CN212727533U - Multilayer PCB board convenient to heat dissipation - Google Patents
Multilayer PCB board convenient to heat dissipation Download PDFInfo
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- CN212727533U CN212727533U CN202021331124.5U CN202021331124U CN212727533U CN 212727533 U CN212727533 U CN 212727533U CN 202021331124 U CN202021331124 U CN 202021331124U CN 212727533 U CN212727533 U CN 212727533U
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- circuit board
- board body
- heat dissipation
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Abstract
The utility model discloses a multilayer PCB board convenient to heat dissipation, including a plurality of circuit board bodies, still include radiator unit, radiator unit is including setting up the insulating heat-conducting layer on adjacent circuit board body opposite face and setting up the heat conduction piece between adjacent insulating heat-conducting layer, the both ends face of heat conduction piece respectively with the opposite face butt of two insulating heat-conducting layers, the side of circuit board body is equipped with the fan, the air current direction of fan is parallel with the circuit board body, there is the space that supplies circulation of air in the heat conduction piece, insulating heat-conducting layer produces the heat with circuit board body during operation and conducts, there is the space that supplies circulation of air in the heat conduction piece, the fan accelerates the air flow of heat conduction piece, accelerate the heat dissipation, heat conduction piece heat conduction, increase area of contact, the heat dissipation efficiency is improved, the heat conduction piece plays the supporting role simultaneously, circuit board body vibrations.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to multilayer PCB board convenient to heat dissipation.
Background
The PCB board is also called as a printed circuit board, is an important electronic component, is small to an electronic watch, a calculator, is large to a computer, a communication electronic device and a military weapon system, and has electronic elements such as an integrated circuit.
Because of integrating the degree height, multilayer PCB board can produce a large amount of heats at the during operation, and current multilayer PCB board mostly dispels the heat through outside fan, and this kind of radiating mode can't dispel the heat to multilayer PCB inboard inside for the heat dissipation is inhomogeneous between the multilayer PCB board, holistic radiating effect is poor, long-term work back, influences the life of multilayer PCB board easily, still can lead to electronic components trouble, influences electronic equipment's operation.
Because of the distribution has various components and parts on the circuit board body, there is the clearance between the adjacent circuit board body, does not have shock attenuation measure between the circuit board body of current multilayer PCB board, and circuit board body middle part range of vibration is great when meetting to vibrate, makes the circuit board body appear deformation or crack easily, influences the performance of multilayer PCB board.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides a multilayer PCB board convenient to heat dissipation can be absorbing simultaneously
In order to realize the purpose, the utility model discloses a technical scheme is: the utility model provides a multilayer PCB board convenient to heat dissipation, includes a plurality of circuit board bodies, still includes radiator unit, radiator unit is including setting up the insulating heat-conducting layer on adjacent circuit board body opposite face and setting up the heat-conducting piece between adjacent insulating heat-conducting layer, the both ends face of heat-conducting piece respectively with the opposite face butt of two insulating heat-conducting layers, the side of circuit board body is equipped with the fan, the air current direction of fan is parallel with the circuit board body, there is the space that supplies the circulation of air in the heat-conducting piece.
Among the above-mentioned technical scheme, insulating heat-conducting layer conducts the circuit board body during operation production heat, exists the space that supplies the circulation of air in the heat-conducting piece, and the fan accelerates the air flow of heat-conducting piece for the heat dissipation, and heat-conducting piece heat conduction heat, increase area of contact improves the radiating efficiency, and the heat-conducting piece plays the supporting role simultaneously, and circuit board body vibrations are too big when preventing to appear shaking.
As a further setting of the utility model, the heat-conducting piece includes the conducting strip parallel with the circuit board body, the conducting strip is the undulation direction of wave and conducting strip and the air current direction looks perpendicular of fan.
Among the above-mentioned technical scheme, the wave conducting strip has increased the area of contact of conducting strip with the air, improves the radiating effect of fan, and the conducting strip is preferred to be made with copper, and copper has good heat conductivility, and certain deformation can be produced to wave conducting strip when receiving pressure, has good shock attenuation effect.
As the utility model discloses a further setting, the conducting strip includes a plurality of crests and trough, and is adjacent be equipped with the crest and the crisscross setting of trough of two piece at least conducting strips and adjacent conducting strip between the insulating heat-conducting layer.
Among the above-mentioned technical scheme, make the conducting strip can be better with the air contact, provide better support simultaneously.
As a further arrangement of the present invention, the heat dissipation assembly further includes a heat conduction post penetrating through all the circuit board bodies.
Among the above-mentioned technical scheme, the preferred copper preparation of using of heat conduction post, copper have good heat conductivility, and the heat conduction post can balance the temperature difference between each circuit board body, makes the heat dissipation more even, improves holistic radiating effect, prevents to cause the trouble of multilayer PCB board because of local high temperature.
As a further setting of the utility model, heat conduction post cavity sets up, and the lateral wall of heat conduction post is equipped with the window with the position that the heat-conducting piece corresponds.
Among the above-mentioned technical scheme, the window makes the air in the heat conduction post and the air intercommunication in the heat conduction spare space for the inside air flow of heat conduction post improves the radiating effect.
As a further setting of the utility model, the insulating heat-conducting layer is heat conduction silica gel pad.
Among the above-mentioned technical scheme, heat conduction silica gel pad has good insulating nature and good heat conductivity, and circuit board body surface distribution's components and parts make circuit board body surface unevenness, and heat conduction silica gel pad has certain compliance and compression performance good, and the surface of laminating circuit board body that can be better improves the radiating effect, and heat conduction silica gel pad also has good elasticity simultaneously, has good shock attenuation effect.
The present invention will be further described with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic view of an embodiment of the present invention;
FIG. 2 is a rear view of an embodiment of the present invention;
FIG. 3 is a cross-sectional view of an embodiment of the present invention;
FIG. 4 is a schematic view of an embodiment of a heat-conducting column;
fig. 5 is a schematic view of a heat-conducting fin according to an embodiment of the present invention.
Detailed Description
When terms such as "upper" and "lower", "right" and "left" or similar relative expressions are used in the present embodiment, these refer only to the accompanying drawings and are not necessarily actual usage.
The specific embodiment of the utility model is shown in fig. 1-5, a multilayer PCB board convenient for heat dissipation comprises a plurality of circuit board bodies 01, in this embodiment, four circuit board bodies 01 are provided, the side of the circuit board bodies 01 is provided with a fan 02, the airflow direction of the fan 02 is parallel to the circuit board bodies 01, the opposite surfaces of the adjacent circuit board bodies 01 are provided with insulating heat-conducting layers 03, at least two heat-conducting sheets 04 parallel to the circuit board bodies 01 are arranged between the adjacent insulating heat-conducting layers 03, in this embodiment, four heat-conducting sheets 04 are arranged between the adjacent insulating heat-conducting layers 03, the heat-conducting sheets 04 are wavy, the fluctuation direction of the heat-conducting sheets 04 is perpendicular to the airflow direction of the fan 02, each heat-conducting sheet 04 comprises a plurality of wave crests 041 and wave troughs 042, the wave crests 041 and the wave troughs 042 of the adjacent heat-conducting sheets 04 are arranged in a staggered manner, so that the heat-conducting sheets 04 can better contact with air, the end surfaces of, the insulating heat conduction layer 03 conducts heat generated by the circuit board body 01 when working, the heat conducting sheet 04 conducts heat, the fan 02 accelerates air flow of the heat conducting sheet 04 to accelerate heat dissipation, the wavy heat conducting sheet 04 enables a gap for air circulation to exist in the heat conducting sheet 04, the contact area of the heat conducting sheet 04 and air is increased, and the heat dissipation effect of the fan 02 is improved, in the embodiment, the heat conducting sheet 04 is made of copper, the copper has good heat conduction performance, the wavy heat conducting sheet 04 can deform to a certain extent when being subjected to pressure, good shock absorption and support effects are achieved, the circuit board body 01 is prevented from vibrating too much when vibration occurs, heat conducting columns 05 penetrate through the circuit board body 01, in the embodiment, the heat conducting columns 05 are six and are perpendicular to the circuit board body 01, the heat conducting columns 05 are arranged in a hollow mode, and windows 051 are arranged at positions, corresponding to the heat conducting sheets 04, of the side walls of the, in the embodiment, the heat-conducting column 05 is made of copper, the copper has good heat-conducting property, the heat-conducting column 05 can balance the temperature difference between the circuit board bodies 01, so that the heat dissipation is more uniform, the overall heat dissipation effect is improved, the fault of a multilayer PCB caused by overhigh local temperature is prevented, the window 051 enables the air in the heat-conducting column 05 to be communicated with the air in the gap of the heat-conducting sheet 04, the air flow in the heat-conducting column 05 is accelerated, and the heat dissipation effect is improved. Has good shock absorption effect.
The utility model discloses do not confine the above-mentioned embodiment to, the general technical personnel in this field can adopt other multiple embodiments to implement according to the utility model discloses a, perhaps all adopt the utility model discloses a design structure and thinking do simple change or change, all fall into the utility model discloses a protection scope.
Claims (6)
1. The utility model provides a multilayer PCB board convenient to heat dissipation, includes a plurality of circuit board bodies, its characterized in that: still include radiator unit, radiator unit is including setting up the insulating heat-conducting layer on adjacent circuit board body opposite face and setting up the heat-conducting piece between adjacent insulating heat-conducting layer, the both ends face of heat-conducting piece respectively with the opposite face butt of two insulating heat-conducting layers, the side of circuit board body is equipped with the fan, the air current direction and the circuit board body of fan are parallel, there is the space that supplies circulation of air in the heat-conducting piece.
2. The multi-layer PCB board facilitating heat dissipation of claim 1, wherein: the heat conducting piece comprises a heat conducting fin parallel to the circuit board body, the heat conducting fin is wavy, and the fluctuation direction of the heat conducting fin is perpendicular to the airflow direction of the fan.
3. The multi-layer PCB board facilitating heat dissipation of claim 2, wherein: the heat-conducting fins comprise a plurality of wave crests and wave troughs, and the adjacent wave crests and wave troughs are arranged in a staggered mode, wherein at least two heat-conducting fins are arranged between the insulating heat-conducting layers, and the adjacent heat-conducting fins are arranged.
4. The multi-layer PCB board facilitating heat dissipation of claim 3, wherein: the heat dissipation assembly further comprises heat conduction columns penetrating through all the circuit board bodies.
5. The multi-layer PCB facilitating heat dissipation of claim 4, wherein: the heat conducting column is arranged in a hollow mode, and a window is arranged in the position, corresponding to the heat conducting piece, of the side wall of the heat conducting column.
6. The multi-layer PCB facilitating heat dissipation of claim 5, wherein: the insulating heat conduction layer is a heat conduction silica gel pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021331124.5U CN212727533U (en) | 2020-07-08 | 2020-07-08 | Multilayer PCB board convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021331124.5U CN212727533U (en) | 2020-07-08 | 2020-07-08 | Multilayer PCB board convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212727533U true CN212727533U (en) | 2021-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021331124.5U Active CN212727533U (en) | 2020-07-08 | 2020-07-08 | Multilayer PCB board convenient to heat dissipation |
Country Status (1)
| Country | Link |
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| CN (1) | CN212727533U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460149A (en) * | 2023-10-31 | 2024-01-26 | 同扬光电（江苏）有限公司 | High-efficient integrated flexible line way board of multilayer structure |
-
2020
- 2020-07-08 CN CN202021331124.5U patent/CN212727533U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460149A (en) * | 2023-10-31 | 2024-01-26 | 同扬光电（江苏）有限公司 | High-efficient integrated flexible line way board of multilayer structure |
| CN117460149B (en) * | 2023-10-31 | 2024-06-14 | 同扬光电（江苏）有限公司 | High-efficient integrated flexible line way board of multilayer structure |
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