CN218735758U - High-efficient radiating high heat conduction aluminium base board - Google Patents
High-efficient radiating high heat conduction aluminium base board Download PDFInfo
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- CN218735758U CN218735758U CN202222815229.3U CN202222815229U CN218735758U CN 218735758 U CN218735758 U CN 218735758U CN 202222815229 U CN202222815229 U CN 202222815229U CN 218735758 U CN218735758 U CN 218735758U
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- heat dissipation
- high heat
- radiator
- heat
- aluminum substrate
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Abstract
The utility model discloses a high-efficient radiating high heat conduction aluminium base board, including the heat dissipation lid, fixedly connected with radiator on the inside position of heat dissipation lid, all run through and be provided with miniature fan on the inside position of radiator, the upper surface of heat dissipation lid is provided with three wire guide side by side on leaning on the front position in the left side, the upper surface of heat dissipation lid is provided with the radiator switch on leaning on the front position on the right side. The utility model discloses in, the cooling lid can realize the protection to aluminium base board body, the heat conduction on the aluminium base board body can be accelerateed to the copper, in the heat of being convenient for spreads into the radiator box through the copper, heat on the copper can pass through graphite flake and heat dissipation silicone grease simultaneously, thermal conduction can be with higher speed, be convenient for realize thermal absorption, the radiator can be to the heat of graphite flake and heat dissipation silicone grease go on the external heat dissipation, micro fan during operation, the air flow can accelerate, can pass through the louvre with the air in the radiator and effuse like this, thermal external heat dissipation efficiency has been improved like this.
Description
Technical Field
The utility model relates to an aluminium base board field especially relates to a high-efficient radiating high heat conduction aluminium base board.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. The high-end application is also designed to be a double-sided board, and the structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer. The aluminum-based composite board is rarely used as a composite board and can be formed by laminating a common composite board, an insulating layer and an aluminum base.
The aluminum substrate assembly on the existing market has the function of fast heat conduction, when the aluminum substrate assembly is used for a long time, surface heat is accumulated and cannot be dissipated, the operation resistance of the aluminum substrate is too large, the normal use of the aluminum substrate is influenced, meanwhile, the electronic element is easy to age in an accelerated mode when the aluminum substrate assembly works under the high-temperature condition, the aluminum substrate assembly is not beneficial to long-term use of the aluminum substrate, and the heat dissipation effect is limited.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, and the aluminium base board of high-efficient radiating high heat conduction that proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the high-heat-conductivity aluminum substrate with high-efficiency heat dissipation comprises a heat dissipation cover, wherein a radiator is fixedly connected to the inner position of the heat dissipation cover, a micro fan penetrates through and is arranged on the inner position of the radiator, three parallel wire holes are formed in the upper surface of the heat dissipation cover close to the middle and front positions of the left side, a radiator switch is arranged on the upper surface of the heat dissipation cover close to the front position of the right side, an insulating layer is fixedly connected to the surface position of the bottom of the radiator, first sliding grooves penetrate through and are arranged at two ends of the bottom of the inner side of the heat dissipation cover, first sliding blocks are slidably connected in the sliding grooves, graphite sheets are fixedly connected between the inner wall positions of the two sliding blocks, an aluminum substrate is arranged at the bottom of the graphite sheets, copper plates are fixedly connected at the top and the bottom of the aluminum substrate, heat dissipation silicon grease is arranged at the bottom of the copper plates, and a heat dissipation box is fixedly connected between the middle positions of the left sides of the two copper plates.
As a further description of the above technical solution:
the outer surface of the miniature fan is fixedly connected with a dust screen.
As a further description of the above technical solution:
the graphite sheet is made of graphene.
As a further description of the above technical solution:
the inside of the heat dissipation box is penetrated and provided with heat dissipation fins.
As a further description of the above technical solution:
the insulating layer is made of silica gel.
As a further description of the above technical solution:
the second sliding blocks are fixedly connected to the positions of the two sides of the heat dissipation silicone grease.
As a further description of the above technical solution:
and fixing holes are formed in the four corners of the upper surface of the heat dissipation cover.
As a further description of the above technical solution:
and the middle position of the surface of the heat dissipation cover is provided with a heat dissipation hole.
The utility model discloses following beneficial effect has:
1. the utility model discloses in, the cooling lid can realize the protection to aluminium base plate body, the heat conduction on the aluminium base plate body can be accelerated to the copper, the heat of being convenient for spreads into in the radiator box through the copper, heat on the copper can pass through graphite flake and heat dissipation silicone grease simultaneously, thermal conduction can accelerate, be convenient for realize thermal absorption, the radiator can be to the heat of graphite flake and heat dissipation silicone grease go on outer the scattering, micro fan during operation, can accelerate the air flow, can pass through the louvre with the air in the radiator like this and shed, thermal outer radiating efficiency has been improved like this, the copper is enough to carry out quick conduction to the heat, the radiating effect is improved, thereby the heat-sinking capability of aluminium base plate body has been improved, the stability and the reliability of aluminium base plate body work operation have been guaranteed.
2. The utility model discloses in, can prevent through the dust screen that external dust and granule from getting into inside the PCB multiply wood to influence the use of aluminium base board internal element, can loose the heat effectively, this kind of design radiating effect is good, and the heat dissipation is fast, and long service life, it is not fragile, through the spout and the convenient dismantlement of heat dissipation lid of slider.
Drawings
Fig. 1 is a cross-sectional view of a high thermal conductivity aluminum substrate with high heat dissipation efficiency according to the present invention;
fig. 2 is an exploded view of a high thermal conductivity aluminum substrate with high heat dissipation efficiency provided by the present invention;
fig. 3 is the utility model provides a high-efficient radiating high heat conduction aluminum substrate's heat dissipation lid schematic diagram.
Illustration of the drawings:
1. a heat dissipation cover; 2. a heat sink; 3. a micro fan; 4. a dust screen; 5. a radiator switch; 6. a chute; 7. a first slider; 8. a copper plate; 9. an aluminum substrate; 10. a heat dissipation box; 11. a heat sink; 12. a graphite sheet; 13. heat dissipation silicone grease; 14. a fixing hole; 15. a wire guide hole; 16. heat dissipation holes; 17. an insulating layer; 18. and a second slider.
Detailed Description
Referring to fig. 1-3, the present invention provides an embodiment: a high-heat-conductivity aluminum substrate with high-efficiency heat dissipation comprises a heat dissipation cover 1, a heat radiator 2 is fixedly connected to the inner position of the heat dissipation cover 1, micro fans 3 are penetrated and arranged on the inner positions of the heat radiator 2, three parallel wire holes 15 are arranged on the front position of the upper surface of the heat dissipation cover 1 close to the middle of the left side, a heat radiator switch 5 is arranged on the front position of the upper surface of the heat dissipation cover 1 close to the right side, an insulating layer 17 is fixedly connected to the surface position of the bottom of the heat radiator 2, sliding grooves 6 are penetrated and arranged on the two ends of the bottom of the inner side of the heat dissipation cover 1, first sliding blocks 7 are slidably connected in the sliding grooves 6, graphite sheets 12 are fixedly connected between the inner wall positions of the two first sliding blocks 7, an aluminum substrate 9 is arranged at the bottom of the graphite sheets 12, copper plates 8 are fixedly connected to the top and the bottom of the aluminum substrate 9, and the copper plates 8 are fixedly connected to the graphite sheets 12, the bottom position of the copper plate 8 is provided with heat dissipation silicone grease 13, the heat dissipation box 10 is fixedly connected between the middle positions on the left sides of the two copper plates 8, the heat dissipation cover 1 can protect the aluminum substrate 9 body, the copper plate 8 can accelerate heat conduction on the aluminum substrate 9 body, so that heat can be conveniently transmitted into the heat dissipation box 10 through the copper plate 8, meanwhile, the heat on the copper plate 8 can accelerate heat conduction through the graphite sheet 12 and the heat dissipation silicone grease 13, so that heat absorption is conveniently realized, the heat of the graphite sheet 12 and the heat dissipation silicone grease 13 can be externally dissipated by the heat dissipater 2, when the micro fan 3 works, air flow can be accelerated, so that air in the heat dissipater 2 can be dissipated through the heat dissipation holes 16, so that the heat dissipation efficiency is improved, the copper plate 8 can rapidly conduct heat, the heat dissipation effect is improved, and the heat dissipation capacity of the aluminum substrate 9 body is improved, the stability and the reliability of the working operation of the aluminum substrate 9 body are ensured.
Equal fixedly connected with dust screen 4 on the surface position of micro-fan 3, the material of graphite flake 12 is graphite alkene, the inside of radiator box 10 all runs through and is provided with fin 11, the material of insulating layer 17 is silica gel, equal fixedly connected with second slider 18 on the position of heat dissipation silicone grease 13 both sides, all be provided with fixed orifices 14 on the upper surface four corners position of radiator cover 1, fix radiator cover 1 to the place that needs to install aluminium base board 9 through fixed orifices 14, insert first slider 7 and second slider 18 of graphite flake 12 or heat dissipation silicone grease 13 side in the spout 6 of radiator cover 1 medial surface, control micro-fan 3 work through radiator switch 5, when graphite flake 12, heat dissipation silicone grease 13 and aluminium base board 9 generate heat and radiate heat in the air, rotate the heat in the air through micro-fan 3 and discharge rapidly, when the component on aluminium base board 9 generates heat, can transmit heat to graphite flake 12, heat dissipation silicone grease 13, graphite flake 12, heat dissipation silicone grease 13 and 9 convey heat to 8, then transmit heat to radiator box 10 in the heat dissipation box, reach the fin 11 side through radiator box, the radiator box can generate a large amount of heat through radiator fan 12 and heat dissipation silicon grease 10 when the radiator box on the aluminium base board 9 can generate heat through radiator 3 and the quick heat dissipation silicon base board.
The working principle is as follows: fixing the heat dissipation cover 1 to the place where the aluminum substrate 9 needs to be installed through the fixing hole 14, inserting the first slider 7 and the second slider 18 on the side of the graphite sheet 12 or the heat dissipation silicone grease 13 into the sliding groove 6 on the inner side of the heat dissipation cover 1, controlling the operation of the micro fan 3 through the heat dissipation switch 5, when the graphite sheet 12, the heat dissipation silicone grease 13 and the aluminum substrate 9 generate heat to radiate the heat to the air, the heat in the air is rapidly discharged through the rotation of the micro fan 3, when the element on the aluminum substrate 9 generates heat, the heat can be transferred to the graphite sheet 12 and the heat dissipation silicone grease 13, the graphite sheet 12, the heat dissipation silicone grease 13 and the aluminum substrate 9 transfer the heat to the copper plate 8, and then the heat is transferred to the heat dissipation box 10, the heat is dissipated through the heat dissipation fins 11 on the side of the heat dissipation box 10, so as to achieve the heat dissipation effect, when the graphite sheet 12, the heat dissipation silicone grease 13 and the element on the aluminum substrate 9 generate a large amount of heat, and the heat dissipation box 10 can not rapidly dissipate the heat, the heat through the group control the micro fan 3.
Claims (8)
1. The utility model provides an aluminium base board of high-efficient radiating high heat conduction, includes radiating cover (1), its characterized in that: the heat dissipation cover is characterized in that a radiator (2) is fixedly connected to the inner position of the heat dissipation cover (1), a micro fan (3) penetrates through and is arranged on the inner position of the radiator (2), three parallel wire holes (15) are formed in the position, close to the middle and front positions, of the upper surface of the heat dissipation cover (1), a radiator switch (5) is arranged on the position, close to the front position, of the upper surface of the heat dissipation cover (1), an insulating layer (17) is fixedly connected to the surface position of the bottom of the radiator (2), sliding grooves (6) are formed in the positions, close to the two ends of the bottom of the inner side of the heat dissipation cover (1), the first sliding blocks (7) are connected to the inner side of the sliding grooves (6) in a sliding mode, graphite flakes (12) are fixedly connected to the inner wall positions of the two first sliding blocks (7), an aluminum substrate (9) is arranged at the bottom of the graphite flakes (12), copper plate (8) is fixedly connected to the top and the bottom of the aluminum substrate (9), a copper plate (8) is fixedly connected to the graphite flake (12), heat dissipation silicon grease (13) is arranged at the bottom of the two heat dissipation cover (8), and a heat dissipation box (10) is connected to the middle position, between the left side of the heat dissipation cover.
2. The aluminum substrate with high heat conductivity and high heat dissipation efficiency as claimed in claim 1, wherein: the outer surface of the micro fan (3) is fixedly connected with a dust screen (4).
3. The aluminum substrate with high heat conductivity and high heat dissipation efficiency as claimed in claim 1, wherein: the material of the graphite sheet (12) is graphene.
4. The aluminum substrate with high heat conductivity and high heat dissipation efficiency as claimed in claim 1, wherein: the heat dissipation box (10) is internally provided with heat dissipation fins (11) in a penetrating mode.
5. The aluminum substrate with high heat conductivity and high heat dissipation efficiency as claimed in claim 1, wherein: the insulating layer (17) is made of silica gel.
6. The aluminum substrate with high heat conductivity and high heat dissipation efficiency as claimed in claim 1, wherein: and the positions of both sides of the heat dissipation silicone grease (13) are fixedly connected with second sliding blocks (18).
7. The aluminum substrate with high heat conductivity and high heat dissipation efficiency as claimed in claim 1, wherein: and fixing holes (14) are formed in the four-angle positions of the upper surface of the heat dissipation cover (1).
8. The aluminum substrate with high heat conductivity and high heat dissipation efficiency as claimed in claim 1, wherein: the middle position of the surface of the heat dissipation cover (1) is provided with a heat dissipation hole (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222815229.3U CN218735758U (en) | 2022-10-25 | 2022-10-25 | High-efficient radiating high heat conduction aluminium base board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222815229.3U CN218735758U (en) | 2022-10-25 | 2022-10-25 | High-efficient radiating high heat conduction aluminium base board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218735758U true CN218735758U (en) | 2023-03-24 |
Family
ID=85591773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222815229.3U Active CN218735758U (en) | 2022-10-25 | 2022-10-25 | High-efficient radiating high heat conduction aluminium base board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218735758U (en) |
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2022
- 2022-10-25 CN CN202222815229.3U patent/CN218735758U/en active Active
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