CN209330511U - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN209330511U CN209330511U CN201821504702.3U CN201821504702U CN209330511U CN 209330511 U CN209330511 U CN 209330511U CN 201821504702 U CN201821504702 U CN 201821504702U CN 209330511 U CN209330511 U CN 209330511U
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- China
- Prior art keywords
- heat
- radiator
- bottom plate
- conducting piece
- chip
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Abstract
The utility model discloses a kind of radiator, the radiator (100) includes: bottom plate (110)；Heat radiation module (130), it is mounted on the bottom plate (110), and including heat-conducting piece (131) and elastic component (132), the heat-conducting piece (131) can be bonded under the pressure effect that the elastic component (132) apply with the chip (20) on the printed circuit board (10) being mounted below the bottom plate (110)；Blower (120), is mounted on the bottom plate (110) and neighbouring the heat radiation module (130) are arranged, to take away heat from the heat radiation module (130) using the air-flow blowed.By above-mentioned radiator, heat-conducting piece is fit together completely with the chip as heat source always, the thermal resistance being significantly reduced between heat radiation module and heat source improves heat dissipation effect.
Description
Technical field
The utility model relates to chip cooling fields, dissipate more specifically to a kind of for what is radiated to chip
Thermal.
Background technique
Printed circuit board is usually the substrate of group apparatus, electronic part, is to be formed between point on general substrate by predetermined design
Connection and the printed board of printed element, major function are the connections for making various electronic components form predetermining circuit, play relaying
The effect of transmission is the critical electronic interconnection piece of electronic product.The substrate and crucial interconnection piece loaded as electronic component, it is any
Electronic equipment or product are both needed to be equipped with.
Electronic devices such as chip sometimes on a printed circuit, at work, chip can heat production, thus in order to protect
Card chip is in normal temperature range and needs to radiate to it.
However, since the manufacture size of each chip itself and the precision that is installed on printed circuit board are different,
Cause chip that may can not completely attach to or be bonded with the radiating element or device for executing heat sinking function, or even between the two
There may be biggish gaps, cause heat transfer efficiency poor, radiating efficiency is low.
Utility model content
One embodiment of the utility model provides a kind of radiator, and chip is installed on a printed circuit, special
Sign is that the radiator includes: bottom plate；Heat radiation module is mounted on the bottom plate, and including heat-conducting piece and elastic component,
The heat-conducting piece can under the pressure effect that the elastic component applies with the printed circuit that is mounted below the bottom plate
Chip fitting on plate；Blower, is mounted on the bottom plate and the neighbouring heat radiation module is arranged, with using the air-flow blowed
Heat is taken away from the heat radiation module.
Optionally, thermal hole is offered on the bottom plate, the heat-conducting piece is pasted by the thermal hole and the chip
It closes.
Optionally, the quantity of the elastic component is multiple, and each elastic component is strip elastic slice, and one end is connected to institute
Bottom plate is stated, the other end is connected to the heat-conducting piece.
Optionally, the distance between the heat-conducting piece and the printed circuit board are less than the thickness of the chip.
Optionally, the heat radiation module further comprises: radiator；Heat pipe, the evaporation ends of the heat pipe are connected to described
On heat-conducting piece, condensation end is connected to the radiator, and working fluid can flow in the heat pipe.
Optionally, guide hole is offered on the bottom plate, a part of the heat pipe is arranged along the guide hole.
Optionally, the heat pipe is U-shaped, and including capillary structure, with allow working fluid evaporation ends and condensation end it
Between circulate.
Optionally, assembling stud is further provided on the bottom plate, the blower is installed in by screw
On the assembling stud, and the distance between the blower and the bottom plate are at least the chip in the printed circuit
The maximum value of mounting height on plate.
Optionally, the radiator further comprises the fan shroud for installing the blower, and the fan shroud is located at
It is arranged in same level above the heat-conducting piece and with the radiator.
Optionally, the blower is centrifugal fan, and the heat-conducting piece is heat conduction aluminium block, and the radiator includes multiple dissipates
Hot fin.
According to radiator provided by the utility model, by under the pressure effect that elastic component applies, so that thermally conductive
Part can fit together with the chip as heat source completely always, and can be adapted to according to different chip mounting heights
Ground changes the pressure that elastic component applies heat-conducting piece automatically, will not lead to certain chips because of chip size tolerance and installation error
Compactness is not high, thus, the thermal resistance being significantly reduced between heat radiation module and heat source improves heat dissipation effect.Simultaneously as thermally conductive
Part is avoided and mounting hole is extraly arranged near chip, therefore, so that thermally conductive since pressure effect is fitted on chip
Installation site of the part on bottom plate is unrestricted, more flexible, significantly improves convenience.
Detailed description of the invention
The following drawings only does schematic illustration and explanation to the utility model, does not limit the scope of the utility model.
Fig. 1 is the installation condition schematic diagram according to the radiator of the embodiments of the present invention；
Fig. 2 a is the structural schematic diagram of radiator shown in FIG. 1；
Fig. 2 b is the decomposition diagram of radiator shown in FIG. 1；
Fig. 3 a is the schematic diagram of the heat radiation module of radiator shown in FIG. 1；
Fig. 3 b is the decomposition diagram of heat radiation module shown in Fig. 3 a；
Fig. 4 is the schematic diagram of the bottom plate of radiator shown in FIG. 1.
Drawing reference numeral explanation:
10: printed circuit, 20: chip, 100: radiator, 110: bottom plate, 111: thermal hole, 112: guide hole, 113:
Assembling stud, 114: riveting point, 120: blower, 130: heat radiation module, 131: heat-conducting piece, 132: elastic component, 133: heat pipe,
1331: evaporation ends, 1332: condensation end, 1333: inactive portion, 134: radiator.
Specific embodiment
In order to which the technical features, objects and effects to utility model are more clearly understood, Detailed description of the invention sheet is now compareed
The specific embodiment of utility model, identical label indicates identical part in the various figures.
To make simplified form, only schematically showing and the utility model relevant portion, and not generation in each figure
Its practical structures as product of table.In addition, there is identical structure or function in some figures so that simplified form is easy to understand
Component, only symbolically depict one of those, or only marked one of those.
Embodiment according to the present utility model provides a kind of be used to being mounted on printing referring to Fig.1, Fig. 2 a and Fig. 2 b
The radiator 100 that chip 20 on circuit 10 radiates.Chip 20 is caused due to factors such as manufacturing tolerance and installation accuracies
For the different chips of same model, after being mounted on printed circuit board 10, it is also possible to relative to printed circuit
There is different height, this brings certain difficulty to chip cooling to a certain extent for plate 10.
In the present embodiment, the whole mountable side on the printed circuit board 10 of radiator 100, and may include bottom plate 110
And it is mounted on heat radiation module 130 and blower 120 on bottom plate 110.
Bottom plate 110 is settable on the printed circuit board 10, for example, bottom plate 110 can be metal plate plate, or can use
The materials such as the SECC or tinplate that play a supportive role are made, and there is bottom plate 110 thickness appropriate to be mounted thereon to support
All parts, any suitable way can be used between printed circuit board 10 and connect.
Heat radiation module 130 may include heat-conducting piece 131 and elastic component 132, and elastic component 132 can be installed in radiator 100
Pressure is applied to heat-conducting piece 131 when on to printed circuit board 10, for example, downward pressure, enables heat-conducting piece 131 from top
It is fully fitted on chip 20, so that thermal resistance between the two is significantly reduced, after chip 20 generates heat, in chip 20
In the case where directly contacting with heat-conducting piece 131, heat can be thermally conducted to heat-conducting piece 131 from chip 20, it is thus possible to improve and dissipate
Thermal effect.
Thermal hole 111 can be offered on bottom plate 110, as shown in figure 4, heat-conducting piece 131 can pass through the thermal hole 111 and core
Piece 20 is bonded.The size of thermal hole 111 can be slightly larger than the size of heat-conducting piece 131.
Heat-conducting piece 131 can be heat conduction aluminium block, as shown in Figure 2 b, general rectangular, have certain thickness, and lead
Chip 20 can be completely covered in hot aluminium block, so that contact area between the two is maximum.Elastic component 132 can be in long strip
Elastic slice either springs, and it is settable multiple, to apply uniform pressure to heat-conducting piece 131.
Specifically, as shown in Figure 2 b, this four elastic components 132 can be generally with equal there are four elastic component 132 is settable
The mode of even distribution is arranged on heat-conducting piece 131.For example, one end of elastic component 132 may be connected to heat-conducting piece 131, the other end can
It is connected on bottom plate 110.Elastic component 132 can have bending section, not yet be mounted on printed circuit board 10 in radiator 100
And in the state of the non-stress of heat-conducting piece 131, the one end of elastic component 132 connecting with heat-conducting piece 131 will be lower than to be connect with bottom plate 110
One end.In this case, after on the printed circuit board 10 that radiator 100 is installed to not set chip 20,
So that the gap or distance between heat-conducting piece 131 and printed circuit board 10 are less than height of the chip 20 relative to printed circuit board 10
Degree.Therefore, after assembling, due to making gap or distance between heat-conducting piece 131 and printed circuit board 10 in design
It is less than height of the chip 20 relative to printed circuit board 10, chip 20 heads on heat-conducting piece 131 upwards, so that elastic component 132 is sent out
Chip 20 is clamped heat-conducting piece 131 to apply due to deformation and then to heat-conducting piece 131 downward pressure by raw upward deformation
Between printed circuit board 10, realize that heat-conducting piece 131 fits together completely with chip 20.
Alternatively, said from another angle, as described above, not yet by radiator 100 be installed to printed circuit board 10 it
Before, heat-conducting piece 131 and elastic component 132 are in non-stress, and heat-conducting piece 131 is in first highly relative to bottom plate 110, and
After radiator 100 is installed on printed circuit board 10, by the ejection of chip 20, deformation occurs upwards for elastic component 132,
Heat-conducting piece 131 moves up to be in the second height relative to bottom plate 110, and the second height is higher than the first height.
Therefore, for the different chips being mounted on different printing circuit board, the orientation up and down of heat-conducting piece 131 may
It is different, from this point on for, it is believed that the heat radiation module 130 in the present embodiment is floating type heat radiation module 130, that is, is led
Warmware 131 is adjustable assembly height or position under the pressure effect of elastic component 132.Between elastic component 132 and bottom plate 110
It can be connected by way of riveting, for example, settable multiple riveting points 114 on bottom plate 110, as shown in figure 4, these riveting points
114 can be generally in around thermal hole 114.Each elastic component 132 can be connected to bottom plate 110 by two riveting points 114
On.Alternatively, elastic component 132 can also by being bonded, the various suitable modes such as spot welding connect with bottom plate 110.
In addition, heat radiation module 130 may also include heat pipe 133 and radiator 134.Radiator 134 may include radiating fin knot
Structure.Heat pipe 133 transmits heat by the evaporation of the liquid in Totally enclosed vacuum pipe and condensation, have very high thermal conductivity,
Excellent isothermal, heat flow density changeability, direction of heat flow invertibity, can remotely transferring, thermostatic characteristics, thermal diode and heat
The series of advantages such as switch performance.
Heat pipe 133 can be U-shaped, housed inside with the working fluid that can be circulated.Heat pipe 133 may include capillary knot
Structure, and can have evaporation ends 1331, condensation end 1332 and the inactive portion between evaporation ends 1331 and condensation end 1332
1333, as shown in Figure 3a and Figure 3b shows.Evaporation ends 1331 can be connected on heat-conducting piece 131 in a manner of directly contacting, condensation end
1332 are similarly connected to radiator 134 in a manner of directly contacting, consequently facilitating heat pipe 133 and heat-conducting piece 131 and radiator
Heat transfer between 134.When the energization of chip 20, adstante febre, heat can be thermally conducted to heat-conducting piece 131 from chip 20, and then be transmitted to
The evaporation ends 1331 of heat pipe 133, the working fluid in heat pipe 133 absorbs heat in evaporation ends 1331 and evaporates and become steam state, and flows to
For condensation end 1332 to take away heat, which can be the evaporation latent heat of working fluid.In the working fluid of steam via heat
The central passage of pipe 133 and flow to condensation end 1332, and be condensed into liquid at condensation end 1332 and discharge latent heat, in hair
Under fine texture effect, condensed fluid flow back into evaporation ends 1331 again, and continues to absorb heat in evaporation ends 1331, realizes closure
It circulates.
In addition, guide hole 112 can be also offered on bottom plate 110 in order to facilitate the arrangement of heat pipe 133, as shown in figure 4,
The guide hole 112 can extend from thermal hole 111, so that the two holes on the whole can be generally T-shaped.A part pipe of heat pipe 133
Extend from heat-conducting piece 131 along guide hole 112.Guide hole 112 can be more slightly wider relative to heat pipe 133.
Working fluid in heat pipe 133 can be any suitable fluid media (medium), for example, water, air etc..
It is the heat dissipation power source of radiator 100 for the blower 120 of radiator 100, it is mountable in radiator
Around 134, so as to the air quickly flowed be provided for radiator 134, in order to fast towards 134 blow flow of radiator
Speed belt walks the heat released due to working fluid condensation in radiator 134, and these air-flows are flowing through radiator
It is also to be flowed along the direction far from heat-conducting piece 131 when 134, heating after being exchanged heat to prevent fluid stopping through radiator 134
Air-flow flows to heat-conducting piece 131 and reheating heat-conducting piece 131 again.In one embodiment, blower 120 can be centrifugal wind
Machine, it is mountable above heat-conducting piece 131, and can be in same level with radiator 134, as shown in Figure 2 a.In wind
When 120 operation of machine, air-flow, axially into blade space, is then revolved in the driving further aspect of draught fan impeller with impeller by blower
Turn, on the other hand improves energy under the action of inertia, leave impeller along radial direction.
As shown in Figure 2 a, the mountable predetermined height on bottom plate 110 of blower 120, and can be near radiator 134,
To which blower 120 can drive air-flow to flow through radiator 134.As described above, working fluid discharges heat at condensation end 1332, and
This partial heat can be transmitted to radiator 134, and external air flow exchanges heat, to become when flowing through radiator 134 with radiator 134
Heat is taken away at hot-air.
In one embodiment, multiple assembling studs 113 can be set on bottom plate 110, as shown in figure 4, blower 110
It can be mounted on assembling stud 113 by fasteners such as screws.For example, two or more settable assembling studs
113, as long as blower 120 can be securely fixed.
The distance between blower 120 and bottom plate 110, or generally height of the assembling stud 113 relative to bottom plate 110
Degree, can be greater than certain preset distance, the preset distance can be defined as the maximum distance that heat radiation module 120 floats up and down or
The maximum value of the mounting height of chip 20 on the printed circuit board 10 is said, to avoid interference heat-conducting piece 131 for different chips
The assembly height adjustment of progress.
In one embodiment, radiator 100 can further comprise fan shroud, and blower 120 may be mounted in fan shroud,
Fan shroud and blower 120 can be mounted on the side of radiator 134 in same level, when blower 120 operates, certain driving air-flow
Level flows through radiator 134, flow through radiator 134 and the air-flow of heating continues flow forward and without flow through heat-conducting piece 131.Heat dissipation
Device 134 can be at different heights in the vertical direction with heat-conducting piece 131, and projection in the vertical direction can not overlap each other.
Blower 120 may be provided at the top of heat-conducting piece 131, and radiator 134 is located at the side of blower 120.
Certainly, other than this mounting means, blower 120 can also be mounted on other positions, as long as enabling to cold
But air-flow smoothly flows through radiator 134 and cool down.For example, blower 120 is mountable below radiator 134.
It should be understood that other than radiating to the chip on printed circuit board, it is provided by the utility model to dissipate
Thermal 100 can be also used for radiating to other similar device.
By above-mentioned radiator 100, chip 20 pushes up heat-conducting piece 131 upwards, while elastic component 132 passes through deformation to thermally conductive
Part 131 applies downward and pressure, and heat-conducting piece 131 is fit together with the chip 20 as heat source completely always,
And the pressure that elastic component 132 applies heat-conducting piece 131 can be changed automatically according to different chip mounting heights and adaptedly,
Certain chip compactness will not be caused not high because of chip size tolerance and installation error, thus relative to different chip and reality
Border installation situation, heat radiation module 120 can be described as being floating type, to be significantly reduced between heat radiation module 120 and heat source
Thermal resistance improves heat dissipation effect.
In addition, above-mentioned radiator 100 is required to a mounting base 110, installation in general and structure letter
It is single.Since heat-conducting piece 131 is avoided and mounting hole is extraly arranged near chip since pressure effect is fitted on chip
Etc. structures, it is therefore, more flexible so that installation site of the heat-conducting piece 131 on bottom plate 110 is unrestricted, significantly improve just
Victory.
Tool of the series of detailed descriptions listed above only for the feasible embodiment of the utility model
Body explanation, and not to limit the protection scope of the utility model, it is all without departing from made by the utility model skill spirit etc.
Effect embodiment or change should be included within the scope of protection of this utility model such as the combination, segmentation or repetition of feature.
Claims (10)
1. a kind of radiator (100), which is characterized in that the radiator (100) includes:
Bottom plate (110)；
Heat radiation module (130) is mounted on the bottom plate (110), and including heat-conducting piece (131) and elastic component (132), described to lead
Warmware (131) can be electric with the printing below the bottom plate (110) under the pressure effect that the elastic component (132) apply
Chip (20) fitting on road plate (10)；
Blower (120), is mounted on the bottom plate (110) and neighbouring the heat radiation module (130) are arranged, to utilize the gas blowed
It flows and takes away heat from the heat radiation module (130).
2. radiator according to claim 1, which is characterized in that offer thermal hole on the bottom plate (110)
(111), the heat-conducting piece (131) is bonded by the thermal hole (111) with the chip (20).
3. radiator according to claim 1, which is characterized in that the quantity of the elastic component (132) be it is multiple, each
Elastic component (132) is strip elastic slice, and one end is connected to the bottom plate (110), and the other end is connected to the heat-conducting piece
(131)。
4. radiator according to any one of claim 1 to 3, which is characterized in that the heat-conducting piece (131) with it is described
The distance between printed circuit board (10) is less than the thickness of the chip (20).
5. radiator according to claim 3, which is characterized in that the heat radiation module (130) further comprises:
Radiator (134)；
The evaporation ends (1331) of heat pipe (133), the heat pipe (133) are connected on the heat-conducting piece (131), condensation end (1332)
It is connected to the radiator (134), working fluid being capable of the flowing in the heat pipe (133).
6. radiator according to claim 5, which is characterized in that offer guide hole on the bottom plate (110)
(112), a part of the heat pipe (133) is arranged along the guide hole (112).
7. radiator according to claim 6, which is characterized in that the heat pipe (133) is U-shaped and including capillary knot
Structure, to allow working fluid to circulate between the evaporation ends (1331) and the condensation end (1332).
8. radiator according to claim 1, which is characterized in that be further provided with wind on the bottom plate (110)
Machine installs stud (113), and the blower (120) is fixed on the assembling stud (113) by screw, and the wind
The distance between machine (120) and the bottom plate (110) are at least peace of the chip (20) on the printed circuit board (10)
Fill the maximum value of height.
9. radiator according to claim 5, which is characterized in that the radiator (100) further comprise for
The fan shroud of the blower (120) is installed, the fan shroud be located above the heat-conducting piece (131) and with the radiator
(134) it is arranged in same level.
10. radiator according to claim 5, which is characterized in that the blower is centrifugal fan, the heat-conducting piece
It (131) is heat conduction aluminium block, the radiator (134) includes multiple radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821504702.3U CN209330511U (en) | 2018-09-14 | 2018-09-14 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821504702.3U CN209330511U (en) | 2018-09-14 | 2018-09-14 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209330511U true CN209330511U (en) | 2019-08-30 |
Family
ID=67706889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821504702.3U Active CN209330511U (en) | 2018-09-14 | 2018-09-14 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209330511U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113701251A (en) * | 2021-08-30 | 2021-11-26 | 青岛海信日立空调系统有限公司 | Air conditioner |
-
2018
- 2018-09-14 CN CN201821504702.3U patent/CN209330511U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113701251A (en) * | 2021-08-30 | 2021-11-26 | 青岛海信日立空调系统有限公司 | Air conditioner |
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