KR100683690B1 - Plasma display module - Google Patents

Abstract

An object of the present invention is to provide a plasma display module having a chassis base structure capable of effectively dissipating heat generated from an integrated circuit chip installed to drive a plasma display panel. Is a plasma display panel displaying an image using plasma discharge, a chassis base supporting the plasma display panel at the rear of the plasma display panel, and an electrical signal disposed at the rear of the chassis base and applied to the plasma display panel. A plasma display module comprising: a driving circuit board for generating a signal; and a signal transmitting means for electrically connecting the plasma display panel and the driving circuit board, wherein the chassis base has at least one end of the signal transmission device. The bent portion is provided with a bent portion, wherein the bent portion is formed with a space between the chassis base and the space is bent to open toward the front of the chassis base, the bent portion formed with the chassis base and the bent portion It provides a plasma display module having a heat dissipation fin to the heat dissipation action of the chassis base in the space, the thickness of the bent portion on which the integrated circuit chip is seated is thicker than the thickness of the chassis base.

Description

Plasma display module

1 is an exploded perspective view illustrating an example of a plasma display module.

2 is a cross-sectional view taken along the line II-II of FIG.

3 is a cross-sectional view of a portion of a plasma display module according to an embodiment of the present invention.

4 is a cross-sectional view taken along line III-III of FIG. 3;

5 is a cross-sectional view of a portion of a plasma display module according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: plasma display module 20: plasma display panel

30, 130: chassis base 31, 131: bending part

40, 140: drive circuit board 51, 151: connection cable

52, 152: integrated circuit chip 60, 160: cover plate

70, 170: double sided tape 180: thermally conductive resin

185: heat dissipation sheet 190: heat dissipation fin

The present invention relates to a plasma display module, and more particularly, to a plasma display module having a chassis base structure capable of effectively dissipating heat generated in an integrated circuit chip installed to drive a plasma display panel.

Examples of flat panel displays include liquid crystal displays (LCDs), plasma display panels (PDPs), field emission displays (FEDs), and electroluminescent displays (ELDs).

Among these, the plasma display device is a flat panel display that displays an image using a gas discharge phenomenon, and can be manufactured with a thin thickness of several centimeters or less, has a large screen, and has a wide viewing angle. It is in the spotlight as a device.

FIG. 1 is an exploded perspective view showing an example of a display module used in the plasma display device among these flat panel display devices.

As shown in FIG. 1, the plasma display module 10 includes a display panel 20, a predetermined number of driving circuit boards 40 each including elements and circuits for driving the display panel, and the display panel 20. ) And a chassis base 30 for supporting the driving circuit board 40 from the front and the rear, respectively, and signal transmission means 50 for electrically connecting the display panel 20 and the driving circuit board 40 to each other. do.

The plasma display module 10 manufactures the front panel 21 and the rear panel 22 and combines them to form the display panel 20, and the display panel 20 behind the display panel 20. ) And the chassis base 30 are assembled by a double-sided tape 70 disposed between the chassis base 30 and the chassis base 30, and the driving circuit board 40 is mounted on the chassis base 30.

The chassis base 30 must have sufficient rigidity because the display panel 20 is supported on the front side and the driving circuit board 40 is supported on the back side. On the other hand, the chassis base 30 is preferably made thin so that the total weight of the plasma display module is not too large. Accordingly, as shown in FIG. 1, a reinforcement member 35 is added to the chassis base 30 to support both the display panel 20 and the driving circuit board 40 with the thin chassis base 30. Combined structure was used. The reinforcing member 35 serves as a part on which the signal transmission means 50 is seated.

The signal transmitting means 50 includes a connection cable 51 and an integrated circuit chip 52. The connection cable 51 is a connection cable called a tape carrier package (TCP). In this connection cable, a plurality of conductors extend in the longitudinal direction of the connection cable 51, and at least some of the conductors It is electrically connected to the integrated circuit chip 52 mounted on the connection cable 51. The integrated circuit chip 52 is disposed and fixed on the reinforcing member 35, and the connection cable 51 and the integrated circuit chip 52 are disposed on the reinforcing member 35 on the reinforcing member 35. The cover plate 60 is fixed to and fixed to cover the cover. The integrated circuit chip 52 mounted on the connection cable 51 must process a large number of signals at the same time quickly and perform a large number of switching operations for a short time to process the signals. Heat is generated. In addition, since the integrated circuit chip 52 is driven at a high voltage and is relatively expensive, it is necessary to smoothly dissipate heat generated during driving in order to prevent breakage, thereby suppressing the temperature rise of the integrated circuit chip 52. .

2 is a cross-sectional view taken along the line II-II of FIG. 1.

As shown in FIG. 2, in the conventional plasma display panel, heat generated from the integrated circuit chip 52 is transferred to the reinforcing member 35 and the cover plate 60, and the integrated circuit. The heat is radiated through a path that is radiated through convection to the atmosphere surrounding the circuit chip 52. The cover plate 60 is formed of a material having good thermal conductivity, and is formed to dissipate heat generated from the integrated circuit chip 52 during driving of the plasma display module.

However, in the conventional heat dissipation structure of the integrated circuit chip in the plasma display panel, the temperature rise of the integrated circuit chip due to the heat generation of the integrated circuit chip is not effectively blocked, the temperature of the cover plate becomes excessively high, and such a high temperature It affects the outside of the device, and if the power consumption is high, the heat dissipation amount is not enough, there was a problem that the thermal fixation state is maintained. Therefore, there is a need to develop a plasma display panel having a heat dissipation structure capable of more effectively dissipating heat generated from the integrated circuit chip.

 The present invention is to solve the above problems, an object of the present invention to provide a plasma display module having a heat dissipation structure that can effectively dissipate heat generated from an integrated circuit chip installed to drive the plasma display panel. will be.

An object of the present invention as described above, a plasma display panel for displaying an image by using a plasma discharge, a chassis base for supporting the plasma display panel from the rear of the plasma display panel, disposed behind the chassis base and the plasma A plasma display module comprising a driving circuit board for generating an electrical signal applied to a display panel and signal transmission means for electrically connecting the plasma display panel and the driving circuit board, wherein the chassis base has the signal at at least one end thereof. A bent portion on which a transmission means is seated, wherein the bent portion is formed with a space formed between the chassis base and the space is bent to open toward the front of the chassis base, and the bent portion is formed with the chassis base and the bent portion. It provides a plasma display module having a heat dissipation fin to the heat dissipation action of the chassis base in the space formed by, and the thickness of the bent portion on which the integrated circuit chip is seated is thicker than the thickness of the chassis base.

Here, the signal transmission means for controlling a signal that is electrically connected to the plasma display panel and the driving circuit board, the signal disposed on the bent portion and connected to at least a portion of the cable and transmitted to the plasma display panel. It includes an integrated circuit chip.

Here, the thermal conductive resin is interposed between the bent portion and the integrated circuit chip so that heat can be more smoothly conducted from the integrated circuit chip toward the bent portion.

The plasma display module may further include a cover plate covering the bent portion on which the integrated circuit chip is disposed and disposed in contact with the integrated circuit chip to cover the integrated circuit chip and the cable, and the cover plate and the integrated circuit. Since the heat dissipation sheet is interposed between the chips, the heat dissipation can be conducted through the cover plate, which is more preferable.

Hereinafter, with reference to the accompanying drawings will be described in detail embodiments of the present invention. The same members are assigned to the same members as those described in the prior art in the following description of the embodiments of the present invention.

3 illustrates a cross-sectional view of a portion of a plasma display module according to an embodiment of the present invention.

As shown in FIG. 3, the plasma display module according to an exemplary embodiment of the present invention includes a chassis base for supporting the plasma display panel 120 and the plasma display panel 120 behind the plasma display panel 120. 130, a driving circuit board 140 disposed behind the chassis base 130 and generating an electrical signal applied to the plasma display panel 120 and the plasma display panel 120 and the driving circuit board. And a signal transmitting means 150 for electrically connecting the 140. The chassis base 130 has a bent portion 131 on which at least one end the signal transmission means 150 is seated, and the bent portion 131 has a space formed between the chassis base 130 and the chassis base 130. And the space is bent to open toward the front of the chassis base 130. The bent portion 131 is integrally formed with the bent portion 131 in a space formed between the bent portion 131 and the chassis base 130 and is perpendicular to the longitudinal direction of the bent portion 131. The heat dissipation fin 190 is disposed. The signal transmission means 150 is a cable 151 for electrically connecting the plasma display panel 120 and the driving circuit board 130, and is disposed on the bent portion 131 and the cable 151 of the cable 151. And an integrated circuit chip 152 connected to at least a portion thereof to control a signal transmitted to the plasma display panel.

In the plasma display module according to the present invention having the above-described configuration, a structure for dissipating heat generated by the integrated circuit chip 152 will be described. During the driving of the integrated circuit chip 152, the integrated circuit chip 152 performs a frequent switching function and is driven by a high voltage, so that a large amount of heat is generated in the integrated circuit chip 152. This heat is conducted to the chassis base 130 via the bent portion 131 to radiate heat. The heat dissipation structure of the integrated circuit chip in the plasma display panel according to an embodiment of the present invention is superior to the prior art in that the heat dissipation fin 190 in the space formed between the chassis base 130 and the bent portion 131 Is to install it. By installing the heat dissipation fins 190, the surface area of the shaggy base 130 may be increased in which heat generated from the integrated circuit chip 152 is conducted and radiated. Due to an increase in the surface area of the chassis base 130, more heat may be radiated through convection into the air. The bent portion 131 provided with the heat dissipation fin 190 may serve as a heat sink to absorb heat generated by the integrated circuit chip 152 to dissipate heat.

In addition, a thermal conductive resin 180 may be interposed between the integrated circuit chip 152 and the bent portion 131. In this case, the heat generated from the integrated circuit chip 152 may be smoothly conducted toward the bent portion 131. The thermally conductive resin 180 may use a thermally conductive grease or a resin having better thermal conductivity.

In addition, the plasma display module according to the exemplary embodiment of the present invention covers the bent portion 131 on which the integrated circuit chip 152 is disposed, and the cover plate 160 disposed in contact with the integrated circuit chip 152. It is preferable to further provide. In this case, the cover plate 160 protects and covers the integrated circuit chip 152 and the connection cable 151. Since the heat generated from the integrated circuit chip 152 is conducted as it is, the cover plate 160 may be made of a material having high thermal conductivity to emit a large amount of heat. In addition, the heat dissipation sheet 185 may be interposed between the integrated circuit chip 152 and the cover plate 160 to better dissipate heat generated in the integrated circuit chip 152.

4 is a cross-sectional view taken along line III-III of FIG. 3.

As shown in FIG. 4, the heat dissipation fin 190 is disposed in a space formed between the chassis base 130 and the bent portion 131 perpendicular to the longitudinal direction of the bent portion 131. In FIG. 4, the heat dissipation fin 190 is formed integrally with the bent portion 131, and the heat dissipation fin 190 is made of the same material as the bent portion 131, for example, such as aluminum. Although it may be formed integrally with the bent portion 131 as a material, it is preferable to adopt a material that has better productivity and exhibits better thermal diffusivity than aluminum, and then separately manufactured and then assembled with the bent portion 131. Can be.

In addition, although the heat dissipation fin 190 is shown as being perpendicular to the longitudinal direction of the bent portion 131 in Figure 4, preferably, the heat dissipation fin 190 is the longitudinal direction of the bent portion 131 Or may be disposed at a predetermined angle with respect to the longitudinal direction of the bent portion 131.

In addition, the heat dissipation fin 190 is shown as having a length not exceeding the chassis base 130 in front of the chassis base 130 in Figures 3 and 4, Preferably, the chassis base 130 In order to increase the surface area of the heat dissipation fin 190 may extend further forward through the front of the chassis base 130. In addition, although the heat dissipation fin 190 is shown as having a rectangular shape in FIGS. 3 and 4, preferably, the upper side of the heat dissipation fin 190 is convex toward the front of the chassis base 130 to increase the surface area. It may have an arc or similar shape.

5 is a cross-sectional view showing another embodiment of the plasma display module according to the present invention. In the present embodiment, the thickness D ′ of the bent portion 131 on which the integrated circuit chip 152 is seated is thicker than the thickness D of the chassis base 130. By making the thickness of the bent portion 131 on which the integrated circuit chip 152 is seated thicker than the thickness of the chassis base 130, the conduction flow of heat generated in the integrated circuit chip 152 is smoothed. The heat capacity of the bent portion 131 through which heat is conducted can be increased. Therefore, it is possible to absorb more heat generated from the integrated circuit chip 152, thereby improving the heat dissipation effect.

As described above, according to the present invention, by adding a heat radiation fin in the space formed between the chassis base and the bent portion, the surface area of the chassis base in contact with the atmosphere can be increased to increase the amount of heat dissipation, and the bending is in contact with the integrated circuit chip. By increasing the thickness of the part, the heat flow from the integrated circuit chip can be smoothed, and the heat capacity can be increased to absorb more heat. Thus, the heat generated during the operation of the integrated circuit chip for operating the plasma display panel can be reduced. A plasma display module having a structure capable of dissipating effectively can be provided.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (6)

A plasma display panel which displays an image using plasma discharge; A chassis base supporting the plasma display panel behind the plasma display panel; A driving circuit board disposed behind the chassis base and generating an electrical signal applied to the plasma display panel; And A plasma display module comprising signal transmission means for electrically connecting the plasma display panel and the driving circuit board. The chassis base has a bent portion in which the signal transmission means is seated at at least one end, and the bent portion is bent such that a space is formed between the chassis base and the space is opened toward the front of the chassis base. The bent portion includes a heat dissipation fin for dissipating the chassis base in a space formed by the chassis base and the bent portion, And a thickness of the bent portion on which the integrated circuit chip is seated is thicker than a thickness of the chassis base. The method of claim 1, The signal transmitting means includes a cable electrically connecting the plasma display panel and the driving circuit board, and an integrated circuit disposed on the bent portion and connected to at least a portion of the cable to control a signal transmitted to the plasma display panel. Plasma display module comprising a chip. delete The method of claim 2, And a thermally conductive resin is interposed between the bent portion and the integrated circuit chip. The method of claim 2, And a cover plate covering the bent portion in which the integrated circuit chip is disposed and disposed in contact with the integrated circuit chip to cover the integrated circuit chip and the cable. The method of claim 5, And a heat dissipation sheet is interposed between the cover plate and the integrated circuit chip.

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