CN210469864U - High radiating double-deck PCB board subassembly - Google Patents

High radiating double-deck PCB board subassembly Download PDF

Info

Publication number
CN210469864U
CN210469864U CN201921482658.5U CN201921482658U CN210469864U CN 210469864 U CN210469864 U CN 210469864U CN 201921482658 U CN201921482658 U CN 201921482658U CN 210469864 U CN210469864 U CN 210469864U
Authority
CN
China
Prior art keywords
pcb
heat
pcb board
heat dissipation
conducting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201921482658.5U
Other languages
Chinese (zh)
Inventor
徐华罗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Huangjia Technology Co Ltd
Original Assignee
Huizhou Huangjia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Huangjia Technology Co Ltd filed Critical Huizhou Huangjia Technology Co Ltd
Priority to CN201921482658.5U priority Critical patent/CN210469864U/en
Application granted granted Critical
Publication of CN210469864U publication Critical patent/CN210469864U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a high-heat-dissipation double-layer PCB assembly, which belongs to the technical field of PCB assemblies and comprises a first PCB, wherein a plurality of electronic elements are arranged at the top of the first PCB, a heat-conducting plate is fixed at the bottom of the first PCB, a second PCB is fixed at the bottom of the heat-conducting plate, and heat-dissipation holes are formed in the bottoms of the first PCB and the second PCB; be provided with the louvre, the dust screen, the radiating block, the heat-conducting plate, when the PCB subassembly produced a large amount of heats, the heat can be through heat-conducting plate transmission to radiating block department, again through radiating block transmission to radiating hole department, so that the heat is through the louvre effluvium, improve rate of heat dissipation, so that the heat that the PCB board produced can effluvium fast, it is difficult to effluvium to reduce the heat and pile up and cause the degree of damage to the PCB board in the PCB board, and improve the service life of PCB board, the dust screen can make outside dust be difficult to enter into the inside to the PCB board through the louvre simultaneously.

Description

High radiating double-deck PCB board subassembly
Technical Field
The utility model relates to a PCB board subassembly technical field specifically is a high radiating double-deck PCB board subassembly.
Background
A printed circuit board, also known as a printed circuit board, abbreviated as a printed board, abbreviated as pcb (printed circuit board) or pwb (printed wiring board), which is cut into a certain size by using an insulating board as a substrate, and is provided with at least one conductive pattern and holes (such as element holes, fastening holes, metalized holes, and the like) for replacing a chassis of an electronic component in the prior art and realizing the mutual connection of the electronic component; such boards are known as "printed" circuit boards because they are made using electronic printing techniques; it is not exact to custom refer to a "printed wiring board" as a "printed circuit" because there are no "printed components" on the printed board, but only wiring.
In the existing double-layer PCB assembly, a large amount of heat is generated when the PCB assembly works for a long time, and the heat is only dissipated by the heat dissipation of the PCB, so that the heat cannot be dissipated from the PCB quickly, and electronic elements in the PCB can be damaged; meanwhile, the PCB is only installed through the installation hole in the PCB body, and then the installation hole is broken when being extruded by external force, so that the PCB falls off on equipment, and the use of the PCB is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high radiating double-deck PCB board subassembly has solved the current double-deck PCB board subassembly among the above-mentioned background art and has been difficult to fast heat dissipation and the fragile problem of mounting hole.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high radiating double-deck PCB board subassembly, includes first PCB board, a plurality of electronic component are installed at the top of first PCB board, the bottom of first PCB board is fixed with the heat-conducting plate, the bottom of heat-conducting plate is fixed with the second PCB board, the louvre has all been seted up to the bottom of first PCB board and second PCB board, the internally mounted of louvre has the dust screen, a plurality of radiating blocks are all installed to the top and the bottom of heat-conducting plate, the mounting hole has been seted up all around at the top of first PCB board, the inside of mounting hole is fixed with the rubber pad.
Preferably, the heat dissipation block is located inside the heat dissipation hole, and the heat dissipation block is made of aluminum.
Preferably, a plurality of the heat dissipation holes are equidistantly distributed on the first heat conduction plate and the second heat conduction plate.
Preferably, the dustproof net is provided with a plurality of holes, and the hole diameter of the dustproof net is 0.5 mm.
Preferably, the length of the heat conductive plate is greater than the lengths of the first and second PCBs.
Preferably, a plurality of air bags are arranged inside the rubber pad.
Compared with the prior art, the beneficial effects of the utility model are that: the high-heat-dissipation double-layer PCB assembly is provided with heat dissipation holes, a dust screen, a heat dissipation block and a heat conduction plate, when the PCB assembly generates a large amount of heat, the heat can be transferred to the heat dissipation block through the heat conduction plate and then transferred to the heat dissipation hole through the heat dissipation block, so that the heat can be dissipated through the heat dissipation holes, the heat dissipation speed is improved, the heat generated by the PCB can be dissipated quickly, the degree that the heat is difficult to dissipate, the heat is accumulated in the PCB and damages the PCB is caused is reduced, the service life of the PCB is prolonged, and meanwhile, external dust is difficult to enter the PCB through the heat dissipation holes through the dust screen; be provided with the rubber pad simultaneously, when the mounting hole receives external force extrusion, the rubber pad can the deformation compression to protect the mounting hole, gasbag in the rubber pad can make the rubber pad keep longer elasticity simultaneously, and long when improving the use of rubber pad, and play and avoid the mounting hole to take place to break, the effect that the PCB board takes place to damage, the life of this PCB board is prolonged simultaneously, this problem of current double-deck PCB board subassembly is difficult to fast dispel the heat and the mounting hole is fragile has been solved.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of a front cross-sectional structure of a first PCB board of the present invention;
FIG. 3 is an enlarged schematic view of the structure of the present invention A;
fig. 4 is an enlarged schematic structural diagram of the present invention B.
In the figure: 1. a first PCB board; 2. an electronic component; 3. a heat conducting plate; 4. a dust screen; 5. a second PCB board; 6. heat dissipation holes; 7. a heat dissipating block; 8. mounting holes; 9. and (7) a rubber pad.
Detailed description of the preferred embodiments
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "disposed," "mounted," "connected," "fixed," "sleeved," and the like are to be construed broadly, e.g., as either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; the two elements may be connected directly or indirectly through an intermediate medium, and the two elements may be connected internally or in an interaction relationship, and a person skilled in the art can understand the specific meaning of the above terms in the present invention according to specific situations.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a high radiating double-deck PCB board subassembly, includes first PCB board 1, electronic component 2, heat-conducting plate 3, dust screen 4, second PCB board 5, louvre 6, radiating block 7, mounting hole 8 and rubber pad 9, a plurality of electronic component 2 are installed at first PCB board 1's top, first PCB board 1's bottom is fixed with heat-conducting plate 3, heat-conducting plate 3's bottom is fixed with second PCB board 5, radiating hole 6 has all been seted up to first PCB board 1 and second PCB board 5's bottom, radiating hole 6's internally mounted has dust screen 4, a plurality of radiating blocks 7 are all installed to heat-conducting plate 3's top and bottom, mounting hole 8 has been seted up all around first PCB board 1's top, the inside of mounting hole 8 is fixed with rubber pad 9 to play the guard action to mounting hole 8, prevent that mounting hole 8 is damaged.
Referring to fig. 2-3, the heat dissipation block 7 is located inside the heat dissipation holes 6, and the heat dissipation block 7 is made of aluminum to improve the heat dissipation effect of the heat dissipation block 7, and the heat dissipation holes 6 are equidistantly distributed on the first PCB 1 and the second PCB 5 to dissipate heat through the heat dissipation holes 6, thereby preventing heat from being difficult to dissipate in the first PCB and the second PCB 5.
Referring to fig. 1 to 3, the plurality of dust screens 4 are provided, and the aperture of each dust screen 4 is 0.5mm, so that dust is prevented from entering the first PCB 1 and the second PCB 5 through the heat dissipation holes 6, and the length of the heat conduction plate 3 is greater than the lengths of the first PCB 1 and the second PCB 5, so that heat generated by the first PCB 1 and the second PCB is quickly dissipated through the heat conduction plate 3.
Referring to fig. 1 and 4, a plurality of air bags are disposed inside the rubber pad 9 to keep the rubber pad 9 with longer elasticity and improve the service life of the rubber pad 9.
The working principle is as follows: firstly, when first PCB board 1 and second PCB board 5 work and produce a large amount of heats, the heat can be through heat-conducting plate 3 transmission to radiating block 7 department, again through radiating block 7 transmission to louvre 6 department, so that the heat is through louvre 6 effluvium, improve rate of heat dissipation, dust screen 4 can make outside dust be difficult to get into to first PCB board 1 and second PCB board 5's inside through louvre 6 simultaneously, be provided with rubber pad 9 simultaneously, when mounting hole 8 receives external force extrusion, rubber pad 9 can the deformation compression, in order to protect mounting hole 8, the gasbag in rubber pad 9 can make rubber pad 9 keep longer elasticity simultaneously, and it is long when improving rubber pad 9's use, and play and avoid mounting hole 8 to take place to break, the effect that the PCB board takes place to damage.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a high radiating double-deck PCB board subassembly, includes first PCB board (1), its characterized in that: a plurality of electronic component (2) are installed at the top of first PCB board (1), heat-conducting plate (3) have been fixed with to the bottom of first PCB board (1), the bottom of heat-conducting plate (3) is fixed with second PCB board (5), louvre (6) have all been seted up to the bottom of first PCB board (1) and second PCB board (5), the internally mounted of louvre (6) has dust screen (4), a plurality of radiating block (7) have all been installed to the top and the bottom of heat-conducting plate (3), mounting hole (8) have all been seted up all around at the top of first PCB board (1), the inside of mounting hole (8) is fixed with rubber pad (9).
2. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: the radiating block (7) is located inside the radiating hole (6), and the radiating block (7) is made of aluminum.
3. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: a plurality of the heat dissipation holes (6) are equidistantly distributed on the first PCB (1) and the second PCB (5).
4. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: the dustproof net (4) is provided with a plurality of holes, and the hole diameter of the dustproof net (4) is 0.5 mm.
5. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: the length of the heat conducting plate (3) is larger than the lengths of the first PCB (1) and the second PCB (5).
6. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: a plurality of air bags are arranged inside the rubber pad (9).
CN201921482658.5U 2019-09-07 2019-09-07 High radiating double-deck PCB board subassembly Active CN210469864U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921482658.5U CN210469864U (en) 2019-09-07 2019-09-07 High radiating double-deck PCB board subassembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921482658.5U CN210469864U (en) 2019-09-07 2019-09-07 High radiating double-deck PCB board subassembly

Publications (1)

Publication Number Publication Date
CN210469864U true CN210469864U (en) 2020-05-05

Family

ID=70433421

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921482658.5U Active CN210469864U (en) 2019-09-07 2019-09-07 High radiating double-deck PCB board subassembly

Country Status (1)

Country Link
CN (1) CN210469864U (en)

Similar Documents

Publication Publication Date Title
US6839232B2 (en) Fan-less housing
KR20020074073A (en) Heat dissipation structure of ic
CN210469864U (en) High radiating double-deck PCB board subassembly
JPH11251772A (en) Plasma display device
KR100846771B1 (en) Plasma display unit
CN209787682U (en) High efficiency heat dissipation router
CN201742652U (en) Enclosure structure for optical transceiver
CN206273052U (en) A kind of PCB heat abstractor and cabinet
CN211930970U (en) HDI circuit board that contains blind hole
CN210328410U (en) Gain amplifier's heat radiation structure
CN214046159U (en) PCB circuit board with penetrating type via hole bonding pad
CN211930977U (en) Multilayer HDI circuit board of inlayer interconnection
CN210927435U (en) Power module with heat dissipation mechanism
CN214046136U (en) Mixed-compression stepped high-frequency multilayer blind hole circuit board
CN213718317U (en) Multilayer HDI circuit board of inlayer interconnection
KR101082436B1 (en) Plasma display apparatus
CN213755501U (en) Printed circuit board capable of fast radiating
CN211149991U (en) L ED electronic display screen with heat abstractor
CN212696439U (en) Power supply heat dissipation device
CN213522529U (en) Low-impedance multilayer circuit board
CN213818047U (en) Wireless router capable of realizing high-speed stable transmission
CN213276556U (en) Computer cooling fin convenient to heat dissipation
CN211062383U (en) L ED display screen with long service life
CN211019731U (en) Communication equipment
CN210431703U (en) Internet of things gateway equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant