature of the module is reduced through the electron hole reaction generated after two semiconductors in the semiconductor refrigerator are electrified, then the semiconductor refrigerator is cooled through the combined fan, and through the combined fan, the heat generated by the motor of each fan is less, so that the temperature of the semiconductor refrigerator cannot be increased again even if the semiconductor refrigerator is cooled.

Description

Heat dissipation formula photovoltaic module

Technical Field

The utility model relates to a photovoltaic module technical field specifically is a heat dissipation formula photovoltaic module.

Background

The photoelectric module is a main component of optical transmission equipment and is used for photoelectric conversion, namely, an electric signal is firstly converted into an optical signal, the optical signal is transmitted through an optical fiber, and the transmitted optical signal is converted into the electric signal through the optical module.

For known heat dissipation type photovoltaic modules, as referred to patent: CN113970817A, in the actual use process of the heat dissipation type photovoltaic module, because the heat dissipation efficiency of the heat dissipation structure is low, the heat dissipated by the photovoltaic module due to the sealing structure is difficult to be dissipated quickly in the use process, so that the temperature is continuously raised until the internal electronic components are damaged; meanwhile, in the actual use process of the heat dissipation type photoelectric module, as the heat dissipation mechanism still can dissipate heat outwards when in use, the heat dissipation assembly also needs to be cooled, so that the service life of the heat dissipation mechanism is ensured, and the service life of the photoelectric module is ensured.

SUMMERY OF THE UTILITY MODEL

The utility model provides a to prior art not enough, the utility model provides a heat dissipation formula photovoltaic module has overcome prior art not enough, and structural design is simple, and the effectual current heat dissipation formula photovoltaic module of having solved, heat radiation structure radiating efficiency is low, still does not carry out the problem of supplementary radiating subassembly to heat dissipation mechanism.

In order to solve the technical problem, the utility model provides a following technical scheme:

a heat dissipating photovoltaic module, comprising:

the module main body is an external structure of the module, and other accessories are assembled through the module main body to form the photoelectric module;

a semiconductor refrigerator mounted at the bottom of the module body;

and the combined fan is arranged at the bottom of the semiconductor refrigerator.

Preferably, the semiconductor refrigerator further comprises:

insulating ceramic plates located at upper and lower ends of the semiconductor refrigerator;

the metal conductors are positioned at the upper end and the lower end of the semiconductor refrigerator and positioned in the insulating ceramic plate;

an N-type semiconductor located between the metal conductors;

a P-type semiconductor located between the metal conductors;

a spacer located between the P-type semiconductor and N-type semiconductor and between metal conductors.

Preferably, the combined fan further comprises:

the fan is combined into a combined fan through a plurality of fans;

the fan dust screen is positioned at the top of the fan and corresponds to each fan;

a connector installed between the fans.

Preferably, the module body further includes:

a rotating ring uniformly mounted on a side surface of the module body;

the rotating shaft is connected with the rotating ring in a penetrating way;

and the through holes are uniformly formed in the rotating ring and penetrate through the rotating ring.

Preferably, the module body further includes:

a ventilation duct mounted on a side surface of the module main body;

the through holes are uniformly formed in the ventilation pipe, penetrate through the rotary ventilation pipe and correspond to the through holes in the rotary ring;

and the through hole dustproof net is arranged outside the through hole on the surface of the ventilation pipe.

Preferably, the ventilation pipe further comprises:

the ventilation pipe is movably connected with the rotating ring through a rotating shaft.

The embodiment of the utility model provides a heat dissipation formula photovoltaic module possesses following beneficial effect: through setting up semiconductor cooler and combination formula fan, thereby cool down you to the module through the produced electron hole reaction of two semiconductor circular telegrams in the semiconductor cooler back, then cool down the semiconductor cooler through the fan of combination formula, through the fan of combination formula for the produced heat of the motor of every fan is less, makes even to cool down the semiconductor cooler and can not heat up again.

Through setting up the semiconductor refrigerator for through the produced electron hole reaction of N type semiconductor and P type semiconductor, thereby make when circular telegram, can lead to its one end temperature rise and one end cooling through the electron hole that N type semiconductor and P type semiconductor produced, through the one end laminating module bottom that the semiconductor refrigerator will cool down, thereby carry out cooling treatment to the module.

Through setting up combination formula fan, cool down through the forced air cooling effect through the hot junction of the semiconductor refrigerator bottom of combination formula fan to its top for semiconductor refrigerator can last cool down, has guaranteed semiconductor refrigerator's life, has also guaranteed the cooling time of semiconductor refrigerator to the module simultaneously, the life of the promotion module that becomes looks.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the movable ventilation structure of the present invention;

FIG. 3 is a schematic view of the semiconductor refrigerator of the present invention;

fig. 4 is a schematic structural view of the combined fan of the present invention.

In the figure: 1. a module body; 2. a semiconductor refrigerator; 21. an insulating ceramic plate; 22. a metal conductor; 23. a partition plate; 24. an N-type semiconductor; 25. a P-type semiconductor; 3. a combined fan; 31. a fan dust screen; 32. a fan; 33. a connecting member; 4. a rotating ring; 5. a through hole; 6. a rotating shaft; 7. a vent pipe; 8. and a through hole dustproof net.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Example (b): as shown in fig. 1, the module body 1 is used to combine the other parts with the module body 1, so that the parts are combined into a photoelectric module with the module body 1, and the module body 1 is connected with the semiconductor refrigerator 2 and the combined fan 3, and then the rotating ring 4 on the side of the module body 1 is rotated by the rotating shaft 6, so that the through hole 5 on the module body moves to be not corresponding to the through hole inside, thereby preventing dust from entering the module body 1 through the through hole 5 and damaging the electronic components in the module body 1 when not in use.

Specifically, please refer to fig. 2, compare fig. 1, fig. 2 has disassembled ventilation pipe 7 and rotatory ring 4, ventilation pipe 7 and through-hole dust screen 8 have been newly added, make it show that the air in the main body of module main body 1 can be exchanged with the outside air through-hole 5 on ventilation pipe 7, thereby reduce the inside temperature, and utilize pivot 6 to make ventilation pipe 7 be connected with rotatory ring 4, make rotatory ring 4 parcel ventilation pipe 7, make through-hole 5 on the rotatory ring 4 correspond with through-hole 5 on ventilation pipe 7, and utilize through-hole dust screen 8 on the ventilation pipe in order to do the effect that blocks the dust when using, and rotatory pivot 6 when not using, thereby misplace through-hole 5 on rotatory ring 4 and through-hole 5 on ventilation pipe 7.

Specifically, referring to fig. 3, comparing with fig. 1, fig. 3 is a diagram illustrating a structure of a semiconductor refrigerator 2, and an insulating ceramic plate 21, a metal conductor 22, a partition plate 23, an N-type semiconductor 24 and a P-type semiconductor 25 are additionally added, so that the semiconductor refrigerator 2 is energized to generate electron holes in the P-type semiconductor and the N-type semiconductor, that is, the peltier effect, so that electron hole pairs are generated near an upper contact, the internal energy is reduced, the temperature is reduced, heat is absorbed to the outside, the internal energy is increased due to recombination of the electron hole pairs at the other end, the temperature is increased, and heat is released to the environment, which is called a hot end, so that heat at the upper cold end is transmitted to the insulating ceramic plate 21 through the metal conductor 22, so that the insulating ceramic plate 21 cools the module body 1 above, and the partition plate 23 separates the N-type semiconductor 24 and the P-type semiconductor 25, thereby reacting only through the contact, but not touch sensing.

Specifically, referring to fig. 4, comparing fig. 1 with fig. 4, fig. 4 shows that the structure of the combined fan 3 is disassembled, the fan 32, the fan dust-proof net 31 and the connecting member 33 are added, which shows the combined fan 3 formed by combining the fans 32, so that the combined structure can be utilized, and the power of the motor driving the fan 32 to rotate is reduced, although the quantity is increased, the heat generated by electromagnetism is reduced, so that the combined fan 3 does not need to be cooled again by the cooling component, and in use, the degree of dust entering the fan 32 in a working state is reduced by the fan dust-proof net 31, the connecting member 33 is a component for connecting each fan 32, and the bolts penetrate through the threaded holes in the connecting member 33 to penetrate through the whole fan 32, so that each fan 32 is combined to form the combined fan 3

The working principle is as follows: firstly, through the electron hole reaction that N type semiconductor 24 and P type semiconductor 25 produced, thereby make when circular telegram, can lead to its one end to rise warm and one end cooling through the electron hole that N type semiconductor 24 and P type semiconductor 25 produced, through laminating the module bottom with the one end of semiconductor refrigerator 2 cooling, thereby carry out cooling treatment to the module, cool down through the air-cooled effect to the hot junction of semiconductor refrigerator 2 bottom above it through combination formula fan 3, make semiconductor refrigerator 2 can be continuous to lower the temperature, the life of semiconductor refrigerator 2 has been guaranteed, the cooling time of semiconductor refrigerator 2 to the module has also been guaranteed simultaneously, the life of module has been promoted in the change of phase.

Claims (6)

1. A heat dissipation type photovoltaic module, comprising:

the module main body (1) is an external structure of the module, and other accessories are assembled through the module main body to form the photoelectric module;

a semiconductor refrigerator (2) mounted on the bottom of the module body (1);

and the combined fan (3) is arranged at the bottom of the semiconductor refrigerator (2).

2. The heat dissipating photovoltaic module of claim 1, wherein the semiconductor cooler (2) further comprises:

insulating ceramic plates (21) located at upper and lower ends of the semiconductor refrigerator (2);

metal conductors (22) which are located at upper and lower ends of the semiconductor refrigerator (2) and which are located inside an insulating ceramic plate (21);

an N-type semiconductor (24) located between the metal conductors (22);

a P-type semiconductor (25) located between the metal conductors (22);

a spacer (23) located between the P-type semiconductor (25) and the N-type semiconductor (24) and between the metal conductors (22).

3. A heat dissipating photovoltaic module in accordance with claim 1, wherein the combined fan (3) further comprises:

a fan (32) which is combined into a combined fan (3) by a plurality of fans (32);

a fan dust screen (31) positioned on top of the fan (32) and corresponding to each fan;

a connector (33) mounted between the fans (32).

4. The heat dissipating photovoltaic module of claim 1, wherein the module body (1) further comprises:

a rotating ring (4) which is uniformly mounted on the side surface of the module body (1);

a rotating shaft (6) which is connected with the rotating ring (4) in a penetrating way;

and the through holes (5) are uniformly formed in the rotating ring (4) and penetrate through the rotating ring (4).

5. The heat dissipating photovoltaic module of claim 1, wherein the module body (1) further comprises:

a ventilation duct (7) attached to a side surface of the module body (1);

the through holes (5) are uniformly formed in the ventilation pipe (7) and penetrate through the rotary ventilation pipe (7) to correspond to the through holes (5) in the rotary ring (4);

and the through hole dustproof net (8) is arranged outside the through hole (5) on the surface of the ventilation pipe (7).

6. The heat dissipating photovoltaic module according to claim 5, wherein the air duct (7) further comprises:

the ventilation pipe (7) is movably connected with the rotating ring (4) through a rotating shaft (6).

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