CN221573120U

CN221573120U - Heat abstractor for server network card

Info

Publication number: CN221573120U
Application number: CN202323608698.9U
Authority: CN
Inventors: 李文泉
Original assignee: Shenzhen Lianrui Electronics Co ltd
Current assignee: Shenzhen Lianrui Electronics Co ltd
Priority date: 2023-12-27
Filing date: 2023-12-27
Publication date: 2024-08-20
Anticipated expiration: 2033-12-27

Abstract

The utility model discloses a server network card heat abstractor, which comprises a carrier and at least two heat radiating fins, wherein the carrier is used for being detachably arranged on a server network card and is positioned at one side of the server network card, which is away from a circuit board body, and the carrier can exchange heat with the server network card; the at least two radiating fins are arranged on the carrier, each radiating fin is positioned on one side of the carrier, which is opposite to the server network card, and each radiating fin can exchange heat with the carrier. The technical scheme of the utility model can efficiently cool the server network card.

Description

Heat abstractor for server network card

Technical Field

The utility model relates to the technical field of network card heat dissipation, in particular to a server network card heat dissipation device.

Background

A Server Network card (Server Network INTERFACE CARD), also known as a Server Network adapter or Server Network interface card, is an expansion card or integrated circuit for connecting a Server to a computer Network, which provides a communication interface between the Server and the Network, enabling the Server to exchange and communicate data with other devices via the Network.

In recent years, the requirements on the data transmission rate of a server are higher and higher, and as the data transmission rate is increased, the requirements on the performance of the network card are also higher and higher, so that the power consumption of the network card is higher and higher, and the heat dissipation of the network card is important.

At present, the server network card is generally integrated on a circuit board in the case, and heat dissipation of the server network card is mainly realized by driving gas in the case to flow by a fan in the case, specifically, when flowing gas flows through the server network card, heat on the surface of the server network card can be taken away, and cooling is realized, but the cooling mode cannot meet the cooling requirement of the current high-performance network card.

Disclosure of utility model

The utility model mainly aims to provide a server network card heat dissipation device, which aims to solve the technical problem that the existing cooling mode of a server network card cannot meet the cooling requirement of a high-performance network card.

In order to achieve the above purpose, the heat dissipation device for the server network card provided by the utility model comprises a carrier and at least two heat dissipation fins, wherein the carrier is detachably arranged on the server network card and is positioned at one side of the server network card, which is opposite to the circuit board body, and the carrier can exchange heat with the server network card; the at least two radiating fins are arranged on the carrier, each radiating fin is positioned on one side of the carrier, which is opposite to the server network card, and each radiating fin can exchange heat with the carrier.

In one possible implementation manner, the at least two cooling fins are arranged at intervals, a gas flow channel is formed between any two adjacent cooling fins, each gas flow channel extends in the width direction of the carrier, an extension end of the gas flow channel is provided with an air inlet, and the other extension end of the gas flow channel is provided with an air outlet.

In one possible embodiment, the width of each gas flow channel is gradually reduced from the corresponding air inlet to the corresponding air outlet.

In one possible embodiment, the heat sink has side edges facing away from the carrier, the side edges of all of the heat sinks being in the same plane.

In a possible implementation manner, the carrier comprises a bottom plate and a carrier plate, the bottom plate is used for being detachably arranged on the server network card, the carrier plate is rotatably arranged on the bottom plate and is positioned on one side of the bottom plate, which is away from the server network card, and each radiating fin is arranged on one side of the carrier plate, which is away from the bottom plate;

The bottom plate can be in heat exchange with the server network card and the carrier plate respectively, the carrier plate can be in heat exchange with any radiating fins, and the carrier plate rotates relative to the bottom plate so as to adjust the orientation of the radiating fins.

In one possible implementation manner, the bottom plate is provided with a first threaded hole, the carrier plate is provided with a second threaded hole corresponding to the first threaded hole, and the server network card heat dissipation device comprises a screw, and the screw can sequentially penetrate through the second threaded hole and the first threaded hole and is in threaded connection with the second threaded hole and the first threaded hole respectively.

According to the server network card heat dissipation device, the carrier capable of performing heat exchange with the server network card is arranged on the side surface of the circuit board body, facing away from the server, of the server network card, the heat transfer radiating fins of the server network card are based on the carrier, the radiating fins of the sheet body structure have enough surface area to be in contact with gas flowing in the server case, high-efficiency heat dissipation is achieved, on the premise that the fan power in the case is not increased, the radiating area between the server network card and the gas in the case is indirectly increased by arranging the radiating fins, the heat dissipation effect of the server network card is improved, and the use safety of the server network card is ensured.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a heat dissipation device for a network card of a server according to an embodiment of the present utility model;

fig. 2 is a partial enlarged view at a in fig. 1.

Reference numerals illustrate:

1. A carrier; 11. a bottom plate; 12. a carrier plate; 2. a heat sink; 21. a gas flow passage; 22. an air inlet; 23. an air outlet; 24. a side edge; 100. a server network card.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, "and/or" throughout this document includes three schemes, taking a and/or B as an example, including a technical scheme, a technical scheme B, and a technical scheme that both a and B satisfy; in addition, the technical solutions of the embodiments may be combined with each other, and it is necessary to base that the technical solutions can be implemented by those skilled in the art, and when the technical solutions are contradictory or cannot be implemented, it should be considered that the combination of the technical solutions does not exist and is not within the scope of protection claimed by the present utility model.

The utility model provides a heat dissipation device for a server network card.

In the embodiment of the present utility model, as shown in fig. 1 and fig. 2, the server network card heat dissipation device includes a carrier 1 and at least two heat dissipation fins 2, where the carrier 1 is detachably disposed on the server network card 100 and is located at a side of the server network card 100 facing away from the board body of the circuit board, and the carrier 1 can exchange heat with the server network card 100; at least two cooling fins 2 are all arranged on the carrier 1, each cooling fin 2 is positioned on one side of the carrier 1 facing away from the server network card 100, and each cooling fin 2 can exchange heat with the carrier 1.

Both the carrier 1 and the heat sink 2 are made of a thermally conductive material, such as copper, aluminum, silver, iron, etc.

There are various manners in which the carrier 1 may be detachably mounted on the server network card 100, for example, one of the carrier 1 and the server network card 100 is provided with a buckle, and the other is provided with a slot, and the buckle and the slot are clamped so as to realize detachable connection between the carrier 1 and the server network card 100, for example, screw holes are provided on both the carrier 1 and the server network card 100, and the carrier 1 is fixed on the server network card 100 by connecting the screw with the two screw holes, and for example, the carrier 1 may be adhered on the server network card 100 by means of adhesion.

It is to be understood that, in the server network card heat dissipation device according to the technical scheme of the utility model, the carrier 1 capable of performing heat exchange with the server network card 100 is installed on the side surface of the circuit board body of the server network card 100, the heat transfer radiating fin 2 of the server network card 100 is based on the carrier 1, the radiating fin 2 of the sheet structure has enough surface area to be in contact with the gas flowing in the server case, so that efficient heat dissipation is realized, and on the premise of not increasing the fan power in the case, the radiating area between the server network card 100 and the gas in the case is indirectly increased by arranging the radiating fin 2, so that the heat dissipation effect of the server network card 100 is improved, and the use safety of the server network card 100 is ensured.

At least two cooling fins 2 are arranged at intervals, a gas flow passage 21 is formed between any two adjacent cooling fins 2, each gas flow passage 21 extends in the width direction of the carrier 1, an extension end of the gas flow passage 21 is provided with an air inlet 22, and the other extension end of the gas flow passage 21 is provided with an air outlet 23.

In fact, after the assembly is completed, the air inlet 22 of the air flow channel 21 faces the fan in the chassis, when the fan is started, air flows from the fan to the air inlet 22, enters the air flow channel 21 from the air inlet 22, and finally flows to the air outlet 23 under the guidance of the air flow channel 21, and in the process, the air can be guided to flow between the cooling fins 2 effectively, so that the cooling efficiency is improved.

The width of each gas flow passage 21 is gradually reduced from the corresponding air inlet 22 to the corresponding air outlet 23. The width of the gas flow channel 21 refers to the interval between the two corresponding heat dissipation fins 2.

It will be appreciated that the gas flow path 21 is limited in the flow process due to the gradual decrease in width, so that the gas flow rate is increased, and the higher gas flow rate can enhance the heat transfer and heat removal effects, thereby further improving the heat dissipation efficiency.

In addition, since the width of the gas flow channel 21 is gradually reduced, gas molecules can be made to be closer to the surface of the heat sink 2, and the contact area between the gas and the heat sink 2 is increased.

The heat sink 2 has side edges 24 facing away from the carrier 1, the side edges 24 of all heat sinks 2 being on the same plane. Thus, air can flow between the radiating fins 2 more smoothly, the resistance of air circulation is reduced, and the radiating effect is improved.

Meanwhile, all the side edges 24 of the radiating fins 2 are on the same plane, so that no protruding part exists between the radiating fins 2, maintenance and replacement are convenient for maintenance personnel, interference to other components in the chassis can be reduced, and maintenance convenience is improved.

An opening for allowing gas to flow into the gas flow channel 21 is formed between two adjacent side edges 24, gas in the chassis flows into or out of the gas flow channel 21 through the openings between the air inlet 22, the air outlet 23 and the two side edges 24, and the opening between the two adjacent side edges 24 is not sealed, so that the efficiency of gas flowing into or out of the gas flow channel 21 is improved, and the gas can efficiently dissipate heat on the surface of the heat plate 2.

The carrier 1 comprises a bottom plate 11 and a carrier plate 12, the bottom plate 11 is detachably arranged on the server network card 100, the carrier plate 12 is rotatably arranged on the bottom plate 11 and is positioned at one side of the bottom plate 11, which is away from the server network card 100, and each radiating fin 2 is arranged at one side of the carrier plate 12, which is away from the bottom plate 11;

the bottom plate 11 can exchange heat with the server network card 100 and the carrier plate 12 respectively, the carrier plate 12 can exchange heat with any radiating fins 2, and the carrier plate 12 rotates relative to the bottom plate 11 to adjust the orientation of the radiating fins 2.

It will be appreciated that, because the carrier plate 12 can rotate, the arrangement direction of the cooling fins 2 can be adjusted according to the actual situation, so that the air inlet 22 of the air flow channel 21 can more accurately face the fan to obtain the best cooling effect, which is also helpful to adapt to different server models and configurations.

In specific implementation, there are various embodiments of the rotational connection between the base plate 11 and the carrier plate 12, for example, slots are formed on the base plate 11 and the carrier plate 12, and the carrier plate 12 can be rotated by taking the rod body as an axis by screwing the carrier plate 12 when the carrier plate is used, for example, the base plate 11 is provided with a first threaded hole, the carrier plate 12 is provided with a second threaded hole (not shown) corresponding to the first threaded hole (not shown), the server network card heat dissipation device comprises screws (not shown), the screws can sequentially pass through the second threaded hole and the first threaded hole and are respectively in threaded connection with the second threaded hole and the first threaded hole, when the screws are not installed, the rotation angle of the carrier plate 12 is adjusted in advance, and then the screws pass through the second threaded hole and the first threaded hole, and the screws are screwed down, so that the server network card heat dissipation device is convenient, fast, firm and reliable.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims

1. A server network card heat dissipation device for a server network card (100), comprising:

The carrier (1) is used for being detachably arranged on the server network card (100) and is positioned on one side of the server network card (100) away from the circuit board body, and the carrier (1) can exchange heat with the server network card (100); and

The server comprises at least two radiating fins (2), wherein the at least two radiating fins (2) are arranged on a carrier (1), each radiating fin (2) is positioned on one side of the carrier (1) opposite to the server network card (100), and each radiating fin (2) can exchange heat with the carrier (1).

2. The server network card heat dissipating device according to claim 1, wherein the at least two heat dissipating fins (2) are arranged at intervals, a gas flow channel (21) is formed between any two adjacent heat dissipating fins (2), each gas flow channel (21) extends in the width direction of the carrier (1), an extension end of the gas flow channel (21) is formed with an air inlet (22), and the other extension end of the gas flow channel (21) is formed with an air outlet (23).

3. The server network card heat sink according to claim 2, wherein the width of each air flow channel (21) is tapered in a direction from the corresponding air inlet (22) to the corresponding air outlet (23).

4. A server network card heat sink according to claim 2, characterized in that the heat sink (2) has side edges (24) facing away from the carrier (1), the side edges (24) of all the heat sinks (2) being on the same plane.

5. The server network card heat dissipation device according to claim 1, wherein the carrier (1) comprises a bottom plate (11) and a carrier plate (12), the bottom plate (11) is used for being detachably arranged on the server network card (100), the carrier plate (12) is rotatably arranged on the bottom plate (11) and is positioned on one side of the bottom plate (11) facing away from the server network card (100), and each heat dissipation sheet (2) is arranged on one side of the carrier plate (12) facing away from the bottom plate (11);

The base plate (11) can be in heat exchange with the server network card (100) and the carrier plate (12) respectively, the carrier plate (12) can be in heat exchange with any radiating fin (2), and the carrier plate (12) rotates relative to the base plate (11) to adjust the orientation of the radiating fin (2).

6. The server network card heat dissipating device according to claim 5, wherein the bottom plate (11) is provided with a first threaded hole, the carrier plate (12) is provided with a second threaded hole corresponding to the first threaded hole, and the server network card heat dissipating device comprises a screw which can sequentially pass through the second threaded hole and the first threaded hole and is in threaded connection with the second threaded hole and the first threaded hole, respectively.