CN217486756U - Full-shielding digital high-power transmitting device - Google Patents
Full-shielding digital high-power transmitting device Download PDFInfo
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- CN217486756U CN217486756U CN202221091736.0U CN202221091736U CN217486756U CN 217486756 U CN217486756 U CN 217486756U CN 202221091736 U CN202221091736 U CN 202221091736U CN 217486756 U CN217486756 U CN 217486756U
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Abstract
The application relates to a full-shielding digital high-power transmitting device, which belongs to the technical field of digital transmitting devices and comprises a shell, a high-power module, an output impedance conversion module and a heat dissipation structure, wherein the high-power module, the output impedance conversion module and the heat dissipation structure are positioned in the shell; the heat dissipation structure comprises a high heat conduction piece and a heat radiator, wherein the high heat conduction piece is used for conducting heat generated by the high-power module to the shell, and the heat radiator is connected with the high heat conduction piece. This application has the effect that improves the inside radiating effect of digital type emitter.
Description
Technical Field
The application relates to the technical field of digital transmitting devices, in particular to a full-shielding digital high-power transmitting device.
Background
At present, a fully shielded digital high-power transmitting device is arranged in a submarine and comprises a shell, a high-power module and an output impedance module, wherein the high-power module is arranged in the shell. Meanwhile, the fully-shielded digital high-power transmitting device is arranged in the submarine, so that the shell has better sealing property in order to reduce the risk that water enters the shell to damage the high-power module and the output impedance module.
The high-power module generates a large amount of heat during operation, but the housing needs to have good sealing performance, so that the heat generated by the high-power module is not easy to dissipate in the housing. The long-term high-power module at high temperature can reduce its service life. Generally, a fully shielded digital high-power emitting device does not have a good heat dissipation device to dissipate heat of a high-power module.
SUMMERY OF THE UTILITY MODEL
In order to improve the heat dissipation effect of a high-power module in a digital transmitting device, the application provides a full-shielding digital high-power transmitting device.
The application provides a high-power emitter of full shield digital type adopts following technical scheme:
a full-shielding digital high-power transmitting device comprises a shell, a high-power module, an output impedance conversion module and a heat dissipation structure, wherein the high-power module, the output impedance conversion module and the heat dissipation structure are positioned in the shell;
the heat dissipation structure comprises a high heat conduction piece and a heat radiator, wherein the high heat conduction piece is used for conducting heat generated by the high-power module to the shell, and the heat radiator is connected with the high heat conduction piece.
Through adopting above-mentioned technical scheme, the heat that high-power module produced can transmit to whole shell through high heat-conducting piece, then cools down on to whole shell through outside air, and high heat-conducting piece can be with heat transfer to radiator simultaneously, and the radiator disperses the heat, has reduced the risk that the heat that high-power module produced is too concentrated to be difficult for volatilizing. Through the structure, the heat generated by the high-power module can be timely volatilized, and the heat can be transferred to the whole shell, so that the heat dissipation effect is improved.
Optionally, the heat sink includes a bottom plate connected to the high thermal conductive member and a heat dissipation assembly disposed on the bottom plate, and the bottom plate is provided with heat dissipation lines.
Optionally, the heat dissipation assembly includes a heat dissipation branch plate disposed on the bottom plate, and a first support plate and a second support plate disposed on the heat dissipation branch plate, where the first support plate and the second support plate are respectively located on two opposite sides of the heat dissipation branch plate.
Through adopting above-mentioned technical scheme, the bottom plate divides board, first extension board and second extension board with the heat conduction of high heat-conducting piece transmission to the heat dissipation, has increased the heat radiating area of radiator, and the setting of heat dissipation line has further increased the heat radiating area of radiator simultaneously, makes the radiating effect of radiator better.
Optionally, the first support plate is provided with the heat dissipation lines and/or the second support plate is provided with the heat dissipation lines.
Optionally, a plurality of first support plates and a plurality of second support plates are arranged on the heat dissipation branch plate at intervals.
Through adopting above-mentioned technical scheme, the area of contact of first extension board and second extension board and the inside air of shell has been increased in setting up of heat dissipation line, and first extension board sets up a plurality ofly with the second extension board, has increased the area of contact of radiator with the inside air of shell, and then has improved the radiating effect of radiator.
Optionally, the first support plate and the second support plate are symmetrically arranged on the heat dissipation branch plate.
By adopting the technical scheme, after the heat is transferred to the heat dissipation branch plate, the heat is transferred to the first support plate and the second support plate which are symmetrical through the heat dissipation branch plate, and then the first support plate and the second support plate are heated more uniformly.
Optionally, the first support plate and the second support plate are arranged on the heat dissipation branch plate in a staggered manner.
Through adopting above-mentioned technical scheme, heat transfer divides the board after to dispel the heat, divides the board transmission first extension board via the heat dissipation and after the heat saturation that bears on first extension board, to the heat can transmit to the second extension board on, like above-mentioned step circulation in proper order, and then make the radiating effect of radiator better.
Optionally, the heat dissipation structure further includes a heat dissipation plate mounted on the high power module, the high thermal conductive member is located between the high power module and the heat sink, and a projection of the heat dissipation plate on the high power module is located outside a projection range of the heat sink on the high power module.
Through adopting above-mentioned technical scheme, the heat that high-power module produced conducts to the heating panel through high heat-conducting piece on, then on conducting to the radiator via the heating panel, the size of radiator is less than the size of cooling panel, and then has guaranteed heat radiation structure's radiating effect under the condition of saving the cost.
In summary, the present application includes at least one of the following beneficial technical effects:
the heat generated by the high-power module can be conducted to the radiator and the whole shell through the high heat-conducting piece, so that the heat dissipation effect on the high-power module is improved;
the arrangement of the heat dissipation branch plate, the first support plate and the second support plate increases the contact area between the heat radiator and the air in the shell, so that the heat dissipation effect of the heat radiator is improved;
the setting of heat dissipation line has further increased the area of contact of radiator with the inside air of shell for the radiator has better radiating effect.
Drawings
Fig. 1 is an exploded view of a fully shielded digital high power transmitting device in an embodiment of the present application.
Fig. 2 is an exploded view of the power module, the heat dissipation structure and the output impedance transformation module in the embodiment of the present application.
Fig. 3 is an overall configuration diagram of a heat sink in the embodiment of the present application.
Description of reference numerals: 1. a housing; 2. a high power module; 3. an output impedance transformation module; 4. a heat dissipation structure; 41. a high thermal conductivity member; 42. a heat sink; 421. a base plate; 422. a heat dissipating component; 4221. heat dissipation is divided into plates; 4222. a first support plate; 4223. a second support plate; 43. a heat dissipation plate; 5. heat dissipation lines.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The embodiment of the application discloses a fully shielded digital high-power transmitting device. Referring to fig. 1, the fully shielded digital high-power transmitter includes a housing 1, a high-power module 2, an output impedance conversion module 3 and a heat dissipation structure 4, wherein a cavity is disposed inside the housing 1, and the high-power module 2, the output impedance conversion module 3 and the heat dissipation structure 4 are all mounted in the cavity. The heat generated by the high-power module 2 is dissipated through the heat dissipation structure 4, so that the heat dissipation effect of the high-power module 2 is improved.
Referring to fig. 1, the high power module 2 includes a circuit board, a power module mounted on the circuit board, a conditioning circuit, a driving circuit, a protection circuit, and a high power IGBT circuit. The high-power IGBT circuit is a main heating part, so that the high-power IGBT circuit is arranged in the middle of the circuit board, and the corresponding heat dissipation structure 4 is also arranged in the middle of the circuit board, so that the heat dissipation effect of the high-power module 2 is better.
The output impedance conversion module 3 is located on one side of the heat dissipation structure 4 departing from the high-power module 2, and the output impedance conversion module 3 comprises an output electric plate, a boost output voltage transformer and an inductor, wherein the boost output voltage transformer and the inductor are installed on the output electric plate.
Referring to fig. 2, the heat dissipating structure 4 includes a high thermal conductive member 41, a heat sink 42 and a heat dissipating plate 43, the high thermal conductive member 41 and the heat sink 42 are respectively disposed on two opposite sides of the heat dissipating plate 43, one side of the high thermal conductive member 41 away from the heat dissipating plate 43 is located at the high power IGBT circuit, preferably, in this embodiment, both the high thermal conductive member 41 and the heat sink 42 are mounted on the heat dissipating plate 43 through bolts, and the high thermal conductive member 41 is mounted on the housing 1 through bolts. The heat generated by the high-power IGBT circuit is conducted to the entire housing 1 and the heat sink 42 through the high thermal conductive member 41, thereby improving the heat dissipation effect of the high-power module 2.
Referring to fig. 2, in the embodiment, it is preferable that the high thermal conductive member 41 is made of red copper material, so that the high thermal conductive member 41 has a better thermal conductive effect, and the thermal conductive efficiency is improved. The power module, the conditioning circuit, the driving circuit, the protection circuit, the high-power IGBT circuit and the high-heat-conducting piece 41 are all located in the projection range of the heat dissipation plate 43 on the circuit board, and the heat dissipation plate 43 is installed on the circuit board through bolts. Meanwhile, the projection of the heat sink 42 on the circuit board is located outside the projection range of the heat dissipation plate 43 on the circuit board. Through the structure, on one hand, the manufacturing cost is reduced; on the other hand, the heat generated by the power module, the conditioning circuit, the driving circuit and the protection circuit is conducted to the heat dissipation plate 43, and then conducted to the heat sink 42 through the heat dissipation plate 43.
Referring to fig. 2 and 3, the heat sink 42 includes a bottom plate 421 connected to the heat dissipation plate 43 and a plurality of sets of heat dissipation assemblies 422 disposed on the bottom plate 421, wherein the plurality of sets of heat dissipation assemblies 422 are arranged on the heat sink 42 at intervals. In the present embodiment, two sets of heat dissipation assemblies 422 are preferably disposed, and the two sets of heat dissipation assemblies 422 are symmetrically disposed on the bottom plate 421. Wherein, one side of the bottom plate 421 departing from the heat dissipation plate 43 is provided with the zigzag heat dissipation lines 5, so as to increase the contact area between the bottom plate 421 and the air and improve the heat dissipation effect. The multiple sets of heat dissipation assemblies 422 have the same structure, and the following description will use one set of heat dissipation assemblies 422 as an example.
Referring to FIG. 3, the heat sink assembly 422 includes a heat sink sub-plate 4221, a first support plate 4222, and a second support plate 4223. One end of the sub-plate is integrally connected to the bottom plate 421, and the other end extends in a direction away from the bottom plate 421. The first support plate 4222 and the second support plate 4223 are respectively arranged at two sides of the heat dissipation branch plate 4221, namely, the heat dissipation branch plate 4221, the first support plate 4222 and the second support plate 4223 are arranged in a fork shape. In the present embodiment, the first support plate 4222 and the second support plate 4223 are preferably integrally connected to the heat dissipation branch plate 4221.
The first support plate 4222 is provided with saw-toothed heat dissipation lines 5, the second support plate 4223 may be provided with the saw-toothed heat dissipation lines 5, or the second support plate 4223 is not provided with the saw-toothed heat dissipation lines 5, and in this embodiment, the second support plate 4223 is preferably provided with the heat dissipation lines 5.
Referring to fig. 3, the first support plate 4222 and the second support plate 4223 may be symmetrically disposed on the heat dissipation plate 4221, or may be arranged in a staggered manner. Staggered arrangement means that the second plates 4223 are positioned between two first plates 4222, or the first plates 4222 are positioned between two second plates 4223, and so on. In this embodiment, the first support plate 4222 and the second support plate 4223 are preferably arranged on the heat dissipation branch plate 4221 in a staggered manner, so that heat is firstly transferred to the first support plate 4222 through the heat dissipation branch plate 4221, and when the heat borne by the first support plate 4222 is in a saturated state, the heat is transferred to the second support plate 4223, and the heat is circulated in sequence, so that the heat dissipation effect is better.
The implementation principle of the fully shielded digital high-power transmitting device in the embodiment of the application is as follows: the high-power module 2 generates heat during operation, and partial heat conducts to whole shell 1 through high heat-conducting piece 41, and partial heat transmits to heating panel 43 through high heat-conducting piece 41 on, and the heat on the heating panel 43 can conduct to bottom plate 421 on, then the heat transmits to multiunit radiator unit 422 via bottom plate 421 on, through the above-mentioned process, the heat that makes high-power module 2 produce can be timely volatilize, and then improves the radiating effect to high-power module 2.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. A kind of whole shielding digital type high-power transmitting device, characterized by that: the high-power LED lamp comprises a shell (1), a high-power module (2) positioned in the shell (1), an output impedance conversion module (3) and a heat dissipation structure (4);
the heat dissipation structure (4) comprises a high heat conduction member (41) for conducting heat generated by the high-power module (2) to the housing (1) and a heat sink (42) connected with the high heat conduction member (41).
2. The fully shielded digital high power transmitting device according to claim 1, wherein: the radiator (42) comprises a bottom plate (421) connected with the high heat conducting piece (41) and a radiating assembly (422) arranged on the bottom plate (421), and radiating grains (5) are arranged on the bottom plate (421).
3. The fully shielded digital high power transmitting device as claimed in claim 2, wherein: the heat dissipation assembly (422) comprises a heat dissipation sub plate (4221) arranged on the bottom plate (421), and a first support plate (4222) and a second support plate (4223) arranged on the heat dissipation sub plate (4221), wherein the first support plate (4222) and the second support plate (4223) are respectively located on two opposite sides of the heat dissipation sub plate (4221).
4. The fully shielded digital high power transmitting device according to claim 3, wherein: the first support plate (4222) is provided with the heat dissipation lines (5) and/or the second support plate (4223) is provided with the heat dissipation lines (5).
5. The fully shielded digital high power transmitting device as claimed in claim 3 or 4, wherein: the first support plate (4222) and the second support plate (4223) are both provided with a plurality of support plates, and the plurality of first support plates (4222) and the plurality of second support plates (4223) are arranged on the heat dissipation sub-plate (4221) at intervals.
6. The fully shielded digital high power transmitting device according to claim 5, wherein: the first support plate (4222) and the second support plate (4223) are symmetrically arranged on the heat dissipation sub plate (4221).
7. The fully shielded digital high power transmitting device according to claim 5, wherein: the first support plate (4222) and the second support plate (4223) are arranged on the heat dissipation sub plate (4221) in a staggered mode.
8. The fully shielded digital high power transmitting device according to claim 1, wherein: the heat dissipation structure (4) further comprises a heat dissipation plate (43) mounted on the high-power module (2), the high-heat-conducting piece (41) is located between the high-power module (2) and the heat sink (42), and the projection of the heat dissipation plate (43) on the high-power module (2) is located outside the projection range of the heat sink (42) on the high-power module (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221091736.0U CN217486756U (en) | 2022-05-07 | 2022-05-07 | Full-shielding digital high-power transmitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221091736.0U CN217486756U (en) | 2022-05-07 | 2022-05-07 | Full-shielding digital high-power transmitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217486756U true CN217486756U (en) | 2022-09-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221091736.0U Active CN217486756U (en) | 2022-05-07 | 2022-05-07 | Full-shielding digital high-power transmitting device |
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| Country | Link |
|---|---|
| CN (1) | CN217486756U (en) |
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2022
- 2022-05-07 CN CN202221091736.0U patent/CN217486756U/en active Active
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