CN212519547U - High-efficient radiating multilayer printed wiring board - Google Patents

High-efficient radiating multilayer printed wiring board Download PDF

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Publication number
CN212519547U
CN212519547U CN202021438177.7U CN202021438177U CN212519547U CN 212519547 U CN212519547 U CN 212519547U CN 202021438177 U CN202021438177 U CN 202021438177U CN 212519547 U CN212519547 U CN 212519547U
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Prior art keywords
radiator
pipeline
circuit board
printed wiring
multilayer printed
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CN202021438177.7U
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Chinese (zh)
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王小明
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Shenzhen Jiubaba Electronics Co ltd
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Shenzhen Jiubaba Electronics Co ltd
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Abstract

The utility model discloses a high-efficient radiating multilayer printed wiring board, including first circuit board, first radiator, second circuit board, second pipeline, second radiator and the cold row of second, the basal surface one end fixed mounting of first circuit board has first radiator, and outside one side of first radiator is equipped with first entry, and the one end of first pipeline is installed to the internal connection of first entry, and just first pipeline pastes the basal surface at first circuit board, the other end of first pipeline is connected to the inside of first export, and first export establishes the outside opposite side at first radiator, inside one side of first radiator is equipped with first cold row, and the inside opposite side of first radiator is equipped with first water pump. The utility model discloses utilize two radiators to carry out the circulation flow through the copper pipe with the cooling water on the surface of two circuit boards to take away the heat of its production, reduce the circuit board temperature, improve the radiating efficiency.

Description

High-efficient radiating multilayer printed wiring board
Technical Field
The utility model relates to a circuit board technical field specifically is a high-efficient radiating multilayer printed wiring board.
Background
The circuit board is divided into a single-sided board, a double-sided board and a multilayer board according to the number of layers, wherein the single-sided board has the same surface with wires, the manufacture is usually simple, the double-sided board can only be used for simple products, the two end faces of the double-sided board can be connected with the wires, and the multilayer board has at least more than three layers.
With the improvement of the living standard of people and the continuous development of electronic information technology, the multilayer board becomes the mainstream product of the circuit board, the multilayer circuit board is small in size, large in capacity and lighter and thinner, but the existing multilayer circuit board has a plurality of medium layers, and the generated heat cannot be dissipated, so that the work of the circuit board is influenced, and even the circuit board is damaged.
The existing multilayer circuit board mostly uses the internal copper layer or aluminum layer to dissipate heat, which aims to make the multilayer circuit board thin, but the heat dissipation effect is not ideal.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-efficient radiating multilayer printed wiring board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient radiating multilayer printed wiring board, includes first circuit board, first radiator, second circuit board, second pipeline, second radiator and the cold row of second, the basal surface one end fixed mounting of first circuit board has first radiator, and outside one side of first radiator is equipped with first entry, and the one end of first pipeline is installed to the internal connection of first entry, and just first pipeline pastes the basal surface at first circuit board, the other end of first pipeline is connected to the inside of first export, and first export establishes the outside opposite side at first radiator, inside one side of first radiator is equipped with first cold row, and the inside opposite side of first radiator is equipped with first water pump.
Preferably, a second radiator is fixedly mounted at one end of the top surface of the second circuit board, a second inlet is formed in one side of the outer portion of the second radiator, one end of a second pipeline is connected and mounted in the second inlet, and the second pipeline is attached to the top surface of the second circuit board.
Preferably, the other end of the second pipe is connected to the inside of the second outlet, and the second outlet is provided at the other side of the outside of the second radiator.
Preferably, a second cold row is arranged on one side inside the second radiator, and a second water pump is arranged on the other side inside the second radiator.
Preferably, the first pipeline and the second pipeline are both made of copper materials.
Preferably, a first fan is fixedly installed on the rear surface of the first cold row, and a second fan is fixedly installed on the rear surface of the second cold row.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a first pipeline, because of adopting the copper product material to make, so the coolant liquid that flows in this first pipeline can give the heat that first circuit board produced and take away, reached the recirculated cooling liquid and taken away thermal effect, through setting up first fan, make the coolant liquid with this heat take first cold row in back can dispel the heat and fall, reached the radiating effect of forced air cooling, through setting up first water pump, make the coolant liquid in the first pipeline can flow the circulation, reached the initiative and extracted the coolant liquid and carry out the effect of circulating.
2. The utility model discloses a second pipeline, because of adopting the copper product material to make, so the coolant liquid that flows in this second pipeline can give the heat that the second circuit board produced and take away, reached the recirculated cooling liquid and taken away thermal effect, through setting up the second fan, make the coolant liquid with this heat can dispel the heat and fall after taking this heat to the cold row of second in, the radiating effect of forced air cooling has been reached, through setting up the second water pump, make the coolant liquid in the second pipeline can flow the circulation, reached the initiative and extracted the coolant liquid and carry out the effect of circulating.
Drawings
Fig. 1 is a schematic front view of the present invention;
fig. 2 is a schematic rear view of the present invention;
fig. 3 is a schematic bottom view of the first circuit board of the present invention;
fig. 4 is a schematic top view of the second circuit board according to the present invention.
In the figure: 1. a first circuit board; 2. a first conduit; 3. a first inlet; 4. a first heat sink; 5. a first cold row; 6. a first water pump; 7. a first outlet; 8. a second circuit board; 9. a second conduit; 10. a second outlet; 11. a second water pump; 12. a second heat sink; 13. a second cold row; 14. a second inlet; 15. a first fan; 16. a second fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 4, the present invention provides an embodiment: a high-efficiency heat-dissipation multilayer printed circuit board comprises a first circuit board 1, a first radiator 4, a second circuit board 8, a second pipeline 9, a second radiator 12 and a second cold row 13, wherein the first radiator 4 is fixedly installed at one end of the bottom surface of the first circuit board 1, a first inlet 3 is formed in one side of the outer portion of the first radiator 4, one end of a first pipeline 2 is installed in the first inlet 3 in a connected mode, the first pipeline 2 is attached to the bottom surface of the first circuit board 1, the first pipeline 2 is made of copper materials, so that heat generated by the first circuit board 1 can be taken away by cooling liquid flowing in the first pipeline 2, the effect that the heat is taken away by circulating cooling liquid is achieved, the other end of the first pipeline 2 is connected to the inner portion of a first outlet 7, the first outlet 7 is formed in the other side of the outer portion of the first radiator 4, the first cold row 5 is arranged on one side of the inner portion of the first radiator 4, the installation of first cold row 5 makes the cooling liquid contain the heat in first pipeline 2 and can cooperate first fan 15 to expand the heat dissipation by a wide margin, the fixed surface installs first fan 15 behind first cold row 5, through setting up first fan 15, make the cooling liquid with this heat take first cold row 5 in the back can dispel the heat and fall, the radiating effect of forced air cooling has been reached, the inside opposite side of first radiator 4 is equipped with first water pump 6, through setting up first water pump 6, make the cooling liquid in the first pipeline 2 can flow the circulation, the effect that the cooling liquid that has reached the initiative extraction and has carried out the circulation.
A second radiator 12 is fixedly mounted at one end of the top surface of the second circuit board 8, a second inlet 14 is arranged at one side of the outside of the second radiator 12, one end of a second pipeline 9 is mounted in the second inlet 14 in an internal connection mode, the second pipeline 9 is attached to the top surface of the second circuit board 8, the second pipeline 9 is made of copper materials, so that heat generated by the second circuit board 8 can be taken away by cooling liquid flowing in the second pipeline 9, the effect of taking away the heat by circulating the cooling liquid is achieved, the first pipeline 2 and the second pipeline 9 are both made of copper materials, the other end of the second pipeline 9 is connected to the inside of a second outlet 10, the second outlet 10 is arranged at the other side of the outside of the second radiator 12, a second cold row 13 is arranged at one side of the inside of the second radiator 12, and the second cold row 13 is mounted so that the heat contained in the cooling liquid in the second pipeline 9 can be greatly matched with a second fan 16 for expansion and heat dissipation, the rear surface fixed mounting of second cold row 13 has second fan 16, through setting up second fan 16, makes the coolant liquid can dispel the heat and arrange after taking this heat to the cold row 13 of second in, has reached the radiating effect of forced air cooling, and the inside opposite side of second radiator 12 is equipped with second water pump 11, through setting up second water pump 11, makes the coolant liquid in the second pipeline 9 can flow the circulation, has reached the effect that the active extraction coolant liquid circulated.
The working principle is as follows: the utility model discloses need external power supply before the use, then open the switch, its first water pump 6 begins work, first water pump 6 is taken out the cooling liquid in first pipeline 2 and is made its basal surface at first circuit board 1 circulate, its coolant liquid flows out through first export 7, absorb and take away the heat that first circuit board 1 sent through first pipeline 2, this coolant liquid flows into the inside of first entry 3 at last, then first entry 3 is with this coolant liquid first cold row 5 on, and first fan 15 behind the first cold row 5 begins to rotate, it flows wind and blows away the heat on first cold row 5 surface, this coolant liquid returns first water pump 6's inside at last, thereby accomplish the circulation, and the heat dissipation flow of second circuit board 8 is the same with the heat dissipation flow of first circuit board 1.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a high-efficient radiating multilayer printed wiring board, includes first circuit board (1), first radiator (4), second circuit board (8), second pipeline (9), second radiator (12) and the cold row of second (13), its characterized in that: the utility model discloses a cold water pipeline, including first circuit board (1), the outside of first circuit board (1) is equipped with first pipeline (2), the inside connection of first pipeline (3) installs the one end of first pipeline (2), and first pipeline (2) paste the basal surface at first circuit board (1), the other end of first pipeline (2) is connected to the inside of first export (7), and first export (7) establish the outside opposite side at first radiator (4), inside one side of first radiator (4) is equipped with first cold row (5), and the inside opposite side of first radiator (4) is equipped with first water pump (6).
2. The multilayer printed wiring board with efficient heat dissipation according to claim 1, wherein: the top surface one end fixed mounting of second circuit board (8) has second radiator (12), and the outside one side of second radiator (12) is equipped with second entry (14), and the one end of second pipeline (9) is installed to the internal connection of second entry (14), and second pipeline (9) paste on the top surface of second circuit board (8).
3. The multilayer printed wiring board with efficient heat dissipation according to claim 1, wherein: the other end of the second pipeline (9) is connected to the inside of a second outlet (10), and the second outlet (10) is arranged on the other side of the outside of the second radiator (12).
4. The multilayer printed wiring board with efficient heat dissipation according to claim 1, wherein: and a second cold row (13) is arranged on one side in the second radiator (12), and a second water pump (11) is arranged on the other side in the second radiator (12).
5. The multilayer printed wiring board with efficient heat dissipation according to claim 1, wherein: the first pipeline (2) and the second pipeline (9) are both made of copper materials.
6. The multilayer printed wiring board with efficient heat dissipation according to claim 1, wherein: the rear surface of the first cold row (5) is fixedly provided with a first fan (15), and the rear surface of the second cold row (13) is fixedly provided with a second fan (16).
CN202021438177.7U 2020-07-18 2020-07-18 High-efficient radiating multilayer printed wiring board Active CN212519547U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021438177.7U CN212519547U (en) 2020-07-18 2020-07-18 High-efficient radiating multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021438177.7U CN212519547U (en) 2020-07-18 2020-07-18 High-efficient radiating multilayer printed wiring board

Publications (1)

Publication Number Publication Date
CN212519547U true CN212519547U (en) 2021-02-09

Family

ID=74436563

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021438177.7U Active CN212519547U (en) 2020-07-18 2020-07-18 High-efficient radiating multilayer printed wiring board

Country Status (1)

Country Link
CN (1) CN212519547U (en)

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