KR100728165B1 - Plasma display device - Google Patents

Abstract

The plasma display device of the present invention effectively dissipates heat generated by an intelligent power module, and includes a plasma display panel, a chassis base to which the plasma display panel is attached and supported, and mounted on the chassis base and electrically connected to the plasma display panel. And a printed circuit board assembly, an intelligent power module provided in the printed circuit board assembly, a heat sink attached to the intelligent power module, and a connection member connecting the heat sink and the printed circuit board assembly.

Plasma Display, Chassis Base, Intelligent Power Module, Connector

Description

Plasma Display Device {PLASMA DISPLAY DEVICE}

1 is a perspective view schematically illustrating an exploded view of a plasma display device according to a first embodiment of the present invention.

2 is an exploded perspective view illustrating an intelligent power module, a heat sink, and a connection member.

3 is a plan view showing the assembled state of FIG.

4 is a cross-sectional view taken along the line IV-IV of FIG. 3.

FIG. 5 is a cross-sectional view taken along the line VV of FIG. 3.

6 is an exploded perspective view illustrating an intelligent power module, a heat sink, and a connection member according to a second embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. 6.

8 is an exploded perspective view illustrating an intelligent power module, a heat sink, a connecting member, and a heat dissipation pad according to a third embodiment of the present invention.

9 is a cross-sectional view taken along the line VII-VII of FIG. 8.

10 is an exploded perspective view illustrating an intelligent power module and a plate heat sink according to a fourth embodiment of the present invention.

FIG. 11 is a cross-sectional view taken along the line II-XI of FIG. 10.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display device that effectively dissipates heat generated by an intelligent power module.

In general, a plasma display apparatus generates a plasma by gas discharge and displays an image using the plasma, a plasma display panel for supporting the panel, and a plurality of printed circuits mounted on the chassis base. Printed circuit board assemblies.

The plasma display panel has two glass substrates facing each other, and a discharge space is formed therein, and thus has a weak mechanical rigidity against impact. Therefore, the chassis base is formed of a metal having a higher mechanical rigidity than the glass substrate to support the panel.

In addition to supporting the mechanical stiffness of the panel, the chassis base provides mounting space for printed circuit board assemblies, heat sink function of the panel, and electromagnetic interference (EMI). ) It is in charge of grounding function.

In addition, a panel via a double-sided tape is attached to the front of the chassis base so that the chassis base performs the above functions, and printed circuit board assemblies are mounted to the rear of the chassis base.

The back of the chassis base has a plurality of bosses, which are mounted on the boss and fixedly mounted by fastening a set screw to the boss.

These printed circuit board assemblies are provided in plural to perform the respective functions for driving the panel. That is, the printed circuit board assemblies may include a sustain board assembly for controlling the sustain electrode, a scan board assembly for controlling the scan electrode, an address buffer board assembly for controlling the address electrode, and a control signal for driving the address electrode by receiving an image signal from the outside. An image processing / control board assembly for generating a control signal required for driving the sustain electrode and the scan electrode and applying the same to the corresponding board assemblies, and a power board assembly for supplying power for driving the board assemblies.

The holding board assembly is connected to the sustain electrode which is drawn out from the inside of the panel, the scan board assembly is connected to the scan electrode which is drawn out from the inside of the panel, and the address buffer board assembly is connected to the address electrode drawn out from the inside of the panel. It is connected via a flexible printed circuit and a connector.

In addition, the sustain board assembly and the scan board assembly include an intelligent power module for applying a driving signal to the sustain electrode and the scan electrode. The intelligent power module includes a power switching element such as a power transistor and a field effect transistor (FET), a driving circuit for driving the power switching element, and a protection circuit for protecting the power switching element. It's built into the package.

The intelligent power module consists of various circuit elements, a printed circuit board mounting the same, and a case for supporting the same. The printed circuit board is composed of an epoxy resin plate bonded in the form of surface mount devices (SMD) and a metal plate (usually aluminum) for transferring heat generated from the circuit elements to the heat sink.

The intelligent power module generates a large amount of heat during operation because it includes a large amount of heat-generating power switching elements in one package. In order to dissipate this heat, a heat sink is attached to the metal plate of the intelligent power module. The heat sink expands the heat dissipation area of the intelligent power module to dissipate heat released by internal circuitry to the outside.

However, as the panel becomes larger and smaller, the number of sustain electrodes, scan electrodes, and address electrodes increases, and as the number of switching operations of the switching elements in the intelligent power module increases, the heat sink generates heat generated in the intelligent power module. It will reveal the limit in heat dissipation.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display device that effectively dissipates heat generated from an intelligent power module.

A plasma display device according to an embodiment of the present invention, a plasma display panel, a chassis base for attaching and supporting the plasma display panel, a printed circuit board assembly mounted on the chassis base and electrically connected to the plasma display panel And an intelligent power module provided in the printed circuit board assembly, a heat sink attached to the intelligent power module, and a connection member connecting the heat sink and the printed circuit board assembly.

The connection member may be formed of a metal having excellent thermal conductivity.

The heat sink may include a horizontal plate that maintains a horizontal state with the printed circuit board assembly, a plurality of fins protruding in the vertical direction of the horizontal plate and extending in one direction, and among the plurality of fins. In one of the above, it may include a rib protruding from the pin to be parallel to the horizontal plate spaced apart from the horizontal plate, to form an insertion groove in the longitudinal direction of the pin, the rib is formed long in the longitudinal direction of the pin. .

The rib may include a first rib and a second rib formed in two adjacent pins, respectively.

The connecting member includes a vertical plate formed to connect the heat sink and the printed circuit board assembly in a vertical direction thereof, a first protrusion bent at a right angle from the vertical plate and coupled to an insertion groove of the heat sink, and the vertical plate. It may include a second protrusion formed in the extending direction of the coupling coupled to the insertion hole formed in the printed circuit board assembly.

The first protrusion may be coupled to the insertion groove to be in surface contact with the horizontal plate and the rib.

The second protrusion may be longer than the thickness of the substrate of the printed circuit board assembly having the insertion hole.

The connecting member may be provided at both ends of the fin in the longitudinal direction of the heat sink.

The area of the horizontal plate may be wider than the area of the intelligent power module.

In addition, the heat sink may include a horizontal plate that is horizontal with the printed circuit board assembly and includes a screw hole, and a plurality of fins protruding in the vertical direction thereof and extending in one direction. .

The connection member may include a vertical plate formed in a vertical direction in the heat sink and the printed circuit board assembly, and bent at a right angle from the vertical plate, disposed between the fins of the heat sink, and through holes corresponding to the screw holes. It may include a first projection to be formed, and a second projection formed in the extending direction of the vertical plate is coupled to the insertion hole formed in the printed circuit board assembly.

In addition, according to an embodiment of the present invention, the plasma display panel includes a set screw fastened to the screw hole through the through hole.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

1 is a perspective view schematically illustrating an exploded view of a plasma display device according to a first embodiment of the present invention.

Referring to this drawing, the plasma display apparatus is provided with a plasma display panel 11 for displaying an image using gas discharge, and is provided on the rear surface of the panel 11 to plan heat generated by the panel 11 due to gas discharge. Heat-dissipating sheets 13 that conduct and spread in a direction, a chassis base 15 attached to the rear surface of the panel 11 via the heat-dissipating sheets 13 to support the panel 11, and the chassis base ( And printed circuit board assemblies 17 mounted on the back of 15 and electrically connected (not shown) to the panel 11 to drive the panel 11.

The panel 11 displays an image by using gas discharge. Since the present embodiment relates to the coupling relationship between the panel 11 and other components, detailed description of the panel 11 is omitted here. . The panel 11 generates heat during gas discharge.

The heat dissipation sheet 13 conducts and diffuses the heat in the planar direction of the panel 11. The heat dissipation sheet 13 may be made of various materials such as acrylic heat dissipating material, graphite heat dissipating material, metal heat dissipating material, or carbon nanotube heat dissipating material.

The chassis base 15 is attached to the rear surface of the panel 11 via the heat dissipation sheet 13 to support the panel 11, and the printed circuit board assemblies 17 are mounted on the opposite side of the panel 11. They also support it. The chassis base 15 thus has mechanical rigidity capable of supporting the panel 11 and the printed circuit board assemblies 17.

These printed circuit board assemblies 17 are placed on a boss (see Fig. 4) 18 provided in the chassis base 15 in a plurality, and are set by the set screws 19 fastened to the bosses 18. Is fixed. In addition, the printed circuit board assemblies 17 are provided in plural in order to perform respective functions of driving the panel 11.

That is, the printed circuit board assemblies 17 may include a sustain board assembly 17a for controlling a sustain electrode (not shown), a scan board assembly 17b for controlling a scan electrode (not shown), and an address electrode (not shown). The address buffer board assembly 17c for controlling, an image processing / control board that receives an image signal from the outside, generates a control signal for driving the address electrode and a control signal for driving the sustain electrode and the scan electrode, and applies it to the corresponding board assemblies. Assembly 17d, and a power board assembly 17e for supplying power for driving the board assemblies.

Of these printed circuit board assemblies 17, the holding board assembly 17a and the scanning board assembly 17b are involved in sustain discharge. During sustain discharge, the sustain board assembly 17a applies a sustain pulse to the sustain electrode, and the scan board assembly 17b applies a sustain pulse to the scan electrode, and each has an intelligent power module 21. The intelligent power module 21 includes various circuit elements, a printed circuit board on which the same is mounted, and a case for supporting the same. Here, one component that generates heat during driving will be described.

2 is an exploded perspective view illustrating an intelligent power module, a heat sink, and a connection member. The structure of FIG. 2 can be equally applied to the holding board assembly 17a and the scanning board assembly 17b, and hereinafter, the holding board assembly 17a is described as an example for convenience.

The intelligent power module 21 includes a plurality of terminals 21a and is connected to the terminal holes 17aa provided in the circuit pattern of the holding board assembly 17a. These terminals 21a are soldered to the terminal holes 17aa on opposite sides of the holding board assembly 17a.

The intelligent power module 21 mounted on the holding board assembly 17a is attached with a heat sink 23 to dissipate heat generated when the panel 11 is driven. The heat sink 23 radiates heat generated from the intelligent power module 21 to protect the intelligent power module 21 from a thermal load, and enables the intelligent power module 21 to be continuously driven.

In addition, in order to further increase the heat dissipation effect of the intelligent power module 21, the connection member 25 connects the heat sink 23 and the holding board assembly 17a to each other. The connecting member 25 assists the heat dissipation performance of the heat sink 23, and is formed of a metal having excellent thermal conductivity, for example, a metal including aluminum, and may be formed of a material that is the same as the heat sink 23. have.

On the other hand, the heat sink 23 is attached to the intelligent power module 21 in a surface contact state so as to easily absorb heat from the intelligent power module 21. A heat conduction sheet (not shown) may be provided between the heat sink 23 and the intelligent power module 21 for heat conduction. In addition, the heat sink 23 is formed in a structure in which a heat dissipation area is widened for rapid radiation of absorbed heat. The heat sink 23 is formed in a structure including a horizontal plate 23a, fins 23b, and ribs 23c.

The horizontal plate 23a is formed in a plate shape to maintain a horizontal state with the holding board assembly 17a and absorbs heat from the intelligent power module 21. The area a of the horizontal plate 23a is formed to be wider than the area b of the intelligent power module 21 (see Fig. 3). Therefore, the heat generated by the intelligent power module 21 can be conducted to the horizontal plate 23a in a short time. In this case, the area refers to areas of planes corresponding to each other in parallel with the heat sink 23 attached to the intelligent power module 21.

These pins 23b protrude in the vertical direction to the horizontal plate 23a and are formed long in one direction. In addition, these pins 23b are arranged at equal intervals in the horizontal plate 23a, thereby enabling uniform heat dissipation in the horizontal plate 23a.

The rib 23c also forms an insertion groove 23d in the longitudinal direction of the pin 23b between the pins 23b. To this end, the rib 23c is spaced apart in the protruding direction of the pin 23b from the horizontal plate 23a, and is formed long in the longitudinal direction of the pin 23b while being parallel to the horizontal plate 23a. That is, the insertion groove 23d is formed as a space surrounded by the horizontal plate 23a, the pin 23b and the rib 23c.

The rib 23c may be formed only on one pin 23b among the adjacent pins 23b (not shown), and the first rib 123c and the second rib formed on both adjacent pins 23b. 223c.

This rib 23c forms an insertion groove 23d to enable insertion of the connecting member 25. Therefore, when the ribs 23c are formed with both the first ribs 123c and the second ribs 223c on the pins 23b, respectively, the ribs 23c may have a more stable structure.

Further, the rib 23c may be formed only in one of the pins 23b, but may be formed between all the pins 23b. In this case, since the insertion groove 23d is formed between all the fins 23b, the connecting member 25 may be selectively inserted at an appropriate position among the various fins 23b of the heat sink 23.

The connecting member 25 is formed to have a structure in which the heat sink 23 and the holding board assembly 17a are connected to each other with heat conduction. That is, the connection member 25 is formed to include a vertical plate 25a, a first protrusion 25b, and a second protrusion 25c.

The vertical plate 25a is formed in a direction perpendicular to the side of the heat sink 23 to connect the heat sink 23 and the holding board assembly 17a. The vertical plate 25a may be formed over the entire width range of the heat sink 23, but may be formed over a part of the width range (see FIGS. 3 and 4). When the width of the vertical plate 25a is large, the thermal conductivity from the heat sink 23 to the holding board assembly 17a is improved. When the width is small, the convection around the power intelligent module 31 is satisfactorily achieved. do. Therefore, the width of the vertical plate 25a is set to an appropriate size in consideration of thermal conductivity and convection.

The first protrusion 25b is bent from the vertical plate 25a. This first projection 25b is formed at the end of the vertical plate 25a adjacent to the heat sink 23 and inserted into the insertion groove 23d of the heat sink 23 (see Fig. 5). This first projection 25b is in surface contact with the horizontal plate 23a and the rib 23c forming the insertion groove 23d. To this end, the first protrusion 25b is coupled to the insertion groove 23d by an interference fit. This surface contact structure improves the heat conduction performance from the heat sink 23 to the holding board assembly 17a.

The second protrusion 25c is formed in the longitudinal direction of the vertical plate 25a and coupled to the holding board assembly 17a. To this end, the holding board assembly 17a has an insertion hole 17ab corresponding to the second protrusion 15c. In addition, a plurality of the insertion holes 17ab may be formed in a portion where a circuit pattern is not formed corresponding to the width of the heat sink 23 (not shown).

This second protrusion 25c is a portion that directly transfers heat transferred to the vertical plate 25a to the scanning board assembly 17a, and is preferably coupled to the scanning board assembly 17a in the widest possible area. Therefore, the second protrusion 25c is formed longer than the substrate thickness of the holding board assembly 17a having the insertion hole 17ab, and is forcibly fitted to the insertion hole 17ab. In this case, the second protrusion 25c is in surface contact with the holding board assembly 17a at least by the thickness of the substrate. In addition, the second protrusion 25c may be connected to a ground pattern (not shown) of the holding board assembly 17a to improve the grounding performance of the circuit.

The connecting member 25 may be provided at both ends of the heat sink 23 in the longitudinal direction of the fin 23b. In this case, the two connecting members 25 implement heat conduction from the heat sink 23 to the holding board assembly 17a more effectively than when the one heat conductive member 25 is provided, and also the heat sink ( Thermal equilibrium in 23) can be maintained.

Under the same conditions in which the temperature of the intelligent power module 21 is the highest, the temperature of the heat sink according to the prior art was 75.8 degrees, but the first embodiment was 68.6 degrees to obtain a temperature stress reduction effect of about 7.2 degrees. Can be.

6 is an exploded perspective view illustrating an intelligent power module, a heat sink, and a connection member according to a second embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. 6.

Referring to these drawings, since the second embodiment has an overall similar configuration as compared with the first embodiment, only different parts will be described herein.

The heat sink 323 of the second embodiment is composed of a horizontal plate 323a and a plurality of fins 323b. This horizontal plate 323a is provided with the screw hole 323aa.

In addition, the connection member 325 is composed of a vertical plate 325a, a first protrusion 325b and a second protrusion 325c. The first protrusion 325b has a through hole 325ba corresponding to the screw hole 323aa.

And the second embodiment has a set screw 326, unlike the first embodiment. The set screw 326 is fastened to the screw hole 323aa through the through hole 325ba, thereby connecting the connection member 325 and the heat sink 323 to each other. The first protrusion 325b of the connecting member 325 is in surface contact with the horizontal plate 323a of the heat sink 323 by the fastening force of the set screw 326. The set screw 326 may itself conduct the heat of the horizontal plate 323a to the first protrusion 325b.

After inserting the second projection 325c of the connecting member 325 into the insertion hole 17aa of the holding board assembly 17a, and placing the first projection 325b on the vertical plate 325a, the set screw 326 ) Is inserted into the through hole 325ba and fastened to the screw hole 323aa, whereby the connection member 325 and the heat sink 323 are connected to each other. The set screw 326, the through hole 325ba, and the screw hole 323aa prevent deformation of the connecting member 325 when the connecting member 325 is coupled to the heat sink 323 and the holding board assembly 17a. You can prevent it.

8 is an exploded perspective view illustrating an intelligent power module, a heat sink, a connecting member, and a heat dissipation pad according to a third embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along the line VII-VII of FIG. 8.

Referring to these figures, the third embodiment has an overall similar configuration as compared with the first embodiment, and includes the configuration of the first embodiment and the heat dissipation pad 27. This heat dissipation pad 27 is interposed between the holding board assembly 17a and the chassis base 15 at a position corresponding to the intelligent power module 21.

By mounting the retaining board assembly 17a to the boss 18 of the chassis base 15 with the set screw 19, the heat dissipation pad 27 is applied to the compressive force of the retaining board assembly 17a and the chassis base 15. The state interposed therebetween can be maintained. In addition, the heat dissipation pads 27 may be attached to both surfaces thereof through an adhesive (not shown).

Therefore, the heat generated by the intelligent power module 21 is radiated from the heat sink 23, transferred to the holding board assembly 17a through the connecting member 25, and radiated from the holding board assembly 17a, and also a heat radiating pad. It is delivered to the chassis base 15 through 27 and radiated from the chassis base 15. That is, the heat radiation pad 27 has the heat radiation performance of the first embodiment and the heat radiation performance to the chassis base 15 together.

Since the end portions of the terminals 21a of the intelligent power module 21 are in contact with each other, the heat dissipation pads 27 are formed of a material having electrical insulation to prevent shorts of the terminals 21a.

FIG. 10 is an exploded perspective view illustrating an intelligent power module and a plate heat sink according to a fourth exemplary embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along the line VII-XI of FIG. 10.

Referring to these figures, the fourth embodiment is slightly different compared with the first embodiment. In the first embodiment, the heat sink 23 and the connection member 25 are formed separately, and the heat sink 23 has a plurality of fins 23b.

In contrast, the fourth embodiment includes a plate heat sink 523 having no fins 23b described above, and the heat sink 523 and the connection member 525 are integrally formed.

The plate heat sink 523 is attached to the intelligent power module 21, and may be attached via the thermal grease 22. The connecting member 525 has a vertical plate 525a, a connecting portion 525b connected to the plate heat sink 523, and a projection 252c connecting the vertical plate 525a to the holding board assembly 17a. .

This fourth embodiment may be somewhat inferior in heat dissipation performance compared to the other embodiments described above, but since it does not have fins, it does not require an installation height corresponding to the height of the fins, so that the rear of the holding board assembly 17a It can be effectively applied when height is limited.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, by connecting the heat sink and the printed circuit board assembly provided in the intelligent power module with each other as a connecting member, the heat generated in the intelligent power module transferred to the heat sink is printed circuit board. By transferring to the assembly, heat dissipation is simultaneously performed in the heat sink and the printed circuit board assembly, thereby improving the heat dissipation performance of the intelligent power module.

Claims (15)

A plasma display panel; A chassis base to which the plasma display panel is attached and supported; A printed circuit board assembly mounted on the chassis base and electrically connected to the plasma display panel; An intelligent power module provided in the printed circuit board assembly; A heat sink attached to the intelligent power module; And And a connection member connecting the heat sink and the printed circuit board assembly. According to claim 1, And the connection member is formed of a metal having excellent thermal conductivity. According to claim 1, The heat sink is a horizontal plate for maintaining a horizontal state with the printed circuit board assembly, A plurality of pins protruding from the horizontal plate in a vertical direction thereof and extending in one direction; Protrudes from the pin so as to be spaced apart from the horizontal plate and parallel to the horizontal plate so as to form an insertion groove in the longitudinal direction of the pin between any one of the plurality of pins forming the longitudinal direction of the pin. Plasma display device comprising a rib that is formed long. The method of claim 3, wherein And the ribs include first ribs and second ribs respectively formed on two adjacent fins. The method of claim 3, wherein The connecting member may include a vertical plate formed in a vertical direction in the heat sink and the printed circuit board assembly; A first protrusion bent at a right angle from the vertical plate and coupled to an insertion groove of the heat sink; And a second protrusion formed in an extension direction of the vertical plate and coupled to an insertion hole formed in the printed circuit board assembly. The method of claim 5, And the first protrusion is coupled to the insertion groove and is in surface contact with the horizontal plate and the rib. The method of claim 5, And the second protrusion is formed longer than a thickness of a substrate of the printed circuit board assembly having the insertion hole. The method of claim 5, The connecting member is provided at both ends of the fin in the longitudinal direction of the heat sink. The method of claim 3, wherein And the area of the horizontal plate is wider than that of the intelligent power module. According to claim 1, The heat sink is horizontal with the printed circuit board assembly and a horizontal plate having a screw hole; And a plurality of fins protruding from the horizontal plate in a vertical direction thereof and extending in one direction. The method of claim 10, The connecting member includes a vertical plate formed to connect the heat sink and the printed circuit board assembly in a vertical direction thereof; A first protrusion bent at a right angle from the vertical plate and disposed between the fins of the heat sink and forming a through hole corresponding to the screw hole; And a second protrusion formed in an extension direction of the vertical plate and coupled to an insertion hole formed in the printed circuit board assembly. The method of claim 11, wherein And a set screw fastened to the screw hole through the through hole. According to claim 1, And a heat dissipation pad provided between the printed circuit board assembly and the chassis base corresponding to the intelligent power module. According to claim 1, And the heat sink is formed in a plate shape. The method according to claim 1 or 14, The connection member is a plasma display device formed integrally with the heat sink.

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