CN215187542U

CN215187542U - PCB board that radiating effect is good

Info

Publication number: CN215187542U
Application number: CN202120436066.0U
Authority: CN
Inventors: 魏雨森
Original assignee: Xingtai Polytechnic College
Current assignee: Xingtai Polytechnic College
Priority date: 2021-03-01
Filing date: 2021-03-01
Publication date: 2021-12-14
Anticipated expiration: 2031-03-01

Abstract

The utility model discloses a PCB board with good heat dissipation effect, which comprises a board body, wherein the PCB board is arranged in the board body, the upper surface of the PCB board is fixedly connected with a heat dissipation coating, the upper surface of the heat dissipation coating is fixedly connected with a wind channel, the upper surface of the wind channel is fixedly connected with a resin board, the upper surface of the resin board is fixedly connected with a first insulating material layer, a plurality of heat dissipation holes are arranged at intervals at the top of the wind channel, the bottom ends of the heat dissipation holes are communicated with the inside of the wind channel, the top ends of the heat dissipation holes are communicated with the upper surface of the first insulating material layer, the lower surface of the PCB board is fixedly connected with a wiring copper foil layer, the lower side of the wiring copper foil layer is provided with a ceramic heat dissipation layer, a bonding glue layer is fixedly connected between the upper surface of the ceramic heat dissipation layer and the lower surface of the wiring copper foil layer, the device can quickly dissipate heat, improve the efficiency, accelerate the heat transfer in the board body, prevent the occurrence of the phenomenon that the heat accumulation causes the overlarge PCB board operation resistance and the normal use of the PCB board, the heat dissipation performance is improved.

Description

PCB board that radiating effect is good

Technical Field

The utility model relates to a PCB board specifically is a PCB board that radiating effect is good, belongs to PCB board technical field.

Background

The printed circuit board, also called printed circuit board, is the provider of electronic component electrical connection, the printed circuit board has been shown with "PCB" more than 100 years of history, the PCB board in the existing market does not have the function that the radiating effect is good, the accumulation of surface heat can not be dissipated when using for a long time, the operating resistance of the PCB board is too large, the normal use of the PCB board is influenced, meanwhile, the accelerated aging of the electronic component is easily caused when working under the high temperature condition, and the long-term use of the PCB board is not facilitated, therefore, the problem is improved.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a PCB board that the radiating effect is good just for solving above-mentioned problem, can dispel the heat fast, raise the efficiency for the heat transfer in the plate body prevents that the heat from piling up and causing PCB board operation resistance too big, and the condition that influences the normal use of PCB board appears, improves heat dispersion.

The utility model achieves the above purpose by the following technical proposal, a PCB board with good heat dissipation effect, which comprises a board body, wherein the board body is internally provided with the PCB board, the upper surface of the PCB board is fixedly connected with a heat dissipation coating, the upper surface of the heat dissipation coating is fixedly connected with an air duct, the upper surface of the air duct is fixedly connected with a resin board, the upper surface of the resin board is fixedly connected with a first insulating material layer, the top of the air duct is provided with a plurality of heat dissipation holes at intervals, the bottom ends of the heat dissipation holes are communicated with the inside of the air duct, the top ends of the heat dissipation holes are communicated with the upper surface of the first insulating material layer, the lower surface of the PCB board is fixedly connected with a wiring copper foil layer, the lower side of the wiring copper foil layer is provided with a ceramic heat dissipation layer, a bonding glue layer is fixedly connected between the upper surface of the ceramic heat dissipation layer and the lower surface of the wiring copper foil layer, the lower side of the ceramic heat dissipation layer is provided with a second insulating material layer, a heat dissipation hollow layer is arranged between the ceramic heat dissipation layer and the second insulating material layer, a plurality of graphite rods are distributed in the heat dissipation spacing layer at intervals, the top ends of the graphite rods are fixedly connected with the lower surface of the ceramic heat dissipation layer, and the bottom ends of the graphite rods are fixedly connected with the upper surface of the second insulating material layer.

Preferably, in order to facilitate quick heat dissipation and improve efficiency, the two sides of the plate body are fixedly connected with heat-conducting plates, and one side of each heat-conducting plate, which is far away from the plate body, is fixedly connected with a heat-radiating fin.

Preferably, in order to prevent external dust from entering the inside of the board body and influencing the working performance of the PCB, the inner walls of the heat dissipation holes are fixedly connected with dust screens.

Preferably, in order to prevent the heat from accumulating to cause the PCB operation resistance to be too large, the normal use condition of the PCB is influenced, the heat dissipation performance is improved, the heat dissipation coating material is heat dissipation glue, the air duct is made of copper material, and the heat conducting plate is made of aluminum material.

Preferably, in order to effectively avoid electric shock and electric leakage, the first insulating material layer and the second insulating material layer are made of rubber materials.

Preferably, in order to facilitate the installation of the PCB and the use, the four corners of the upper surface of the board body are provided with installation slot holes.

The utility model has the advantages that: through setting up wind channel and graphite rod, the heat of PCB board upper surface transmits to the external world through wind channel and louvre, the heat of PCB board lower surface passes to the heat dissipation through graphite rod and separates the sky in situ, carrying out heat exchange transmission to the external world through heat-conducting plate and heat dissipation and separating the sky layer, be convenient for dispel the heat fast, raise the efficiency, heat radiation fin is convenient for the heat dissipation of PCB board both sides face, through setting up heat dissipation coating and heat-conducting plate, the internal heat transfer of acceleration plate, it piles up to cause PCB board operation resistance too big to prevent the heat to appear, the condition that influences the normal use of PCB board appears, improve heat dispersion, effectively prevent dust through setting up the dust screen, prevent that external dust from getting into the inside working property that influences the PCB board of plate body, the installation of PCB board of being convenient for through setting up the installation slotted hole, high durability and convenient use.

Drawings

Fig. 1 is a schematic view of the internal structure of the present invention;

fig. 2 is a top view of the present invention;

in the figure: 1. a plate body; 2. a PCB board; 3. a heat-dissipating coating; 4. an air duct; 5. a resin plate; 6. a first layer of insulating material; 7. heat dissipation holes; 8. routing the copper foil layer; 9. a ceramic heat dissipation layer; 10. bonding the adhesive layer; 11. a second layer of insulating material; 12. a heat dissipation spacing layer; 13. a graphite rod; 14. a heat conducting plate; 15. heat dissipation fins; 16. a dust screen; 17. and (7) installing a slotted hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, a PCB with good heat dissipation effect comprises a board body 1, a PCB 2 is disposed in the board body 1, a heat dissipation coating 3 is fixedly connected to the upper surface of the PCB 2, an air duct 4 is fixedly connected to the upper surface of the heat dissipation coating 3, a resin board 5 is fixedly connected to the upper surface of the air duct 4, a first insulating material layer 6 is fixedly connected to the upper surface of the resin board 5, a plurality of heat dissipation holes 7 are spaced at the top of the air duct 4, the bottom ends of the heat dissipation holes 7 are communicated with the inside of the air duct 4, the top ends of the heat dissipation holes 7 are communicated with the upper surface of the first insulating material layer 6, a wiring copper foil layer 8 is fixedly connected to the lower surface of the PCB 2, a ceramic heat dissipation layer 9 is disposed under the wiring copper foil layer 8, an adhesive layer 10 is fixedly connected between the upper surface of the ceramic heat dissipation layer 9 and the lower surface of the wiring copper foil layer 8, a second insulating material layer 11 is disposed under the ceramic heat dissipation layer 9, a heat dissipation spacing layer 12 is arranged between the ceramic heat dissipation layer 9 and the second insulating material layer 11, a plurality of graphite rods 13 are distributed in the heat dissipation spacing layer 12 at intervals, the top ends of the graphite rods 13 are fixedly connected with the lower surface of the ceramic heat dissipation layer 9, and the bottom ends of the graphite rods 13 are fixedly connected with the upper surface of the second insulating material layer 11.

As a preferred technical scheme of the utility model, the equal rigid coupling in plate body 1 both sides has heat-conducting plate 14, one side rigid coupling that plate body 1 was kept away from to heat-conducting plate 14 has heat radiation fins 15.

As an optimized technical scheme of the utility model, 7 inner wall rigid couplings of louvre have dust screen 16.

As an optimal technical scheme of the utility model, the 3 materials of thermal coating are glued for the heat dissipation, wind channel 4 is made for the copper material, heat-conducting plate 14 is made for aluminium system material.

As a preferred technical solution of the present invention, the first insulating material layer 6 and the second insulating material layer 11 are made of rubber materials.

As an optimized technical scheme of the utility model, the installation slotted hole 17 has all been seted up to four edges on plate body 1 upper surface.

When the utility model is used, firstly, the heat on the upper surface of the PCB 2 is transferred to the outside through the air duct 4 and the heat dissipation holes 7, the heat on the lower surface of the PCB 2 is transferred to the heat dissipation spacing layer 12 through the graphite rod 13, the heat is transmitted to the outside through the heat conducting plate 14 and the heat dissipation spacing layer 12, which is convenient for fast heat dissipation and improves efficiency, the heat dissipation fins 15 are arranged to facilitate the heat dissipation on the two side surfaces of the PCB 2, then the heat transmission speed in plate body 1 can be accelerated through heat dissipation coating 3 and heat-conducting plate 14 to the inside heat of plate body 1, prevent that the heat from piling up and causing 2 operation resistances of PCB board too big, the condition that influences the normal use of 2 PCB boards appears, improve heat dispersion, the dust screen 16 that sets up at last is effectively dustproof, prevent that external dust from getting into the inside working property that influences 2 PCB boards of plate body 1, the installation of the installation slotted hole 17 of setting be convenient for 2 PCB boards, high durability and convenient use.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a PCB board that radiating effect is good, includes plate body (1), its characterized in that: the PCB is characterized in that a PCB (2) is arranged in the plate body (1), a heat dissipation coating (3) is fixedly connected to the upper surface of the PCB (2), an air duct (4) is fixedly connected to the upper surface of the heat dissipation coating (3), a resin plate (5) is fixedly connected to the upper surface of the air duct (4), a first insulating material layer (6) is fixedly connected to the upper surface of the resin plate (5), a plurality of heat dissipation holes (7) are arranged at intervals at the top of the air duct (4), the bottom ends of the heat dissipation holes (7) are communicated with the inside of the air duct (4), the top ends of the heat dissipation holes (7) are communicated with the upper surface of the first insulating material layer (6), a wiring copper foil layer (8) is fixedly connected to the lower surface of the PCB (2), a ceramic heat dissipation layer (9) is arranged on the lower side of the wiring copper foil layer (8), a bonding glue layer (10) is fixedly connected between the upper surface of the ceramic heat dissipation layer (9) and the lower surface of the wiring copper foil layer (8), a second insulating material layer (11) is arranged on the lower side of the ceramic heat dissipation layer (9), be equipped with between ceramic heat dissipation layer (9) and second insulating material layer (11) and dispel the heat and separate empty layer (12), it has a plurality of graphite rods (13) to dispel the heat to separate the interval distribution in empty layer (12), graphite rod (13) top rigid coupling pottery heat dissipation layer (9) lower surface, graphite rod (13) bottom rigid coupling second insulating material layer (11) upper surface.

2. The PCB with good heat dissipation effect as claimed in claim 1, wherein: the heat-conducting plate is characterized in that heat-conducting plates (14) are fixedly connected to two sides of the plate body (1), and heat-radiating fins (15) are fixedly connected to one side, far away from the plate body (1), of each heat-conducting plate (14).

3. The PCB with good heat dissipation effect as claimed in claim 1, wherein: and a dust screen (16) is fixedly connected to the inner wall of the heat dissipation hole (7).

4. The PCB board with good heat dissipation effect as claimed in claim 2, wherein: the heat dissipation coating (3) is made of heat dissipation glue, the air duct (4) is made of copper, and the heat conduction plate (14) is made of aluminum.

5. The PCB with good heat dissipation effect as claimed in claim 1, wherein: the first insulating material layer (6) and the second insulating material layer (11) are made of rubber materials.

6. The PCB with good heat dissipation effect as claimed in claim 1, wherein: four corners of the upper surface of the plate body (1) are provided with mounting slotted holes (17).