CN114745851B

CN114745851B - PCB board of arbitrary installation

Info

Publication number: CN114745851B
Application number: CN202210196426.3A
Authority: CN
Inventors: 刘继挺; 曹斌; 张孝蒋; 吴浩兵; 李建
Original assignee: Shanghai Ykc Corp
Current assignee: Shanghai Ykc Corp
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2023-12-05
Anticipated expiration: 2042-03-01
Also published as: CN114745851A

Abstract

The invention discloses a randomly installed PCB (printed circuit board) which comprises a chassis, a PCB main board and splice plates, wherein the PCB main board and splice plates are arranged on the chassis; the PCB board main board comprises an inserting part which can be inserted into the PCB board main board placing part and a butt joint part which is arranged around the PCB board main board; the splice plate comprises a heat radiation plate, a buffer part and two splice parts, and the butt joint of the PCB main board and the splice plate is realized by splicing the splice parts with the butt joint parts. According to the invention, by designing the splice plate, a user can splice different PCB boards together by using the splice plate, and meanwhile, the PCB boards can be used as heat dissipation components independently, so that the PCB boards can meet the production and research and development requirements.

Description

PCB board of arbitrary installation

Technical Field

The invention relates to the technical field of PCB manufacturing, in particular to a randomly installed PCB.

Background

A PCB, a printed wiring board, is one of the important components of the electronics industry. Almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device, a military weapon system, has only electronic components such as an integrated circuit, and a printed board is used for electrically interconnecting the respective components. The printed circuit board consists of an insulating chassis, connecting wires and bonding pads for assembling and welding electronic elements, and has the dual functions of a conductive circuit and the insulating chassis. The wiring device can replace complex wiring, realizes electric connection among elements in a circuit, simplifies assembly and welding work of electronic products, reduces wiring workload in a traditional mode, and greatly lightens labor intensity of workers; and the whole volume is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved.

In the research and development of the PCB, the installation and heat dissipation of the PCB are the problems of the production and research personnel, in daily use, a large amount of heat is generated when the electronic components on the PCB work, if proper air flow heat dissipation is not carried out, the PCB can accumulate most of heat to cause temperature rise, so that the circuit performance is reduced or the breakdown of the PCB is caused, therefore, the heat dissipation part of the PCB is required to be reasonably designed, the heat dissipation part is limited by the use environment of the PCB, the space of the PCB is required to be fully utilized, and the installation space in the electronic equipment is utilized to the greatest extent.

In order to overcome the above-mentioned drawbacks, those skilled in the art have innovated researches in an effort to create a randomly mounted PCB board.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a PCB which is randomly installed, wherein the PCB is installed on a chassis, a splice plate is spliced on the chassis according to the requirement, and the purpose of connecting the PCB with heat dissipation is realized through the splice plate.

In order to solve the technical problems, the invention adopts a technical scheme that: the PCB board comprises a chassis, a PCB board main board and splice plates, wherein the PCB board main board and splice plates are arranged on the chassis, a PCB board main board placing part and a plurality of splice plate placing parts surrounding the periphery of the PCB board placing part are arranged on the chassis, clamping parts are arranged on the periphery of the lower surface of the chassis, the clamping parts are two types, and a slot surrounding the lower surface of the chassis and a circle of slot surrounding the periphery of the lower surface of the chassis and a card outside the slot can be clamped;

through grafting between the joint portion, realize the stable connection between the adjacent chassis, guarantee the stability of the PCB board of grafting on the chassis.

The PCB board mainboard comprises a plugging part which can be plugged in the PCB board mainboard placing part and a butt joint part which is arranged on the periphery of the PCB board mainboard, and when the plugging part is connected, the plugging part is plugged in the PCB board mainboard placing part on the chassis to fix the PCB board mainboard.

The splice plate comprises a heat radiation plate, a buffer part and two splice parts, wherein the buffer part is arranged outside the heat radiation plate, the splice parts are arranged outside the buffer part, the two splice parts are symmetrical about the axis of the splice plate, and the splice part is spliced with the butt joint part to realize the butt joint of the PCB board main board and the splice plate; the splice plate can connect two PCB boards together.

The PCB board main boards are sequentially connected with each other in an end-to-end mode, two ends of each PCB board main board are connected with 2 adjacent PCB board main boards through splice plates, and a closed annular PCB board body is formed.

Further, three-dimensional phonon crystal unit cells with periodically repeated space are arranged in the buffer part, the three-dimensional phonon crystal unit cells are fixedly arranged on the cube frames, and two adjacent cube frames are connected through a connecting column. The characteristic that the three-dimensional phonon crystal unit can shield aperiodic sound wave is utilized, noise generated during operation of the PCB is absorbed, meanwhile, the three-dimensional phonon crystal unit is arranged in the buffer part, the flexible characteristic of the buffer part is utilized to protect the three-dimensional phonon crystal unit inside, the buffer part can absorb vibration generated on the PCB and provide deformation space for the splice plate, and the connection reliability between the PCB main body and the splice plate is ensured.

Further, a ceramic heat dissipation substrate is arranged in the chassis, and extends to the surface of the splice plate placing part. The ceramic heat dissipation substrate absorbs heat generated on the PCB and dissipates heat through the splice plates, and has good heat conductivity and insulativity, so that the safety of the whole PCB is ensured.

Further, the upper surface of the splice plate is coated with an insulating heat dissipation film. And certain heat dissipation is carried out on the splice plates through the insulating heat dissipation films.

Further, a metal radiating block is arranged at the top of the radiating plate, the radiating block penetrates through the upper surface and the lower surface of the radiating plate, and aluminum fins are fixedly arranged at the top of the metal radiating block. The metal radiating block is connected with the ceramic radiating substrate in the chassis, and simultaneously, aluminum fins are utilized for radiating, so that the radiating efficiency is improved.

Further, a snowflake-shaped heat conducting fin is arranged in the heat radiating plate, and the heat conducting fin is communicated with the metal heat radiating block. The heat conductive sheet can increase the heat dissipation area of the heat dissipation plate.

Further, the splice plate is in an hourglass shape, and two ends of the splice plate can be connected with the PCB main body.

Further, a first wire-arranging groove is arranged in the butt joint part, a second wire-arranging groove is arranged on the splicing part, the first wire-arranging groove is communicated with the second wire-arranging groove, and the first wire-arranging groove is communicated with the second wire-arranging groove to realize the conduction between the PCB main body and the splice plate.

Further, two second wire-arranging grooves on the same splice plate are connected through a metal conductive belt.

The beneficial effects of the invention are as follows:

1. according to the invention, the splice plates are spliced in the PCB main board placing part on the chassis, the chassis is combined into a required shape through the clamping part to complete the assembly of the PCB, and the reliability of splicing among the PCB main boards is ensured by arranging the double splicing mode of splicing the chassis and the direct splicing of the PCB and the splice plates, so that a user can select a proper chassis according to actual use requirements, and the installation space of the PCB is utilized to the greatest extent;

2. the splice plate comprises the heat radiation plate, the buffer part and the splice part, and the heat radiation plate is arranged, so that the splice plate has the function of assisting in heat radiation of the PCB, when the heat radiation performance of the PCB main board needs to be enhanced, a plurality of splice plates can be spliced around the PCB main board to increase heat radiation, and the buffer part is internally provided with three-dimensional phonon crystal unit cells, and the splice plate has certain noise reduction by utilizing the characteristic that the three-dimensional phonon crystal unit cells can block aperiodic vibration sound waves;

3. the splice plate is provided with the splice part, the PCB main board is provided with the butt joint part, when the PCB main board is in butt joint with the splice plate, the butt joint part is only required to be designed into a standard part, the PCB and the chassis edge can be designed into different shapes, and in actual use, the PCB main boards with different shapes can be spliced with the splice plate, so that the splice plate is convenient for mass production.

The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.

Drawings

FIG. 1 is a schematic diagram of the structure of the present invention;

FIG. 2 is an exploded view of the present invention;

FIG. 3 is a block diagram of the first clamping portion chassis of the present invention;

FIG. 4 is a block diagram of an alternative embodiment of the invention configured as a joint chassis;

FIG. 5 is a schematic view of the splice plate of the present invention;

FIG. 6 is a schematic view of the structure of the buffer part of the present invention;

FIG. 7 is a schematic view of the structure of a second embodiment of the present invention;

FIG. 8 is a schematic view of the structure of a chassis of other shapes of the present invention;

the parts in the drawings are marked as follows:

the LED lamp comprises a chassis, an 11PCB board main board placing part, a 12 splice board placing part, a 13 clamping part, a 131 slot, a 132 groove, a 133 card, a 14 ceramic radiating substrate, a 2PCB board main board, a 21 splicing part, a 22 butt joint part, a 23 first wire arrangement groove, a 3 splice board, a 31 radiating board, a 311 metal radiating block, a 312 aluminum fin, a 32 buffer part, a 321 three-dimensional phonon crystal unit, a 322 square frame, a 323 connecting column, a 33 splicing part and a 34 second wire arrangement groove.

Detailed Description

The following specific embodiments of the invention are described in order to provide those skilled in the art with an understanding of the present disclosure. The invention may be embodied in other different forms, i.e., modified and changed without departing from the scope of the invention.

Example 1: the utility model provides a PCB board of arbitrary installation, is shown in fig. 1 and fig. 2, includes chassis 1 and PCB board mainboard 2 and splice plate 3 of setting on the chassis, be provided with PCB board mainboard portion of placing 11 and a plurality of splice plate portion of placing 12 of surrounding around PCB mainboard portion of placing on the chassis, as shown in fig. 3 and fig. 4, be provided with joint portion 13 around the chassis lower surface, joint portion is two kinds, around slot 131 of the four circles of chassis lower surface and can the joint slot 132 and the card 133 outside the recess, connect through grafting between the joint portion between two adjacent chassis, realize stable connection between the adjacent chassis.

The chassis is internally provided with a ceramic heat dissipation substrate 14 extending to the surface of the splice plate placement portion. The ceramic heat dissipation substrate absorbs heat generated on the PCB, so that the heat generated during the operation of the PCB main board is transferred to the chassis, the whole bottom of the PCB main board is contacted with the chassis, the large contact area is beneficial to heat conduction, and meanwhile, the ceramic heat dissipation substrate has good heat conductivity and insulativity, and the safety of the whole PCB is guaranteed.

The PCB board mainboard comprises a plugging part 21 which can be plugged into the PCB board mainboard placing part and a butt joint part 22 which is arranged around the PCB board mainboard, and when the PCB board mainboard is installed, the plugging part is plugged into the PCB board mainboard placing part on the chassis, so that the PCB board mainboard is fixed in the chassis.

The splice plate is hourglass form, and PCB board main part all can be connected at the both ends of splice plate, through designing the splice plate into the hourglass form of symmetry, after the splice plate joint is in the PCB board main part, based on the special shape of splice plate, guarantees the stability between splice plate and the PCB board mainboard.

As shown in fig. 5, the splice plate includes a heat dissipation plate 31, a buffer portion 32 and two splice portions 33, the buffer portion is disposed outside the heat dissipation plate, the splice portions are disposed outside the buffer portion, the two splice portions are symmetrical about an axis of the splice plate, the splice portions are inverted trapezoids, and the splice portions are spliced with the butt joint portions to realize butt joint of the PCB board main board and the splice plate; the splice plate can connect two PCB boards together.

The first wire-arranging groove 23 is arranged in the butt joint part, the second wire-arranging groove 34 is arranged on the splicing part, the first wire-arranging groove is communicated with the second wire-arranging groove, and the connection between the PCB main body and the splice plate is realized through the communication between the first wire-arranging groove and the second wire-arranging groove. According to actual use condition, cover the protective cover in second winding displacement groove outside.

The two second wire-arranging grooves on the same splice plate are connected through a metal conductive belt. The metal conductive tape is a silver paste layer coated inside the splice plate.

As shown in fig. 6, three-dimensional photonic crystal unit 321 with periodically repeated space is arranged in the buffer part, the three-dimensional photonic crystal unit is fixedly installed on a cube frame 322, two adjacent cube frames are connected through a connecting column 323, the cube frame and the connecting column are both made of silicon rubber, the characteristic that the three-dimensional photonic crystal unit can shield aperiodic sound waves is utilized to absorb noise generated during the operation of the PCB, meanwhile, the three-dimensional photonic crystal unit is arranged in the buffer part, the characteristic of flexibility of the buffer part is utilized to protect the three-dimensional photonic crystal unit inside, and the buffer part can provide deformation space for the splice plate while absorbing vibration generated on the PCB, so that the connection reliability between the PCB main body and the splice plate is ensured.

The bottom of the splice plate is abutted against the ceramic radiating substrate in the chassis, and the heat absorbed and stored in the chassis is dissipated into the surrounding air through the splice plate.

The upper surface of the splice plate is coated with an insulating heat dissipation film. And the insulating heat dissipation film is utilized to conduct certain heat dissipation on the splice plate.

As shown in fig. 5, a metal heat dissipation block 311 is disposed at the top of the heat dissipation plate, and penetrates through the upper and lower surfaces of the heat dissipation plate, and an aluminum fin 312 is fixedly mounted at the top of the metal heat dissipation block. The metal radiating block is connected with the ceramic radiating substrate in the chassis, the fan is used for blowing air to the aluminum fins, heat on the aluminum fins is conducted to surrounding air, the aluminum fins are used for radiating, and radiating efficiency is improved.

The inside of heating panel is provided with snow-like conducting strip, the conducting strip with metal heat dissipation piece intercommunication. The heat conducting fin can improve the radiating area of heating panel, and the heat that the heat dissipation piece also can be crossed to the heat conducting fin simultaneously and aluminium fin can not timely radiating is temporarily stored, prevents that the heat from piling up in chassis and PCB board mainboard.

Example 2: as shown in FIG. 7, when the heat productivity of the PCB board is higher and the heat dissipation of the PCB board needs to be enhanced, the splice plate can be used as an auxiliary heat dissipation device independently, the splice plate is spliced around the PCB board, and the heat dissipation device in the splice plate is utilized to dissipate heat of the PCB board, so that the heat dissipation capacity of the PCB board is increased

Example 3: as shown in FIG. 8, according to the actual use requirement, the chassis and the PCB main board can be designed into regular polygon, round shape and the like according to the requirement, and the chassis, the PCB main board and the splice plate are made into standard components, so that the PCB can be used and produced conveniently, and the production cost of enterprises is reduced

The foregoing description is only illustrative of the present invention and is not to be construed as limiting the scope of the invention, and all equivalent structures made by the description of the invention and the accompanying drawings, or direct or indirect application in other related technical fields, are equally included in the scope of the invention.

Claims

1. A PCB board of arbitrary installation, its characterized in that: the PCB board comprises a chassis, a PCB board main board and splice plates, wherein the PCB board main board placing part and a plurality of splice plate placing parts surrounding the periphery of the PCB board placing part are arranged on the chassis, clamping parts are arranged on the periphery of the lower surface of the chassis, the clamping parts are two types, and a slot surrounding the lower surface of the chassis and a groove capable of being clamped with the slot and a card outside the groove;

the PCB board main board comprises an inserting part which can be inserted into the PCB board main board placing part and a butt joint part which is arranged around the PCB board main board;

the splice plate comprises a heat radiation plate, a buffer part and two splice parts, wherein the buffer part is arranged outside the heat radiation plate, the splice parts are arranged outside the buffer part, the two splice parts are symmetrical about the axis of the splice plate, and the splice part is spliced with the butt joint part to realize the butt joint of the PCB board main board and the splice plate;

the PCB board main boards are sequentially connected and end to end, so that two ends of each PCB board main board are connected with 2 adjacent PCB board main boards through splice plates to form a closed annular PCB board body;

the two adjacent chassis are connected with each other in a plugging manner through the clamping parts, so that stable connection between the adjacent chassis is realized.

2. An arbitrarily mounted PCB in accordance with claim 1 wherein: three-dimensional phonon crystal unit cells periodically repeated in space are arranged in the buffer part and fixedly installed on the cube frames, and two adjacent cube frames are connected through a connecting column.

3. An arbitrarily mounted PCB in accordance with claim 1 wherein: the chassis is internally provided with a ceramic heat dissipation substrate which extends to the surface of the splice plate placing part.

4. An arbitrarily mounted PCB in accordance with claim 1 wherein: the upper surface of the splice plate is coated with an insulating heat dissipation film.

5. An arbitrarily mounted PCB in accordance with claim 1 wherein: the top of heating panel is provided with the metal heat dissipation piece, the heat dissipation piece runs through the upper and lower surface of heating panel, the top fixed mounting of metal heat dissipation piece has the aluminium fin.

6. An arbitrarily mounted PCB in accordance with claim 5 wherein: the inside of heating panel is provided with snow-like conducting strip, the conducting strip with metal heat dissipation piece intercommunication.

7. An arbitrarily mounted PCB in accordance with claim 1 wherein: the splice plate is hourglass-shaped.

8. An arbitrarily mounted PCB in accordance with claim 1 wherein: the butt joint part is internally provided with a first wire-arranging groove, the splicing part is provided with a second wire-arranging groove, and the first wire-arranging groove is communicated with the second wire-arranging groove.

9. An arbitrarily mounted PCB in accordance with claim 8 wherein: the two second wire-arranging grooves on the same splice plate are connected through a metal conductive belt.