CN209345488U - A kind of radiator for semiconductor equipment - Google Patents
A kind of radiator for semiconductor equipment Download PDFInfo
- Publication number
- CN209345488U CN209345488U CN201821605823.7U CN201821605823U CN209345488U CN 209345488 U CN209345488 U CN 209345488U CN 201821605823 U CN201821605823 U CN 201821605823U CN 209345488 U CN209345488 U CN 209345488U
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- cooling
- cooling cylinder
- heat dissipation
- mounting box
- fin
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of radiators for semiconductor equipment, including frame and cooling body, the upper and lower part edge correspondence of lower portion side is equipped with two heat dissipation copper pipes, it is equidistant and vertically-mounted have six roots of sensation cooling fin between two groups of heat dissipation copper pipes, the other end of two groups of perfusion tubes is correspondingly connected with the inlet and liquid outlet of cooling body, the utility model, the air of sucking heat dissipation position is rotated using Y80M1-2 type motor driven flabellum, convenient for rapid cooling, conducive to rapid cooling, radiating efficiency is improved；The radiating fin and groove that are welded using the copper sheet two sides of cooling fin increase the contact area with hot-air, improve heat output, radiating efficiency are improved, convenient for rapid cooling inside semiconductor device；Cooled down using the work of SF2-4 profile shaft flow fan to the first cooling cylinder and the second cooling cylinder wind-cooling heat dissipating, the first cooling cylinder and the secondary radiating and cooling of the second cooling cylinder improve coolant liquid cooling efficiency, conducive to the heat dissipation effect for improving semiconductor device.
Description
Technical field
The utility model relates to radiator correlative technology field, specially a kind of radiator for semiconductor equipment.
Background technique
Semicon industry is subordinate to electronics and information industry, belongs to hardware industry, one to grow up based on semiconductor
A industry.Semiconductor refers to that a kind of electric conductivity can be controlled, and range can be from insulator to the material between conductor.No matter from science and technology
Or from the perspective of economic development, the importance of semiconductor is all very huge.Today, most electronic product, was such as counted
Core cell in calculation machine, mobile phone or digital audio tape all has extremely close connection with semiconductor.Common
Semiconductor material has silicon, germanium, GaAs etc., and silicon is even more in various semiconductor materials, most powerful in business application
One kind.Semiconductor manufacturing facility carries out that a large amount of heat can be generated when semiconductors manufacture, therefore needs to carry out radiating and cooling to it
Semiconductor equipment is set to work normally for a long time, but semiconductor has strict requirements to environment during generating, generally
It is required that being extremely net environment, general wind-cooling heat dissipating needs are swapped with outside air, are polluted inside semiconductor manufacturing facility
Environment, therefore cannot use, when using liquid-cooling heat radiation, now without the liquid-cooling heat radiation mechanism for being used for semiconductor equipment, by general liquid cooling
Cooling mechanism is used for semiconductor heat-dissipating, and radiating efficiency is lower, influences heat dissipation effect.The utility model proposes one kind for half thus
The radiator of conductor device is for solving the above problems.
Utility model content
The purpose of this utility model is to provide a kind of radiators for semiconductor equipment, to solve above-mentioned background technique
The problem of middle proposition.
To achieve the above object, the utility model provides the following technical solutions: a kind of radiator for semiconductor equipment,
Including frame and cooling body, the upper and lower part edge of the lower portion side, which corresponds to, is equipped with two heat dissipation copper pipes, and two
It is equidistant and vertically-mounted have six roots of sensation cooling fin, the interface pair of two one middle side parts of heat dissipation copper pipe between the group heat dissipation copper pipe
It should be tightly connected one end of two perfusion tubes, the other end of perfusion tube described in two groups is correspondingly connected with the inlet of cooling body and goes out
Liquid mouth, lower portion horizontal axis position and the side far from cooling fin are horizontally installed with Y80M1-2 type motor, described
The attachment base at the output shaft end connection flabellum center of Y80M1-2 type motor, the cooling fin includes copper sheet and radiating fin, institute
Copper sheet inner hollow is stated, 16 radiating fins correspond to the two sides that level is welded on copper sheet, the cooling body packet two-by-two
Mounting box, SF2-4 profile shaft flow fan, the first cooling cylinder, the second cooling cylinder and JB/T5415-2000 micro centrifugal pump are included, it is described
Side inside mounting box is vertically-mounted SF2-4 profile shaft flow fan, and the middle position inside the mounting box is tiltedly installed with
First cooling cylinder, the other side inside the mounting box are tiltedly installed with the second cooling cylinder, and the mounting box bottom corresponds to the
The position of one cooling cylinder and the second cooling cylinder is equipped with two groups of JB/T5415-2000 micro centrifugal pumps.
Preferably, the cooling body include the first separation net, the second separation net, mounting rack and windshield, described first
Separation net is chimeric to be mounted on the opening inner side that mounting box is opened up close to axial flow blower side, and second separation net is chimeric to be mounted on
The opening inner side that mounting box is opened up close to the second cooling cylinder side is equipped with SF2-4 profile shaft flow fan on the inside of the mounting rack,
The top and bottom of the mounting rack connect the top and bottom of mounting box by fixing screws, and the windshield is chimeric to be mounted on
Between SF2-4 profile shaft flow fan and mounting box.
Preferably, the top of first cooling cylinder is tightly connected the top of the second cooling cylinder, two groups of institutes by connecting tube
It states liquid outlet and inlet at the top of JB/T5415-2000 micro centrifugal pump and the first cooling cylinder and second is correspondingly connected with by conduit
The bottom end of cooling cylinder.
Preferably, the cooling fin further includes support column and groove, and support column described in eight groups is equidistantly welded on the interior of copper sheet
Side, two grooves correspond to punching press in the two sides of copper sheet.
Preferably, the radiating fin outer surface is equidistantly stamped with diamond groove, and the top of the copper sheet and bottom end are corresponding
It is connected to two heat dissipation copper pipes.
Preferably, the output shaft of the Y80M1-2 type motor is pacified towards cooling fin, the outside of the Y80M1-2 type motor
Equipped with pod.
Preferably, the two sides of the frame roof and bottom are corresponding is welded with four connecting plates, two heat dissipations vertically
The corresponding inside for being mounted on two steel tanks of copper pipe, the corresponding top and bottom being welded on the inside of frame of two steel tanks.
Compared with prior art, the utility model has the beneficial effects that
1. being convenient for rapid cooling using the air of Y80M1-2 type motor driven flabellum rotation sucking heat dissipation position, being conducive to fast
Speed heat dissipation, improves radiating efficiency；
2. the radiating fin and groove that are welded using the copper sheet two sides of cooling fin increase the contact area with hot-air, improve
Heat output improves radiating efficiency, convenient for rapid cooling inside semiconductor device；3, it is worked using SF2-4 profile shaft flow fan to the
One cooling cylinder and the cooling of the second cooling cylinder wind-cooling heat dissipating, the first cooling cylinder and the secondary radiating and cooling of the second cooling cylinder, improve cooling
Liquid cooling efficiency, conducive to the heat dissipation effect for improving semiconductor device.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of the utility model；
Fig. 2 is the cooling fin cross-sectional structure schematic diagram of the utility model；
Fig. 3 is the cooling body structural schematic diagram of the utility model.
In figure: frame 1, heat dissipation copper pipe 2, cooling fin 3, copper sheet 31, radiating fin 32, support column 33, groove 34, cooler
Structure 4, mounting box 41, the first separation net 42, the second separation net 43, SF2-4 profile shaft flow fan 44, the first cooling cylinder 45, second are cold
But cylinder 46, JB/T5415-2000 micro centrifugal pump 47, mounting rack 48, windshield 49, Y80M1-2 type motor 5, flabellum 6, steel tank
7, perfusion tube 8, pod 9, connecting plate 10.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of radiator for semiconductor equipment, packet
Frame 1 and cooling body 4 are included, the upper and lower part edge of 1 interior side of frame, which corresponds to, is equipped with two heat dissipation copper pipes 2, and two groups
Between heat dissipation copper pipe 2 it is equidistant and it is vertically-mounted have a six roots of sensation cooling fin 3, the corresponding sealing of the interface of two 2 one middle side parts of heat dissipation copper pipe
One end of two perfusion tubes 8 is connected, the other end of two groups of perfusion tubes 8 is correspondingly connected with the inlet and liquid outlet of cooling body 4, frame
The side of 1 inner horizontal axial location of frame and separate cooling fin 3 is horizontally installed with Y80M1-2 type motor 5, Y80M1-2 type motor 5
Output shaft end connection 6 center of flabellum attachment base, Y80M1-2 type motor 5 drive flabellum 6 rotation sucking heat dissipation position sky
Gas is convenient for rapid cooling, is conducive to rapid cooling, improves radiating efficiency, and cooling fin 3 includes copper sheet 31 and radiating fin 32, copper sheet
31 inner hollows, 16 radiating fins 32 correspond to the two sides that level is welded on copper sheet 31 two-by-two, and cooling body 4 includes mounting box
41, SF2-4 profile shaft flow fan 44, the first cooling cylinder 45, the second cooling cylinder 46 and JB/T5415-2000 micro centrifugal pump 47, peace
Side inside mounted box 41 is vertically-mounted SF2-4 profile shaft flow fan 44, and the middle position inside mounting box 41 is tiltedly installed with
First cooling cylinder 45, the other side inside mounting box 41 are tiltedly installed with the second cooling cylinder 46, and 41 bottom of mounting box corresponds to the
The position of one cooling cylinder 45 and the second cooling cylinder 46 is equipped with two groups of JB/T5415-2000 micro centrifugal pumps 47, SF2-4 profile shaft stream
The work of blower 44 cools down to the first cooling cylinder 45 and 46 wind-cooling heat dissipating of the second cooling cylinder, the first cooling cylinder 45 and the second cooling cylinder 46
Secondary radiating and cooling improves coolant liquid cooling efficiency, conducive to the heat dissipation effect for improving semiconductor device.
Further, cooling body 4 includes the first separation net 42, the second separation net 43, mounting rack 48 and windshield 49, the
One separation net 42 is chimeric to be mounted on the opening inner side that mounting box 41 is opened up close to 44 side of axial flow blower, and the second separation net 43 is chimeric
It is mounted on the opening inner side that mounting box 41 is opened up close to 46 side of the second cooling cylinder, the inside of mounting rack 48 is equipped with SF2-4 type
Axial flow blower 44, the top and bottom of mounting rack 48 connect the top and bottom of mounting box 41, windshield 49 by fixing screws
It is chimeric to be mounted between SF2-4 profile shaft flow fan 44 and mounting box 41.
Further, the top of the first cooling cylinder 45 by connecting tube be tightly connected the second cooling cylinder 46 top, two groups
The liquid outlet and inlet at the top of JB/T5415-2000 micro centrifugal pump 47 are correspondingly connected with the first cooling cylinder 45 and the by conduit
The bottom end of two cooling cylinders 46.
Further, cooling fin 3 further includes support column 33 and groove 34, and eight groups of support columns 33 are equidistantly welded on copper sheet 31
Inside, the corresponding punching presses of two grooves 34 are in the two sides of copper sheet 31, the radiating fin 32 of 31 two sides of the copper sheet welding of cooling fin 3 and recessed
Slot 34 increases the contact area with hot-air, improves heat output, improves radiating efficiency, convenient for quickly dissipating inside semiconductor device
Heat.
Further, 32 outer surface of radiating fin is equidistantly stamped with diamond groove, the corresponding company in the top of copper sheet 31 and bottom end
Lead to two heat dissipation copper pipes 2.
Further, the output shaft of Y80M1-2 type motor 5 is equipped with towards cooling fin 3, the outside of Y80M1-2 type motor 5
Pod 9.
Further, the two sides of 1 top and bottom of frame are corresponding is welded with four connecting plates 10, two heat dissipation copper pipes vertically
The 2 corresponding inside for being mounted on two steel tanks 7, the corresponding top and bottom for being welded on 1 inside of frame of two steel tanks 7.
Working principle: in actual work, frame 1 is fixed on by the connecting plate 10 of 1 two sides of frame and is partly led by operator
The position for needing to radiate inside body device, and make the side of cooling fin 3 close to the position for needing to radiate, cooling fin 3, perfusion tube 8
Inside injection coolant liquid, then cooling body 4 is mounted on the outside of semiconductor device by operator, and then operator controls
Y80M1-2 type motor 5 drives the air of the rotation sucking heat dissipation of flabellum 6 position, is convenient for rapid cooling, is conducive to rapid cooling, improves
Radiating efficiency；3 internal coolant of cooling fin absorbs heat spreader, 32 He of radiating fin of 31 two sides of the copper sheet welding of cooling fin 3
Groove 34 increases the contact area with hot-air, improves heat output, improves radiating efficiency, convenient for quickly dissipating inside semiconductor device
Heat；Coolant liquid inside cooling fin 3 is conveyed into the first cooling cylinder by the effect of one group of JB/T5415-2000 micro centrifugal pump 47
45 and second inside cooling cylinder 46, and the work of SF2-4 profile shaft flow fan 44 is to the first cooling cylinder 45 and the second cooling cylinder 46 is air-cooled dissipates
Heat drop temperature, 46 2 radiating and coolings of the first cooling cylinder 45 and the second cooling cylinder improve coolant liquid cooling efficiency, partly lead conducive to improving
The heat dissipation effect of body device, the coolant liquid inside the second cooling cylinder 46 pass through another group of JB/T5415-2000 micro centrifugal pump 47
Again it is conveyed into inside cooling fin 3.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (7)
1. a kind of radiator for semiconductor equipment, including frame (1) and cooling body (4), it is characterised in that: the frame
(1) the upper and lower part edge of interior side, which corresponds to, is equipped with two heat dissipation copper pipes (2), between heat dissipation copper pipe described in two groups (2)
It is equidistant and it is vertically-mounted have six roots of sensation cooling fin (3), the interface of two (2) one middle side parts of heat dissipation copper pipe is corresponding to be tightly connected two
One end of root perfusion tube (8), the other end of perfusion tube described in two groups (8) are correspondingly connected with the inlet and liquid out of cooling body (4)
Mouthful, the side of frame (1) the inner horizontal axial location and separate cooling fin (3) is horizontally installed with Y80M1-2 type motor
(5), the attachment base at output shaft end connection flabellum (6) center of the Y80M1-2 type motor (5), the cooling fin (3) include
Copper sheet (31) and radiating fin (32), copper sheet (31) inner hollow, 16 radiating fins (32) correspond to water two-by-two
For flat welded in the two sides of copper sheet (31), the cooling body (4) includes mounting box (41), SF2-4 profile shaft flow fan (44), first
Cooling cylinder (45), the second cooling cylinder (46) and JB/T5415-2000 micro centrifugal pump (47), the one of mounting box (41) inside
Side is vertically-mounted SF2-4 profile shaft flow fan (44), and it is cold that the internal middle position of the mounting box (41) is tiltedly installed with first
But cylinder (45), the internal other side of the mounting box (41) are tiltedly installed with the second cooling cylinder (46), mounting box (41) bottom
Portion corresponds to the first cooling cylinder (45) and the position of the second cooling cylinder (46) is equipped with two groups of JB/T5415-2000 micro centrifugal pumps
(47)。
2. a kind of radiator for semiconductor equipment according to claim 1, it is characterised in that: the cooling body
It (4) include the first separation net (42), the second separation net (43), mounting rack (48) and windshield (49), first separation net
(42) it is fitted into and is mounted on the opening inner side that mounting box (41) are opened up close to axial flow blower (44) side, second separation net (43)
The chimeric opening inner side for being mounted on mounting box (41) and being opened up close to the second cooling cylinder (46) side, the inside of the mounting rack (48)
SF2-4 profile shaft flow fan (44) is installed, the top and bottom of the mounting rack (48) connect mounting box by fixing screws
(41) top and bottom, the windshield (49) is chimeric to be mounted between SF2-4 profile shaft flow fan (44) and mounting box (41).
3. a kind of radiator for semiconductor equipment according to claim 1, it is characterised in that: first cooling cylinder
(45) top by connecting tube be tightly connected the second cooling cylinder (46) top, JB/T5415-2000 described in two groups it is miniature from
Liquid outlet and inlet at the top of heart pump (47) are correspondingly connected with the first cooling cylinder (45) and the second cooling cylinder (46) by conduit
Bottom end.
4. a kind of radiator for semiconductor equipment according to claim 1, it is characterised in that: the cooling fin (3)
It further include support column (33) and groove (34), support column described in eight groups (33) is equidistantly welded on the inside of copper sheet (31), two institutes
Groove (34) corresponding punching press is stated in the two sides of copper sheet (31).
5. a kind of radiator for semiconductor equipment according to claim 1, it is characterised in that: the radiating fin
(32) outer surface is equidistantly stamped with diamond groove, and the top of the copper sheet (31) is connected to two heat dissipation copper pipes (2) with bottom end correspondence.
6. a kind of radiator for semiconductor equipment according to claim 1, it is characterised in that: the Y80M1-2 type
The output shaft of motor (5) is equipped with pod (9) on the outside of the Y80M1-2 type motor (5) towards cooling fin (3).
7. a kind of radiator for semiconductor equipment according to claim 1, it is characterised in that: frame (1) top
The two sides of portion and bottom are corresponding to be welded with four connecting plates (10) vertically, and two heat dissipation copper pipe (2) correspondences are mounted on two
The inside of steel tank (7), the corresponding top and bottom being welded on the inside of frame (1) of two steel tanks (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821605823.7U CN209345488U (en) | 2018-09-29 | 2018-09-29 | A kind of radiator for semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821605823.7U CN209345488U (en) | 2018-09-29 | 2018-09-29 | A kind of radiator for semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209345488U true CN209345488U (en) | 2019-09-03 |
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ID=67745370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821605823.7U Active CN209345488U (en) | 2018-09-29 | 2018-09-29 | A kind of radiator for semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209345488U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114534640A (en) * | 2022-02-16 | 2022-05-27 | 安徽海华科技集团有限公司 | Methylation reaction system for o-cresol production |
-
2018
- 2018-09-29 CN CN201821605823.7U patent/CN209345488U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114534640A (en) * | 2022-02-16 | 2022-05-27 | 安徽海华科技集团有限公司 | Methylation reaction system for o-cresol production |
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