CN213522529U

CN213522529U - Low-impedance multilayer circuit board

Info

Publication number: CN213522529U
Application number: CN202022828739.5U
Authority: CN
Inventors: 曹建奇; 沈绍伦; 叶洪发
Original assignee: Shenzhen Xingda Pcb Co ltd
Current assignee: Shenzhen Xingda Pcb Co ltd
Priority date: 2020-12-01
Filing date: 2020-12-01
Publication date: 2021-06-22
Anticipated expiration: 2030-12-01

Abstract

The utility model discloses a multilayer circuit board with low impedance, which comprises a multilayer circuit board main body, wherein the corners at the top and the bottom of the multilayer circuit board main body are fixedly connected with clamping seats, the tops of eight clamping seats are respectively provided with a clamping groove, and the eight clamping grooves are respectively connected with a buffer mechanism in a clamping way; the heat dissipation mechanism can remarkably improve the heat dissipation effect of the circuit board, quickly discharges heat generated by the circuit board in the working process, avoids heat accumulation, prevents the heat from damaging the internal precise components, prolongs the service life of the circuit board, and can basically prevent dust from falling on the surface of the circuit board and avoid the influence on the working performance of the circuit board.

Description

Low-impedance multilayer circuit board

Technical Field

The utility model relates to a circuit board field specifically is a multilayer circuit board of low impedance.

Background

The multilayer board is produced through the first inner layer pattern, the subsequent printing and etching process to form single or double sided base board, the base board is set between the layers, and the subsequent heating, pressurizing and adhering are performed.

Traditional multilayer circuit board receives the damage because outside striking easily, perhaps drops so that unable use from the eminence, and then influences its life greatly, and produces painful multilayer circuit board when using, its heat dispersion is than poor for the accurate components and parts of this circuit board receive destruction because the heat gathering, influence its life greatly, and traditional circuit board can't play the guard action to the dust, accumulates too many dust and can influence the performance of circuit board greatly.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multilayer circuit board of low impedance, receive the damage because outside striking easily with the traditional multilayer circuit board that proposes in solving above-mentioned background art, perhaps fall so that unable use from the eminence, and then influence its life greatly, and produce the multilayer circuit board of pain when using, its heat dispersion is than poor, make the accurate components and parts of this circuit board receive destruction because the heat gathering, influence its life greatly, and traditional circuit board can't play the guard action to the dust, accumulate too many dust and can influence the problem of the usability of circuit board greatly.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a low-impedance multilayer circuit board, includes the multilayer circuit board main part, the corner at multilayer circuit board main part top and the equal fixedly connected with block seat of corner of bottom, eight the block groove has all been seted up at the top of block seat, eight the equal block in block groove is connected with buffer gear, eight buffer gear's bottom respectively with the both ends at the inboard top of two channel plates and the both ends fixed connection of inboard bottom, two the top of channel plate is all through the first fixing bolt fixedly connected with dustproof mechanism of a plurality of, two the both sides of channel plate are respectively through two curb plates of a plurality of second fixing bolt fixedly connected with, two the equal fixedly connected with in bottom at channel plate both ends installs two mechanisms, two the equal fixedly connected with heat dissipation mechanism in middle part at channel plate both ends.

As a preferred technical scheme, eight buffer gear is by fixed block, buffer spring, buffer beam and cushion socket, the dashpot has been seted up at the top of cushion socket, the dashpot passes through buffer spring fixedly connected with fixed block, the bottom fixedly connected with buffer beam of fixed block.

As a preferred technical scheme of the utility model, dustproof mechanism comprises dust screen, fixed frame and two fixed strips, the equal fixedly connected with fixed strip in both sides of fixed frame, two a plurality of screw hole has all been seted up at the top of fixed strip, the middle part fixedly connected with dust screen of fixed frame.

As the utility model discloses an optimal technical scheme, four installation mechanism comprises first mounting bolt, second mounting bolt and aluminum alloy angle sign indicating number, there are first mounting bolt and second mounting bolt at the both ends of aluminum alloy angle sign indicating number threaded connection respectively.

As a preferred technical scheme of the utility model, two heat dissipation mechanism comprises radiating seat and a plurality of fin, a plurality of evenly distributed's the fin, a plurality of fixedly connected with fin of radiating seat the middle part of fin has all been seted up a plurality of louvre.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the buffering mechanism can greatly reduce the serious damage to the circuit board caused by the accidental impact of the external environment or the falling from the process, and prolong the service life of the circuit board;

2. the heat dissipation mechanism can remarkably improve the heat dissipation effect of the circuit board, quickly discharge heat generated by the circuit board in the working process, avoid heat accumulation, prevent the heat from damaging internal precise components and prolong the service life of the circuit board;

3. the dustproof mechanism can basically prevent dust from falling on the surface of the circuit board and avoid the dust from influencing the working performance of the circuit board.

Drawings

Fig. 1 is a sectional view of the entire internal structure of the present invention;

fig. 2 is a perspective view of the dustproof mechanism of the present invention;

fig. 3 is a front view of the buffer mechanism of the present invention;

FIG. 4 is a schematic view of the connection between the trough-shaped plate and the side plate according to the present invention;

fig. 5 is a perspective view of the heat dissipation mechanism of the present invention;

fig. 6 is a perspective view of the heat sink of the present invention.

In the figure: 1. a trough-shaped plate; 2. a heat dissipation mechanism; 3. an installation mechanism; 4. a first fixing bolt; 5. a dust-proof mechanism; 6. a multilayer wiring board main body; 7. a buffer mechanism; 8. a clamping seat; 9. a fixing strip; 10. a threaded hole; 11. a fixing frame; 12. a dust screen; 13. a fixed block; 14. a buffer spring; 15. a buffer seat; 16. a buffer tank; 17. a buffer rod; 18. a heat sink; 19. a heat dissipation base; 20. heat dissipation holes; 21. side plates.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-6, the utility model provides a multilayer circuit board of low impedance, including multilayer circuit board main part 6, the equal fixedly connected with block seat 8 of corner and the bottom at the corner at multilayer circuit board main part 6 top, the block groove has all been seted up at the top of eight block seat 8, the equal block in eight block groove is connected with buffer gear 7, the bottom of eight buffer gear 7 respectively with the both ends at the inboard top of two channel plates 1 and the both ends fixed connection of inboard bottom, the top of two channel plates 1 is all through the dustproof mechanism 5 of the first fixedly connected with of a plurality of 4, two curb plates 21 of two channel plates 1's both sides through a plurality of second fixed bolt fixedly connected with respectively, two equal fixedly connected with installation mechanisms 3 in the bottom at two channel plates 1 both ends, the equal fixedly connected with heat dissipation mechanism 2 in the middle part at two channel plates 1 both ends.

Preferably, eight buffer gear 7 are by fixed block 13, buffer spring 14, buffer beam 17 and cushion socket 15, and buffer slot 16 has been seted up at the top of buffer socket 15, and buffer slot 16 passes through buffer spring 14 fixedly connected with fixed block 13, and the bottom fixedly connected with buffer beam 17 of fixed block 13, buffer spring 14 cushion along the direction of buffer beam 17 and vibrate to this counteracts the injury that the vibration in the external environment caused the circuit board, and the practicality is very strong.

Preferably, dustproof mechanism 5 comprises dust screen 12, fixed frame 11 and two fixed strips 9, and the equal fixedly connected with fixed strip 9 in both sides of fixed frame 11, a plurality of screw hole 10 have all been seted up at the top of two fixed strips 9, and the middle part fixedly connected with dust screen 12 of fixed frame 11, dust screen 12 can be outside the dust separation, do not influence partial thermal scattering and disappearing simultaneously, and the design is comparatively practical.

Preferably, the four mounting mechanisms 3 are composed of first mounting bolts, second mounting bolts and aluminum alloy corner connectors, the two ends of each aluminum alloy corner connector are respectively in threaded connection with the first mounting bolts and the second mounting bolts, and the circuit board can be conveniently mounted and maintained through the mounting mechanisms 3.

Preferably, two heat dissipation mechanisms 2 are composed of a heat dissipation seat 19 and a plurality of heat dissipation fins 18, the heat dissipation fins 18 are fixedly connected to the top of the heat dissipation seat 19 and are evenly distributed, a plurality of heat dissipation holes 20 are formed in the middle of the plurality of heat dissipation fins 18, the effective contact area of the heat dissipation fins 18 and the outside air is greatly increased through the heat dissipation holes 20, and the heat dissipation efficiency is remarkably improved.

When specifically using, the utility model relates to a multilayer circuit board of low impedance, when using, install this circuit board through installation mechanism 3, in its working process, can produce partly heat, the heat transmits to radiating seat 19 earlier, transmit to the outside air by fin 18 again, the effective area of contact of 20 greatly increased fins 18 of louvre and outside air, show and promote the radiating efficiency, if there is the dust to fall down, can be outside by the 12 separation of dust screen, do not influence the scattering and disappearing of part heat simultaneously, the design is comparatively practical, and dismantle and maintain simple and fast, when this circuit board receives the unexpected striking of outside environment or falls from the process, buffer spring 14 cushions the shock along buffer beam 17's direction, with this counteracts the injury that the vibration caused the circuit board in the outside environment, the practicality is very strong.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A multilayer wiring board of low impedance, includes multilayer wiring board main part (6), its characterized in that: the corner at multilayer line board main part (6) top and the equal fixedly connected with block seat (8) of corner of bottom, eight the block groove has all been seted up at the top of block seat (8), eight the equal block in block groove is connected with buffer gear (7), eight the bottom of buffer gear (7) respectively with the both ends at two inboard tops of two trough plate (1) and the both ends fixed connection of inboard bottom, two the top of trough plate (1) is all through the first fixing bolt of a plurality of (4) fixedly connected with dustproof mechanism (5), two the both sides of trough plate (1) are respectively through two curb plates of a plurality of second fixing bolt fixedly connected with (21), two the equal fixedly connected with in bottom at trough plate (1) both ends installs two mechanism (3), two the equal fixedly connected with heat dissipation mechanism (2) in middle part at trough plate (1) both ends.

2. A low impedance multilayer circuit board according to claim 1, wherein: eight buffer gear (7) constitute by fixed block (13), buffer spring (14), buffer beam (17) and cushion socket (15), buffer slot (16) have been seted up at the top of buffer socket (15), buffer slot (16) are through buffer spring (14) fixedly connected with fixed block (13), the bottom fixedly connected with buffer beam (17) of fixed block (13).

3. A low impedance multilayer circuit board according to claim 1, wherein: dustproof mechanism (5) comprise dust screen (12), fixed frame (11) and two fixed strip (9), the equal fixedly connected with fixed strip (9) in both sides of fixed frame (11), two a plurality of screw hole (10) have all been seted up at the top of fixed strip (9), the middle part fixedly connected with dust screen (12) of fixed frame (11).

4. A low impedance multilayer circuit board according to claim 1, wherein: the four installation mechanisms (3) are composed of first installation bolts, second installation bolts and aluminum alloy angle connectors, and the two ends of each aluminum alloy angle connector are respectively in threaded connection with the first installation bolts and the second installation bolts.

5. A low impedance multilayer circuit board according to claim 1, wherein: two heat dissipation mechanism (2) comprise radiating seat (19) and a plurality of fin (18), the top fixedly connected with a plurality of evenly distributed's fin (18) of radiating seat (19), a plurality of fin (20) have all been seted up at the middle part of fin (18).