KR100670525B1 - Plasma Display Device - Google Patents

Abstract

The present invention relates to a plasma display device, and more particularly, cooling by installing a heat sink having at least one heat dissipation fin in thermal contact with upper and lower sides of a driving chip installed on a signal line connecting an electrode of a plasma display panel and a driving circuit. The present invention relates to a plasma display device that maximizes performance.

Plasma Display Panel, Cover Plate, Driving Chip, Heat Sink

Description

Plasma Display Device

1 and 2 are partial cross-sectional views showing the installation state of the driving chip in the plasma display device according to the prior art.

3 is an exploded perspective view illustrating main components of a plasma display device according to an exemplary embodiment of the present invention.

4 is a partial sectional view showing an installation state of a driving chip according to an embodiment of the present invention.

Figure 5 is a partial cross-sectional view showing an installation state of a driving chip according to another embodiment of the present invention.

<Description of the code | symbol by the principal part of drawing>

10; Plasma display panel 30; Chassis base

40; Circuit board 50; TCP

51; Driving chips 61,62; Cover plate

71,72; Heat sink 82,84; Solid state thermal conductor

92,94; Liquid phase thermal conductor

The present invention relates to a plasma display device, and more particularly, cooling by installing a heat sink having at least one heat dissipation fin in thermal contact with upper and lower sides of a driving chip installed at a signal line connecting an electrode and a driving circuit of the plasma display panel. The present invention relates to a plasma display device that maximizes performance.

In general, a plasma display device is used in combination with a plasma display panel (PDP) formed by forming electrodes on two opposite substrates, overlapping each other at a predetermined interval, injecting a discharge gas therein, and sealing the same. It refers to a flat panel display device using).

Plasma display devices can be formed thinner than Cathode ray tube (CRT) display devices, which occupy a large volume, and thus are suitable for realizing a large screen with a relatively small volume. In addition, the plasma display device does not need to form an active element such as a transistor, compared to other flat panel display devices such as LCD, has a wide viewing angle and high brightness.

The plasma display apparatus is formed by forming a plasma display panel and installing elements necessary for screen realization such as a driving circuit connected to each electrode of the panel.

In a plasma display panel, each pixel is represented through discharge in that pixel region. The discharge is generated in the pixel space by the voltage applied to the electrode, and generates atoms in the plasma or excited state in the space. The power required to discharge is eventually lost to light, but most of it is converted to heat in the panel. Materials such as phosphors for forming panels become a problem because they are prone to deterioration and denaturation and shorten their lifespan at high temperatures. In addition, overheating in the panel, in particular partial overheating, may cause thermal expansion deformation and subsequent stress of the glass plate, which is the substrate of the panel, and may cause breakage.

On the other hand, the driving circuit connected to the electrodes of the plasma display panel consumes a lot of power to implement the screen. The consumption of power eventually means heat generation, and when the driving circuit is overheated, it is likely to malfunction in the circuit operation. Such a malfunction may cause a problem of degrading the screen quality, for example, by causing a discharge to occur even in a pixel portion which should not be discharged. Therefore, in the plasma display device, a problem of effectively dissipating heat generated from a driving circuit in which heat is concentrated becomes an important technical problem. In particular, when heat generation is concentrated, such as a driving chip of a tape carrier package (TCP), heat dissipation of a part that is difficult to cool becomes a problem unless heat contact with a heat sink is performed separately.

In general, in the plasma display device, a chassis attached to the rear surface of a panel is generally used to dissipate heat from a heat generating part such as a panel and a driving circuit to the outside. The chassis is typically made by coupling the reinforcement to the plate-shaped chassis base. The chassis base may be integrally formed with a reinforcement part for reinforcement. In the rear of the chassis, circuits for driving the panel are distributed on a plurality of substrates and mounted together with a power supply.

The chassis base supports the panel to reinforce the mechanical strength, and also receives heat from the panel or driving circuit in contact with the chassis and releases heat into the space while increasing the heat dissipation area. It also serves to evenly distribute partially concentrated heat. For this role, the chassis base is formed of a metal such as aluminum having excellent thermal conductivity.

On the other hand, when a heating element such as a panel or a driving circuit is directly contacted with a chassis which is a kind of heat sink, for example, when the back side of the panel and the chassis base are directly contacted, Therefore, the plane may be uneven. In addition, the panel also partially heat deformation while displaying the screen, so that the chassis base and the rear surface of the panel do not come into contact with each other to form a gap. If double-sided tape is used to join the panel and chassis base, the tape may create a gap between the panel and the chassis base.

In heat dissipation, the presence of the air layer usually lowers the heat dissipation efficiency. Therefore, a thermal conductive medium is often used between the panel and the chassis base. The heat conducting medium plays a role of thermally contacting the two parts while mediating heat transfer between the heating elements. In addition, the heat conducting medium also prevents a state in which the temperature is generated by uniformly conducting heat by avoiding a state in which the panel is locally heated. In addition, when a thermally conductive medium having a buffering force is used, it may also play a role of alleviating external shock and absorbing stress caused by thermal deformation of the panel and chassis base.

By the way, cooling of the driving chip is particularly a problem in the case of TCP, COF, etc. in which the signal electrode connected to the pixel of the plasma display device panel and the driving circuit for driving these electrodes are embedded while the driving chip is embedded in the path.

To describe this problem in more detail below, in the TCP or COF, the driving chip is not installed on a separate circuit board unlike other driving circuit elements, and is located in the middle of the signal line connecting the driving circuit unit and the electrode of the panel, such as a signal line. It is located in space. However, the driving chip installed in TCP or COF generates a lot of heat, and direct heat radiation into the air is not efficient. Therefore, these drive chips are installed to release heat while contacting the bent peripheral end or cover plate of the chassis base.

1 and 2 are partial cross-sectional views of a plasma display device which briefly show a heat dissipation structure of these conventional drive chips.

In FIG. 1, the driving chip 5a of the TCP 5 is attached to the cover plate 6 through the heat conducting medium 7 and 8 to the reinforcing material 4 of the chassis 3, and thermal contact is made. In FIG. 2, the driving chip 5a of the TCP 5 is inserted between the bent peripheral end 3a of the chassis base 3 and the cover plate 6, and thermal conduction is carried out through the heat conducting medium 7 and 8. The state in which it is made is shown. Reference numeral 1 denotes a plasma display panel, and 1a and 1b denote front and rear substrates of the panel.

However, simply contacting the driving chip with the chassis or chassis accessory or simply interposing the thermal conductive medium may not sufficiently cool the driving chip of the TCP which emits a large amount of heat, which may cause the driving chip to malfunction and shorten the life. .

In addition, there is a technical trend that the structure of the plasma display apparatus is converted from the dual method of drawing the address electrodes on the upper and lower sides of the plasma display device to the single method of drawing the electrodes only on the lower or upper sides of the panel. In this trend, more heat is generated in the TCP driving chip connecting the address electrode to the driving circuit.

In addition, while increasing the brightness of the plasma display device is also achieved by increasing the efficiency of the display device, an increase in brightness and an increase in area usually result in an increase in power. Much of the power is eventually released to the outside as heat in the plasma display device. Therefore, the heat generation amount of the driving chip is increased in the high-brightness large-area product compared to the low-brightness small-area product is a technical key to improve the cooling efficiency for this.

The object of the present invention devised in view of such a problem is that the cooling of the driving chip is difficult to sufficiently achieve in the plasma display device using TCP, COF, etc. in which the driving chip is installed on the signal line connecting the electrodes of the panel and the driving circuit. It is an object of the present invention to provide a plasma display device having a heat dissipation structure capable of improving the cooling efficiency of a driving chip in TCP, COF, and the like.

Plasma display device according to the present invention for achieving the above object is a chassis is attached to the rear of the plasma display panel, the drive circuit is installed behind the chassis, the drive circuit and the electrode terminal provided in the peripheral portion of the panel is driven In a plasma display device connected to a signal line having a chip, a plurality of heat sinks having at least one heat sink fin formed on one side thereof may be provided on upper and lower surfaces of the driving chip.

At this time, the heat dissipation plate installed on the driving chip is installed in the reinforcement is installed in contact with the upper and lower surfaces of the driving chip, between the driving chip and the reinforcing material is interposed a solid plate-type heat conducting medium for dissipating heat generated from the driving chip. Alternatively, a flowable heat conducting medium is provided between the driving chip and the plate-shaped heat conducting medium to efficiently transfer heat generated from the driving chip to the heat sink through the reinforcing material.

The reinforcing material is preferably an upper and lower cover plate formed of a straight plate-like plate, and the upper and lower cover plates are coupled to each other by a screw fastening method.

The heat sink is preferably formed of an aluminum material, and in this case, the heat radiation fin of the heat sink is to be installed to match the convection direction of the air.

The chassis base of the chassis of the present invention may be formed of aluminum used as a conventional material, and when the material of the chassis base is formed of steel or plastic having a lower thermal conductivity than aluminum, the concept of the present invention is more appropriately applied. It can be a way to.

Hereinafter, preferred embodiments of the present invention as described above will be described in more detail with reference to the accompanying drawings.

3 is an exploded perspective view of an embodiment of a plasma display device according to the present invention. As shown in FIG. 3, the plasma display apparatus according to an exemplary embodiment of the present invention supports a plasma display panel 10 including two substrates 11 and 12 and a panel behind the panel 10. And a circuit board 40 mounted on the chassis base 30 and the rear surface of the chassis base 30 and provided with a driving circuit.

On the front substrate 11 of the plasma display panel 10, sustain electrodes having straight lines parallel to each other are formed horizontally, and address electrodes having straight lines parallel to each other are formed on the rear substrate 12. The partition wall is positioned in parallel with the address electrode, and a phosphor layer is disposed above the address electrode.

In addition, a chassis is installed behind the rear substrate 12. The chassis is composed of a plate-shaped chassis base 30, the chassis base 30 is fixed to the rear surface of the rear substrate 12 by a double-sided tape 21 or the like, between the chassis base 30 and the rear substrate 12 The thermal conductive medium 20 is interposed with the double-sided tape 21.

In addition, a plurality of circuit boards 40 and a power supply device are installed at the rear of the chassis base 30, and the circuit board 40 is provided with integrated circuit chips and other electric and electronic element devices necessary for driving the panel. 40 may be coupled to the chassis base 30 via a boss or the like.

In addition, both ends of the signal lines such as TCP 50 are connected to the circuit board 40 coupled to the chassis and the rear substrate 12 constituting the panel. To prevent damage to the signal lines, cover plates are provided at the end of the panel to protect the signal lines from the outside.

Here, the cover plate according to the embodiment of the present invention is provided with an upper cover plate 61 formed in a plate shape on the upper side of the TCP (50), the plate-shaped lower cover plate 62 is provided below the TCP (50). .

Here, a plurality of heat sinks 71 and 72 are installed on the upper surface of the upper cover plate 61 and the lower surface of the lower cover plate 62, respectively. At this time, the heat sinks 71 and 72 are installed on the outer surface of the upper and lower cover plates 61 and 62 so as to correspond to the positions where the driving chip 51 of the TCP 50 connecting the panel board and the circuit board is installed. do. That is, the upper heat sink 71 is installed so that the heat dissipation fins face upwards, and the lower heat sink 72 is installed so that the heat dissipation fins face downwards.

The upper and lower cover plates 61 and 62 are coupled to each other by a method of fastening the screws 63.

In addition, as shown in FIG. 4, in order to assist the heat dissipation of the driving chip 51 of the TCP 50, the surface of the driving chip 51 and the upper and lower cover plates 42 and 44 abut on a solid surface. Each of the plate heat conductive media 82 and 84 is interposed. The solid-state thermal conductors 82 and 84 are made of one of an acrylic resin including a metal plate, a carbon sheet, and a filler.

The heat radiation action of the TCP driving chip in the plasma display device according to the present invention configured as described above will be described.

The signal processing driving chip 51 of the TCP 50 emits a lot of heat in accordance with the operation. Therefore, the upper and lower surfaces of the TCP driving chip 51 are thermally contacted with the upper and lower cover plates 61 and 62 through the solid plate-shaped heat conducting media 82 and 84, respectively, so that the heat generated is discharged to the outside. do.

In addition, the upper and lower cover plates 61 and 62 are respectively provided with heat sinks 71 and 72 in surface contact with each other, so that heat generated from the driving chip 51 of the TCP 50 is transferred to the upper cover plate 61. Heat is released upward by the heat dissipation action of the plurality of heat dissipation plates 71, and at the same time, the heat is smoothly discharged into the air by the heat dissipation action of the heat dissipation plates 72 installed on the lower cover plate 62. .

In addition, the plurality of heat dissipation fins formed on one side of the heat dissipation plates 71 and 72 are installed in a state in which the heat dissipation plates 71 and 72 are in surface contact with the surfaces of the cover plates 61 and 62 so as to match the convection direction of air. As a result, the contact with air is smooth and the cooling performance is improved.

5 is a cross-sectional view showing another embodiment of the present invention. As shown in FIG. 5, a driving chip 51 is interposed between upper and lower cover plates 61 and 62, and the driving chip ( Between the 51 and the upper and lower cover plates 61 and 62, the plate-shaped heat conduction medium 82 and 84 and the driving chip 51 of the solid-state plate heat conduction medium 82 and 84 are interposed therebetween. In between, liquid thermal grease (92,94) is further processed. The liquid phase thermal conductive medium may be replaced with a gel type thermal conductive medium or a rubber sheet.

In addition, in another embodiment of the present invention, the length of the lower heat sink 72 ′ installed on the lower cover plate 62 is further extended toward the circuit board 40.

Another embodiment of the present invention having such a configuration is a gel type because the driving chip 51 of TCP is in contact with the upper and lower cover plates (61, 62) through the liquid gel-type heat conducting medium (92, 94) The effect is due to the characteristics of the thermal conductive medium.

That is, since the gel type thermal conductive medium has a lot of fluidity and may have a partly different thickness between the two rigid bodies, the contact surfaces of the solid plate thermal conductive members 82 and 84 and the driving chip 51 are somewhat nonuniform and partially contact the contact surfaces. In the case where the gap is formed, thermal conduction is made through the entire contact surface in a state of preventing the gap by the gel type thermal conductive media 92 and 94. Therefore, the gel thermal conductors 92 and 94 substantially increase the heat conduction area between the plate thermal conductors 82 and 84 and the driving chip 51 and increase the heat dissipation efficiency.

Thus, one embodiment of the present invention and another embodiment of the chassis base 30 constituting the chassis is a material formed of a steel or plastic material, as well as the case of using a good thermal conductivity material, such as aluminum, etc. In the case where the thermal conductivity is not good, such as the base, particularly, the heat generated from the driving chip is smoothly discharged to increase the cooling performance.

As described above, the present invention is not limited to the above-described embodiments, and any person having ordinary skill in the art to which the present invention pertains may have various modifications without departing from the gist of the present invention as claimed in the claims. Of course, such changes are within the scope of the claims.

As described above, the present invention significantly improves the cooling efficiency of TCP and COF in which the driving chip is installed on the signal line connecting the electrodes and the driving circuit of the plasma display device, thereby preventing an operation error of the driving chip and driving the same. There is an effect of extending the life of the chip.

Accordingly, the present invention effectively increases the size of the panel and effectively provides a driving chip provided in a signal line connecting the electrode of the panel and the driving circuit in the technical trend of the plasma display apparatus adopting the single type scanning method. It will be said to be an invention suitable for cooling.

Claims (11)

In a plasma display device having a chassis attached to the rear of the plasma display panel, a driving circuit is provided behind the chassis, and the driving circuit and the panel are connected by a signal line having a driving chip. And a heat dissipation plate having at least one heat dissipation fin formed on one side thereof so as to be in thermal contact with upper and lower surfaces of the driving chip. The method of claim 1, Cover plates are provided on the upper and lower surfaces of the driving chip, and the heat dissipation plate is installed on the cover plate. The method of claim 2, And a solid plate-shaped heat conducting medium for dissipating heat generated by the driving chip between the driving chip and the cover plate. The method of claim 3, wherein The solid-state heat conducting medium is a plasma display device, characterized in that made of one of an acrylic resin comprising a metal plate, a carbon sheet, a filler. The method of claim 3, wherein And a flowable thermal conductive medium is further provided between the driving chip and the plate-shaped thermal conductive medium. The method of claim 5, The flowable thermal conductive medium is one of a thermal grease, a gel type thermal conductive medium, and a rubber sheet. The method of claim 2, And the cover plate is formed of a straight plate-shaped plate. The method of claim 7, wherein The upper and lower cover plates are coupled to each other by a screw fastening method. The method of claim 1, And the heat sink is formed of aluminum. The method of claim 1, And the heat dissipation plate is installed such that the heat dissipation fins coincide with the convection direction of air. The method of claim 1, And the chassis base of the chassis is formed of one of steel or plastic.

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