CN212783436U - High-efficient radiating integrated circuit - Google Patents

High-efficient radiating integrated circuit Download PDF

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Publication number
CN212783436U
CN212783436U CN202022245879.XU CN202022245879U CN212783436U CN 212783436 U CN212783436 U CN 212783436U CN 202022245879 U CN202022245879 U CN 202022245879U CN 212783436 U CN212783436 U CN 212783436U
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CN
China
Prior art keywords
integrated circuit
heat dissipation
air inlet
fixedly arranged
dissipation layer
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Application number
CN202022245879.XU
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Chinese (zh)
Inventor
武堃
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Xiamen Jingcun Semiconductor Technology Co Ltd
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Xiamen Jingcun Semiconductor Technology Co Ltd
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Priority to CN202022245879.XU priority Critical patent/CN212783436U/en
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Publication of CN212783436U publication Critical patent/CN212783436U/en
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Abstract

The utility model discloses a high-efficient radiating integrated circuit relates to integrated circuit heat dissipation technical field, can produce a large amount of heats at the function in-process for solving current integrated circuit, and these heats cause adverse effect to integrated circuit easily, to this we need advance radiating problem to it. The integrated circuit heat dissipation mechanism comprises an integrated circuit heat dissipation mechanism body, and is characterized in that an upper heat dissipation layer is arranged above the integrated circuit heat dissipation mechanism body and is fixedly connected with the upper portion of the integrated circuit heat dissipation mechanism body, an integrated circuit mounting groove is formed in the middle position of the upper heat dissipation layer, an integrated circuit body is fixedly mounted inside the integrated circuit mounting groove, an air inlet machine is fixedly mounted at the upper end of the integrated circuit body, two air inlet machines are mounted on the air inlet machine, an air inlet is fixedly mounted at the rear end face of the air inlet machine, and an air inlet through hole is fixedly mounted between the air inlet.

Description

High-efficient radiating integrated circuit
Technical Field
The utility model relates to an integrated circuit heat dissipation technical field specifically is a high-efficient radiating integrated circuit.
Background
An integrated circuit (integrated circuit) is a type of microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability. It is denoted by the letter "IC" in the circuit.
However, the conventional integrated circuit generates a large amount of heat during operation, and the heat is easy to cause adverse effects on the integrated circuit, so that heat dissipation is needed; thus, the existing requirements are not met, and an integrated circuit with efficient heat dissipation is provided for the existing requirements.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-efficient radiating integrated circuit to solve the current integrated circuit that proposes in the above-mentioned background art and can produce a large amount of heats at the function in-process, these heats cause adverse effect to integrated circuit easily, to this we need advance radiating problem to it.
In order to achieve the above object, the utility model provides a following technical scheme: an integrated circuit with high-efficiency heat dissipation comprises an integrated circuit heat dissipation mechanism body, an upper heat dissipation layer is arranged above the integrated circuit heat dissipation mechanism body and fixedly connected with the upper part of the integrated circuit heat dissipation mechanism body, an integrated circuit mounting groove is fixedly arranged at the middle position of the upper radiating layer, an integrated circuit body is fixedly arranged inside the integrated circuit mounting groove, an air inlet fan is fixedly arranged at the upper end of the integrated circuit body, two air inlet fans are arranged, an air inlet is fixedly arranged on the rear end face of each air inlet fan, an air inlet through hole is fixedly arranged between each air inlet fan and the integrated circuit body, an exhaust fan is fixedly arranged at the lower end of the integrated circuit body, and two exhaust fans are installed, the rear end face of each exhaust fan is fixedly provided with an air outlet, and an air exhaust through hole is fixedly installed between each exhaust fan and the integrated circuit body.
Preferably, a bottom heat dissipation layer is arranged below the integrated circuit heat dissipation mechanism body and fixedly connected with the lower portion of the integrated circuit heat dissipation mechanism body, and a bottom aluminum alloy radiator is fixedly mounted at the lower end of the bottom heat dissipation layer.
Preferably, a bottom heat conducting fin is fixedly arranged between the bottom aluminum alloy radiator and the integrated circuit mounting groove.
Preferably, four equal fixed mounting in angle of upper portion heat dissipation layer outer wall have set screw, and four angles of upper portion heat dissipation layer outer wall all are through set screw and bottom heat dissipation layer threaded connection.
Preferably, an aluminum alloy shell is fixedly mounted on the outer wall of the integrated circuit mounting groove.
Preferably, a side heat-conducting fin is fixedly mounted on one side of the aluminum alloy shell, which is far away from the integrated circuit mounting groove.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses an upper and lower both ends at the integrated circuit body are equipped with air inlet through-hole and exhaust through-hole respectively, it is effectual to make the integrated circuit body ventilate in the integrated circuit mounting groove, the heat of being convenient for is scattered from the through-hole department, air inlet through-hole department is equipped with the air inlet machine and can inhales wind from the air intake, exhaust through-hole department is equipped with the air exhauster and comes to discharge inside wind from air outlet department, different operational mode through two above-mentioned fans, can improve the radiating efficiency of inside integrated circuit body, thereby can reach high-efficient radiating purpose, and then avoided the high temperature to cause the condition appearance of adverse effect to integrated circuit.
2. The bottom heat dissipation layer adopts the bottom conducting strip to conduct heat, so that the heat on the upper portion of the bottom heat dissipation layer can be conducted to the bottom aluminum alloy radiator through the bottom conducting strip to dissipate heat, and the overall heat dissipation effect can be further improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a partial structure of the upper heat dissipation layer of the present invention;
FIG. 3 is a schematic view of a partial structure of the bottom heat dissipation layer of the present invention;
in the figure: 1. an integrated circuit heat dissipation mechanism body; 2. an upper heat dissipation layer; 3. a bottom heat dissipation layer; 4. fixing screws; 5. an integrated circuit body; 6. an integrated circuit mounting slot; 7. a bottom thermally conductive sheet; 8. an air inlet; 9. an air inlet machine; 10. an air inlet through hole; 11. an air outlet; 12. an exhaust fan; 13. an air exhaust through hole; 14. an aluminum alloy housing; 15. a side heat-conducting fin; 16. bottom aluminum alloy radiator.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, the present invention provides an embodiment: an integrated circuit with high-efficiency heat dissipation comprises an integrated circuit heat dissipation mechanism body 1, an upper heat dissipation layer 2 is arranged above the integrated circuit heat dissipation mechanism body 1, the upper heat dissipation layer 2 is fixedly connected with the upper part of the integrated circuit heat dissipation mechanism body 1, an integrated circuit mounting groove 6 is fixedly arranged at the middle position of the upper heat dissipation layer 2, an integrated circuit body 5 is fixedly arranged inside the integrated circuit mounting groove 6, an air inlet machine 9 is fixedly arranged at the upper end of the integrated circuit body 5, two air inlet fans 9 are arranged, an air inlet 8 is fixedly arranged on the rear end surface of the air inlet fan 9, an air inlet through hole 10 is fixedly arranged between the air inlet fan 9 and the integrated circuit body 5, an exhaust fan 12 is fixedly arranged at the lower end of the integrated circuit body 5, two exhaust fans 12 are installed, an exhaust outlet 11 is fixedly installed on the rear end face of each exhaust fan 12, and an exhaust through hole 13 is fixedly installed between each exhaust fan 12 and the integrated circuit body 5.
Further, a bottom heat dissipation layer 3 is arranged below the integrated circuit heat dissipation mechanism body 1, the bottom heat dissipation layer 3 is fixedly connected with the lower portion of the integrated circuit heat dissipation mechanism body 1, a bottom aluminum alloy radiator 16 is fixedly mounted at the lower end of the bottom heat dissipation layer 3, the bottom heat dissipation layer 3 conducts heat through a bottom heat conduction sheet 7, heat on the upper portion of the bottom heat dissipation layer can be conducted to the bottom aluminum alloy radiator 16 through the bottom heat conduction sheet 7, and therefore the overall heat dissipation effect can be further improved.
Further, a bottom heat conducting fin 7 is fixedly arranged between the bottom aluminum alloy radiator 16 and the integrated circuit mounting groove 6, and the bottom heat conducting fin 7 plays a role in heat conduction.
Further, four equal fixed mounting in angle of upper portion heat dissipation layer 2 outer wall have set screw 4, and four angles in upper portion heat dissipation layer 2 outer wall all pass through set screw 4 and 3 threaded connection in bottom heat dissipation layer, utilize set screw 4 can convenience of customers with upper portion heat dissipation layer 2 and bottom heat dissipation layer 3 make up fixedly.
Further, an aluminum alloy housing 14 is fixedly mounted on the outer wall of the ic mounting groove 6, and the side heat-conducting fins 15 conduct the side heat with the aluminum alloy housing 14.
Further, a side heat-conducting fin 15 is fixedly mounted on the side of the aluminum alloy case 14 away from the ic mounting groove 6, and the side heat-conducting fin 15 is used for side heat conduction.
The working principle is as follows: when in use, the upper end and the lower end of the integrated circuit body 5 are respectively provided with the air inlet through hole 10 and the air outlet through hole 13, so that the integrated circuit body 5 has good ventilation effect in the integrated circuit mounting groove 6, the heat can be conveniently dissipated from the through holes, the air inlet machine 9 arranged at the air inlet through hole 10 can suck air from the air inlet 8, the air outlet machine 12 arranged at the air outlet through hole 13 is used for discharging internal air from the air outlet 11, the heat dissipation efficiency of the internal integrated circuit body 5 can be improved through different operation modes of the two fans, the purpose of high-efficiency heat dissipation can be achieved, the adverse effect of overhigh temperature on the integrated circuit can be avoided, the bottom heat dissipation layer 3 adopts the bottom heat conduction sheet 7 for heat conduction, the heat at the upper part can be conducted to the bottom aluminum alloy radiator 16 through the bottom heat conduction sheet 7, and the whole heat dissipation effect can be further improved, the fixing screws 4 can be used for facilitating the user to combine and fix the upper heat dissipation layer 2 and the bottom heat dissipation layer 3, and the side heat conduction fins 15 and the aluminum alloy shell 14 conduct the side heat.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a high-efficient radiating integrated circuit, includes integrated circuit heat dissipation mechanism body (1), its characterized in that: the integrated circuit heat dissipation mechanism comprises an integrated circuit heat dissipation mechanism body (1), wherein an upper heat dissipation layer (2) is arranged above the integrated circuit heat dissipation mechanism body (1), the upper heat dissipation layer (2) is fixedly connected with the upper portion of the integrated circuit heat dissipation mechanism body (1), an integrated circuit mounting groove (6) is fixedly arranged at the middle position of the upper heat dissipation layer (2), an integrated circuit body (5) is fixedly arranged inside the integrated circuit mounting groove (6), an air inlet fan (9) is fixedly arranged at the upper end of the integrated circuit body (5), two air inlet fans (9) are arranged on the air inlet fan (9), an air inlet through hole (10) is fixedly arranged between the air inlet fan (9) and the integrated circuit body (5), an exhaust fan (12) is fixedly arranged at the lower end of the integrated circuit body (5), two air inlets (8) are arranged on the exhaust fan (12), and an exhaust outlet (11) is fixedly arranged on the rear end face of, an air exhaust through hole (13) is fixedly arranged between the exhaust fan (12) and the integrated circuit body (5).
2. An integrated circuit with efficient heat dissipation as recited in claim 1, wherein: the integrated circuit heat dissipation mechanism is characterized in that a bottom heat dissipation layer (3) is arranged below the integrated circuit heat dissipation mechanism body (1), the bottom heat dissipation layer (3) is fixedly connected with the lower portion of the integrated circuit heat dissipation mechanism body (1), and a bottom aluminum alloy radiator (16) is fixedly mounted at the lower end of the bottom heat dissipation layer (3).
3. An integrated circuit with efficient heat dissipation as recited in claim 2, wherein: and a bottom heat conducting fin (7) is fixedly arranged between the bottom aluminum alloy radiator (16) and the integrated circuit mounting groove (6).
4. An integrated circuit with efficient heat dissipation as recited in claim 1, wherein: four equal fixed mounting in angle of upper portion heat dissipation layer (2) outer wall have set screw (4), and four angles of upper portion heat dissipation layer (2) outer wall all are through set screw (4) and bottom heat dissipation layer (3) threaded connection.
5. An integrated circuit with efficient heat dissipation as recited in claim 1, wherein: and an aluminum alloy shell (14) is fixedly arranged on the outer wall of the integrated circuit mounting groove (6).
6. An integrated circuit with efficient heat dissipation as recited in claim 5, wherein: and a side heat-conducting fin (15) is fixedly arranged on one side of the aluminum alloy shell (14) far away from the integrated circuit mounting groove (6).
CN202022245879.XU 2020-10-10 2020-10-10 High-efficient radiating integrated circuit Active CN212783436U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022245879.XU CN212783436U (en) 2020-10-10 2020-10-10 High-efficient radiating integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022245879.XU CN212783436U (en) 2020-10-10 2020-10-10 High-efficient radiating integrated circuit

Publications (1)

Publication Number Publication Date
CN212783436U true CN212783436U (en) 2021-03-23

Family

ID=75057114

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022245879.XU Active CN212783436U (en) 2020-10-10 2020-10-10 High-efficient radiating integrated circuit

Country Status (1)

Country Link
CN (1) CN212783436U (en)

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