KR100553932B1 - Plasma display panel - Google Patents

Abstract

The present invention relates to a plasma display panel that can improve the heat dissipation of the plasma display panel.

According to an embodiment of the present invention, a plasma display panel includes a panel, a printed circuit board supplying a driving signal for driving the panel, a heat sink to dissipate heat generated from the panel and the printed circuit board, and the printed circuit board. A heat sink installed in the plurality of grooves, a back cover fastened to the heat sink, a contact portion formed with grooves or holes formed in the back cover and corresponding to grooves formed in the heat sink, and the heat sink and the contact portion. It is characterized by including a shock absorber positioned between.

With this configuration, the plasma display panel according to the embodiments of the present invention transfers heat generated inside the plasma display panel to the back cover through a heat sink formed on the printed circuit board, and forms a hole in the back cover. Therefore, the heat sink may protrude outside the plasma display panel to improve heat dissipation efficiency.

 In addition, since a separate blower is not required to dissipate heat generated inside the plasma display panel, noise caused by the blower can be prevented and manufacturing cost can be reduced by removing additional devices.

Description

Plasma Display Panel {PLASMA DISPLAY PANEL}             

1 is a perspective view schematically showing the inside of a typical plasma display panel.

FIG. 2 is a schematic cross-sectional view of the plasma display panel of FIG. 1 taken along line AA ′. FIG.

3 is a perspective view schematically illustrating an interior of a plasma display panel according to a first embodiment of the present invention.

4 is a schematic cross-sectional view of the plasma display panel shown in FIG. 3 taken along line AA ′.

5 is a perspective view schematically illustrating an interior of a plasma display panel according to a second embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of the plasma display panel shown in FIG. 5 taken along line AA ′.

<Explanation of symbols for the main parts of the drawings>

1,100,200: plasma display panel 10,110,210: cabinet

20,120,220: Panel 30,130,230: Heat sink

35,135,235: Heat sink 40,140,240: Printed circuit board

50,150,250: Guard 60,160,260: Back cover

90,190,290: Screw 95,195,270: Hole

170: contact portion 180: shock absorber

The present invention relates to a plasma display panel, and more particularly, to a plasma display panel capable of improving heat dissipation of heat generated inside the plasma display panel.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include liquid crystal displays, field emission displays, electro luminescence, and plasma display panel displays.

Among them, the plasma display panel displays an image including characters or graphics by emitting phosphors by 147 nm ultraviolet rays generated when discharge of an inert mixed gas such as He + Xe, Ne + Xe or He + Ne + Xe. Such a plasma display panel is not only thin and large in size, but also has a fast response speed and is suitable for displaying a large-area image due to the recent development of many technologies. Therefore, the plasma display panel is used as a display device for high-definition television, monitor, and indoor / outdoor advertising.

FIG. 1 is a perspective view schematically showing the inside of a typical plasma display panel, and FIG. 2 is a schematic cross-sectional view of the plasma display panel shown in FIG. 1 taken along line AA ′.

1 and 2, a typical plasma display panel 1 includes a panel 20, a heat sink 30, a printed circuit board 40, a back cover 60, and the like. A cabinet 10 is provided.

The panel 20 is composed of a front substrate and a rear substrate (not shown) and phosphors are coated on the rear substrate. The front substrate transmits light generated from the phosphor to display a predetermined image.

The panel 20 includes a plurality of driving integrated circuits (hereinafter referred to as "driver ICs") connected to scan electrodes and address electrodes (not shown) for supplying data signals and scan signals, respectively. do. The driver ICs are composed of a scan driver IC and a data driver IC, each of which is installed between the printed circuit board 40 and the panel 20 to the panel 20 in response to a control signal supplied from the printed circuit board 40. Supply the drive signal.

The heat sink 30 supports the panel 20 and serves to dissipate heat generated when the plasma display panel 1 is driven. As the material of the heat sink 20, a metallic material having high thermal conductivity, for example, aluminum is used to efficiently dissipate heat generated from the panel 20 and the printed circuit board 40. Guards 50 protruding from the heat sink 30 are formed at four corners of the heat sink 30. A hole 95 is formed in the guard 50, and a screw 90 penetrates the hole 95 to fix the heat sink 30 to the back cover 60.

The printed circuit board 40 is fixed to the protrusion 45 formed on the heat sink 30 and supplies a predetermined driving signal to the electrodes of the panel 20. To this end, the printed circuit board 40 includes various driving units, and the printed circuit board 40 and the panel 20 are connected by an FPC (Flexible Printed Circuit) (not shown). The printed circuit board 40 has a heat sink 35 formed in a rectangular shape on the printed circuit board 40 to dissipate heat generated from the printed circuit board 40.

The cabinet 10 is installed at the front of the panel 20 to protect the panel 20 from external shocks and is composed of a glass and a front filter. The front filter is composed of an optical characteristic film, an electromagnetic shield (EMI) shielding film, and an ultraviolet shielding film. The glass protects the front filter from damage from external impact. The optical characteristic film improves the optical characteristics of the plasma display panel by lowering the luminance of red (R) and green (G) and increasing the luminance of blue (B) among the light incident from the panel 20. The electromagnetic shielding film shields electromagnetic waves and prevents electromagnetic waves incident from the panel 20 from being emitted to the outside. The infrared shielding film shields the infrared rays emitted from the panel 20 to prevent the infrared rays above the reference from being emitted to the outside so that signals transmitted using the infrared rays such as a remote controller can be normally transmitted.

The plasma display panel is provided with a back cover 60 to surround the plasma display panel when shipped. The back cover 60 is coupled to the cabinet 10 to protect the plasma display panel from external shock and to block electromagnetic waves emitted to the rear surface.

The plasma display panel 1 generates a lot of heat in the panel 20 and the printed circuit board 40 during driving. The heat generated from the inside of the plasma display panel 1 is radiated through the heat sink 30 and the heat sink 35, but the heat dissipation efficiency is low, so that the inside of the plasma display becomes a high temperature state. When the inside of the plasma display is in a high temperature state, the driving characteristics of the plasma display panel are deteriorated and the driving elements are damaged. In order to solve the heat dissipation problem, a blower (FAN) may be installed in the plasma display panel, but noise may be generated when the blower is driven. In addition, manufacturing costs are high because additional devices must be added for heat dissipation.

Accordingly, an object of the present invention is to provide a plasma display panel that can effectively dissipate heat generated in the plasma display panel.

In order to achieve the above object, a plasma display panel according to an embodiment of the present invention is a panel, a printed circuit board for supplying a driving signal for driving the panel, and a heat sink for radiating heat generated from the panel and the printed circuit board. And a heat sink installed on the printed circuit board and having a plurality of grooves, a back cover fastened to the heat sink, and a contact portion having grooves formed in the back cover and corresponding to grooves formed in the heat sink, And a shock absorber positioned between the heat sink and the contact portion.

The plasma display panel according to the embodiment of the present invention is further provided with a screw for fastening the heat sink and the back cover.

Plasma display panel according to an embodiment of the present invention is characterized in that the guard extending from the heat sink is formed near the edge of the heat sink.

The guard of the plasma display panel according to an embodiment of the present invention is characterized in that a hole through which the screw is formed.

In the plasma display panel according to an exemplary embodiment of the present invention, a hole through which the screw penetrates is formed near a corner of the back cover.

The shock absorber of the plasma display panel according to the embodiment of the present invention is characterized in that it is formed of a thermally conductive material.

The back cover of the plasma display panel according to the embodiment of the present invention is characterized by being formed of a thermally conductive material.

Plasma display panel according to an embodiment of the present invention is characterized in that it further comprises a cabinet installed on the front of the panel and fastened to the back cover.

In the plasma display panel according to an exemplary embodiment of the present invention, a hole through which the screw penetrates is formed near a corner of the cabinet.

According to an embodiment of the present invention, a plasma display panel includes a panel, a printed circuit board supplying a driving signal for driving the panel, a heat sink to dissipate heat generated from the panel and the printed circuit board, and the printed circuit board. And a back cover having a plurality of grooves formed therein, and a back cover having a hole through which the heat sink penetrates and is coupled to the heat sink.

The plasma display panel according to the embodiment of the present invention is further provided with a screw for fastening the heat sink and the back cover.

Plasma display panel according to an embodiment of the present invention is characterized in that the guard extending from the heat sink is formed near the edge of the heat sink.

The guard of the plasma display panel according to an embodiment of the present invention is characterized in that a hole through which the screw is formed.

In the plasma display panel according to an exemplary embodiment of the present invention, a hole through which the screw penetrates is formed near a corner of the back cover.

The back cover of the plasma display panel according to the embodiment of the present invention is characterized by being formed of a thermally conductive material.

The plasma display panel according to an exemplary embodiment of the present invention may further include a cabinet installed at the front of the panel and fastened to the back cover.

In the plasma display panel according to an exemplary embodiment of the present invention, a hole through which the screw penetrates is formed near a corner of the cabinet.

Other objects and features of the present invention in addition to the above objects will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, the plasma display panel according to the present invention will be described in detail with reference to FIGS. 3 to 6.

3 is a perspective view schematically illustrating an interior of a plasma display panel according to a first embodiment of the present invention, and FIG. 4 is a schematic cross-sectional view of the plasma display panel shown in FIG. 3 taken along a line A-A '. .

3 and 4, the plasma display panel 100 according to the first embodiment of the present invention includes a panel 120, a heat sink 130, a printed circuit board 140, and a back cover 160. And a cabinet 110.

The panel 120 is composed of a front substrate and a rear substrate (not shown) and phosphors are coated on the rear substrate. The front substrate transmits light generated from the phosphor to display a predetermined image.

The panel 120 includes a plurality of driving integrated circuits (hereinafter referred to as "driver ICs") connected to scan electrodes and address electrodes (not shown) to supply data signals and scan signals, respectively. do. The driver ICs are composed of a scan driver IC and a data driver IC, each of which is installed between the printed circuit board 140 and the panel 120 and is connected to the panel 120 in response to a control signal supplied from the printed circuit board 140. Supply the drive signal.

The heat sink 130 supports the panel 120 and serves to dissipate heat generated when the panel 120 is driven. As the material of the heat sink 120, a metallic material having high thermal conductivity, for example, aluminum, is used to efficiently dissipate heat generated from the panel 120 and the printed circuit board 140. Guards 150 protruding from the heat sink 130 are formed at four corners of the heat sink 130. A hole 195 is formed in the guard 150, and a screw 190 penetrates the hole 195 to fix the heat sink 130 to the back cover 160.

The printed circuit board 140 is fixed to the protrusion 145 formed on the heat sink 130 and supplies a predetermined driving signal to the electrodes of the panel 120. To this end, the printed circuit board 140 includes various driving units, and the printed circuit board 140 and the panel 120 are connected by an FPC (Flexible Printed Circuit) (not shown). The printed circuit board 140 has a heat sink 135 formed in a rectangular shape on the printed circuit board 140 to dissipate heat generated from the printed circuit board 140. The heat sink 135 is provided with a plurality of grooves to increase the heat radiation efficiency.

The cabinet 110 is installed at the front of the panel 120 to protect the panel 120 from external shocks, and is composed of a glass and a front filter. The front filter is composed of an optical film, an EMI shielding film, and an NIR shielding film. The glass protects the front filter from damage from external impact. The optical characteristic film improves the optical characteristics of the plasma display panel by lowering the luminance of red (R) and green (G) and increasing the luminance of blue (B) among the light incident from the panel 120. The electromagnetic shielding film shields electromagnetic waves and prevents electromagnetic waves incident from the panel 120 from being emitted to the outside. The infrared shielding film shields the infrared rays emitted from the panel 120 to prevent the infrared rays above the reference from being emitted to the outside so that signals transmitted using the infrared rays such as a remote controller can be normally transmitted.

When the plasma display panel is shipped, the back cover 160 is installed to surround the plasma display panel. The back cover 160 is coupled to the cabinet 110 to protect the plasma display panel from external shocks and to block electromagnetic waves emitted to the rear surface. In addition, the back cover 160 has a contact portion 170 formed at a point corresponding to the heat sink 135 installed on the printed circuit board 134.

The contact unit 170 is in contact with the heat sink 135 to dissipate heat generated from the printed circuit board 140 to conduct heat generated from the printed circuit board 140 to the back cover 160 to increase the heat dissipation efficiency. . The contact portion 170 is formed with grooves corresponding to the grooves formed in the heat sink 135 to increase the contact area with the heat sink 135. A shock absorber 180 having high thermal conductivity is disposed between the contact unit 170 and the heat sink 135 to reduce noise and vibration generated when the plasma display panel 100 is driven. The shock absorber 180 may reduce vibration and noise generated inside the plasma display panel 100 and absorb shock from the outside.

In order to effectively dissipate heat generated inside the plasma display panel, the thermal conductivity between the heat sink 130 and the back cover 160 should be increased. To this end, the heat sink 130 and the back cover 160 should be strongly fastened. Holes 195 are formed in the back cover 160 and the guard 150 to strongly fasten the heat sink 130 and the back cover 160. These holes 195 are fastened to the back cover 160 and the heat sink 130 by the screw 190.

The plasma display panel 100 according to the first embodiment of the present invention has a contact portion 170 formed on the heat sink 135 and the back cover 160 formed on the printed circuit board 140 with the shock absorber 180 therebetween. ) Is in contact with the heat generated inside the plasma display panel 100 to conduct to the heat sink (130). Through this structure, heat generated in the plasma display panel 100 is transferred to the back cover 160 to form a wide heat dissipation area. Since the plasma display panel 100 according to the first embodiment of the present invention has a large heat radiation area, the heat radiation efficiency can be improved.

FIG. 5 is a perspective view schematically illustrating an interior of a plasma display panel according to a second embodiment of the present invention, and FIG. 6 is a schematic cross-sectional view of the plasma display panel shown in FIG. 5 taken along line AA ′. .

5 and 6, the plasma display panel 200 according to the second embodiment of the present invention includes a panel 220, a heat sink 230, a printed circuit board 240, and a back cover 260. And a cabinet 210.

The panel 220 is composed of a front substrate and a rear substrate (not shown) and phosphors are coated on the rear substrate. The front substrate transmits light generated from the phosphor to display a predetermined image.

The panel 220 includes a plurality of driving integrated circuits (hereinafter referred to as "driver ICs") connected to scan electrodes and address electrodes (not shown) to supply data signals and scan signals, respectively. do. The driver ICs include a scan driver IC and a data driver IC, each of which is installed between the printed circuit board 240 and the panel 220 and is connected to the panel 220 in response to a control signal supplied from the printed circuit board 240. Supply the drive signal.

The heat sink 230 supports the panel 220 and serves to dissipate heat generated when the panel 220 is driven. As the material of the heat sink 220, a metallic material having high thermal conductivity, for example, aluminum, is used to efficiently dissipate heat generated from the panel 220 and the printed circuit board 240. The guard 250 protruding from the heat sink 230 is formed at four corners of the heat sink 230. A hole 295 is formed in the guard 250, and a screw 290 passes through the hole 295 to fix the heat sink 230 to the back cover 260.

The printed circuit board 240 is fixed to the protrusion 245 formed on the heat sink 230 and supplies a predetermined driving signal to the electrodes of the panel 220. To this end, the printed circuit board 240 includes various driving units, and the printed circuit board 240 and the panel 220 are connected by an FPC (Flexible Printed Circuit) (not shown). The printed circuit board 240 has a heat sink 235 formed in a rectangular shape on the printed circuit board 240 to dissipate heat generated from the printed circuit board 240. The heat sink 235 is formed with a plurality of grooves to increase the heat radiation efficiency.

The cabinet 210 is installed on the front of the panel 220 to protect the panel 220 from external shocks, and is composed of a glass and a front filter. The front filter is composed of an optical film, an EMI shielding film, and an NIR shielding film. The glass protects the front filter from damage from external impact. The optical characteristic film improves the optical characteristics of the plasma display panel by lowering the luminance of red (R) and green (G) and increasing the luminance of blue (B) among the light incident from the panel 220. The electromagnetic shielding film shields electromagnetic waves and prevents electromagnetic waves incident from the panel 220 from being emitted to the outside. The infrared shielding film shields the infrared rays emitted from the panel 220 to prevent the infrared rays above the reference from being emitted to the outside so that signals transmitted using infrared rays such as a remote controller can be normally transmitted.

The back cover 260 is installed to surround the plasma display panel when the plasma display panel is shipped. The back cover 260 is fastened to the cabinet 210 to protect the plasma display panel from external shock and to block electromagnetic waves emitted to the rear surface. In the back cover 260, a plurality of holes 270 through which the heat sink 2345 penetrates is formed at a point corresponding to the heat sink 235 formed on the printed circuit board 240.

In order to effectively dissipate heat generated inside the plasma display panel 200, the thermal conductivity between the heat sink 230 and the back cover 260 should be increased. To this end, the heat sink 230 and the back cover 260 should be strongly fastened. Holes 295 are formed in the back cover 260 and the guard 250 to strongly fasten the heat sink 230 and the back cover 260. These holes 295 are fastened to the back cover 260 and the heat sink 230 by the screw 290.

The plasma display panel 200 according to the second exemplary embodiment of the present invention passes through the heat sink 135 through a plurality of holes 170 formed in the back cover 260 to recover heat generated from the printed circuit board 240. By conducting the cover 260 to widen the heat dissipation area, the heat generated from the printed circuit board 240 may be radiated out of the plasma display panel 200, thereby increasing heat dissipation efficiency.

As described above, the plasma display panel according to the embodiments of the present invention includes a heat sink having a plurality of grooves formed on a printed circuit board, and transfers heat generated inside the plasma display panel to the back cover through the heat sink. In addition, by forming a hole in the back cover, the heat sink may protrude out of the plasma display panel to improve heat dissipation efficiency.

 In addition, since a separate blower is not required to dissipate heat generated inside the plasma display panel, noise caused by the blower can be prevented and manufacturing cost can be reduced by removing additional devices.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (17)

Panel, A printed circuit board supplying a driving signal for driving the panel; A heat sink for radiating heat generated from the panel and the printed circuit board; A heat sink installed on the printed circuit board and having a plurality of grooves; A back cover fastened to the heat sink, A contact portion formed in the back cover and having grooves corresponding to grooves formed in the heat sink; And a shock absorber positioned between the heat sink and the contact portion. The method of claim 1, And a screw for fastening the heat sink to the back cover. The method of claim 2, And a guard extended from the heat sink is formed near an edge of the heat sink. The method of claim 3, wherein And a hole through which the screw penetrates is formed in the guard. The method of claim 2, And a hole through which the screw penetrates near an edge of the back cover. The method of claim 1, And the shock absorber is formed of a thermally conductive material. The method of claim 1, And the back cover is formed of a thermally conductive material. The method of claim 2, And a cabinet installed at the front of the panel and fastened to the back cover. The method of claim 8, And a hole through which the screw penetrates near an edge of the cabinet. Panel, A printed circuit board supplying a driving signal for driving the panel; A heat sink for radiating heat generated from the panel and the printed circuit board; A heat sink installed on the printed circuit board and having a plurality of grooves; And a back cover having a hole through which the heat sink penetrates and is coupled to the heat sink. The method of claim 10, And a screw for fastening the heat sink to the back cover. The method of claim 11, And a guard extended from the heat sink is formed near an edge of the heat sink. The method of claim 12, And a hole through which the screw penetrates is formed in the guard. The method of claim 11, And a hole through which the screw penetrates near an edge of the back cover. The method of claim 10, And the back cover is formed of a thermally conductive material. The method of claim 11, And a cabinet installed at the front of the panel and fastened to the back cover. The method of claim 16, And a hole through which the screw penetrates near an edge of the cabinet.

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