KR100766922B1 - Plasma display device - Google Patents

Abstract

A plasma display device is provided to increase a contact area between a heat-sink and a high heat radiating circuit element by inserting a part of the high heat radiating circuit element into a groove of the heat-sink. A chassis base is coupled with a plasma display panel in order to support the plasma display panel. A printed circuit board assembly is installed at the chassis base and is electrically connected to the plasma display panel in order to drive the plasma display panel. A high heat radiating circuit element(20) is installed in the printed circuit board assembly. A heat-sink(17) comes in contact with the high heat radiating circuit element. A groove(30) is formed at one side of the heat-sink opposite to the high heat radiating circuit element in order to receive a part of the high heat radiating circuit element.

Description

Plasma Display Device {PLASMA DISPLAY DEVICE}

1 is a partially exploded perspective view of a plasma display device according to a first embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view illustrating an enlarged portion of the heat sink mounted on the high heat generating circuit device of FIG. 1.

3 is a cross-sectional view taken along line III-III of FIG. 2.

4 is a perspective view of a heat sink provided in the plasma display device according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a state in which a heat sink provided in a plasma display device according to a second embodiment of the present invention is mounted on a high heat generating element.

6 is a cross-sectional view illustrating a state in which a heat sink provided in a plasma display device according to a third embodiment of the present invention is mounted on a high heat generating element.

7 is a cross-sectional view illustrating a state in which a heat sink provided in a plasma display device according to a fourth embodiment of the present invention is mounted on a high heat generating element.

8 is a perspective view illustrating a heat sink provided in a plasma display device according to a fourth embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: plasma display panel 11: thermal diffusion sheet

12: chassis base 13: circuit board assembly

13a: scan electrode driving board 13b: logic board

13c: power supply board 13d: address buffer board

13e: sustain electrode drive board 14: boss

15: set screw 17: heat sink

17a: heat dissipation fin 20: high heat generation circuit element

30: groove 50: heat dissipation

60: inclined portion 61: free space

The present invention relates to a plasma display device, and more particularly, to improve the heat sink's heat dissipation efficiency by improving the structure of a heat sink mounted on a high heat generating circuit element of a circuit board assembly, and to easily mount the heat sink to a high heat generating circuit element. The present invention relates to a plasma display device.

Plasma generally refers to another state that is different from the state of solid, liquid and gas, but here the state in which the substance in the gas state is electrically ionized. In addition, a plasma display apparatus using plasma displays characters, graphics, or images by using a glow discharge among gas discharge phenomena.

The plasma display apparatus operating in the glow discharge region has an advantage of maintaining the discharge at a voltage lower than the discharge start voltage, and converts the received analog image signal into digital data to implement an image on the plasma display panel. .

In general, a plasma display device generates a plasma by gas discharge and displays an image using the plasma, a plasma display panel for supporting the plasma display panel, and a plurality of chassis bases mounted on the chassis base. It includes a printed circuit board assembly.

The plasma display panel attaches two glass substrates to face each other, and forms a discharge space therein. In addition, an adhesive member such as a double-sided tape is attached to the rear surface of the plasma display panel.

In addition, a plasma display panel having double-sided tape is attached to the front of the chassis base, and circuit board assemblies are mounted to the rear of the chassis base.

In addition, a plurality of bosses are formed on the back of the chassis base, and the circuit board assemblies are placed on the boss and fasten the circuit board assembly to the boss by using fasteners such as set screws. .

In addition, the chassis base may be manufactured by pressing a thin metal plate, and the chassis base may be bent or additionally provided with a reinforcing member on one side in order to withstand a certain torsional or bending stress.

The chassis base has a constant mechanical rigidity, and the chassis base is equipped with circuit board assemblies. In addition, the chassis base may be a heat sink of the plasma display panel, and may be electrically connected to the circuit board assembly to generate electromagnetic interference (hereinafter referred to as 'EMI') generated in the circuit board assembly. Absorb and reduce.

Meanwhile, the circuit board assembly provided in the chassis base drives the plasma display panel. The circuit board assembly includes a sustain electrode driving board controlling the sustain electrode, a scan electrode driving board controlling the scan electrode, and an address controlling the address electrode. A buffer board includes a logic board for receiving an image signal from an external source, generating a control signal for driving an address electrode, a control signal for driving a sustain electrode, and a scan electrode, and applying a logic signal to a corresponding board and supplying power to the board.

The sustain electrode driving board is connected to the sustain electrode which is drawn out from the inside of the plasma display panel, the scan electrode driving board is connected to the scan electrode which is drawn out from the inside of the plasma display panel, and the address buffer board is It is connected to an address electrode drawn out from the inside, and each connection is made through a printed circuit and a connector.

In addition, the sustain electrode driving board and the scan electrode driving board protect the power switching element, the driving circuit for driving the power switching element, and the power switching element for applying driving signals to the sustain electrode and the scanning electrode, respectively. A protection circuit is provided.

As described above, the circuit board assembly includes various circuit elements, and a heat sink may be mounted on a high heat generating circuit element that generates high heat. The heat sink absorbs heat generated from the high heat generating circuit and radiates it into the air, and maintains the temperature of the high heat generating circuit properly so that the high heat generating circuit can not be deteriorated to high heat and can be operated continuously. .

The heat generated from this high heat generating circuit element deteriorates not only the circuit element itself but also other circuit elements arranged adjacently and degrades the function of the circuit board assembly. Therefore, the cooling technology of the high heat generating circuit element is important in the plasma display device.

In order to efficiently dissipate heat generated from the high heat generating circuit element in a short time, the capacity of the heat sink mounted on the high heat generating circuit element must be increased, and the volume of the heat sink must be increased.

On the other hand, in recent years, since plasma display devices have become larger and slimmer, circuit devices have been highly integrated and miniaturized. Therefore, the design size of the heat sink is inevitably limited.

In general, the heat sink and the high heat generating circuit device has a structure in contact with each other, the conventional heat sink has a feature that the contact surface is flat. Therefore, when the heat sink is mounted on the high heat generating circuit element, the possibility of detachment is large, and thus there is a problem in that assembly is not easy. In addition, even if the assembly is completed, there is a possibility that the heat sink is separated from the high heat generating circuit element. In addition, there was a problem that the heat dissipation performance of the heat sink is reduced.

The present invention has been made to solve the above problems, the object of which is to improve the structure of the heat sink mounted on the high heat generating circuit element of the circuit board assembly to improve the heat dissipation efficiency of the heat sink, the heat sink is a high heat generating circuit element There is provided a mounting plasma display device which can be easily mounted.

According to an embodiment of the present invention, a plasma display device includes a plasma display panel in which an image is implemented, a chassis base to which the plasma display panel is attached, and supports the plasma display panel, mounted on the chassis base, and electrically connected to the plasma display panel. A circuit board assembly for driving, a high heat generating circuit element provided in the circuit board assembly and a heat generating contact with the high heat generating circuit element, and having a groove for receiving at least a portion of the high heat generating circuit element on one side facing the high heat generating circuit element. Include a sink.

The shape of the groove formed in the heat sink is matched with the shape of the high heat generating circuit element.

An inclined portion is formed on a side surface of the groove formed in the heat sink.

Sides of the grooves formed in the heat sink form an inclined portion so that an opening surface is wider than a bottom surface, and when the high heat generating circuit device is inserted, a free space is formed between the side of the high heat generating circuit device and the inclined portion of the groove.

The high heat generating circuit device is inserted into the groove formed in the heat sink, and a heat dissipation material is further interposed between the groove and the high heat generating circuit device.

The heat dissipating material is a gel material that fills a gap between the high heat generating circuit device and the bottom and side surfaces of the groove.

The heat dissipating material is made of any one or more materials selected from the group consisting of acrylic, graphite, metal or carbon nanotube materials.

One surface of the groove formed in the heat sink is opened.

The high heat generating circuit element is a switching element.

The high heat generating circuit device is a main control integrated circuit mounted on a logic board.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

1 is a partially exploded perspective view of a plasma display device according to a first embodiment of the present invention.

Referring to FIG. 1, the plasma display apparatus according to the present exemplary embodiment includes a plasma display panel 10 that implements an image on a front surface by using a gas discharge phenomenon, and a chassis base coupled to a rear surface of the plasma display panel 10. 12 and a thermal diffusion sheet 11 interposed between the chassis base 12 and the plasma display panel 10 to absorb heat generated from the plasma display panel 10. In addition, the boss 14 protrudes from one side of the chassis base 12.

The circuit board assembly 13 is attached to the boss 14 by the set screw 15, the heat sink 17 is attached to the high heat generating circuit element 20 of the circuit board assembly 13, and the heat sink 17 is attached to the boss 14. The heat absorbs the heat generated from the high heat generating circuit element 20 and radiates to the outside.

Although not shown in the drawing, the front cover is provided on the front side of the plasma display panel 10, and the back cover is provided on the rear side of the chassis base 12. The front cover and the back cover are combined to form an external appearance of the plasma display device.

The plasma display panel 10 is attached to one surface of the chassis base 12 by a double-sided tape or the like, and the thermal diffusion sheet 11 is mounted between the plasma display panel 10 and the chassis base 12. In addition, the thermal diffusion sheet 11 receives and dissipates heat generated from the plasma display panel 10.

A plurality of circuit board assemblies 13 are mounted on the rear surface of the chassis base 12, and the chassis base 12 has a mechanical rigidity capable of supporting the plurality of circuit board assemblies 13. In addition, the chassis base 12 may be manufactured by pressing a thin metal sheet, etc., and should be manufactured to have mechanical torsion or bending resistance. In addition, the chassis base 12 may be further provided with a reinforcing member (not shown) to increase mechanical rigidity.

The circuit board assembly 13 includes a power supply board 13c for supplying a voltage, a logic board 13b for receiving an image signal and generating a control signal according thereto, and a discharge cell according to the control signal generated in the logic board 13b. There is an address buffer board 13d that applies a voltage for selecting (not shown) to the address electrode (not shown). In addition, the circuit board assembly 13 includes a scan electrode driver board 13a and a sustain electrode driver board 13e applied to the scan electrode (not shown) and the sustain electrode (not shown) according to a signal transmitted from the logic board 13b. ), And the like.

Meanwhile, circuit elements required for driving the plasma display panel 10 are formed in the circuit board assemblies 13, and among these circuit elements, particularly high heat generating circuit elements are present. The heat sink 17 is mounted on one surface of the high heat generating circuit element to cool the high heat generating circuit element.

In the present embodiment, a description will be given focusing on the heat sink 17 provided in the logic board 13b of the circuit board assembly 13. However, the heat sink 17 is not limited to the high heat generating circuit device 20 provided in the logic board 13b and may be applied to all high heat generating circuit devices of the plasma display device.

FIG. 2 is a partially cutaway perspective view illustrating an enlarged portion of the heat sink 17 mounted on the high heat generation circuit 20 in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line Ш- Ш of FIG.

Referring to FIGS. 2 and 3, a high heat generating circuit 20 is mounted on the logic board 13b, and a heat sink 17 is mounted on an outer surface of the high heat generating circuit 20.

On the other hand, the groove 30 is formed on one side of the heat sink 17, the shape of the groove 30 may be formed to match the appearance of the high heat generating circuit device (20).

A portion of the high heat generating circuit element 20 is inserted into the groove 30 formed in the heat sink 17. In addition, the inner surface of the groove 30 and the outer surface of the high heat generating circuit element 20 are in close contact with each other, so that the heat of the high heat generating circuit element 20 is easily conducted to the heat sink 17.

On the other hand, when the groove 30 is not formed in the heat sink 17 and the contact surface is flat, the heat of the high heat generating circuit element 20 is conducted only in the first direction (the x-axis direction in the drawing). However, the heat of the high heat generating circuit device 20 according to the present embodiment is conducted in the first direction (x-axis direction in the drawing) and the second direction (y-axis direction in the drawing) as shown in FIG. 3.

The first direction x is a direction perpendicular to the contact surface, and the second direction y is a direction perpendicular to the first direction x.

As the high heat generating circuit device 20 is deeply inserted into the groove 30 of the heat sink 17, the contact area between the high heat generating circuit device 20 and the heat sink 17 increases, and thus the heat of the high heat generating circuit device 20 is increased. Can be delivered to the heat sink 17 more quickly. Therefore, the temperature of the high heat generating circuit element 20 can be maintained more stably, and continuous driving is possible.

4 is a perspective view of a heat sink provided in the plasma display device according to the first embodiment of the present invention.

The heat sink 17 absorbs heat generated from the high heat generating circuit device 20 and radiates it to the outside, thereby protecting the high heat generating circuit device 20 from a heat load, and enabling continuous driving of the high heat generating circuit device 20. Thus, the heat sink 17 is designed to have a large heat dissipation area in order to quickly radiate the absorbed heat.

Accordingly, a plurality of heat dissipation fins 17a are disposed in the heat sink 17 in an uneven shape, and the heat dissipation fins 17a radiate a lot of heat into the air for a short time from the heat transferred from the high heat generation circuit element 20. do.

The heat dissipation capability of the heat sink 17 varies depending on the thickness, area, or installation direction of the heat dissipation fin 17a. In particular, it is preferable to have a structure in which the heat radiation fins 17a are easily cooled by air by allowing air to flow smoothly between the heat radiation fins 17a.

If the groove 30 is not formed in the heat sink 17, the heat sink 17 is easily detached from the high heat generating circuit element 20, so assembly is not easy, but the groove 30 is formed in the heat sink 17. Since the high heat generating circuit element 20 is inserted into the groove 30, the high heat generating circuit element 20 and the heat sink 17 are easily coupled to each other.

In addition, an increase in the contact area between the heat sink 17 and the high heat generating circuit element 20 also has the effect of faster thermal conduction.

As shown in FIG. 4, the groove 30 of the heat sink 17 has a structure in which the high heat generating circuit device 20 is inserted, and the shape of the groove 30 is rectangular along the outer shape of the high heat generating circuit device 20. It is a shape. However, there is no particular limitation on the geometry of the groove 30 except for the case where the shape of the groove 30 follows the outline of the high heat generating circuit device 20.

In the method of coupling the heat sink 17 and the high heat generating circuit element 20, first, a method of press-fitting the high heat generating circuit element 20 to the heat sink 17, and a second method of attaching the heat sink 17 using a heat conductive adhesive, Third, there is a method of mounting using a fastener such as a set screw, and there is no particular limitation on the fastening method.

Even if the groove 30 is precisely processed along the outer shape of the high heat generating circuit device 20, a gap may occur between the outer surface of the high heat generating circuit device 20 and the inner surface of the groove 30.

FIG. 5 is a cross-sectional view illustrating a state in which a heat sink provided in a plasma display device according to a second embodiment of the present invention is mounted on a high heat generating element.

As shown, a heat dissipation member 50 is provided between the high heat generating circuit element 20 and the inner surface of the groove 30 of the heat sink 17. The heat dissipating material 50 may be acryl-based, graphite-based, metal-based, or carbon nanotube-based, depending on the material used. In particular, acrylic is a kind of plastic, a kind of adhesive, a material used throughout the industry.

In the present embodiment, the use of the acrylic heat-dissipating material 50 will be described as an embodiment. Examples include thermal grease, silicone oil, and the like. The thermal grease or silicone oil heat dissipating agent 50 of liquid or gel has a property that does not flow down when applied to the high heat generating circuit element or the heat sink 17, and thus the work is easy, and the groove 30 and the high heat generating are excellent. The gap (gap) is easily filled between the circuit elements 20 to maximize the heat conduction efficiency.

In FIG. 5, the shape of the heat dissipation member 50 is shown in a plate shape, but it is solidified between the high heat generating circuit device 20 and the heat sink 17 and attached to each other.

6 is a cross-sectional view illustrating a state in which a heat sink provided in a plasma display device according to a third embodiment of the present invention is mounted on a high heat generating element.

As illustrated, the groove 30 is formed in the heat sink 17, and the inclined portion 60 forms a free space 61 together with one side of the high heat generating circuit device 20. Due to the free space 61, the heat sink 17 can be easily coupled to or separated from the high heat generation circuit 20.

The bottom 30, the side surface, and the opening surface are formed in the groove 30 formed in the heat sink 17, and the inclined portion 60 is formed so that the opening surface is wider than the bottom surface.

After the gel heat dissipation material 50 is applied to the side surface of the groove 30 or the outer surface of the high heat generating circuit element 20, and the high heat generating circuit element 20 is inserted into the groove 30, the heat dissipating material of the gel state is formed. 50 fills the gap between the groove 30 and the high heat generating circuit element 20 and moves to the free space 61.

7 is a cross-sectional view illustrating a state in which a heat sink provided in a plasma display device according to a fourth embodiment of the present invention is mounted on a high heat generating element, and FIG. 8 is provided in a plasma display device according to a fourth embodiment of the present invention. It is a perspective view which shows the heat sink.

As shown, the heat sink 17 has a groove 30 formed therein and is open in the second direction Y from the inside of the groove 30, and the heat sink 17 and the high heat generating circuit element ( The heat dissipation material 50 is interposed between 20).

Heat generated in the high heat generating circuit device 20 is transmitted to the first direction X and the second direction Y through the heat dissipation material 50 and is released into the air.

Since the part of the groove 20 is open, the high heat generating circuit 20 and the heat sink 17 can be easily coupled or separated. In addition, there is an advantage that one heat sink 17 can be applied to the high heat generating circuit device 20 having different sizes.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, a portion of the high heat generating circuit element is inserted into a groove formed in the heat sink, thereby increasing the contact area between the heat sink and the high heat generating circuit element. Therefore, the heat sink has an effect of more effectively dissipating heat generated from the high heat generating circuit device.

In addition, an inclined portion is formed in the groove formed in the heat sink so that the heat sink is easily mounted on the high heat generating circuit element.

In addition, one side of the groove formed in the heat sink is opened so that the heat sink is easily mounted on the high heat generating circuit element.

Claims (10)

A plasma display panel in which an image is implemented; A chassis base to which the plasma display panel is attached and supporting the plasma display panel; A circuit board assembly mounted on the chassis base and electrically connected to and driving the plasma display panel; A high heat generation circuit device provided in the circuit board assembly; And A heat sink in contact with the high heat generating circuit element and having a groove accommodating at least a portion of the high heat generating circuit element on one side facing the high heat generating circuit element Including, And an inclined portion is formed on a side surface of the groove formed in the heat sink. According to claim 1, The shape of the groove formed in the heat sink is matched to the shape of the high heat generating circuit element. delete According to claim 1, The side surface of the groove formed in the heat sink has an inclined portion so that the opening surface is wider than the bottom surface, and when the high heat generating circuit element is inserted, a plasma is formed between the side of the high heat generating circuit element and the inclined portion of the groove. Display device. According to claim 1, And the high heat generating circuit device is inserted into the groove formed in the heat sink, and a heat dissipation material is further interposed between the groove and the high heat generating circuit device. The method of claim 5, The heat dissipating material is a plasma display device that is a gel material that fills a gap between a bottom surface and a side surface of the high heat generating circuit device and the groove. The method of claim 5, The heat dissipating material is a plasma display device made of any one or more materials selected from the group consisting of acrylic, graphite, metal or carbon nanotube materials. According to claim 1, The groove formed in the heat sink is a plasma display device having one side open. According to claim 1, The high heat generating circuit element is a switching element plasma display device. According to claim 1, The high heat generation circuit device is an integrated circuit mounted on the logic board plasma display device.

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