KR20060110478A - Plasma display device - Google Patents

Abstract

A plasma display device is provided to maximize cooling efficiency of a TCP(Tape Carrier Package) or a COF(Chip On Film) by forming a radiating member on a printed circuit board. A chassis base(30) is used for supporting a plasma display panel(10). A printed circuit board including driving circuits(41,42) is installed on a backside of the chassis base at a backside of the plasma display panel. A signal transfer unit having a driving chip(52) connects the driving circuits with electrode terminals formed at a periphery of the plasma display panel. An inclined part(32) is formed on a section of the chassis base. The driving chip is installed on an upper surface of the inclined part and a radiating member is installed in an upward inclined state at an upper side of the printed circuit board.

Description

Plasma Display Device

1 and 2 are partial cutaway cross-sectional view schematically showing a heat dissipation structure of a driving chip according to the prior art.

Figure 3 is a partially cutaway cross-sectional view showing a heat dissipation structure of the driving chip according to an embodiment of the present invention.

Figure 4 is a partial cutaway cross-sectional view according to another embodiment of the present invention.

Figure 5 is a partial cutaway cross-sectional view according to another embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

10; Plasma display panel 20; Thermal conductor

30; Chassis base 32; Slope

40; Circuit board 41,42; Driving circuit

50; TCP 52; Driving chip

60; Heat sink 72,74; Heat transfer medium

80; Heat sink 82; Heat dissipation fin

90; Ground plate

The present invention relates to a plasma display device, and more particularly, to form an inclined portion at an end of the chassis base to be suitable for dissipating heat generated by a signal transmitting means electrically connecting the plasma display panel and the driving circuit. The heat dissipation member for dissipating the driving chip of the signal transmission means is installed in a state in which the heat dissipation member extending upward of the circuit board on which the driving circuit is installed does not interfere with the circuit board. The present invention relates to a plasma display device for improving heat dissipation performance.

Plasma display panel (PDP, Plasma Display Pannel; Hereinafter, a flat panel display device using a “panel” is used.

Such a plasma display device can be formed to have a thin thickness compared to a CRT display device having a large volume, which is suitable for implementing a large screen having a light weight with a relatively small volume. In addition, as compared with other flat panel display devices, there is no need to form active elements such as transistors, and the viewing angle is wider, and it has high brightness.

The plasma display apparatus is formed by installing elements necessary for screen realization such as a driving circuit connected to each electrode of the panel after forming the plasma display panel. In the plasma display panel, each pixel is represented through discharge in the pixel region. . The discharge is generated in the pixel space by the voltage applied to the electrode, and generates plasma or excited atoms in the space. The power required to discharge some of the light escapes, but most of it is converted to heat in the panel. Materials such as phosphors that form the panel become a problem because they tend to deteriorate and denature when the temperature increases, and the life is shortened. In addition, overheating in the panel, in particular, partial overheating, may cause thermal expansion deformation of the glass plate, which is the substrate of the panel, and thus stress, thereby causing breakage.

In addition, a driving circuit connected to the electrodes of the plasma display panel consumes a lot of power to implement the screen. Consumption of power means heat generation, and it is easy to cause malfunction in the circuit operation when the driving circuit is overheated. This malfunction causes a problem that the quality of the screen is degraded, for example, to cause the discharge to occur even in the pixel portion that should not be discharged. Therefore, in the plasma display device, how to effectively release the heat generated from the driving circuit, such as heat is an important technical problem. In particular, when heat generation is concentrated, such as a driving chip portion of a tape carrier package (TCP), which is a signal transmission member, heat dissipation of a portion that is difficult to cool becomes a problem unless it is thermally contacted with a heat sink.

In general, a chassis for supporting a panel is attached to a rear surface of the panel to dissipate heat generated from heat generating parts such as a panel and a driving circuit to the outside. The chassis is typically made by combining a reinforcement with a plate-shaped chassis base, the chassis base is fixed with a double-sided tape on the rear of the rear substrate, a thermal conductive medium is interposed between the chassis base and the rear substrate, the reinforcement is attached to the chassis base It is screwed in. In addition, on the rear of the chassis base, a plurality of integrated circuit chips and other circuit elements for driving the panel are distributedly distributed on the plurality of circuit boards and mounted together with the power supply. The circuit board is installed in a state spaced apart from the chassis base by a boss formed in the chassis base.

As such, the chassis base supports the panel to reinforce mechanical strength and serves to dissipate heat from a panel or driving circuit contacting the chassis, or to disperse partially concentrated heat. In order to perform such a heat dissipation effect, the chassis base is generally formed of a metal such as aluminum having excellent thermal conductivity.

In a plasma display apparatus, TCP or COF (Chip On Film) including a driving chip is used as a signal transmission means for connecting a signal electrode connected to a pixel formed in a panel and a driving circuit for driving these electrodes. Unlike the other driving circuit elements, the driving chip in TCP or COF is not installed on a separate circuit board, but is installed on a signal line connecting the electrode of the panel and the driving circuit unit. Therefore, the driving chip installed in the TCP or COF is high heat generation, and since the heat dissipation is not directly performed in the air is supported by the reinforcement of the chassis base is installed to release heat in the state in which the driving chip is in contact with the reinforcement and the cover plate.

That is, as shown in FIG. 1, the reinforcement of the chassis base 3, which is installed in the state in which the thermal conductor 2 is interposed on the rear surface of the plasma display panel 1 including the two substrates 1a and 1b. The cover plate 6 is installed in the state in which the driving chip 5a of the TCP 5 is supported in the upper portion 4 so that the driving chip 5a is radiated through the heat conductive medium 7 or 8, or Alternatively, as shown in FIG. 2, the drive chip 5a of the TCP 5 is provided between the bent end portion 3a of the chassis base 3 and the cover plate 6 to dissipate heat.

However, according to such a heat dissipation structure, since there is a limit in cooling heat generated in the driving chip 5a of TCP, there is a problem in that malfunctions of the driving chip occur frequently and life is reduced. That is, conventionally, the circuit board 9, on which the various circuit elements 9a and 9b are installed, is installed in a state spaced apart by the chassis base 3 and the boss 3a by a predetermined interval, and is covered by the cover plate 6. Even if the heat dissipation area is to be increased, since the interference is generated by the circuit board 9, the length of the cover plate 6 cannot be extended. Therefore, there is a limit in improving the heat dissipation performance of the driving chip of TCP.

The object of the present invention devised in view of such a problem is to improve the cooling efficiency of TCP or COF in which a driving chip is installed on a signal line connecting a plasma display panel and a driving circuit provided on the rear of the panel.

Another object of the present invention is to improve the cooling efficiency of the plasma display panel and the TCP, COF in the structure of applying the plastic chassis base material of the chassis base supporting the plasma display panel molded of plastic.

In order to achieve the above object, the present invention provides a circuit board on which a driving circuit is installed on a rear surface of a chassis base for supporting the panel at a rear side of a plasma display panel, and the electrode provided at a peripheral portion of the driving circuit and the panel. In a plasma display device in which a terminal is connected to a signal transmission means having a driving chip, the chassis base has an inclined portion formed at an end thereof, and the heat dissipation member is disposed on the upper side of the circuit board with the driving chip interposed on an upper surface of the inclined portion. It is installed to be inclined upwardly in an extended state, characterized in that the heat dissipation member is configured to dissipate heat generated from the driving chip without mutual interference with the driving circuits installed on the circuit board.

The inclined portion of the chassis base is inclined toward the panel while going outward of the chassis base, and the inclined portion is preferably formed at an end stepped at the edge of the chassis base on which the inclined portion is formed.

The heat dissipation member may use a cover plate or a heat dissipation plate. The heat dissipation plate may use a heat dissipation plate provided with a plurality of heat dissipation fins, and may further include a heat dissipation plate on the cover plate.

In addition, the driving chip is preferably attached between the inclined portion of the chassis base and the heat dissipation member interposed between the heat conducting medium.

And, it is preferable that a ground plate is interposed between the heat dissipation member and the circuit board provided with the driving circuit, wherein the ground plate is formed of a leaf spring and the heat dissipation member and the circuit board are elastically pressed by the heat dissipation member. In this case, even if the chassis base is formed of a plastic material, the ground structure is stabilized.

Hereinafter, preferred embodiments of the present invention as described above will be described based on the accompanying drawings.

3 is a partial cutaway cross-sectional view showing a heat dissipation structure of a driving chip according to an embodiment of the present invention, FIG. 4 is a partial cutaway cross-sectional view according to another embodiment of the present invention, and FIG. 5 is still another embodiment of the present invention. A partial cutaway sectional view according to an embodiment.

As described above, the plasma display apparatus according to the embodiment of the present invention has a plasma display panel 10 in which two substrates 11 and 12 are disposed to face each other, and a chassis base 30 supporting the panel from the rear of the panel 10. And a circuit board 40 mounted on the rear surface of the chassis base 20 and provided with driving circuits 41 and 42.

In the plasma display panel 10, sustain electrodes (not shown) are formed on the front substrate 11 in a straight line horizontally with respect to each other, and an address electrode having a straight form in the rear substrate 12 is perpendicular to each other in parallel. Not shown). A barrier rib (not shown) is positioned in parallel with the address electrode, and a phosphor layer (not shown) is formed on the address electrode.

In addition, a chassis base 30 is installed on the rear surface of the rear substrate 12, and the chassis base 30 is fixed to the rear surface of the rear substrate 12 by a double-sided tape 22 or the like. At this time, the thermal conductor 20 is interposed between the chassis base 30 and the rear substrate 12 together with the double-sided tape 22.

A plurality of lead electrodes are formed around the plasma display panel attached to the front surface of the chassis base. The lead electrode is formed outside the sealing part along the periphery of the panel to connect a plurality of electrodes such as an address electrode and a sustain electrode formed over the two substrates constituting the panel with the driving circuit. Accordingly, in order to transmit the electrical signal of the driving circuit to each of the drawing electrodes, a signal transmitting means for connecting the drawing electrode and the driving circuit is provided, and TCP 50 is used in the embodiment of the present invention.

The signal transmission means is a means for connecting the electrodes to control the pixels and the terminals of the driving circuit in a flat panel display having a plurality of pixels. Signal lines are used to bundle and connect one electrode and one driving circuit terminal into one unit. have. In this case, the number of individual wires or individual signal lines forming one integrated signal line is generally related to how many strands of electrodes can be controlled by one driving chip 52.

Recently, the driving chips 52 are used in combination with a signal line, for example, a tape carrier package (TCP) or a chip on film (COF). They are a kind of package having a signal processing chip on its own, and its terminal line is connected to one terminal of both ends connected to them to connect the terminals of both sides.

As shown in FIG. 3, in an exemplary embodiment of the present invention, the edge of the chassis base 30 is stepped so that the panel 10 is inclined toward the outside of the chassis base 30. A fork slope 32 is formed. The circuit board 40 and the TCP 50 are connected to the upper surface of the inclined portion 32 in a state in which the driving chip 52 of the TCP 50 is supported.

Herein, in the present invention, the heat sink 60 is installed on the top surface of the driving chip 52 of the TCP 50 so that the TCP chip 52 is the inclined portion 32 and the heat sink 60 of the chassis base 30. Attached by the heat conduction medium (72) (74) in between is configured to emit from the drive chip 52 through the heat sink (60).

The heat dissipation plate 60 installed in a state in which the inclined portion 32 of the chassis base 30 is inclined is supported by the inclined portion 32 rather than being limited to a predetermined value. Determination is made within a range in which interference does not occur with the driving circuits 41 and 42 of the circuit board 40 provided on the rear surface of the substrate 30.

That is, the heat sink 60 is installed to be inclined in a direction away from the circuit board 40 by the inclined portion 32 formed with a predetermined inclination angle θ at the end of the chassis base 30. Even though the length of the heat sink 60 is extended to the upper side of the circuit board 40, the drive circuits 41 and 42 mounted on the circuit board 40 with a predetermined height and the heat sink 60 are mutually connected. It will not interfere.

The heat sink 60 may be formed by extending the cover plate to the upper side of the circuit board 40. The heat sink 60 is made of a metal having good thermal conductivity, for example, aluminum metal.

 Alternatively, as another embodiment of the present invention, as shown in Figure 4, the structure of the heat sink may be formed of a heat sink 80 formed a plurality of heat dissipation fins 82 on the upper surface and vertically vertically at a predetermined interval. . According to the heat dissipation plate 80, since the contact area with air is increased by the plurality of heat dissipation fins 82, the heat dissipation performance generated by the driving chip 52 of the TCP 50 is improved. Although the heat dissipation fins 82 formed on the heat dissipation plate 80 are illustrated in the transverse direction with respect to the panel 10, the heat dissipation fins 82 may be formed in the longitudinal direction with respect to the panel. In this case, the heat dissipation fins are formed. The cooling effect is improved by matching the direction and the direction of the flow of convection in the internal space of the plasma display apparatus.

On the other hand, although not shown in the figure, the drive chip of the TCP can be fixed to the inclined portion of the chassis base in a state in which a heat sink having a heat radiation fin is attached to the cover plate. That is, the heat dissipation plate may be further installed outside the cover plate to increase the heat dissipation performance of the driving chip.

As described above, the present invention forms the inclined portion 32 to be inclined toward the edge of the chassis base 30 toward the edge, and the driving chip 52 of the TCP 50 on the inclined portion 32 of the chassis base 30. ) Is connected to the driving circuit of the circuit board 40, and the heat sink 60 is attached to the upper surface of the driving chip 52 of the TCP through the heat conducting mediums 72 and 74. Therefore, since the heat sink 60 is installed in an inclined state by the inclined portion 32 of the chassis base, the length of the heat sink 60 toward the circuit board 40 installed on the rear surface of the chassis base 30 is increased. Even if it is sufficiently extended, the interference between the heat sink 60 and the driving circuits 41 and 42 provided on the circuit board 40 does not occur, so that the driving chip of the TCP 50 by the heat sink 60 ( 52) to maximize the heat dissipation effect.

5 is a cross-sectional view showing a heat dissipation structure of a driving chip of TCP according to another embodiment of the present invention.

Another embodiment of the present invention is to reduce the process and manufacturing costs, to reduce the weight of the product by molding the material of the chassis base (30 ') to a plastic material.

An inclined portion 32 'is formed at an end of the chassis base 30' with a predetermined inclination angle θ, and a driving chip of the TCP 50 is provided on the inclined portion 32 'of the chassis base 30'. The heat sink 60 is extended to the upper side of the circuit board 40 in the state of attaching the 52 to fix the heat conducting mediums 72 and 74.

Another embodiment of the present invention is provided with a ground plate 90 having a metallic material elasticity between the heat sink 60 and the circuit board 40. Since the chassis base 30 'is formed of a plastic material, the ground structure is realized through the heat sink 60 formed of a metal material. The ground plate 90 is formed of an elastic plate spring to exhibit a restoring force in a state in which the ground plate 90 is elastically supported with respect to the heat sink 60, thereby maintaining the contact state between the heat sink 60 and the circuit board 40.

According to another embodiment of the present invention configured as described above, since the chassis base 30 ′ in which a plurality of circuit boards 40 are installed is formed of a plastic material through which current does not pass, the heat sink 60 and the circuit board 40 are provided. Ground by the metal ground plate 90 is installed between the (groung) is implemented. This grounding structure, together with other additional grounding structures, constitutes a grounding circuit, thereby further stabilizing the grounding structure of the chassis base 30 'of plastic material.

As described above, the present invention is not limited to the above-described embodiments, and any person having ordinary knowledge in the technical field to which the present invention belongs without departing from the gist of the present invention claimed in the claims. It is to be understood that such modifications are possible, and such changes are within the scope of the claims.

As described above, the plasma display apparatus according to the present invention extends a TCP (or COF) in which a driving chip is installed on a signal line connecting a plasma display panel and a driving circuit provided on a rear surface of the panel to an upper side of the circuit board. The heat dissipation member has the effect of maximizing the cooling efficiency.

In addition, in the structure in which the chassis base for supporting the plasma display panel is applied to the plastic chassis base molded of plastic, the heat generated from the plasma display panel and the driving chip of the TCP (or COF) can be effectively cooled by the heat dissipation member. have. In addition, the structure applying the plastic chassis base has an effect of stabilizing the ground structure of the plastic chassis base by providing a ground plate between the heat dissipation member and the circuit board.

Claims (13)

In the rear of the plasma display panel, a circuit board on which a driving circuit is installed is installed on a rear surface of the chassis base supporting the panel, and the driving circuit and electrode terminals provided at the periphery of the panel are connected to signal transmission means having a driving chip. In the plasma display device, The chassis base has a plasma display device, characterized in that the inclined portion is formed at the end, and the heat dissipation member is installed to be inclined upwardly in an extended form on the upper side of the circuit board with the driving chip on the upper surface of the inclined portion. . The method of claim 1, And the inclined portion is formed to be inclined in a direction in which the panel is installed while going out of the chassis base. The method of claim 1, And the inclined portion is formed at an end formed stepped at the edge of the chassis base. The method of claim 1, And the heat dissipation member is a cover plate. The method of claim 1, And the heat radiating member is a heat radiating plate. The method of claim 3, wherein The heat dissipation plate is a plasma display device, characterized in that provided with a plurality of heat dissipation fins. The method of claim 1, The heat dissipation member is a plasma display device, characterized in that the heat sink is provided on the cover plate. The method of claim 7, wherein The heat dissipation plate is a plasma display device, characterized in that provided with a plurality of heat dissipation fins. The method of claim 1, The driving chip is a plasma display device, characterized in that the thermal conductive medium is interposed between the inclined portion and the heat radiating member of the chassis base. The method of claim 1, And the heat dissipation member is made of aluminum. The method of claim 1, And a ground plate interposed between the heat dissipation member and the circuit board provided with the driving circuit. The method of claim 11, And the grounding member is formed of a leaf spring and pressed by the weight of the heat radiation member to maintain a contact state between the heat radiation member and the circuit board by the elastic restoring force of the leaf spring. The method of claim 1, And the chassis base is formed of a plastic material.

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