KR100680060B1 - Plasma Display Panel - Google Patents

Abstract

The present invention relates to a plasma display panel having a heat sink attached directly to the panel and protecting the panel.

A plasma display panel according to an embodiment of the present invention includes a display panel including an upper substrate having an upper electrode, a lower substrate having a lower electrode, and a plurality of discharge cells formed between the upper substrate and the lower substrate, and side and front portions of the display panel. And a back frame including a flange surrounding the base portion and a base portion on which the flange extends and faces the rear surface of the display panel.

Description

Plasma Display Panel             

1 is a perspective view showing a conventional plasma display panel.

FIG. 2 is a cross-sectional view illustrating the plasma display panel shown in FIG. 1. FIG.

Figure 3 is a simplified view of a conventional PDP panel, heat dissipation sheet and heat sink.

Figure 3 is a simplified view of a conventional PDP panel, heat dissipation sheet and heat sink.

4 illustrates a PDP according to a first embodiment of the present invention.

5 illustrates the frame of FIG. 4 in more detail.

Figure 6 is a simplified view showing the cross section taken in FIG.

7 illustrates a PDP according to a second embodiment of the present invention.

8A is a perspective view of a frame according to a second embodiment of the present invention;

8B is a rear view of the second embodiment frame.

9 is a sectional view of the frame and the panel cut away.

10 is a view briefly showing the connection between the frame and the FPC as seen from the rear of the panel.

<Detailed Description of Symbols for Main Parts of Drawings>

2: data driver IC 3: scan driver IC

10, 42, 142: Panel 12: Pad

14, 53, 153: FPC 15: heat dissipation sheet

18, 48, 152: printed circuit board 20, 46, 146: frame

30, 40, 140: Case 47, 50, 148: Flange

49, 147: Base plate (base part) 59, 150: Back cover

51: uneven portion 55, 154: shock absorbing layer

160: hall

TECHNICAL FIELD The present invention relates to a plasma display panel, and more particularly, to a plasma display panel having a heat sink that is directly attached to the panel and which protects the panel.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. The flat panel display includes a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (hereinafter referred to as "PDP"), and elegro luminescence. (Electro-Luminescence: EL) display device.

Among them, PDP is a flat panel display device that displays images by using plasma discharge, and is used as a display device for high-definition television, monitor, and indoor / outdoor advertising because it has fast response speed and is suitable for displaying large-area images. .

1 is a perspective view illustrating a conventional plasma display panel, and FIG. 2 is a cross-sectional view illustrating the plasma display panel shown in FIG. 1.

1 and 2, a conventional PDP includes a panel 10, a printed circuit board (“PCB”) 18 for driving the panel 10, and a panel 10. The heat sink 20 is provided on the back of the.

The panel 10 includes an upper substrate 10a on which a plurality of scan electrodes are formed, a lower substrate 10b including a plurality of address electrodes formed in a direction crossing the scan electrodes and a phosphor layer formed on the front surface of the substrate. . The phosphor generates visible light by the discharge between the scan electrodes and the address electrodes, and adjusts the transmittance of the visible light to display a predetermined image.

The heat sink 20 supports the panel 10 and serves to dissipate heat generated when the panel 10 is driven. The heat sink 20 is formed of a metal material having a good thermal conductivity, for example, aluminum (Al) or the like so as to radiate heat well. The heat sink 20 has a plurality of holes, through which a screw, a bolt, etc. penetrates to fix the heat sink 20 to a back cover (not shown).

The panel 10 requires a plurality of driving integrated circuits (hereinafter referred to as “driver ICs”) connected to the scan electrodes and the address electrodes to supply data signals and scan signals, respectively. The driver ICs consist of a scan driver IC 3 and a data driver IC 2, each of which is installed between the PCB 18 and the panel 10 in response to a control signal supplied from the PCB 18. Supply a driving signal. To this end, the PCB 18 and the panel 10 are connected by a flexible printed circuit (FPC, 14). The data and scan driver ICs 2 and 3 are directly connected to the electrodes of the IC chip by the FPC 14, and a chip on film (COF) method in which an area including the connection part is sealed with a resin. It consists of packages. In this case, one side of the FPC 14 is connected to the IC chips 16 of the scan and data driver ICs 3 and 2, and is connected to the pads 12 connected to the drive electrodes of the panel 10 of the FPC 14. Connected. At this time, the FPC 14 is bent to reduce the effective mounting area of the driver ICs 2 and 3 so that the driver ICs 2 and 3 are installed on the rear side of the lower substrate 10b. Accordingly, the FPC 14 has a structure surrounding the lower substrate 10b of the panel 10 and the sides of the heat sink 20, and the terminals of the upper FPC 14 are connected to the pads 12 of the panel 10. In addition, the lower FPC 14 terminals are connected to the driver IC 2 on the rear surface of the heat sink 20. The FPCs 14 are each connected to the PCBs 18 by connectors 18.

The case (or cabinet) 30 is installed to protect the PDP from external impact when the PDP described above is shipped.

3 is a view briefly showing a conventional PDP panel, a heat radiation sheet and a heat sink.

Referring to FIG. 3, in the conventional PDP, a heat dissipation sheet 15 for transferring heat of the panel 10 is inserted between the heat dissipation plate 20 and the panel 10. The heat dissipation sheet 15 releases the heat of the panel 10 to the outside, or transfers the heat to the heat dissipation plate 20 to prevent the temperature of the panel 10 from rising rapidly.

In order to attach the heat dissipation sheet 15 to the panel 10 or the heat dissipation plate 20, an adhesive is thinly applied between the heat dissipation plate 20, the heat dissipation sheet 15, and the panel 10, or adhesive tape is used. The heat dissipation sheet 15 serves to transfer heat generated from the panel 10 to the heat dissipation plate 20, but due to the characteristics of the conventional heat dissipation sheet 15, the heat dissipation sheet (or frame) directly contacts the panel 10. Thermal conductivity is lower than that. Even if the heat conduction characteristics of the heat dissipation sheet 15 are good, a plurality of adhesive materials are added and the heat dissipation sheet 15 is added to include a process of fixing the heat dissipation sheet between the heat dissipation plate 20 and the panel 10. Process is included. Thus, the conventional manufacturing process of the plasma display panel has a disadvantage that the process is complicated by the addition of the heat radiation sheet (15). In addition, there is a problem that the manufacturing cost of a large plasma display panel increases, which increases the complexity of the process, and the thickness of the panel becomes thick.

Accordingly, it is an object of the present invention to provide a plasma display panel having a heat sink attached directly to the panel and protecting the panel.

In order to achieve the above object, a plasma display panel according to the present invention includes a display panel including an upper substrate on which an upper electrode is formed, a lower substrate on which a lower electrode is formed, and a plurality of discharge cells formed between the upper substrate and the lower substrate; And a back frame including a flange surrounding the side surface and a part of the front surface of the display panel, and a base portion on which the flange extends and faces the rear surface of the display panel.

The flange includes a first extension part extending in the front direction of the panel from the base part, and a second extension part extending in the rear direction of the panel so as to contact the front surface of the panel at one side of the first extension part.

A printed circuit board having circuits for driving and controlling the display panel; A flexible printed circuit (FPC) is further provided to electrically connect the printed circuit board and the electrodes of the display panel.

The flange is formed with an uneven portion through which the flexible printed circuit (FPC) passes.

At least one hole through which the flexible printed circuit passes is formed in the back frame.

Other objects and features of the present invention other than the above object will become apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 4 to 10.

4 is a diagram illustrating a PDP according to a first embodiment of the present invention.

Referring to FIG. 4, another PDP according to the present invention includes a case 40, a panel 42, a printed circuit board 48, a back cover 59, and a frame 46.

The frame (or heat sink, 46) releases heat from the panel 42 and the PCB 48 when driven, as well as supporting the panel 42 and securing the PCB 48. The temperature of 48 is prevented from rising rapidly. For this purpose, the frame 46 is made of a metal having good thermal conductivity, and aluminum (Al) is typically used. In addition, the frame 46 may be made of a plastic that is easy to be molded and processed as a material. In this case, it is preferable to use a conductive plastic having good thermal and electrical conductivity. Frame 46 of the present invention is located on the back of panel 42 to support panel 42 and secure PCB 48. The frame 46 has a first flange 47 surrounding the upper portion of the panel 42 and a second flange 50 surrounding the lower portion of the panel 42.

The panel 42 is formed of an upper substrate 42a on which a plurality of scan electrodes are formed, a lower substrate 42b including a plurality of address electrodes formed in a direction crossing the scan electrodes, and a phosphor layer formed on the front surface of the substrate. . The phosphor generates visible light by the discharge between the scan electrodes and the address electrodes, and adjusts the transmittance of the visible light to display a predetermined image. In addition, pads are connected to the electrodes of the IC chip by FPC. In addition, in order to be coupled to the frame 46 of the present invention, the panel 42 has a structure in which the lower substrate 42b extends up and down than the upper substrate 42a. That is, when the panel 42 is viewed from the front, the upper and lower widths of the substrate are the same for the upper substrate 42a and the lower substrate 42b, but the upper and lower widths of the lower substrate 42b are larger than the upper substrate 42a. . The extended portion of the lower substrate 42b extends to a length sufficient to abut the flanges 47 and 50 of the frame 46.

The case 40 is installed on the front surface of the panel 42 to surround the extension of the frame 46 to protect the panel 42 from external impact and contaminants, and is composed of a glass and a front filter. The front filter includes an optical characteristic film, an EMI (Electro Magnetic Interference: EMI) shielding film, an infrared shielding film, and the like. The glass protects the front filter from damage from external impact. The optical characteristic film improves the optical characteristics of the PDP by lowering the luminance of red (R) and green (G) and increasing the luminance of blue (B) among the light incident from the panel 42. The electromagnetic shielding film shields electromagnetic waves and prevents electromagnetic waves incident from the panel 42 from being emitted to the outside. The infrared shielding film shields the infrared rays emitted from the panel 42 to prevent the infrared rays above the reference from being emitted to the outside so that the signals transmitted using the infrared rays such as a remote controller can be normally transmitted.

The back cover 59 is fastened together with the case 40 at the rear of the PDP to protect the PDP from external shocks, contaminants, and the like.

The printed circuit board 48 (hereinafter referred to as "PCB") 48 is located at the back of the frame and is fixed by the frame 46. The PCB 48 supplies a drive signal and a control signal to the electrodes of the panel 42. To this end, the PCB 48 has various drives, and the PCB 48 and the panel 42 are connected by an FPC 53 (not shown). The panel 42 requires a driver IC connected to the scan electrodes and the address electrodes to supply data signals and scan signals, respectively. The driver ICs consist of a scan driver IC and a data driver IC, each of which is installed between the PCB 48 and the panel 42 to supply driving signals to the panel 42 in response to a control signal supplied from the PCB 48. do. The data and scan driver IC is constituted by a COF-type package in which the FPC 53 is directly connected to the electrodes of the IC chip and the area including the connection part is sealed with resin. In this case, one side of the FPC 53 is connected to the IC chip of the scan and data driver IC and to pads connected to the drive electrodes on the panel 42 side of the FPC. At this time, the FPC 53 is bent to reduce the effective mounting area of the driver IC so that the driver ICs are installed on the rear side of the lower substrate 42b. Accordingly, the FPC has a structure surrounding the lower substrate 42b of the panel 42 and the side surface of the frame 46, and the terminals of the upper FPC 53 are connected to the pads of the panel 42 and the lower FPC 53. ) Terminals are connected to the driver IC behind the frame 46. The FPCs 53 are each connected to the PCB 48 by connectors. The FPC 53 is connected to the pads of the panel 42 in the front direction of the panel 42 via the second flange 50 from the PCB 48 fixed to the rear surface of the frame 46.

5 is a view showing in detail the frame of Figure 4 showing the connection form of the FPC. 6 is a view schematically showing a cross section taken from FIG. 5.

5 and 6, the frame 46 contacts the rear surface of the panel 42 to support the panel (or base portion 49), and the first flange extending from one side of the substrate 49. 47, a second flange 50 extending from the other side of the mother plate 49 is provided.

The first flange 47 is in close contact with the front surface of the panel 42 at the end of the first extension portion and the first extension portion extending from the mother plate 49 in the front direction of the panel 42. The panel 42 and the frame 46 ) Is provided with a second extension part for fixing. The extension of the first flange 47 allows the panel 42 and the frame 46 to be fixed without a small amount of adhesive or adhesive by pressing the front edge of the panel 420 due to the bent portion formed by the first and second extension portions. In addition, a shock absorbing layer is formed between the first flange 47 and the substrates 42a and 42b of the panel 42 to prevent breakage of the substrates 42a and 42b due to external impact or the like.

The second flange 50 is the same as the first flange 47 in which a bent portion extending from the mother plate 49 to the front surface of the panel 42 is bent. That is, the first extension portion extending from the mother plate 49 is the same, but the second extension portion extending in the panel direction at the end of the first extension portion is the FPC for connecting the electrode pads of the panel 42 and the PCB 48. The uneven part 51 for providing the connection passage of 53 is formed. The uneven portion 51 is formed in the second extension portion 51 that is bent at the front surface of the panel 42. In other words, the second extension portion is not formed in the portion that becomes the passage of the FPC 53, and the portion that does not become the passage of the FPC 53 presses the front edge of the panel 42. As a result, a part of the substrates 42a and 42b are exposed to enable the connection by the FPC 53. In addition, similar to the first flange 47, the second flange 50 may have a shock absorbing layer.

7 is a diagram illustrating a PDP according to a second embodiment of the present invention.

Hereinafter, in describing the second embodiment of the present invention, a detailed description of the same configuration as in the first embodiment will be omitted.

Referring to FIG. 7, another PDP according to the present invention includes a case 140, a panel 142, a printed circuit board 152, a back cover 150, and a frame 146.

The frame (or heat sink, 146) supports the panel 142 and secures the PCB 152, and also releases heat from the panel 142 and the PCB 152 when driven, such that the panel 142 and the PCB ( The temperature of 152 is prevented from rising sharply. The frame 146 has a flange having a mother plate (or base) and first and second stretches.

8A is a perspective view of a frame according to a second embodiment of the present invention, and FIG. 8B is a rear view of the frame of the second embodiment. 9 is a cross-sectional view showing a cut section of the frame and the panel.

8 and 9, the frame 146 according to the present invention includes a base plate 147, a first extension part 148a, and a second extension part 148b.

The mother board 147 has a panel 142 on the front, the PCB 152 is fixed to the back. To this end, first extension portions 148a extending vertically from the mother plate in the direction of the panel 142 are formed at upper and lower edges of the mother plate 147. In addition, a plurality of holes 160 for passing the FPC 153 formed between the PCB 152 and the panel 142 are formed under the mother plate 147, that is, the lower side of the panel 142.

The first extension part 148a contacts the upper side surface of the lower substrate 142b at the upper and lower portions of the panel 142 to support the panel 142. The first extension part is divided into an upper first extension part 148a extending toward the upper part of the panel 142 and a lower first extension part 148b extending toward the lower part of the panel 142. The lower first stretched portion 148b formed on the lower side of the panel 142 among the first stretched portions 148a is not in contact with each other to form the FPC 153 connecting the panel 142 and the PCB 152. Spaced at predetermined intervals. In addition, the second extension part 148b is formed at the end of the first extension part 148a, that is, at the edge opposite to the mother plate 147.

The second extension part 148b contacts the edge of the upper substrate 142a at the upper and lower portions of the panel 142 to support the panel 142. To this end, the second extension part 148b extends in the direction of the upper substrate 142a at a predetermined angle at the end of the first extension part 148a. The upper substrate 142 is positioned at the end of the second extension portion 148b as shown in FIG. 5B. The reason why the second extension part 148b is formed as shown in FIG. 5B is that the second extension part 148b is in the direction of the mother plate 147 so as to bring the panel 142 and the frame 146 into close contact with each other. It is to force it. Here, the second extension portion 148b may be formed such that the 'c' shape and the first extension portion 48a extend at a predetermined angle, and the second extension portion is horizontal to the mother plate. However, in this case, since the portion covering the panel 142 is widened and the panel 142 is not sufficiently supported, it is preferable that the second extension part 148b is formed in the mother plate 147 direction as described above.

In addition, the case 140 is attached to the front portion of the second extension 148b to protect the frame 146 and the panel 142 as shown in FIG. 5B.

The first absorbing portion 148a and the second extending portion 148b and the panel 142 abut on the portion where the upper and lower substrates 142a and 142b are damaged to prevent shock absorbing and wear protection pads 154 such as nonwoven fabrics. ) Can be inserted.

10 is a view briefly showing the connection between the frame and the FPC viewed from the rear direction of the panel.

Referring to FIG. 10, the PCB 152 is fixed to the rear surface of the frame 154. The FPC 153 connecting the PCB 152 and the panel 142 is connected to the electrode pad of the panel 142 through the hole 160 formed in the rear surface of the frame 154.

 As described above, the heat sink according to the present invention is directly attached to the panel without the heat radiation sheet. In addition, the amount of the adhesive or adhesive tape for attaching the heat dissipation sheet and the panel, the heat dissipation sheet, and the heat dissipation plate may be significantly reduced. As a result, heat generated in the panel is directly transferred to the heat sink, so that the temperature rise of the panel can be more effectively suppressed and dissipated. In addition, the heat dissipation area is increased by the elongated portion formed in the frame, and the heat dissipation characteristics of the heat dissipation plate are better than before. In addition, since the heat dissipation sheet is removed, the overall thickness of the plasma display panel is thinner than when the heat dissipation sheet is used. In addition, since the process of attaching the heat dissipation sheet is omitted, the manufacturing cost of the plasma display panel may be lowered.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (5)

A display panel including an upper substrate on which an upper electrode is formed, a lower substrate on which a lower electrode is formed, and a plurality of discharge cells formed between the upper substrate and the lower substrate; A back frame having a flange surrounding a side surface of the display panel and a part of the front surface, and a base portion on which the flange extends and faces a rear surface of the display panel; A printed circuit board having circuits for driving and controlling the display panel; And And a flexible printed circuit (FPC) for electrically connecting the printed circuit board and the electrodes of the display panel. The method of claim 1, The flange, A first extension part extending from the base part in the front direction of the panel; And a second extension part extending from one side of the first extension part so as to be in contact with the front surface of the panel. The method of claim 2, The second extension portion, And extending in parallel with the front surface of the panel or inclined in the direction of the base portion. The method of claim 2, In the second extension portion, And a concave-convex portion through which the flexible printed circuit (FPC) passes. The method of claim 1, In the base portion, And at least one hole through which the flexible printed circuit passes.

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