CN110366351A - Servo-driver Conduction heat-sink structure and its manufacturing method - Google Patents

Servo-driver Conduction heat-sink structure and its manufacturing method Download PDF

Info

Publication number
CN110366351A
CN110366351A CN201910527557.3A CN201910527557A CN110366351A CN 110366351 A CN110366351 A CN 110366351A CN 201910527557 A CN201910527557 A CN 201910527557A CN 110366351 A CN110366351 A CN 110366351A
Authority
CN
China
Prior art keywords
heat
servo
driver
heat dissipation
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910527557.3A
Other languages
Chinese (zh)
Other versions
CN110366351B (en
Inventor
刘冬
钱巍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Estun Automation Co Ltd
Original Assignee
Nanjing Estun Automation Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Estun Automation Co Ltd filed Critical Nanjing Estun Automation Co Ltd
Priority to CN201910527557.3A priority Critical patent/CN110366351B/en
Publication of CN110366351A publication Critical patent/CN110366351A/en
Application granted granted Critical
Publication of CN110366351B publication Critical patent/CN110366351B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309Evaporators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318Condensers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Abstract

The invention discloses a kind of servo-driver Conduction heat-sink structure and its manufacturing methods, servo-driver Conduction heat-sink structure includes one or more heat pipe, heat pipe includes evaporator section and condensation segment, the heat that evaporator section connect for generating power module with the power module being mounted in servo-driver is conducted to condensation segment, and condensation segment connect with the terminal that radiates except servo-driver and is conducted through the heat come for taking away spontaneous evaporation section on condensation segment.The beneficial effects of the present invention are: the present invention is using the power module in heat pipe connection servo-driver, the heat that power module work generates is transmitted to the connection of the heat dissipation terminal other than servo-driver, heat is distributed into atmospheric environment by heat dissipation terminal, it is not contacted since heat dissipation terminal is located at servo-driver, the heat for avoiding heat dissipation terminal from giving out has an impact servo-driver, servo-driver volume in the present invention can because of radiator structure simplification and reduce, realize the miniaturization and modularization of servo-driver.

Description

Servo-driver Conduction heat-sink structure and its manufacturing method
Technical field
The present invention relates to a kind of servo-driver Conduction heat-sink structure and its manufacturing methods.
Background technique
In existing technical field of heat dissipation, heat pipe heat radiation technology it is highly developed with it is universal, in fact in heat dissipation technology Mainstream backbone radiate strength, on IT industry, industrial generation, pipeline, air-conditioning using too numerous to mention.
Nowadays, greatly developing with industrial servo industry, the requirement to servo motor, servo-driver are continuously improved. Wherein servo-driver requires to continue to develop towards directions such as modularization, miniaturization, high power intensities and optimize, this is just to servo Driver proposes higher technical requirements, and in this case, traditional servo-driver die casting aluminium radiator gradually cannot Meet new technical requirements, in normal work for driver, the high heat flux density and short time internal model that high thermal device generates Reliability etc. of the block after bearing high electric pulse impact is proposed new challenge.For solve servo-driver heat dissipation problem:
Attachment 1 discloses a kind of servo-driver radiator structure, is mounted on the back side panel of drive enclosure, the servo-drive Device radiator structure includes heat-conducting plate and heat sink, and heat-conducting plate is detachably connected with heat sink, absorbs servo-driver with heat-conducting plate The heat of generation, and the heat of heat-conducting plate is absorbed using the heat sink that area is greater than heat-conducting plate and heat sheds, this heat dissipation Structure setting in the outside for the shell for watching driver, generated inside servo-driver at a distance from the power module of heat compared with Greatly, heat caused by power module timely cannot be transferred out into shell, and radiator structure self-temperature in heat dissipation Increase the temperature that can be influenced again by shell in shell.
Attachment 2 discloses a kind of radiator of servo-driver comprising heat radiation box, motor, multiple gears are multiple Fan blade and multiple shafts are rotated by motor-driven rotatable shaft, and the fan blade in shaft is rotated synchronously with shaft, to servo-driver Radiating treatment is carried out, this kind of radiator structure complexity is unfavorable for the Miniaturization Design of servo-driver, and the fan blade of the structure is set It sets in cabinet, heat dissipation effect is not especially desirable because being limited by cabinet.
Attachment 3 discloses one kind and knows energy servo drive system radiator, includes servo-driver, heat dissipation door, dissipates Thermal, servo-driver bottom are equipped with radiator, and the antetheca of servo-driver is equipped with heat dissipation door;And specifically disclose heat dissipation The labyrinth mode of structure since the structure of attachment 3 is more complex, and is located in servo-driver, unfavorable as attachment 2 In the Miniaturization Design of servo-driver, heat dissipation effect is similarly also limited.
Attachment 1: Authorization Notice No. is the Chinese utility model patent file of CN204425890U.
Attachment 2: Authorization Notice No. is the Chinese utility model patent file of CN207691717U.
Attachment 3: application publication number is the Chinese invention patent publication document of CN106793693A.
Summary of the invention
The object of the present invention is to provide a kind of servo-driver Conduction heat-sink structures, are conducive to driver and are realizing corpusculum Radiating requirements under product, modularization, high power density target.
To solve the above problems, the technical solution used in the present invention is: servo-driver Conduction heat-sink structure, including one Heat pipe more than root, heat pipe include evaporator section and condensation segment, and evaporator section is connect with the power module being mounted on servo-driver Heat conduction for generating power module causes condensation segment, and condensation segment connect use with heat dissipation terminal except servo-driver is located at The heat come is conducted through in taking away spontaneous evaporation section on condensation segment.Using generation heat in heat pipe connection servo-driver in the present invention Power module, by power module work generate heat transfer out other than servo-driver, to reduce in servo-driver Temperature, the present invention can not contact with servo-driver with the heat dissipation terminal of heat pipe connection due to using heat pipe, avoid heat dissipation Influence of the heat that terminal sheds to servo-driver, the present invention can be conducted heat using a heat pipe, and simplification is watched The structure of driver is taken, it can be achieved that the small size of servo-driver, modular design requirement, due to the capacity of heat transmission of heat pipe By force, radiating rate is fast, can meet the radiating requirements under servo-driver high power density target.
It as a further improvement of the present invention, further include heat dissipation installation base plate, heat dissipation installation base plate is for being mounted on servo On driver, the heat that the power module of servo-driver is mounted on heat dissipation installation base plate for generating power module conducts To heat dissipation installation base plate, the evaporator section of heat pipe is connect with heat dissipation installation base plate, and for that will radiate, the heat on installation base plate is passed It is directed at condensation segment.Heat dissipation installation base plate is arranged in the present invention, is on the one hand convenient for the connection of power module and heat pipe, on the other hand can incite somebody to action Power module is installed concentratedly on heat dissipation installation base plate, and the modularized design requirement of servo-driver is further met.
As a further improvement of the present invention, power module and evaporator section are located at the two sides of heat dissipation installation base plate, Middle power module is removably installed with heat dissipation installation base plate, and evaporator section is fixed with heat dissipation installation base plate.Power in the present invention Module and heat pipe are located at the not ipsilateral of heat dissipation installation base plate, and installation of the power module on heat dissipation installation base plate is more compact, Servo-driver can be made more to minimize.
As a further improvement of the present invention, it is provided with fixing groove for installing the side of evaporator section on heat dissipation installation base plate, Evaporator section is fixed in fixing groove.The present invention opens up fixing groove on heat dissipation installation base plate, facilitates heat pipe and heat dissipation installation base plate Be fixedly connected.
As a further improvement of the present invention, heat dissipation terminal includes multiple fins, is offered on fin scattered with heat pipe The condensation end of the fixation hole that hot end size matches, heat pipe is mutually fixed by the way of cold pressing or welding with the fixation hole on fin. Multiple fins are set in the present invention, increase heat dissipation terminal and wear the contact area of gas, are more convenient the heat dissipation of heat dissipation terminal.
As a further improvement of the present invention, one end of fixation hole is provided with flange.Flange is arranged in the present invention, on the one hand increases The contact surface of big heat pipe and fin, is on the other hand convenient for the fixation of fin and heat pipe.
It is a further object of the present invention to provide a kind of manufacturing methods of servo-driver Conduction heat-sink structure, including
Step 1, production heat dissipation installation base plate and fin, open up fixing groove on a side surface of heat dissipation installation base plate, are radiating The mounting hole for installation power module is opened up on another side surface of installation base plate, fixation hole is opened up on fin, and is made solid One end edge for determining hole forms flange.
Step 2, fin is mounted on the condensation segment of heat pipe, the evaporator section of heat pipe is protruded into servo-driver and pressed It is embedded in fixing groove.
Step 3, power module is mounted on the side far from evaporator section on heat dissipation installation base plate.
Step 4, it is installed using heat dissipation installation base plate as the component on servo-driver.
As a further improvement of the present invention, step 2 includes
Step 2.1, a heat pipe and a fin are taken, the condensation segment of heat pipe is inserted into the fixation hole on fin, and be cold-pressed and turn over Side or by flanging welded on condensation segment.
Step 2.2, step 2.1 is repeated, multiple fins are installed on the heat pipe in step 2.1, complete a heat pipe and is dissipated The installation of hot terminal.
Step 2.3, the evaporator section of the heat pipe in step 2.2 is placed in fixing groove, and by evaporator section into fixing groove Pressing, is fixed on evaporator section in fixing groove.
Step 2.4, step 2.1~step 2.3 is repeated, the installation of remaining heat pipe and the terminal that radiates is completed.
In conclusion the beneficial effects of the present invention are: the present invention using heat pipe connection servo-driver in power module, The heat that power module work generates is transmitted to the connection of the heat dissipation terminal other than servo-driver, is dissipated heat by heat dissipation terminal It is sent in atmospheric environment, since heat dissipation terminal is located at servo-driver and does not contact, the heat that terminal gives out of avoiding radiating is to watching Driver is taken to have an impact, the present invention in servo-driver volume can because of radiator structure simplification and reduce, realize servo The miniaturization and modularization of driver.
Detailed description of the invention
Fig. 1 is the main view of servo-driver Conduction heat-sink structure in the present invention.
Fig. 2 is the top view of servo-driver Conduction heat-sink structure in the present invention.
Wherein: 1, heat pipe;2, evaporator section;3, condensation segment;4, servo-driver;5, power module;6, radiate terminal;7, it dissipates Hot installation base plate;8, fixing groove;10, fin.
Specific embodiment
A specific embodiment of the invention is described further with reference to the accompanying drawing.
Embodiment 1
Servo-driver Conduction heat-sink structure as depicted in figs. 1 and 2, including one or more heat pipe 1, the present embodiment is with three It is illustrated for heat pipe 1.Heat pipe 1 in the present embodiment includes evaporator section 2 and condensation segment 3, and evaporator section 2 is connected with condensation segment 3, Wherein: evaporator section 2 and condensation segment 3 are two parts of heat pipe 1, and the two is actually the structure of integral type, collectively form heat pipe 1, Heat pipe 1 belongs to the prior art, and the improvement of non-present invention in itself, and the present invention is for purposes of illustration only, two parts of event opposite heat tube are done Above-mentioned differentiation, evaporator section 2 connect the heat for generating power module 5 with the power module 5 being mounted on inside servo-driver 4 Amount conduction to condensation segment 3, condensation segment 3 be located at the heat dissipation being separated by a certain distance except servo-driver and with servo-driver The connection of terminal 6 is conducted through the heat come for taking away spontaneous evaporation section 2 on condensation segment 3.
The specific structure that the present invention realizes that evaporator section 2 is connect with power module 5 is: heat dissipation being arranged inside servo-driver Installation base plate 7, heat dissipation installation base plate 7 are used to be detachably arranged in servo-driver 4, servo using modes such as bolts The heat that the power module 5 of driver 4 is detachably arranged on heat dissipation installation base plate 7 for generating power module 5 conducts To heat dissipation installation base plate 7, setting heat dissipation installation base plate 7 not only contributes to the installation of power module 5 in the present invention, realizes servo Modularization, miniaturization and the installation of high power intensity of driver 4, and increase power module 5 and the installation base plate 7 that radiates Contact surface is more conducive to transferring out the heat of the generation of power module 5, and the evaporator section 2 of heat pipe 1 is connect with heat dissipation installation base plate 7, For conducting the heat to radiate on installation base plate 7 to condensation segment 3.
Power module 5 and evaporator section 2 are preferably separately mounted to the two sides of heat dissipation installation base plate 7 by the present embodiment, wherein Evaporator section 2 and heat dissipation installation base plate 7 are fixed, and wherein power module 5 is mounted on the surface of the same side of heat dissipation installation base plate 7, So that the installation of power module 5 is more compact, it can further reduce the volume of servo-driver.The present invention realize evaporator section 2 with The fixed concrete mode of heat dissipation installation base plate 7 is: being provided with fixation for installing the side of evaporator section 2 on heat dissipation installation base plate 7 Slot 8, evaporator section 2 are embedded in evaporator section 2 in fixing groove 8 or by the way of welding by evaporator section by being pressed into fixing groove 8 2 are fixed in fixing groove.The thickness of heat dissipation installation base plate 7 is greater than the diameter of heat pipe 1 in the present invention, and evaporator section 2 is embedded in fixing groove 8 After interior, the outer surface of the cell wall and evaporator section 2 of fixing groove 8 fits, and increases evaporator section 2 and heat dissipation installation base plate to greatest extent 7 contact surface, to improve the efficiency that heat pipe 1 transfers out heat on heat dissipation installation base plate 7.
The terminal 6 that radiates in the present invention includes multiple fins 10, and the radiating end size phase with heat pipe 1 is offered on fin 10 The fixation hole matched, the condensation end of heat pipe 1 by the way of cold pressing or welding with the fixation hole (not shown) phase on fin 10 It is fixed.Currently preferred one end in fixation hole is provided with flange (not shown), after condensation segment 3 passes through fixation hole, Flange can be pressed on condensation segment 3, connect heat pipe 1 with fin 10 stronger, on the other hand increase condensation segment 3 and heat The contact area of pipe 1 facilitates the heat dissipation of condensation segment 3.
In the use of the present invention, can make to dissipate to heat dissipation terminal 6 using modes such as air blast cooling, water cooling, free convection coolings Heat in hot terminal 6 is quickly distributed into atmospheric environment, and heat dissipation terminal 6 and power module 5 is made to there is temperature difference always, with Exempting from, which influences heat pipe 1, conducts heat.
For the present invention when servo-driver 4 works normally, power module 5 will generate higher heat on lesser area, The high heat that power module 5 generates passes to part heat dissipation installation base plate 7 quickly, and heat dissipation installation base plate 7 passes the heat received Pass the evaporator section 2 of part heat pipe 1, the condensation segment 3 that 1 evaporator section 2 of heat pipe will receive heat and be transferred to part heat pipe 1 rapidly utilizes The heat dissipation terminal 6 installed at 1 condensation segment 3 of part heat pipe takes away the heat of 1 condensation segment 3 of heat pipe.The terminal 6 that radiates is by forcing wind The modes such as cold or natural air convection current cooling exchange heat to atmospheric environment.Heat pipe 1 is constantly passed by the heat of its own It leads, reaches and realize the cooling purpose of power module 5.
The present invention has the advantage that the quick conduction of high heat dissipates under 1, achievable internal drive high power density Heat;2. heat dissipation terminal is separated with actuator body, the target of Drive Module, miniaturization is realized;3. improving high fever member Device generates functional reliability when excess heat in a short time when working;4. the terminal that radiates can not be by servo-driver sheet The influence of body and use multiple terminal radiating mode, flexible and convenient;5, the heat pipe 1 in the present invention can be set after stretching out servo-driver The orientation set is more, realizes internal drive heat to driver different directions heat loss through conduction.
Embodiment 2
The technical solution of the present embodiment is the method for manufacturing servo-driver Conduction heat-sink structure in embodiment 1, and this method is specific Include the following steps:
Step 1, production heat dissipation installation base plate 7 and fin 10, open up fixing groove 8 on a side surface of heat dissipation installation base plate 7, The mounting hole for installation power module 5 is opened up on another side surface of heat dissipation installation base plate 7, opens up fixation on fin 10 Hole, and one end edge of fixation hole is made to form flange.
Step 2, fin 10 is mounted on the condensation segment 3 of heat pipe 1, the evaporator section 2 of heat pipe 1 is protruded into servo-driver Portion simultaneously presses in merging fixing groove 8, and the width of the fixing groove 8 opened up in step 1 is slightly less than the diameter of evaporator section 2, due to solid The width for determining slot 8 is slightly less than the diameter of evaporator section 2, and firmly evaporator section 2, which is pressed into fixing groove, can make evaporator section 2 in fixing groove 8 It is interior stiff, realize the fixation of evaporator section 2 and fixing groove 8.It can also be in step 1 by the width of fixing groove 8 in the present embodiment The diameter for being slightly over evaporator section 2 is opened up, evaporator section 2 is placed in fixing groove 8 and is consolidated evaporator section 2 by the way of welding It is scheduled in fixing groove 8.
Step 3, power module 5 is mounted on the side far from evaporator section 2 on heat dissipation installation base plate 7 using screw etc..
Step 4, the installation base plate 7 that radiates is used to connect being mounted on for side detachable (being such as bolted) of evaporator section 2 On servo-driver 4, the installation of servo-driver Conduction heat-sink structure is completed.
Wherein, the step 2 in the present invention specifically includes:
Step 2.1, a heat pipe 1 and a fin 10 are taken, the condensation segment 3 of heat pipe 1 is inserted into the fixation hole on fin 10, and Flanging welded is fixed on condensation segment 3 by cold pressing flange.
Step 2.2, step 2.1 is repeated, multiple fins 10 are installed on the condensation segment 3 of the heat pipe 1 in step 2.1, is completed The installation of a piece heat pipe 1 and heat dissipation terminal 6.
Step 2.3, the evaporator section 2 of the heat pipe 1 in step 2.2 is placed on 8 top of fixing groove, and by evaporator section 2 to admittedly Determine pressing in slot 8, be placed in evaporator section 2 in fixing groove 8, fixes evaporator section with 8 phase of fixing groove or realize two using welding The fixation of person.
Step 2.4, step 2.1~step 2.3 is repeated, the installation of remaining heat pipe 1 and the terminal 6 that radiates is completed.
Not doing the part illustrated in above instructions is the prior art, or has both been able to achieve by the prior art, Such as in opening up for fixing groove 8 and opening up for fixation hole.And heretofore described specific implementation case is only of the invention preferable Case study on implementation, practical range not for the purpose of limiting the invention.Made by i.e. all contents according to the invention patent range etc. Effect variation and modification, all should be used as technology scope of the invention.

Claims (8)

1. servo-driver Conduction heat-sink structure, it is characterised in that: including one or more heat pipe (1), heat pipe (1) includes evaporation Section (2) and condensation segment (3), evaporator section (2) are connect for by power with the power module (5) being mounted in servo-driver (4) The heat that module (5) generates is conducted to condensation segment (3), and condensation segment (3) is connect with heat dissipation terminal (6) except servo-driver is located at The heat come is conducted through for taking away spontaneous evaporation section (2) on condensation segment (3).
2. according to claim 1 watch driver Conduction heat-sink structure, it is characterised in that: further include heat dissipation installation base plate (7), for being mounted on servo-driver (4), the power module (5) of servo-driver (4) is mounted on for heat dissipation installation base plate (7) Heat in heat dissipation installation base plate (7) for generating power module (5) is conducted to heat dissipation installation base plate (7), heat pipe (1) Evaporator section (2) is connect with heat dissipation installation base plate (7), for conducting the heat to radiate on installation base plate (7) to condensation segment (3).
3. servo-driver Conduction heat-sink structure according to claim 2, it is characterised in that: power module (5) and evaporation Section (2) is located at the two sides of heat dissipation installation base plate (7), and wherein power module (5) and heat dissipation installation base plate (7) are removably pacified Dress, evaporator section (2) and heat dissipation installation base plate (7) are fixed.
4. servo-driver Conduction heat-sink structure according to claim 3, it is characterised in that: in heat dissipation installation base plate (7) Side for installing evaporator section (2) is provided with fixing groove (8), and evaporator section (2) is fixed in fixing groove (8).
5. servo-driver Conduction heat-sink structure according to claim 4, it is characterised in that: heat dissipation terminal (6) includes more A fin (10) offers the fixation hole to match with the radiating end size of heat pipe (1), the condensation of heat pipe (1) on fin (10) End is mutually fixed by the way of cold pressing or welding with the fixation hole on fin (10).
6. servo-driver Conduction heat-sink structure according to claim 5, it is characterised in that: one end of fixation hole is provided with Flange.
7. the manufacturing method of servo-driver Conduction heat-sink structure as claimed in claim 6, it is characterised in that: including
Step 1, production heat dissipation installation base plate (7) and fin (10), opens up fixation on a side surface of heat dissipation installation base plate (7) Slot (8) opens up the mounting hole for installation power module (5), in fin on another side surface of heat dissipation installation base plate (7) (10) fixation hole is opened up on, and one end edge of fixation hole is made to form flange;
Step 2, fin (10) is mounted on the condensation segment (3) of heat pipe (1), the evaporator section (2) of heat pipe (1) is protruded into servo and is driven In dynamic device and press in insertion fixing groove (8);
Step 3, power module (5) is mounted on to the side in heat dissipation installation base plate (7) far from evaporator section (2);
Step 4, heat dissipation installation base plate (7) is installed as the component on servo-driver (4).
8. according to the method described in claim 7, it is characterized by: step 2 includes
Step 2.1, a heat pipe (1) and a fin (10) are taken, it will be in condensation segment (3) insertion fin (10) of heat pipe (1) In fixation hole, and it is cold-pressed flange or by flanging welded on condensation segment (3);
Step 2.2, step 2.1 is repeated, multiple fins (10) are installed on the heat pipe (1) in step 2.1, complete a heat pipe (1) with heat dissipation terminal (6) installation;
Step 2.3, the evaporator section (2) of the heat pipe (1) in step 2.2 is placed on fixing groove (8), and by evaporator section (2) to Pressing in fixing groove (8), is fixed on evaporator section (2) in fixing groove (8);
Step 2.4, step 2.1~step 2.3 is repeated, the installation of remaining heat pipe (1) and heat dissipation terminal (6) is completed.
CN201910527557.3A 2019-06-18 2019-06-18 Manufacturing method of conduction heat dissipation structure of servo driver Active CN110366351B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910527557.3A CN110366351B (en) 2019-06-18 2019-06-18 Manufacturing method of conduction heat dissipation structure of servo driver

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201910527557.3A CN110366351B (en) 2019-06-18 2019-06-18 Manufacturing method of conduction heat dissipation structure of servo driver
PCT/CN2019/112856 WO2020253008A1 (en) 2019-06-18 2019-10-23 Conductive heat dissipating structure for servo drive, and manufacturing method for same
PCT/CN2020/090115 WO2020253423A1 (en) 2019-06-18 2020-05-14 Manufacturing method for conductive heat dissipation structure of servo driver

Publications (2)

Publication Number Publication Date
CN110366351A true CN110366351A (en) 2019-10-22
CN110366351B CN110366351B (en) 2020-05-12

Family

ID=68216327

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910527557.3A Active CN110366351B (en) 2019-06-18 2019-06-18 Manufacturing method of conduction heat dissipation structure of servo driver

Country Status (2)

Country Link
CN (1) CN110366351B (en)
WO (2) WO2020253008A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020253423A1 (en) * 2019-06-18 2020-12-24 南京埃斯顿自动化股份有限公司 Manufacturing method for conductive heat dissipation structure of servo driver

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2269639Y (en) * 1995-05-09 1997-12-03 郭明 Cooling device for high power semiconductor device
CN1705112A (en) * 2004-05-26 2005-12-07 鸿富锦精密工业(深圳)有限公司 Heat pipe radiating unit and manufacturing method thereof
CN1896913A (en) * 2005-07-15 2007-01-17 富准精密工业(深圳)有限公司 Computer system and its radiating mould set
US20090109620A1 (en) * 2007-10-31 2009-04-30 Wang Cheng-Tu Heat-dissipating device of portable electronic apparatus
CN101776941A (en) * 2009-01-08 2010-07-14 富准精密工业(深圳)有限公司 Radiating device
CN101917835A (en) * 2010-08-23 2010-12-15 上海中科深江电动车辆有限公司 Large-power module cooling structure of electric vehicle controller
JP2011165713A (en) * 2010-02-04 2011-08-25 Fuji Electric Co Ltd Heat sink of semiconductor device
CN102331832A (en) * 2011-09-06 2012-01-25 宁波菲仕电机技术有限公司 Forced air-cooled heat pipe radiating system for servo driver
CN103036394A (en) * 2011-09-29 2013-04-10 台达电子企业管理(上海)有限公司 Heat dissipation device applied to middle and high voltage inverter
CN103167780A (en) * 2011-12-16 2013-06-19 台达电子企业管理(上海)有限公司 Combined type radiator for power module and combined type radiator assembly
CN203289822U (en) * 2013-06-25 2013-11-13 斯恩威(中国)自控系统工程有限公司 Radiator for vehicle-mounted industrial personal computer
CN204425890U (en) * 2015-03-31 2015-06-24 广东技术师范学院 A kind of servo-driver radiator structure
CN104848079A (en) * 2014-02-13 2015-08-19 昆山东大智汇技术咨询有限公司 Large power LED street lamp dissipating heat by heat pipe
CN106793693A (en) * 2016-12-22 2017-05-31 广东技术师范学院 A kind of Intelligent servo drive system heat abstractor
KR20170127327A (en) * 2016-05-11 2017-11-21 주식회사 다원시스 Heat Sink
CN107567239A (en) * 2017-07-24 2018-01-09 广东美的暖通设备有限公司 Radiating subassembly and refrigeration plant
CN207691717U (en) * 2017-12-28 2018-08-03 上海华江企业管理股份有限公司 A kind of radiator of servo-driver
CN109729701A (en) * 2019-01-25 2019-05-07 岩熔之光智能科技(上海)有限公司 A kind of dedicated pulsating heat pipe radiator of high power density servo-driver

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8004842B2 (en) * 2009-05-22 2011-08-23 Asia Vital Components Co., Ltd. Heat dissipation device for communication chassis
TW201144994A (en) * 2010-06-15 2011-12-16 Hon Hai Prec Ind Co Ltd Server and server system
CN110366351B (en) * 2019-06-18 2020-05-12 南京埃斯顿自动化股份有限公司 Manufacturing method of conduction heat dissipation structure of servo driver
CN210519277U (en) * 2019-06-18 2020-05-12 南京埃斯顿自动化股份有限公司 Conduction heat dissipation structure of servo driver

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2269639Y (en) * 1995-05-09 1997-12-03 郭明 Cooling device for high power semiconductor device
CN1705112A (en) * 2004-05-26 2005-12-07 鸿富锦精密工业(深圳)有限公司 Heat pipe radiating unit and manufacturing method thereof
CN1896913A (en) * 2005-07-15 2007-01-17 富准精密工业(深圳)有限公司 Computer system and its radiating mould set
US20090109620A1 (en) * 2007-10-31 2009-04-30 Wang Cheng-Tu Heat-dissipating device of portable electronic apparatus
CN101776941A (en) * 2009-01-08 2010-07-14 富准精密工业(深圳)有限公司 Radiating device
JP2011165713A (en) * 2010-02-04 2011-08-25 Fuji Electric Co Ltd Heat sink of semiconductor device
CN101917835A (en) * 2010-08-23 2010-12-15 上海中科深江电动车辆有限公司 Large-power module cooling structure of electric vehicle controller
CN102331832A (en) * 2011-09-06 2012-01-25 宁波菲仕电机技术有限公司 Forced air-cooled heat pipe radiating system for servo driver
CN103036394A (en) * 2011-09-29 2013-04-10 台达电子企业管理(上海)有限公司 Heat dissipation device applied to middle and high voltage inverter
CN103167780A (en) * 2011-12-16 2013-06-19 台达电子企业管理(上海)有限公司 Combined type radiator for power module and combined type radiator assembly
CN203289822U (en) * 2013-06-25 2013-11-13 斯恩威(中国)自控系统工程有限公司 Radiator for vehicle-mounted industrial personal computer
CN104848079A (en) * 2014-02-13 2015-08-19 昆山东大智汇技术咨询有限公司 Large power LED street lamp dissipating heat by heat pipe
CN204425890U (en) * 2015-03-31 2015-06-24 广东技术师范学院 A kind of servo-driver radiator structure
KR20170127327A (en) * 2016-05-11 2017-11-21 주식회사 다원시스 Heat Sink
CN106793693A (en) * 2016-12-22 2017-05-31 广东技术师范学院 A kind of Intelligent servo drive system heat abstractor
CN107567239A (en) * 2017-07-24 2018-01-09 广东美的暖通设备有限公司 Radiating subassembly and refrigeration plant
CN207691717U (en) * 2017-12-28 2018-08-03 上海华江企业管理股份有限公司 A kind of radiator of servo-driver
CN109729701A (en) * 2019-01-25 2019-05-07 岩熔之光智能科技(上海)有限公司 A kind of dedicated pulsating heat pipe radiator of high power density servo-driver

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020253423A1 (en) * 2019-06-18 2020-12-24 南京埃斯顿自动化股份有限公司 Manufacturing method for conductive heat dissipation structure of servo driver

Also Published As

Publication number Publication date
WO2020253008A1 (en) 2020-12-24
CN110366351B (en) 2020-05-12
WO2020253423A1 (en) 2020-12-24

Similar Documents

Publication Publication Date Title
CN106102418B (en) The cold VPX cabinets efficient radiating apparatus of liquid and method based on soaking plate
CN210519277U (en) Conduction heat dissipation structure of servo driver
CN110366351A (en) Servo-driver Conduction heat-sink structure and its manufacturing method
CN109219319A (en) A kind of isothermal integral heat dissipation device suitable for micro-nano satellite
CN109640581A (en) A kind of air cold plate and its processing method of embedded heat pipes
CN102536745A (en) Heat radiating device for heat pipes
CN201041437Y (en) Semi-conductor refrigerating assembly with heat radiation device
CN101026132A (en) Multi-mode radiator comprising cooling chip and its radiating method
CN212108752U (en) Outdoor machine of air conditioner
CN210725838U (en) Energy-saving self-generating heat dissipation system
CN103868206B (en) Air-conditioner electric control box component and variable-frequency air conditioner with same
CN206343751U (en) A kind of radiator of contravariant carbon dioxide gas arc welding and manual double-purpose welding machine
CN102316701A (en) Heat radiation device
CN215120380U (en) Motor with dehumidification function
CN216490033U (en) Direct-connected generating set radiator fan
CN214857395U (en) Depilatory hand tool applying heat dissipation structure
CN106973555A (en) A kind of cooling cabinet and its printed board assembly
CN215453776U (en) Integrated heat dissipation power module
CN110247322A (en) Recycle the heat dissipating method of electric cabinet
CN214231080U (en) Air duct assembly and food processor
CN106961822B (en) Cooling cabinet and its printed board assembly
CN208985094U (en) Shared miniature heat radiation module
CN210246617U (en) External radiating solar inverter
CN209726452U (en) Air conditioner
CN201018741Y (en) Heat radiating module structure

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant