KR100717748B1 - Plasma display device - Google Patents

Abstract

Plasma display device of the present invention is to reduce the vibration of the heat sink included in the intelligent power module to reduce the noise of the sensitive band, the plasma display panel, the chassis base for attaching and supporting the plasma display panel, the chassis base And a printed circuit board assembly mounted and electrically connected to the plasma display panel, an intelligent power module provided in the printed circuit board assembly, and a heat sink attached to the intelligent power module. The heat sink may include a first plate attached to the intelligent power module, a second plate spaced apart from the first plate at a predetermined interval, and arranged in parallel with each other, and between the first plate and the second plate. It includes a plurality of pins extending in a first direction while being connected to each other and arranged side by side in a second direction crossing the first direction.

Chassis Base, Intelligent Power Module, Heat Sink, Plate, Pin

Description

Plasma Display Device {PLASMA DISPLAY DEVICE}

1 is a perspective view schematically illustrating an exploded view of a plasma display device according to an embodiment of the present invention.

2 is an exploded perspective view illustrating an intelligent power module and a heat sink.

3 is a perspective view of a heat sink;

4 is a cross-sectional view taken along the line IV-IV of FIG. 2.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display device for reducing noise generated in a heat sink of an intelligent power module.

In general, a plasma display apparatus generates a plasma by gas discharge and displays an image using the plasma, a plasma display panel for supporting the panel, and a plurality of printed circuits mounted on the chassis base. Printed circuit board assemblies.

This plasma display panel has two glass substrates facing each other, and has a discharge space therein, and thus has weak mechanical rigidity against impact. Therefore, the chassis base is formed of a metal having a higher mechanical rigidity than the glass substrate to support the panel.

In addition to supporting the mechanical stiffness of the panel, the chassis base provides mounting space for printed circuit board assemblies, heat sink function of the panel, and electromagnetic interference (EMI). ) It is in charge of grounding function.

In addition, a panel with a double-sided tape is attached to the front of the chassis base so that the chassis base performs the above functions, and printed circuit board assemblies are mounted to the rear of the chassis base.

The back of the chassis base has a plurality of bosses, which are mounted on the boss and fixedly mounted by fastening a set screw to the boss.

These printed circuit board assemblies are provided in plural to perform the respective functions for driving the panel. That is, the printed circuit board assemblies may include a sustain board assembly for controlling the sustain electrode, a scan board assembly for controlling the scan electrode, an address buffer board assembly for controlling the address electrode, and a control signal for driving the address electrode by receiving an image signal from the outside. An image processing / control board assembly for generating a control signal required for driving the sustain electrode and the scan electrode and applying the same to the corresponding board assemblies, and a power board assembly for supplying power for driving the board assemblies.

The holding board assembly is connected to the sustain electrode which is drawn out from the inside of the panel, the scan board assembly is connected to the scan electrode which is drawn out from the inside of the panel, and the address buffer board assembly is connected to the address electrode drawn out from the inside of the panel. It is connected via a flexible printed circuit and a connector.

In addition, the sustain board assembly and the scan board assembly include an intelligent power module for applying a driving signal to the sustain electrode and the scan electrode. The intelligent power module includes a power switching element such as a power transistor and a field effect transistor (FET), a driving circuit for driving the power switching element, and a protection circuit for protecting the power switching element. It's built into the package.

The intelligent power module consists of various circuit elements, a printed circuit board mounting the same, and a case for supporting the same. The printed circuit board is composed of an epoxy resin plate bonded in the form of surface mount devices (SMD) and a metal plate (usually aluminum) for transferring heat generated from the circuit elements to the heat sink.

The intelligent power module generates a large amount of heat during operation because it includes a large amount of heat-generating power switching elements in one package. In order to radiate this heat, a heat sink is attached to the metal plate of the intelligent power module. The heat sink expands the heat dissipation area of the intelligent power module to radiate heat from the internal circuitry to the outside. The heat sink has a plurality of fins to increase the heat dissipation area. These pins form a free end.

Therefore, the intelligent power module is operated at a high frequency, and the vibration is generated along with the heat in the intelligent power module. This vibration is transferred to the heat sink with heat so that heat is radiated through the fins, which causes the fins to vibrate. The vibration of the fins in this heat sink generates noise in the sensitive band (2 kHz).

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display device which reduces noise of a sensitive band by reducing vibration of a heat sink provided in an intelligent power module.

A plasma display device according to an embodiment of the present invention, a plasma display panel, a chassis base for attaching and supporting the plasma display panel, a printed circuit board assembly mounted on the chassis base and electrically connected to the plasma display panel, the An intelligent power module provided in the printed circuit board assembly, and a heat sink attached to the intelligent power module. The heat sink may include a first plate attached to the intelligent power module, a second plate spaced apart from the first plate at a predetermined interval, and arranged in parallel with each other, and between the first plate and the second plate. It may include a plurality of pins extending in a first direction while being connected to each other and arranged side by side in a second direction crossing the first direction.

The first plate, the second plate, and the pins may be integrally formed.

The first plate, the second plate, and two pins positioned at the outermost sides may form a quadrangle by connecting ends of each other based on a cross section cut in a direction perpendicular to the first direction.

The first plate and the second plate may be formed to have the same area, and the area may be wider than that of the intelligent power module.

The heat sink may be formed by cutting an intermediate material processed in a continuous process into a predetermined length.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

1 is a perspective view schematically illustrating an exploded view of a plasma display device according to an embodiment of the present invention.

Referring to this drawing, the plasma display apparatus is provided with a plasma display panel 11 for displaying an image using gas discharge, and is provided on the rear surface of the panel 11 to plan heat generated by the panel 11 due to gas discharge. Heat-dissipating sheets 13 that conduct and spread in a direction, a chassis base 15 attached to the rear surface of the panel 11 via the heat-dissipating sheets 13 to support the panel 11, and the chassis base ( And printed circuit board assemblies 17 mounted on the back of 15 and electrically connected (not shown) to the panel 11 to drive the panel 11.

The panel 11 displays an image by using gas discharge. Since the present embodiment relates to the coupling relationship between the panel 11 and other components, detailed description of the panel 11 is omitted here. . The panel 11 generates heat during gas discharge.

The heat dissipation sheet 13 absorbs the heat and conducts the diffusion in the planar direction of the panel 11. The heat dissipation sheet 13 may be made of various materials such as acrylic heat dissipating material, graphite heat dissipating material, metal heat dissipating material, or carbon nanotube heat dissipating material.

The chassis base 15 is attached to the rear surface of the panel 11 via the heat dissipation sheet 13 to support the panel 11, and the printed circuit board assemblies 17 are mounted on the opposite side of the panel 11. They also support it. The chassis base 15 thus has mechanical rigidity capable of supporting the panel 11 and the printed circuit board assemblies 17.

These printed circuit board assemblies 17 are placed on a boss (see FIG. 4) 18 provided in the chassis base 15 in a plurality, and are set by screw screws 19 fastened to the bosses 18. It is fixed. In addition, the printed circuit board assemblies 17 are provided in plural in order to perform respective functions of driving the panel 11.

That is, the printed circuit board assemblies 17 may include a sustain board assembly 17a for controlling a sustain electrode (not shown), a scan board assembly 17b for controlling a scan electrode (not shown), and an address electrode (not shown). The address buffer board assembly 17c for controlling, an image processing / control board that receives an image signal from the outside, generates a control signal for driving the address electrode and a control signal for driving the sustain electrode and the scan electrode, and applies it to the board assemblies. Assembly 17d, and a power board assembly 17e for supplying power for driving the board assemblies.

Of these printed circuit board assemblies 17, the holding board assembly 17a and the scanning board assembly 17b are involved in sustain discharge. During sustain discharge, the sustain board assembly 17a applies a sustain pulse to the sustain electrode, and the scan board assembly 17b applies a sustain pulse to the scan electrode, and each has an intelligent power module 21. The intelligent power module 21 includes various circuit elements, a printed circuit board on which the same is mounted, and a case for supporting the same. Here, one component that generates heat during driving will be described.

2 is an exploded perspective view illustrating an intelligent power module and a heat sink. The structure of FIG. 2 can be equally applied to the holding board assembly 17a and the scanning board assembly 17b, and hereinafter, the holding board assembly 17a is described as an example for convenience.

The intelligent power module 21 includes a plurality of terminals 21a and is connected to the terminal holes 17aa provided in the circuit pattern of the holding board assembly 17a. These terminals 21a are soldered to the terminal holes 17aa on opposite sides of the holding board assembly 17a.

The intelligent power module 21 mounted on the holding board assembly 17a is attached with a heat sink 23 to dissipate heat generated when the panel 11 is driven. The heat sink 23 radiates heat generated from the intelligent power module 21 to protect the intelligent power module 21 from a thermal load, and enables the intelligent power module 21 to be continuously driven.

The heat sink 23 has a heat dissipation performance and is formed in a structure capable of reducing secondary vibration caused by the vibration of the intelligent power module 21. As an example of such a structure, the heat sink 23 includes a first plate 23a and a second plate 23b and a plurality of fins 23c connecting them.

 The first plate 23a is attached to the intelligent power module 21 to receive heat generated therefrom. The first plate 23a maintains surface contact with the intelligent power module 21 so that the heat transfer can proceed quickly, thereby forming the heat transfer area as wide as possible.

In addition, the area of the first plate 23a is formed to be wider than that of the intelligent power module 21. Such a difference in area may prevent a phenomenon in which heat is stagnated in the first plate 23a since heat is transferred from the intelligent power module 21 to the first plate 23a.

A thermal grease and a heat dissipation pad (not shown) may be interposed between the first plate 23a and the intelligent power module 21 to help heat transfer.

The second plate 23b is formed at positions spaced apart from each other while maintaining a predetermined distance from the first plate 23a to maintain a parallel state. The second plate 23b forms a wide contact area with the outside air and radiates heat transferred from the first plate 23a.

The pins 23c connect the first and second plates 23a and 23b to each other between the first plate 23a and the second plate 23b. As a result, heat transfer proceeds from the first plate 23a to the second plate 23b. In addition, the fins 23c extend in the first direction (y-axis direction in the drawing), respectively, and are arranged side by side along the x-axis direction. These pins 23c are connected to the first plate 23a and the second plate 23b over the entire length in the y-axis direction.

As described above, the heat sink 23 is formed by integrally connecting the first plate 23a, the second plate 23b, and the fins 23c. The integrated structure may be formed of a structure in which a second plate 23b separately manufactured in an existing heat sink (not shown) having a structure of the first plate 23a and the fins 23c is connected to the fins 23c. have.

This embodiment illustrates a heat sink 23 formed by cutting an intermediate material 33 processed in a continuous process into a predetermined length as shown in FIG. In other words, the intermediate member 33 is formed by a processing method such as extrusion or drawing, and the heat sink 23 is formed by cutting of the intermediate member 33. The heat sink 23 using this intermediate material 33 can reduce manufacturing cost compared with the heat sink of the structure which connects and manufactures the 2nd plate 23b separately.

The heat sink 23 is formed into a rectangular cross section by the first plate 23a and the second plate 23b and two fins 23c positioned at the outermost side in the x-axis direction. At this time, the cross-sectional square is formed on the basis of the cross section for cutting the heat sink 23 in the direction perpendicular to the y-axis direction.

One or more pins 23c are also provided between the two outermost pins 23c. One end of the pins 23c in the z-axis direction is connected to the first plate 23a and the other end is connected to the second plate 23b.

When the intelligent power module 21 is driven, vibration is generated therefrom. This vibration is transmitted to the pins 23c through the first plate 23a. These pins 23c have one end in the z-axis direction connected to the first plate 23a and the other end connected to the second plate 23b, so that no individual vibration is generated at each end.

Ends of the second plates 23b of the pins 23c are connected to one and do not vibrate individually, so that noise generation in the sensitive band can be maintained within an acceptable range.

In FIG. 4, the solid arrows show that large vibrations generated by the intelligent power module 21 are transmitted to the pins 23c through the first plate 23a, and the dashed arrows indicate that the pins 23c have the second plate 23b. It is shown that the small vibration transmitted to the pins (23c) is transmitted as one by one by. In other words, the vibration transmitted to the pins 23c is gradually weakened from the first plate 23a to the second plate 23b.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, the heat sink included in the intelligent power module is configured by the first and second plates and the pins connecting them, so that the heat generated by the intelligent power module transferred to the heat sink is reduced. At the same time as the divergence, by holding the end of the pins exposed to the vibration generated by the intelligent power module with the second plate, there is an effect of reducing the noise of the sensitive band due to the vibration of the pins.

Claims (5)

A plasma display panel; A chassis base to which the plasma display panel is attached and supported; A printed circuit board assembly mounted on the chassis base and electrically connected to the plasma display panel; An intelligent power module provided in the printed circuit board assembly; And A heat sink attached to the intelligent power module, The heat sink is, A first plate attached to the intelligent power module; A second plate spaced apart from the first plate at a predetermined interval and disposed in parallel to each other; And At least three pins extending in a first direction and arranged side by side in a second direction intersecting the first direction while connecting both to each other between the first plate and the second plate, Two outermost pins of the pins, the first plate and the second plate, And a plurality of ends connected to each other based on a cross section cut in a direction perpendicular to the first direction. According to claim 1, And the first plate, the second plate, and the fins are integrally formed. According to claim 1, 2. The plasma display apparatus of claim 1, wherein the first plate, the second plate, and the two outermost fins form a quadrangle. According to claim 1, The first plate and the second plate is formed in the same area, And the area is wider than that of the intelligent power module. According to claim 1, And the heat sink is formed by cutting an intermediate material processed in a continuous process into a predetermined length.

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