CN220629639U - Multi-area efficient heat exchange circuit board - Google Patents

Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to a multi-area efficient heat exchange circuit board, which comprises a support frame, a mounting plate and a cooling fan, wherein the support frame is arranged on the circuit board; the mounting plate is arranged at the end part of the support frame far away from the circuit board, and a cavity for air flow to pass through is formed between the mounting plate and the circuit board; the heat radiation fan is arranged at the end part of the mounting plate, which is opposite to the circuit board; wherein, the mounting panel wears to be equipped with the gas pocket of intercommunication die cavity, and the shape adaptation of mounting panel and circuit board, radiator fan are located the gas pocket and are located the one side that the circuit board was dorsad. Through the mounting panel structure with circuit board body shape adaptation, construct the die cavity structure of cover on whole circuit board electrical component, simultaneously, when this die cavity structure lets in the air current, the air current can flow through all electrical components on the circuit board, makes the circuit board correspond the heat exchange area of unit that generates heat and promotes by a wide margin, improves heat exchange efficiency effectively, and then promotes the heat dispersion of circuit board.

Description

Multi-area efficient heat exchange circuit board

Technical Field

The utility model belongs to the technical field of circuit boards, and particularly relates to a multi-area efficient heat exchange circuit board.

Background

Many devices and electronic components in the instruments generate a large amount of heat during the working process, and the heat needs to be dissipated from the instruments as soon as possible, otherwise the instruments are overheated, damaged and even burnt. In the fields of computers, automobile instruments, central control systems and the like, in order to increase the heat dissipation speed, a heat dissipation fan is generally required to be mounted on a circuit board, and the heat is carried away by using flowing wind blown out by the fan, so that the heat dissipation speed is increased.

For example, the application number is: CN201922328391.0, entitled "radiator fan mounting structure on circuit board" refers to a radiator fan mounting structure on circuit board, a mounting bracket disposed on one side of circuit board is provided with a mounting groove into which a radiator fan is placed, a plurality of mounting holes and positioning holes are respectively disposed at opposite positions of a side surface of the radiator fan and the mounting groove, and a buffer rubber pad is disposed in the mounting holes and has a protruding portion extending into the positioning holes, so that the radiator fan and the mounting bracket are separated to form a buffer; in addition, one side of the cooling fan adjacent to the circuit board is provided with an electric connection sheet, and an elastic connection spring sheet is arranged at the position, opposite to the electric connection sheet, on the circuit board, and the traditional electric wire is replaced by connection of the electric connection sheet and the connection spring sheet, so that the installation complexity is reduced. Through the use of this radiator fan mounting structure, can effectively improve radiator fan's the convenience of installing and removing to reduce its operational noise, with the travelling comfort in improvement environment.

As can be seen from the above, most of the fan structures adopted in the conventional circuit board heat dissipation structures are directly mounted on the circuit board, the air supply end is aligned with the heat source of the circuit board, such as a chip, when the high-speed air flow output by the fan passes through the heat source, the heat is taken away to realize heat dissipation, however, most of the fan structures on the conventional circuit board extend to one side of the heat source through the bracket, when the high-speed air flow is output along with the leaf fan, the high-speed air flow is initially directed towards the heat source, but lacks an effective guiding component, the high-speed air flow is gradually dispersed, so that the amount of air acting on the heat source is small, the flow velocity is low, the heat transfer efficiency of the heat source is low, and a good heat dissipation function cannot be realized.

Disclosure of Invention

The utility model aims to provide a multi-area efficient heat exchange circuit board, which aims to solve the technical problems that a fan structure on a traditional circuit board mostly extends to one side of a heating source through a bracket, an effective guiding component is lacking, high-speed air flow can be gradually dispersed, so that the amount of air acting on the heating source is small, the flow speed is low, the heat transfer efficiency of the heating source is low, and a good heat dissipation function cannot be realized.

In order to achieve the above purpose, the multi-area efficient heat exchange circuit board provided by the embodiment of the utility model comprises a support frame, a mounting plate and a cooling fan, wherein the support frame is arranged on the circuit board; the mounting plate is arranged at the end part of the support frame far away from the circuit board, and a cavity for air flow to pass through is formed between the mounting plate and the circuit board; the cooling fan is arranged at the end part of the mounting plate, which is opposite to the circuit board; the mounting plate is provided with an air hole communicated with the cavity in a penetrating mode, the mounting plate is matched with the circuit board in shape, and the cooling fan is located on one side, back to the circuit board, of the air hole.

Optionally, the quantity of support frame is four groups, four groups the support frame sets up respectively in the corner position of circuit board, four corners of mounting panel respectively with four groups support frame fixed connection.

Optionally, the air hole is formed at the center of the mounting plate, the cooling fan is arranged at the center of the mounting plate, and the cooling fan pumps the hot air in the cavity to the outer sides of the mounting plate and the circuit board through the air hole.

Optionally, the cooling fan comprises a connecting frame, a cooling frame and a rotating impeller, wherein the connecting frame is arranged on the mounting plate; the heat dissipation frame is arranged at the end part of the connecting frame far away from the mounting plate; the rotary impeller is arranged on the heat dissipation frame; the connecting frame is positioned on one side of the air hole, and a gap is arranged between the end part of the connecting frame for installing the heat dissipation frame and the installing plate.

Optionally, the heat dissipation frame is formed by multiunit aluminium fin interval combination, the heat dissipation frame is annular structure setting, the heat dissipation frame is kept away from the tip of link is provided with the mounting groove, rotatory impeller sets up in the mounting groove, arbitrary adjacent two sets of clearance between the aluminium fin with the mounting groove intercommunication.

Optionally, a plurality of groups of heat conducting fins are arranged between the edges of the mounting plate and the circuit board, and the plurality of groups of heat conducting fins are distributed at intervals so as to divide the edge gaps of the mounting plate and the circuit board into a plurality of groups of air inlets.

Optionally, the heat conducting fin is disposed in an inclined structure compared to the mounting plate.

Optionally, the number of the air holes is multiple, and multiple groups of the air holes are uniformly arranged on the mounting plate in a penetrating way.

The technical scheme or schemes in the multi-area efficient heat exchange circuit board provided by the embodiment of the utility model at least have one of the following technical effects: after the mounting plate is connected with the circuit board through the support frame, a cavity for accommodating electrical components such as chips is formed between the mounting plate and the circuit board, the edge of the cavity is automatically formed into an air port, when the cooling fan operates, air flow enters the cavity from the air port, heat of the electrical components is carried, and the heat is output through the cooling fan, so that heat dissipation is realized; compared with the technical problems that the traditional fan structure mostly extends to one side of a heating source through a support, an effective guiding component is lacking, high-speed air flow can be gradually dispersed, so that the air quantity acting on the heating source is small, the flow speed is low, the heat transfer efficiency of the heating source is low, and a good heat dissipation function cannot be realized.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a multi-area efficient heat exchange circuit board according to an embodiment of the present utility model.

Fig. 2 is a side view of the multi-area high efficiency heat exchange circuit board of fig. 1.

Fig. 3 is a cut-away view of a multi-area efficient heat exchange circuit board provided by an embodiment of the utility model.

Fig. 4 is a schematic structural diagram of a cooling fan according to an embodiment of the present utility model.

Fig. 5 is a schematic structural diagram of a multi-area efficient heat exchange circuit board according to an embodiment of the present utility model when multiple groups of air holes are used.

Fig. 6 is a cut-away view of a mounting plate and support bracket provided by an embodiment of the present utility model.

Fig. 7 is a schematic structural diagram of a mounting plate and a supporting frame with multiple groups of air holes according to an embodiment of the present utility model.

Fig. 8 is a schematic structural view of a heat conductive sheet according to an embodiment of the present utility model.

Wherein, each reference sign in the figure:

100-support 200-mounting plate 300-cooling fan

400-die cavity 500-air hole 310-connecting frame

320-heat dissipation frame 330-rotary impeller 600-heat conducting fin

340-mounting groove.

Description of the embodiments

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to fig. 1 to 8 are exemplary and intended to illustrate embodiments of the present utility model and should not be construed as limiting the utility model.

In the description of the embodiments of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the embodiments of the present utility model and simplify description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.

In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.

In one embodiment of the present utility model, as shown in fig. 1 to 8, a multi-area efficient heat exchange circuit board is provided, which includes a support 100, a mounting board 200 and a cooling fan 300, wherein the support 100 is disposed on the circuit board; the mounting plate 200 is arranged at the end part of the support frame 100 far away from the circuit board, and a cavity 400 for air flow to pass through is formed between the mounting plate 200 and the circuit board; the heat dissipation fan 300 is disposed at an end of the mounting board 200 opposite to the circuit board; wherein, the mounting plate 200 is provided with an air hole 500 communicated with the cavity 400, the shape of the mounting plate 200 is adapted to the shape of the circuit board, and the cooling fan 300 is positioned at one side of the air hole 500 away from the circuit board. In this embodiment, the electrical components of the circuit board are all disposed in the cavity 400, so that the air flow takes away the heat from all the heat generating sources. In other embodiments, the electrical components may be disposed outside the cavity 400, and a thermally conductive material, such as a copper fin structure, may be disposed within the cavity 400 to provide heat exchange with the airflow as a heat transfer component that increases the heat transfer efficiency of the circuit board.

Specifically, after the mounting plate 200 is connected with the circuit board through the supporting frame 100, a cavity 400 for accommodating electrical components such as chips is formed between the mounting plate 200 and the circuit board, the edge of the cavity 400 is automatically formed into an air port, when the cooling fan 300 operates, air flow enters the cavity 400 from the air port, heat of the electrical components is carried, and the heat is output through the cooling fan 300, so that heat dissipation is realized; compared with the technical problems that the traditional fan structure mostly extends to one side of the heating source through the support, the effective guiding component is lacking, high-speed air flow can be gradually dispersed, so that the air quantity acting on the heating source is small, the flow speed is low, the heat transfer efficiency of the heating source is low, and a good heat dissipation function cannot be realized.

As shown in fig. 1 to 8, in another embodiment of the present utility model, the number of the supporting frames 100 is four, the four groups of supporting frames 100 are respectively disposed at corner positions of the circuit board, the four corners of the mounting plate 200 are respectively and fixedly connected with the four groups of supporting frames 100, in this embodiment, the circuit board is disposed in a square plate structure, the shape of the mounting plate 200 is adapted to that of the circuit board, when the mounting plate 200 is disposed on the supporting frames 100, the mounting plate 200 is parallel to the circuit board, and the cavity 400 is disposed in a long and narrow cuboid structure, which is beneficial to improving the gas flow rate, further improving the contact speed between the heat generating source and the gas, and further improving the heat exchange efficiency of the circuit board.

As shown in fig. 1 to 3, in another embodiment of the present utility model, the air hole 500 is formed at a central position of the mounting board 200, the cooling fan 300 is disposed at a central position of the mounting board 200, and the air hole 500 at the central position is configured to rapidly and uniformly exhaust the air flow around the air hole 500, so as to prevent the heat dissipation effect of each position of the circuit board from being different; the heat radiation fan 300 pumps the hot air in the cavity 400 to the outside of the mounting plate 200 and the circuit board through the air hole 500. The positions of the air holes 500 are flexible, and in other embodiments, the air holes 500 may be disposed at the edge of the mounting board 200, and the corresponding cooling fan 300 may be changed according to the change of the disposed positions of the air holes 500.

As shown in fig. 4, in another embodiment of the present utility model, the heat radiation fan 300 includes a connection frame 310, a heat radiation frame 320, and a rotating impeller 330, the connection frame 310 being disposed on the mounting plate 200; the heat dissipation frame 320 is disposed at an end of the connection frame 310 away from the mounting board 200; the rotating impeller 330 is disposed on the heat dissipation frame 320; the connecting frame 310 is located at one side of the air hole 500, a gap is provided between the end of the connecting frame 310, which is used for installing the heat dissipation frame 320, and the mounting plate 200, and dust is always accumulated on the heat dissipation frame 320 along with the time increase of the operation of the rotating impeller 330, and the gap structure is adopted to facilitate the air flow to smoothly enter the heat dissipation frame 320 from the air hole 500, so as to prevent the air hole 500 from being blocked by the dust. Wherein the rotating impeller 330 is a micro fan.

As shown in fig. 4, in another embodiment of the present utility model, the heat dissipation frame 320 is formed by combining a plurality of groups of aluminum fins at intervals, the heat dissipation frame 320 is disposed in a ring structure, an end portion of the heat dissipation frame 320 away from the connection frame 310 is provided with a mounting groove 340, the rotating impeller 330 is disposed in the mounting groove 340, and a gap between any two adjacent groups of aluminum fins is communicated with the mounting groove 340; the main function of the rotating impeller 330 is to form a negative pressure at the position of the air hole 500 to pump hot air to the outside of the cavity 400, so that the heat dissipation frame 320 with a gap structure can not only prevent the air in the air hole 500 from being blocked, but also exchange heat with the fin type heat dissipation frame 320 with a large area when the air flows through the gap, thereby further improving the heat exchange effect.

As shown in fig. 8, in another embodiment of the present utility model, a plurality of groups of heat conductive fins 600 are disposed between the edges of the mounting board 200 and the circuit board, and the plurality of groups of heat conductive fins 600 are spaced apart to divide the edge gap between the mounting board 200 and the circuit board into a plurality of groups of tuyeres. The multi-group tuyere structure can enable air flow to fill into the cavity 400 from a plurality of air inlet angles, so that heat dissipation uniformity is improved.

In another embodiment of the present utility model, as shown in fig. 8, the heat conducting strip 600 is disposed in an inclined structure compared to the mounting plate 200, and the heat conducting strip 600 disposed in the inclined structure is beneficial to prolonging the contact time between the heat conducting strip 600 and the gas, thereby improving the heat exchange efficiency.

In another embodiment of the present utility model, as shown in fig. 5 to 8, the number of the air holes 500 is multiple, and multiple groups of the air holes 500 are uniformly arranged on the mounting board 200 in an array. So as to increase the exhaust speed of the air hole 500 and further improve the heat dissipation effect.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims (8)

1. The utility model provides a high-efficient heat transfer circuit board of multiple areas which characterized in that includes:

the support frame is arranged on the circuit board;

the mounting plate is arranged at the end part of the support frame far away from the circuit board, and a cavity for air flow to pass through is formed between the mounting plate and the circuit board;

the cooling fan is arranged at the end part of the mounting plate, which is opposite to the circuit board;

the mounting plate is provided with an air hole communicated with the cavity in a penetrating mode, the mounting plate is matched with the circuit board in shape, and the cooling fan is located on one side, back to the circuit board, of the air hole.

2. The multi-area high efficiency heat exchange circuit board of claim 1, wherein: the number of the supporting frames is four, the four supporting frames are respectively arranged at the corner positions of the circuit board, and the four corners of the mounting plate are respectively and fixedly connected with the four supporting frames.

3. The multi-area high efficiency heat exchange circuit board of claim 2, wherein: the air holes are formed in the center of the mounting plate, the cooling fan is arranged in the center of the mounting plate, and the cooling fan pumps hot air in the cavity to the outer sides of the mounting plate and the circuit board through the air holes.

4. The multi-area efficient heat exchange circuit board according to any one of claims 1 to 3, wherein: the heat dissipation fan includes:

the connecting frame is arranged on the mounting plate;

the heat dissipation frame is arranged at the end part of the connecting frame far away from the mounting plate;

the rotary impeller is arranged on the heat dissipation frame;

the connecting frame is positioned on one side of the air hole, and a gap is arranged between the end part of the connecting frame for installing the heat dissipation frame and the installing plate.

5. The multi-area high efficiency heat exchange circuit board of claim 4, wherein: the heat dissipation frame is formed by combining a plurality of groups of aluminum fins at intervals, the heat dissipation frame is in an annular structure, the heat dissipation frame is far away from the end part of the connecting frame, a mounting groove is formed in the end part of the connecting frame, the rotating impeller is arranged in the mounting groove, and any two adjacent groups of gaps between the aluminum fins are communicated with the mounting groove.

6. The multi-area efficient heat exchange circuit board according to any one of claims 1 to 3, wherein: a plurality of groups of heat conducting fins are arranged between the edges of the mounting plate and the circuit board, and the heat conducting fins are distributed at intervals to divide the gaps between the edges of the mounting plate and the circuit board into a plurality of groups of air inlets.

7. The multi-area high efficiency heat exchange circuit board of claim 6, wherein: the heat conducting fin is arranged in an inclined structure compared with the mounting plate.

8. The multi-area high efficiency heat exchange circuit board of claim 1, wherein: the number of the air holes is multiple, and the air holes are uniformly arranged on the mounting plate in a penetrating mode.