KR100646565B1 - Plasma display device - Google Patents

Abstract

A plasma display apparatus is provided to reduce weight, a manufacturing cost, and vibration noise by forming a chassis base with a plastic material. A chassis base(40) is positioned at a backside of a panel(23) in order to support the panel. A printed circuit board(60) is positioned at a backside of the chassis base. A TCP(Tape Carrier Package)(70) is used for connecting electrically the panel with the printed circuit board. A driving chip is formed on the TCP. A metal plate(100) is attached on a front surface of the chassis base in order to cover a lower end of the chassis base and to be extended to a lower part of the driving chip. A boss(50) is positioned at the backside of the chassis base in order to couple the chassis base with the printed circuit board.

Description

Plasma display device

1 is an exploded perspective view of a plasma display device according to an exemplary embodiment of the present invention.

2A is a partial cross-sectional view of a plasma display device according to an embodiment of the present invention.

2B is a partial cross-sectional view of a plasma display device according to another embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

10-Rear Panel 20-Front Panel

23-Panel 30-Double Sided Tape

40, 40 '-Chassis Base 50-Boss

60-Circuit Board 70-TCP

80-Drive Chip 100-Metal Plate

110-protective plate 120-heat sink

150-thermally conductive medium

The present invention relates to a plasma display device, and more particularly, a metal thin plate provided in front of a plastic chassis base to secure a ground of a circuit board, and the metal foil plate is a driving chip mounted on TCP while surrounding the lower end of the plastic chassis base. The present invention relates to a plasma display device capable of radiating heat from a driving chip.

A plasma display device is a flat panel display device using a plasma display panel (PDP), in which electrodes are formed on two opposing substrates, overlapped to have a predetermined interval, and then injected into a discharge gas. Say.

Plasma displays can be made thinner than Cathode Ray Tube (CRT) displays, which occupy a large volume, and thus are suitable for realizing a large screen with a relatively small volume. In addition, the plasma display device does not need to form an active element such as a transistor as compared to other flat panel display devices such as LCDs, and has a general characteristic of wide viewing angle and high luminance.

The plasma display apparatus is formed by forming a plasma display panel and installing elements necessary for screen realization such as a driving circuit connected to each electrode of the panel. In a plasma display panel, each pixel is represented through discharge in that pixel region. The discharge is generated in the pixel space by the voltage applied to the electrode, and generates atoms in the plasma or excited state in the space. The power consumed by the discharge eventually ends up in light, but most of it is converted to heat in the panel. Materials such as phosphors for forming panels become a problem because they are prone to deterioration and denaturation and shorten their lifespan at high temperatures. In addition, overheating in the panel, in particular, partial overheating, may cause thermal expansion deformation of the glass plate, which is the substrate of the panel, and thus stress, thereby causing breakage.

On the other hand, a driving circuit connected to the electrodes of the panel consumes a lot of power to implement the screen. The consumption of power eventually means heat generation, and if the driving circuit is overheated, it is likely to malfunction in the circuit operation. Such a malfunction may cause a problem that the quality of the screen is degraded, for example, to cause the discharge to occur even in the pixel portion that should not be discharged. Therefore, an important technical problem is how to effectively release heat generated from a driving circuit in which heat is concentrated in a plasma display device. In particular, when heat generation is concentrated, such as a driving chip portion of a tape carrier package (TCP), heat dissipation of a portion that is difficult to cool becomes a problem unless the heat sink is separately contacted with the heat sink.

In general, in the plasma display device, a chassis attached to the rear surface of a panel is generally used to dissipate heat from a heat generating part such as a panel and a driving circuit to the outside. The chassis is typically made by coupling the reinforcement to the plate-shaped chassis base. The chassis base may be integrally formed with a reinforcement part for reinforcement. The reinforcing material supplements the mechanical strength of the chassis base to prevent deformation of the chassis base due to external force, and also prevents warpage of the chassis base when the panel is deformed by heat, thereby preventing panel deformation. In the rear of the chassis, circuits for driving the panel are distributed on a plurality of substrates and mounted together with a power supply. The circuit board is normally installed in a state where there is no problem in the air flow spaced apart from the chassis base through a boss formed in the chassis base.

The chassis base supports the panel to reinforce mechanical strength, and also receives heat from the panel or driving circuit in contact with the chassis and releases heat into the space while increasing the heat dissipation area. It also serves to evenly distribute partially concentrated heat. To this end, the chassis base is formed of a metal such as aluminum (Al) having excellent thermal conductivity. On the other hand, when combining a heating element such as a panel or a driving circuit with the chassis, which is a kind of heat sink, it is common to increase heat dissipation efficiency by interposing a heat conductive medium between the chassis and the heating element.

Recently, due to the development of circuit and panel design, as the module becomes low power consumption, electromagnetic interference (EMI) and heat generation are decreasing, and there is an effort to replace expensive aluminum chassis with low cost materials. Among these, there is a method of molding the chassis base material into plastic. This has the advantage that it can be molded simply by reducing the weight of the module, reducing the noise and injection in addition to reducing the material cost. However, when the plastic chassis base is used, the grounding of the circuit boards and the heat dissipation of the driving chip are problematic.

The present invention is to solve the above problems of the plastic chassis base, provided with a metal plate in front of the plastic chassis base to secure the ground of the circuit board, the metal plate is mounted on the TCP while wrapping the lower end of the plastic chassis base It is an object of the present invention to provide a plasma display device that can be formed while extending to the lower portion of the driven chip.

According to an aspect of the present invention, there is provided a plasma display device including a panel, a chassis base of a plastic material positioned at a rear of the panel to support the panel, a circuit board positioned at the rear of the chassis base, the panel and the circuit board. It is electrically connected to the TCP, the drive chip is formed, it is attached to the front of the chassis base, characterized in that it comprises a metal plate extending to the lower portion of the drive chip while surrounding the lower end of the chassis base. In this case, the boss positioned on the rear surface of the chassis base to connect the chassis base and the circuit board may be formed to be electrically connected to the metal plate, and the boss may be made of aluminum (Al) or iron (Fe). This is suitable.

In addition, the panel and the metal plate may be formed spaced apart at regular intervals, the panel and the metal plate may be attached with a double-sided tape. In addition, a heat sink may be further provided on the protection plate formed on the TCP to protect the TCP.

In addition, a thermal conductive medium may be further provided between the metal plate and the TCP, and the metal plate may be formed to a thickness of 0.05 mm to 0.2 mm.

In addition, the metal plate may be formed of aluminum (Al) or copper (Cu), and the plastic may be a polyester resin or a polycarbonate resin. In addition, the chassis base may be formed by an injection molding method, the chassis base may be formed by integrally coupling with the boss by an injection molding method.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a plasma display device according to an exemplary embodiment of the present invention. 2A is a partial cross-sectional view of a plasma display device according to an embodiment of the present invention, and FIG. 2B is a partial cross-sectional view of a plasma display device according to another embodiment of the present invention.

1 to 2B, the plasma display device according to the exemplary embodiment of the present invention is located at the rear of the panel 23 and the panel 23, and the chassis base 40 made of a plastic material supporting the panel 23. ), The boss 50 positioned on the rear surface of the chassis base 40, the circuit board 60 positioned on the boss 50, the panel 23, and the circuit board 60. TCP 70, which is electrically connected and has a driving chip 80, a protection plate 110 formed on the TCP 70 to protect the TCP 70, and the chassis base 40. The metal plate 100 is formed to be attached to the front surface of the chassis base 40 and extends to the lower portion of the driving chip 80 while surrounding the lower end of the chassis base 40.

The panel 23 is formed in a shape in which the rear panel 10 and the front panel 20 face each other. A plurality of lead electrodes are formed around the panel 23. The lead electrode is formed outside the sealing part along the periphery of the panel to connect a plurality of electrodes such as an address electrode and a sustain electrode formed over the entire surface of two substrates constituting the panel with the driving circuit.

The rear panel 10 may be formed of a material such as glass having a predetermined thickness to form a panel together with a front substrate, an address electrode, a partition wall partitioning discharge cells to form a discharge space, and a phosphor layer. Is formed.

The front panel 20 is formed of a transparent material such as soda glass to form a panel together with a rear substrate, scan electrodes and sustain electrodes, a dielectric layer for protecting the scan electrodes and sustain electrodes, It is formed of a protective film layer for protecting the dielectric layer. However, the partition wall is not necessarily formed in the rear panel, it may be formed in the front panel and thus does not limit the position of the partition wall.

The chassis base 40 is located behind the panel 23 to prevent the panel 23 from warping or deforming. Typically, the chassis base is manufactured by rolling or casting a metal material such as aluminum (Al) or iron (Fe). However, the metal chassis has a disadvantage in that the weight is large, the material cost is high, and the noise due to vibration is large. The chassis base 40 in the present invention is formed of a plastic material. Accordingly, the weight of the entire product can be reduced, and the material cost is relatively low compared to materials such as aluminum.

The plastic used as the material of the chassis base 40 is preferably formed of a polyester resin or a polycarbonate resin. Polyester resins are commonly referred to as fiber reinforced plastics (FRP) because they are generally reinforced with glass fibers. Recent advances in molding can produce FRP with the same strength as steel. Polycarbonate resin is an engineering plastic that is transparent, has excellent mechanical properties and heat resistance, and is nontoxic and self-extinguishing.

The polyester resin and the polycarbonate resin are thermosetting resins, and it is preferable to use a thermosetting resin having excellent heat resistance to withstand heat generated from a panel or a driving circuit, and having excellent mechanical properties to support the panel. However, the type of plastic is not limited here.

The chassis base 40 may be formed by injection molding. Injection molding is a method in which a mold is manufactured in the shape of a desired chassis base, and the molten plastic is injected into the mold from the outside to be cooled. Therefore, manufacturing speed is fast and it can manufacture at comparatively low cost.

In addition, the rear surface of the chassis base 40, referring to Figure 2a, a reinforcing portion 47 may be formed. The reinforcement part 47 may be separately attached to the chassis base 40, and preferably, may be injection molded integrally with the chassis base 40. The reinforcement part 47 supports the chassis base 40 to prevent deformation of the chassis base 40, and also allows the driving chip 80 to be positioned on an upper surface of the reinforcement part 47 so that the metal plate 100 is located. And the protection plate 120, the heat sink 120, and the driving chip 80 contact each other to provide a structure for heat dissipation of the driving chip 80.

Meanwhile, referring to FIG. 2B, the end 45 of the chassis base is bent to be parallel to the panel 23 without forming the reinforcement 47 in the chassis base 40 ′, and thus the end 45 of the chassis base is formed. The metal plate 100 and the driving chip 80 and the protective plate 120 may be formed in contact with each other.

The boss 50 is formed on the rear surface of the chassis base 40 to couple the chassis base 40 and the circuit board 60 to each other, thereby fixing the circuit board 60 to the chassis base 40. It plays a role. Although the circuit board may be directly in contact with the rear surface of the chassis base and coupled, the heat generated from the circuit board may be difficult to escape. Therefore, the boss 50 may be spaced apart from the chassis base 40 by a predetermined distance so that heat can be convexed through the space between the boss 50 and the circuit board 60. The boss 50 is formed of a metal material such as aluminum (Al), iron (Fe), and is coupled to the rear surface of the chassis base 40. The boss 50 and the chassis base 40 may be coupled to each other by a screw screw method. Preferably, the boss 50 and the chassis base 40 may be integrally formed by injection molding. In this case, since the boss 50 must electrically connect the metal plate 100 and the circuit board 60 attached to the front surface of the chassis base 40, the boss 50 penetrates through the chassis base 40. One end of the boss 50 to the front should be formed to be exposed.

The circuit board 60 includes a power supply board, a sustain drive board, an X control board, a scan board, a scan buffer board, and the like. The power supply board is a part that supplies power to the driving circuit and the panel, and is equipped with an AC / DC converter that converts an external AC voltage into a DC voltage. The sustain drive board generates a sustain signal in synchronization with the signal of the timing controller and supplies the sustain signal to the sustain electrode. The X control board is equipped with an intelligent power module (IPM), a timing controller, and signal input terminals, and a circuit unit for processing data. The scan board generates and supplies a scan signal in synchronization with the signal of the timing controller. The scan buffer board arranges the data to be input to the scan electrodes. The driving circuit is mounted on the back of the chassis in a state of being installed on the circuit board 60 or the like and connected to an electrode formed on the panel 23 to drive them. The lead electrode and the drive circuit are connected by a tape carrier package (TCP) 70 or other signal lines to transfer electrical signals of the drive circuit to each lead electrode.

The TCP 70 may be referred to as a kind of signal line, and is a kind of band-shaped film (FPC) having flexibility in which conductive lines are formed. The driving circuit board 60 and the panel having both ends coupled to the chassis base 40 in a state in which the middle portion of the TCP 70 extends outwardly with the margins of the panel 23 and the chassis base 40. 23). Therefore, there is a risk that the extended middle portion may come into contact with or be damaged by other objects during the process of joining the panel 23 and the chassis base 40 or in the process of moving the assembly. In order to prevent such damage, the end of the panel 23 may be provided with protective plates 110 for protecting the TCP (70) from the outside.

The protective plates 110 are coupled to the end 45 of the chassis base 40, the reinforcement 47 around the end, and the like through screw fixing means. In addition, the heat sink 120 may be further attached to the protection plate 110. The driving chip 80 is located on the TCP 70. Since a lot of heat is generated in the driving chip 80, a separate heat sink 120 is provided in addition to the protection plate 110 to dissipate the driving chip 80. Can be attached further. In addition, a thermal conductive medium 150 may be inserted between the protective plate 110 and the driving chip 80 for effective thermal conductivity.

The metal plate 100 is attached to the front surface of the chassis base 40 and extends to the lower portion of the driving chip 80 while surrounding the lower end of the chassis base 40. The boss 50 and the metal plate 100 are formed to be electrically connected to each other with the chassis base 40 interposed therebetween. In the case of a metal chassis base, the chassis base itself may serve as a ground of the driving circuit. That is, since the circuit board 60, the boss 50, and the metal chassis base on which the driving circuit is mounted are electrically connected, the chassis base is also used for grounding purposes. However, in the case of the plastic chassis base, since the electrical conductivity is significantly low, the ground of the driving circuit is made through the metal plate 100 electrically connected to the boss 50.

The metal plate 100 and the panel 23 are preferably spaced apart at a predetermined interval. In the case of a chassis base made of metal, a double-sided tape is interposed between the panel and the chassis base to fix the panel to the chassis base. A heat conduction medium is provided between the panel and the chassis base to effectively transfer heat generated from the panel to the chassis base. Meanwhile, even in the case of a plastic chassis base, a double-sided tape 30 may be used to fix the panel 23 to the chassis base 40. In the present invention, since the metal plate 100 is attached to the front surface of the chassis base 40, the panel 23 is connected to the chassis base 40 via a double-sided tape 30 between the panel 23 and the metal plate 100. Will be fixed). At this time, unlike the case of the chassis base made of a metal material, it is preferable not to insert a heat conductive medium between the panel 23 and the metal plate 100. Because, in the case of the metal chassis base, heat generated from the panel is transferred to the chassis base along the heat conducting medium and radiated through the chassis base, but in the case of the plastic chassis base, heat is concentrated on the metal plate 100 along the heat conducting medium. Since such heat is not conducted to the plastic chassis base 40, heat dissipation may not be efficiently performed. Therefore, the panel 23 and the metal plate 100 are attached to the double-sided tape 30, but the metal plate 100 and the panel 23 can escape heat in the form of a chimney along the space where the double-sided tape 30 is not located. ) Are spaced apart at regular intervals.

The metal plate 100 extends from the lower portion of the chassis base 40 to the lower portion of the driving chip 80 through the lower portion of the TCP 70. Since the driving chip 80 generates a large amount of heat, heat dissipation is important. In addition to cooling the driving chip 80 through the heat dissipation plate 120 attached to the protective plate 110, the metal plate The heat dissipation efficiency of the driving chip 80 is improved by extending the bottom portion of the driving chip 80 so that the metal plate 100 and the driving chip 80 contact each other. In order to effectively transfer the heat generated from the driving chip 80 to the metal plate 100, the heat conducting medium 150 is inserted into a portion where the metal plate 100 and the driving chip 80 are in contact with each other. Graphite or silicon is used as the thermal conductive medium 150.

The metal plate 100 may be formed to a thickness of 0.05 ~ 0.2mm. For the ground of the driving circuit and the heat dissipation of the driving chip 80, the metal plate 100 does not have to be formed thick, and when the metal plate 100 is thick, weight increases. In addition, if the metal plate 100 is formed too thin, there is a fear that the contact portion with the end of the chassis base (40, 40 ') is broken. Therefore, it is sufficient that the metal plate 100 is provided with only the thickness which is not broken.

In addition, as the material of the metal plate 100, aluminum (Al), copper (Cu) or the like is suitable. Since the metal plate 100 must simultaneously perform the grounding role of the driving circuit and the heat dissipating role of the driving chip 80, the metal plate 100 may be formed of a metal material having excellent electrical conductivity and thermal conductivity, in particular, aluminum (Al) or copper (Cu). . However, the material of the metal plate 100 is not limited thereto, and any material may be used as long as the material has excellent electrical conductivity and thermal conductivity.

As described above, the present invention is not limited to the specific preferred embodiments described above, and any person having ordinary skill in the art to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Various modifications are possible, of course, and such changes are within the scope of the claims.

According to the plasma display device according to the present invention, the material of the chassis base is made of plastic, thereby reducing weight, lowering manufacturing cost, and reducing vibration noise. In addition, by attaching a thin metal plate on the front surface of the chassis base, as well as the grounding of the driving circuit, there is an effect that can perform effective heat dissipation of the driving chip.

Claims (12)

panel; A chassis base made of a plastic material positioned at a rear of the panel to support the panel; A circuit board located behind the chassis base; TCP which electrically connects the panel and the circuit board and has a driving chip; And a metal plate attached to the front surface of the chassis base and extending to a lower portion of the driving chip while surrounding a lower end of the chassis base. The method of claim 1, And a boss disposed at a rear surface of the chassis base to connect the chassis base and the circuit board to be electrically connected to the metal plate. The method of claim 2, And the boss is made of aluminum (Al) or iron (Fe). The method of claim 1, And the panel and the metal plate are spaced apart at regular intervals. The method of claim 1, And the panel and the metal plate are attached with double-sided tape. The method of claim 1, And a heat sink is formed on the protection plate formed on the TCP to protect the TCP. The method of claim 1, And a heat conducting medium between the metal plate and the TCP. The method of claim 1, The metal plate is plasma display device, characterized in that formed to a thickness of 0.05 ~ 0.2mm. The method of claim 1, And the metal plate is made of aluminum (Al) or copper (Cu). The method of claim 1, And said plastic is polyester resin or polycarbonate resin. The method of claim 1, And the chassis base is formed by injection molding. The method of claim 2, And the chassis base is integrally formed with the boss by an injection molding method.

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