KR100717799B1 - Plasma display device - Google Patents

Abstract

Plasma display device of the present invention, to reduce the vibration generated by the heat sink of the switching element and the resulting noise, a plasma display panel, a chassis base for attaching and supporting the plasma display panel, mounted on the chassis base and the plasma A printed circuit board assembly electrically connected to a display panel, a switching element provided on a circuit board of the printed circuit board assembly, a heat sink attached to the switching element, and a vibration damping member interposed between the heat sink and the circuit board. Include.

Plasma display, chassis base, damping element, heat sink

Description

Plasma Display Device {PLASMA DISPLAY DEVICE}

1 is a perspective view schematically illustrating an exploded view of a plasma display device according to a first embodiment of the present invention.

2 is an exploded perspective view of the field effect transistor, the heat sink, and the vibration suppressing member.

3 is a cross-sectional view taken along line III-III of FIG. 2.

4 is a cross-sectional view taken along the line IV-IV of FIG. 2.

5 is an exploded perspective view illustrating a field effect transistor, a heat sink, and a vibration suppressing member according to a second exemplary embodiment of the present invention.

FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display device for reducing vibration generated by a heat sink of a switching element and noise.

In general, a plasma display apparatus generates a plasma by gas discharge and displays an image using the plasma, a plasma display panel for supporting the panel, and a plurality of printed circuits mounted on the chassis base. Printed circuit board assemblies.

The plasma display panel has two glass substrates facing each other, and a discharge space is formed therein, and thus has a weak mechanical rigidity against impact. Therefore, the chassis base is formed of a metal having a higher mechanical rigidity than the glass substrate to support the panel.

In addition to supporting the mechanical stiffness of the panel, the chassis base provides mounting space for printed circuit board assemblies, heat sink function of the panel, and electromagnetic interference (EMI). ) It is in charge of grounding function.

In addition, a panel with a double-sided tape is attached to the front of the chassis base so that the chassis base performs the above functions, and printed circuit board assemblies are mounted to the rear of the chassis base.

The back of the chassis base has a plurality of bosses, which are mounted on the boss and fixedly mounted by fastening a set screw to the boss.

These printed circuit board assemblies are provided in plural to perform the respective functions for driving the panel. That is, the printed circuit board assemblies include a sustain board assembly for controlling the sustain electrode, a scan board assembly for controlling the scan electrode, an address buffer board assembly for controlling the address electrode, and a control signal for driving the address electrode by receiving an image signal from the outside. And an image processing / control board assembly for generating control signals required for driving the sustain electrodes and the scan electrodes and applying them to the board assemblies, and a power board assembly for supplying power for driving the board assemblies.

The holding board assembly is connected to the sustain electrode which is drawn out from the inside of the panel, the scan board assembly is connected to the scan electrode which is drawn out from the inside of the panel, and the address buffer board assembly is connected to the address electrode drawn out from the inside of the panel. It is connected via a flexible printed circuit and a connector.

In addition, the sustain board assembly and the scan board assembly include a power switching element such as a power transistor and a field effect transistor (FET) and a power switching element for applying driving signals to the sustain electrode and the scan electrode, respectively. A driving circuit for driving, and a protection circuit for protecting the power switching element are provided.

These power switching elements are formed in one package or are each provided as a single element. When provided as a single element, in order to radiate heat generated during high frequency driving, each switching element is provided with a heat sink on one side. The switching elements generate vibrations as they are turned on and off at high frequencies, which vibrate the heat sink to generate noise.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display device which reduces vibrations and noise generated in a heat sink of a switching element.

A plasma display device according to an embodiment of the present invention, a plasma display panel, a chassis base for attaching and supporting the plasma display panel, a printed circuit board assembly mounted on the chassis base and electrically connected to the plasma display panel, the And a switching element provided on the circuit board of the printed circuit board assembly, a heat sink attached to the switching element, and a vibration damping member interposed between the heat sink and the circuit board.

The heat sink may support a side surface of the switching element and have a predetermined length in a first direction, and protrude in a second direction perpendicular to the plate plane at both ends of the plate on which the switching element is located. First fins formed parallel to each other along a first direction, second fins protruding in a second direction opposite to the first fins from the plate opposite to the switching element and formed parallel to each other along the first direction It may include.

In addition, the plasma display device according to an embodiment of the present invention includes a screw member fastened to the screw hole of the circuit board through the second fins of the heat sink.

The vibration damping member may include a first member that is formed to extend in the first direction corresponding to the plate of the heat sink, and the second fins that are positioned at the outermost side with the first fins at both ends of the first member. The second member and the third member may be formed to extend in the second direction.

The vibration damping member may include a first member extending in the first direction corresponding to the plate of the heat sink, and corresponding to the second fins positioned at the outermost sides of the first fins at both ends of the first member. It may include a second member and a third member elongated in the second direction, and a fourth member protruding in the second direction from the plate to be parallel to them between the second member and the third member. .

The second fin side of the second member, the second fin side of the third member, and the fourth member side may correspond to each of the second fins of the heat sink.

At least one fourth member may be formed.

The vibration damping member may be formed of an electrical insulation material.

The switching element may be formed of a field effect transistor.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

1 is a perspective view schematically illustrating an exploded view of a plasma display device according to a first embodiment of the present invention.

Referring to this drawing, the plasma display apparatus is provided with a plasma display panel 11 for displaying an image using gas discharge, and is provided on the rear surface of the panel 11 to plan heat generated by the panel 11 due to gas discharge. Heat-dissipating sheets 13 that conduct and spread in a direction, a chassis base 15 attached to the rear surface of the panel 11 via the heat-dissipating sheets 13 to support the panel 11, and the chassis base ( And printed circuit board assemblies 17 mounted on the rear surface of the substrate 15 and electrically connected to the panel 11 to drive the panel 11.

Since the panel 11 displays an image by using gas discharge, embodiments of the present invention relate to the coupling relationship between the panel 11 and other components, and thus, the detailed description of the panel 11 will be omitted. Omit. The panel 11 generates heat during gas discharge.

The heat dissipation sheet 13 absorbs the heat and conducts the diffusion in the planar direction of the panel 11. The heat dissipation sheet 13 may be made of various materials such as acrylic heat dissipating material, graphite heat dissipating material, metal heat dissipating material, or carbon nanotube heat dissipating material.

The chassis base 15 is attached to the rear surface of the panel 11 via the heat dissipation sheet 13 to support the panel 11, and the printed circuit board assemblies 17 are mounted on the opposite side of the panel 11. They also support it. The chassis base 15 thus has mechanical rigidity capable of supporting the panel 11 and the printed circuit board assemblies 17.

These printed circuit board assemblies 17 are placed on bosses (not shown) provided in the chassis base 15 in a plurality, and fixed by set screws 19 fastened to the bosses. In addition, the printed circuit board assemblies 17 are provided in plural in order to perform respective functions of driving the panel 11.

That is, the printed circuit board assemblies 17 include a sustain board assembly 117 that controls the sustain electrode (not shown), a scan board assembly 17b that controls the scan electrode (not shown), and an address electrode (not shown). The address buffer board assembly 17c for controlling, an image processing / control board that receives an image signal from the outside, generates a control signal for driving the address electrode and a control signal for driving the sustain electrode and the scan electrode, and applies it to the corresponding board assemblies. Assembly 17d, and a power board assembly 17e for supplying power for driving the board assemblies.

Of these printed circuit board assemblies 17, the holding board assembly 117 and the scanning board assembly 17b are involved in sustain discharge. During sustain discharge, the sustain board assembly 117 applies a sustain pulse to the sustain electrode, and the scan board assembly 17b applies a sustain pulse to the scan electrode. For this purpose, power switching elements such as power transistors are used. (Not shown) and field effect transistors (FETs) 21 and the like (see FIG. 2). Hereinafter, for convenience, one field effect transistor 21 will be described as an example of a switching element.

2 is an exploded perspective view of the field effect transistor, the heat sink, and the vibration suppressing member. The structure of FIG. 2 can be equally applied to the holding board assembly 117 and the scanning board assembly 17b, and hereinafter, the holding board assembly 117 will be described as an example for convenience.

The field effect transistor 21 has a plurality of terminals 21a and is connected to a terminal hole 17aa provided in a circuit pattern formed on the circuit board 17a of the holding board assembly 117. These terminals 21a are connected by soldering to the terminal holes 17aa on opposite sides of the circuit board 17a.

In this way, the field effect transistor 21 mounted on the circuit board 17a is turned on and off by high frequency in order to drive the panel 11, and generates heat and vibration. A heat sink 23 is attached to the field effect transistor 21 to radiate this heat. Also, in order to reduce the vibration transmitted from the field effect transistor 21 to the heat sink 23 and to reduce the noise due to the vibration, the damping member 25 is provided between the heat sink 23 and the circuit board 17a. Is provided.

The heat sink 23 absorbs and radiates heat generated from the field effect transistor 21 to protect the field effect transistor 21 from a thermal load, thereby enabling continuous operation of the field effect transistor 21. Therefore, the heat sink 23 is formed to have a structure that widens the heat dissipation area in order to quickly absorb heat and rapidly radiate the absorbed heat.

As an example, the heat sink 23 includes a plate 23a, first fins 23b, and second fins 23c. Since the field effect transistor 21 is installed on the circuit board 17a in a direction perpendicular to its plane, the heat sink 23 attached to the field effect transistor 21 is also perpendicular to the plane board thereof. Direction is installed.

The plate 23a is formed in a plate shape and is perpendicular to the circuit board 17a, has a predetermined length in the first direction (y-axis direction in the drawing), and supports the side surface of the field effect transistor 21. Thereby absorbing heat. The area of the plate 23a is formed to be larger than that of the field effect transistor 21 (see Fig. 3). Therefore, heat generated in the field effect transistor 21 may be transferred to the plate 23a having a large area within a short time. In this case, the area means an area of planes corresponding to each other in parallel with the heat sink 23 attached to the field effect transistor 21.

The first fins 23b protrude in the vertical direction (x-axis direction) with respect to the plate 23a at both ends of the plate 23a on which the field effect transistor 21 is located, and are formed long in the z-axis direction. Therefore, the first pins 23b are provided at both ends of the y-axis direction of the plate 23a and formed parallel to each other along the y-axis direction. The field effect transistor 21 is disposed in surface contact with the plate 23a between the first pins 23b, and the screw hole 23aa of the plate 23a is formed through the through hole 21b formed in the field effect transistor 21. It is mounted by a screw (21c) fastened to.

In addition, the second fins 23c protrude from the plate 23a in the x-axis direction opposite to the first fins 23b and are formed parallel to each other in the y-axis direction. Since the second fins 23c may be formed in a portion of the plate 23a corresponding to the field effect transistor 21, the second fins 23c may be provided in two or more, and when formed in three or more, the second fins 23c are disposed at the same interval from each other. The equal spacing of the second fins 23c enables uniform heat dissipation in the plate 23a.

The heat sink 23 configured as described above is connected to the circuit board by the screw member 27 fastened to the screw hole 171ab provided in the circuit board 17a through the z-axis direction between the second fins 23c. Mounted on 17a). This heat sink 23 can be mounted by the method of using the screw member 27 or soldering to the ground pattern, depending on the size and the mounting position on the circuit board 17a.

On the other hand, the vibration damping member 25 is interposed between the heat sink 23 and the circuit board 17a for dissipating heat generated by the field effect transistor 21, thereby suppressing vibration generated by the driving of the field effect transistor 21. Absorb and reduce.

That is, vibration generated in the field effect transistor 21 is transmitted to the heat sink 23 and also to the circuit board 17a. Therefore, the damping member 25 catches the heat sink 23 to reduce vibration, and also reduces the vibration transmitted from the heat sink 23 to the circuit board 17a. Reduction of this vibration reduces noise due to vibration of the heat sink 23 and the circuit board 17a.

The damping member 25 is formed of a softer material than the heat sink 23 and the circuit board 17a, and is formed of an electrical insulating material to prevent the short generation of a circuit pattern of the circuit board 17a. The damping member 25 may be formed in various shapes that may be interposed between the heat sink 23 and the circuit board 17a, and at least a part of the heat sink 23 is supported by the circuit board 17a. Is formed.

This vibration damping member 25 is formed of the first member 25a, the second member 25b, and the third member 25c. The first member 25a is formed long in the y-axis direction corresponding to the plate 23a of the heat sink 23. The second member 25b and the third member 25c are formed long in the x-axis direction at both ends of the first member 25a to correspond to the first pins 23b and the second pins 23c connected thereto. . In this case, the second pins 23c connected to each other are the outermost parts of the second pins 23c in the y-axis direction.

3 and 4, the vibration generated in the field effect transistor 21 is transmitted to the plate 23a of the heat sink 23. As shown in FIG. The vibration transmitted to this plate 23a is transmitted to the first member 25a of the damping member 25 and reduced. Vibration transmitted to the plate 23a is transmitted to the second member 25b and the third member 25c of the damping member 25 through the first pins 23b and the second pins 23c and is reduced. 3 and 4, the solid arrow indicates that vibration generated in the field effect transistor 21 is transmitted to the vibration suppression member 25, and the dashed arrow indicates that the vibration transmitted to the vibration suppression member 25 is attenuated and weakened. it means.

5 is an exploded perspective view illustrating a field effect transistor, a heat sink, and a vibration suppressing member according to a second exemplary embodiment of the present invention, and FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5.

Referring to these drawings, the second embodiment will be described here in terms of different parts since the overall configuration and operation and effect are similar to those of the first embodiment when compared with the first embodiment.

The holding board assembly 117 of the first embodiment illustrates that the vibration damping member 25 is formed of the first member 25a, the second member 25b, and the third member 25c. The retaining board assembly 217 illustrates the damping member 225 further having a fourth member 225d.

The damping member 225 of the second embodiment includes a first member 225a, a second member 225b, a third member 225c and a fourth member 225d as in the first embodiment.

The fourth member 225d protrudes from the plate 225a opposite to the field effect transistor 21 in the x-axis direction so as to be parallel to the second member 225b and the third member 225c. The fourth member 225d may be formed of only one, or two or more plurality of the fourth members 225d may be formed according to the distance between the second members 225d and 225c.

The fourth member 225d corresponds to the second pin 23c on the second member 225b side, the second pin 23c on the third member 225c side, and the second pin 23c therebetween, respectively. do.

Vibration generated by the field effect transistor 21 may be applied to the first member corresponding to the damping member 225 through the plate 23a, the first fins 23b, and the second fins 23c of the heat sink 23. 225a), the second member 225b, and the third member 225c are delivered to the fourth member 225d at the same time.

Therefore, the whole area of the flat cross section (cross section parallel to the circuit board 17a) of the heat sink 23 is supported by the circuit board 17a via the damping member 25. FIG. This second embodiment has a higher vibration damping efficiency than the first embodiment.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, the vibration damping member absorbs vibration generated by the switching element and transmitted to the heat sink by interposing a vibration damping member between the heat sink and the circuit board of the switching element, thereby providing a heat sink or the like. By reducing the vibration of the circuit board has the effect of reducing the noise caused by this vibration.

Claims (9)

A plasma display panel; A chassis base to which the plasma display panel is attached and supported; A printed circuit board assembly mounted on the chassis base and electrically connected to the plasma display panel; A switching element provided on the circuit board of the printed circuit board assembly; A heat sink attached to the switching element; And A damping member interposed between the heat sink and the circuit board, The heat sink is, A plate supporting a side of the switching element and having a predetermined length in a first direction; First fins protruding from one end of the plate on which the switching element is located to both sides of the second direction and parallel to each other along the first direction with respect to the second direction crossing the first direction. ; And And second fins protruding from the plate opposite to the switching element to the other of both sides of the second direction so as to be parallel to each other along the first direction. delete According to claim 1, And a screw member fastened to the screw hole of the circuit board through the second fins of the heat sink. According to claim 1, The damping member is, A first member elongated in the first direction corresponding to the plate of the heat sink, and And a second member and a third member extending in the second direction corresponding to the first fins and the second fins at both ends of the first member. According to claim 1, The damping member is, A first member elongated in the first direction corresponding to the plate of the heat sink; Second and third members formed at both ends of the first member to extend in the second direction corresponding to the first pins and the second pins; and And a fourth member protruding from the plate to the opposite side of the switching element in a second direction so as to be parallel between the second member and the third member. The method of claim 5, And the second fin side of the second member, the second fin side of the third member, and the fourth member side correspond to each of the second fins of the heat sink. The method of claim 5, And at least one fourth member. According to claim 1, And the vibration damping member is formed of an electrical insulating material. According to claim 1, And the switching element is formed of a field effect transistor.

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