KR100739053B1 - A plasma display device - Google Patents

Abstract

The plasma display device of the present invention improves heat dissipation performance of a driver integrated circuit and prevents interference between elements provided in the cover plate and the address buffer board, and includes a plasma display panel, a chassis base, a driver integrated circuit package, and a cover. A plate, and a heat sink provided on the cover plate. This chassis base attaches the plasma display panel to the front and mounts the circuit board assembly to the rear. The driver integrated circuit package includes a driver integrated circuit for connecting a terminal of an electrode withdrawn from a plasma display panel to the circuit board assembly and generating a pulse to be selectively applied to an electrode of the plasma display panel. The cover plate is provided at the rear end of the chassis base to cover the driver integrated circuit package and to be inclined from the end of the chassis base toward the circuit board assembly side.

Driver IC, TCP, Cover Plate, Reinforcement, Heat Sink

Description

Plasma Display Device {A PLASMA DISPLAY DEVICE}

1 is an exploded perspective view of a plasma display device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1.

3 is an exploded perspective view of the cover plate and the heat sink;

The present invention relates to a plasma display device, and more particularly, to a plasma display device that improves heat dissipation performance of a driver integrated circuit and prevents interference between elements provided in a cover plate and an address buffer board.

The plasma display device is an apparatus for displaying an image on a plasma display panel (PDP) using plasma generated by gas discharge.

The plasma display device includes a PDP, a chassis base that supports the PDP, and a display electrode (holding) which is mounted on the opposite side of the chassis base and positioned inside the PDP through a flexible printed circuit (FPC), a connector, or the like. Electrode and scan electrode) or a plurality of circuit board assemblies connected to the address electrode.

This PDP has a weak mechanical rigidity against impact because the PDP seals two glass substrates face to face and forms a discharge space therein. Since the PDP generates heat during driving, the PDP is provided with a thermally conductive sheet on its rear surface. This thermally conductive sheet rapidly conducts and diffuses heat generated in the PDP in the planar direction.

The chassis base is formed of a metallic material having a high mechanical rigidity to support the PDP, and is attached to the PDP through a double-sided tape. In addition to maintaining the rigidity of the PDP, the chassis base is responsible for the mounting support of the circuit board assembly, the heat sink function of the PDP, and the electromagnetic interference (“EMI”) grounding function.

The PDP supported on the chassis base addresses the discharge cells by the address electrodes and the scan electrodes provided in the intersecting state therein, and sustains and discharges the discharge cells by the sustain electrodes and the scan electrodes provided in the selected discharge cells. Implement

The flexible circuit (FPC) connects electrodes provided in the PDP to the circuit board assembly. Thus the electrodes are controlled according to the control signal of the circuit board assembly.

The address electrode is connected to the address buffer board via the driver integrated circuit (IC). This driver IC is provided in the FPC in a packaged state and applies an address pulse to the address electrode.

This driver IC generates high heat and EMI by applying an address pulse to the address electrode within a short time for the gray scale representation in the PDP. The address buffer board includes elements such as resistors and capacitors to configure the circuit to reduce EMI.

In order to dissipate high heat generated in the driver IC, a heat sink may be provided on the driver IC side. In this case, the heat sink should be formed with a short length not reaching the elements so as not to interfere with the elements provided in the address buffer board.

In the case where the heat sink is formed long to improve heat dissipation performance, the heat sink should be formed at a position higher than the elements.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display device which improves heat dissipation performance of a driver integrated circuit and prevents interference between elements provided in the cover plate and the address buffer board. There is.

The plasma display device according to the present invention includes a plasma display panel, a chassis base, a driver integrated circuit package, a cover plate, and a heat sink provided on the cover plate. This chassis base attaches the plasma display panel to the front and mounts the circuit board assembly to the rear. The driver integrated circuit package includes a driver integrated circuit for connecting a terminal of an electrode withdrawn from a plasma display panel to the circuit board assembly and generating a pulse to be selectively applied to an electrode of the plasma display panel. The cover plate is provided at the rear end of the chassis base to cover the driver integrated circuit package and to be inclined from the end of the chassis base toward the circuit board assembly side.

The driver integrated circuit package may be formed as a tape carrier package.

The chassis base is preferably provided with a reinforcing member at its rear end. In this case, the driver integrated circuit package is provided between the reinforcing member and the cover plate.

The cover plate may be formed including an aluminum material having excellent thermal conductivity.

The cover plate may include an inner surface that is formed in parallel with the driver integrated circuit, and an outer surface that is formed to be inclined with the driver integrated circuit by forming a thickness between the inner surface that increases gradually from the lower end to the upper end.

The cover plate includes an extension part which is formed in a line with the outer surface in an incremental direction of thickness and is provided above the circuit board assembly.

The heat sink may be disposed in plurality along the length direction of the cover plate.

The driver integrated circuit and the reinforcing member interpose a thermal grease therebetween, and the driver integrated circuit and the cover plate interpose a thermally conductive sheet therebetween.

The circuit board assembly places elements having a long protruding length among elements installed therein at a position far from the driver integrated circuit. This circuit board assembly is an address buffer board.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a plasma display device according to an embodiment of the present invention, Figure 2 is a cross-sectional view taken along the line II-II of FIG.

The plasma display device includes a PDP 11 for displaying an image using gas discharge, a chassis base 17 provided on the rear side of the PDP 11, and a circuit board provided behind the chassis base 17. Assemblies 15. These circuit board assemblies 15 are electrically connected to the PDP 11 to drive the PDP 11.

The heat dissipation sheet 13 and the double-sided tape 16 are interposed between the rear surface of the PDP 11 and the front surface of the chassis base 17. The heat dissipation sheet 13 conducts and diffuses heat generated in the PDP 11 in the plane direction (x-y plane direction) when the PDP 11 is driven.

The heat dissipation sheet 13 may be made of an acrylic heat dissipating material having excellent thermal conductivity, a graphite heat dissipating material, a metal heat dissipating material, or a carbon nanotube heat dissipating material.

The double-sided tape 16 attaches the PDP 11 and the chassis base 17 to each other at a position where the heat dissipation sheet 13 is not provided. The double-sided tape 16 adheres the PDP 11 and the chassis base 17 to each other so that the heat dissipation sheet 13 is closely arranged on the rear surface of the PDP 11 and the front surface of the chassis base 17.

As shown in FIG. 2, the circuit board assemblies 15 are mounted with a set screw 19 to the boss 18 of the chassis base 17. The circuit board assembly 15 includes an image processing / control board 115, an address buffer board 215, a scan drive board 315, a sustain drive board 415, and a power board 515.

The image processing / control board 115 receives an image signal from the outside to generate a control signal necessary for driving the address electrode 21, the sustain electrode, or the scan electrode, thereby generating the address buffer board 215 and the scan driving board 315. Or the sustain drive board 415, respectively. The address buffer board 215 controls the driver IC 25 that generates an address pulse. The power board 515 supplies the power required for driving the plasma display device as a whole.

The address buffer board 215, the scan driving board 315, and the sustain driving board 415 serve as the FPC 23 to drive the PDP 11 to the address electrode 21 and the scan electrode (not shown) of the PDP 11. And a sustain electrode (not shown), respectively. This embodiment illustrates a structure in which the address buffer board 215 and the address electrode 21 are connected to the FPC 23.

The driver IC 25 is interposed between the address buffer board 215 and the address electrode 21. The driver IC 25 generates an address pulse in accordance with the control signal of the address buffer board 215 and selectively applies this address pulse to the address electrode 21.

By the address pulse applied to the address electrode 21 and the scan pulse applied to the scan electrode, address discharge occurs in the discharge cell where the address electrode 21 and the scan electrode intersect.

This driver IC 25 is provided in the FPC 23 in a packaged state. This driver IC package is available in various forms. This embodiment illustrates a Tape Carrier Package (" TCP ") 27 as an example of a driver IC package.

The input terminal of the TCP 27 is connected to the address buffer board 215, and the output terminal thereof is connected to the address electrode 21 through the FPC 23. That is, the address electrode 21 is drawn out through the FPC 23 and connected to the address buffer board 215 through the TCP 27 and the driver IC 25 disposed at the rear end of the chassis base 17. do.

The chassis base 17 may be formed by pressing a thin metal material. In this case, the chassis base 17 is bent to have mechanical rigidity that can withstand torsional and bending forces.

In addition, the chassis base 17 may be provided with a reinforcing member 29 on its rear surface. The reinforcing member 29 may be appropriately formed at a position to avoid spatial interference with the circuit board assemblies 15 installed at the rear of the chassis base 17.

Of the reinforcing members 29, one reinforcing member 129 is preferably provided at the rear end of the chassis base 17. The reinforcing member 129 supports the driver IC 25 and the TCP 27 that connect the address electrode 21 to the address buffer board 215.

The reinforcing member 129 has a long side (x-axis direction) and a short side (y-axis direction) in a rectangular chassis base 17, and its long side direction (x-axis direction) at the rear side long side end portion of the chassis base 17. It is formed long along.

The cover plate 31 is provided at the rear end of the chassis base 17 provided with the reinforcing member 129 to cover the TCP 27 and move from the end of the chassis base 17 toward the address buffer board 215. It is formed to be inclined. The cover plate 31 may be provided with a heat sink 37.

When the reinforcing member 129 is provided, the cover plate 31 is mounted to the reinforcing member 129 with a set screw 33. The TCP 27 and the driver IC 25 are provided between the reinforcing member 129 and the cover plate 31.

As shown in FIG. 3, the cover plate 31 includes a mounting portion 133 formed in a plane parallel to the driver IC 25, and a through hole 233 formed in the mounting portion 133. The mounting portion 133 in the planar state forms a close contact structure between the cover plate 31 and the driver IC 25 which are formed to be inclined as a whole, and improves the thermal conductivity performance.

By inserting the set screw 33 into the through hole 233 and fastening to a screw hole (not shown) provided in the reinforcing member 129, the cover plate 31 is provided between the driver IC 25 and TCP 27 between. In addition, the reinforcing member 129 is mounted.

By this fastening, the cover plate 31 and the reinforcement member 29 fix the driver IC 25, and heat generated when the driver IC 25 is driven to the cover plate 31 and the reinforcement member 29, respectively. Heat dissipation.

The cover plate 31 may be independently configured to correspond to each of the TCP 27 provided in the longitudinal direction (x-axis direction) of the end of the chassis base 17 in a plurality (not shown).

In addition, as shown in FIG. 1, the cover plate 31 may be formed long along the long side direction (x-axis direction) of the chassis base 17 to cover the plurality of TCPs 27.

The cover plate 31 elongated in this long side direction makes mounting of the cover plate 31 more convenient than a cover plate (not shown) formed independently of the respective TCPs 27, and provides a specific driver IC 25. ) Can prevent the concentrated load from working.

The driver IC 25 and the reinforcing member 129 may interpose a thermal grease 34 therebetween, and the driver IC 25 and the cover plate 31 may interpose a thermal conductive sheet 35 therebetween. have. In this case, when the driver IC 25 is driven, the high heat generated by the driver IC 25 is radiated to the reinforcing member 129 through the thermal grease 34, and the cover plate 31 through the heat conductive sheet 35. Heat dissipation to the side. Heat transferred to the cover plate 31 may be more effectively radiated through the heat sink 37.

The cover plate 31 may be formed of an aluminum material having excellent thermal conductivity. In addition, since the cover plate 31 includes a heat sink 37 on an outer surface thereof, the cover plate 31 may be formed of the same material as the heat sink 37.

The cover plate 31 includes an inner surface 131 and an outer surface 231 forming a variable thickness to form an inclined structure. The inner surface 131 is preferably formed in a plane parallel to the driver IC 25. The outer surface 231 forms a thickness that increases gradually from the bottom of the cover plate 31 to the top in forming a thickness with the inner surface 131 (see FIG. 2). The outer surface 231 is formed to be inclined with the plane of the driver IC 15. That is, the thickness formed by the inner surface 131 and the outer surface 231 increases from the driver IC 25 side toward the opposite end of the address buffer board 215.

In addition, the cover plate 31 further includes an extension 331. The extension part 331 is formed in a straight line with the outer surface 231 at the cover plate 31, and is formed to have a constant thickness, and an upper end thereof is provided at the rear of the address buffer board 215 (see FIG. 2).

This extension part 331 increases the mounting area of the heat sink 37 and improves the heat dissipation performance of the driver IC 25.

Also, the distance L1 formed between the inner surface 131 of the cover plate 31 and the TCP 27 is shorter than the distance L2 formed between the upper end of the cover plate 31 and the address buffer board 215. Is formed.

The heat sink 37 may be injured in multiples along the longitudinal direction of the cover plate 31. The heat sink 37 may be formed longer than the length of the cover plate 31 in the inclined direction.

Therefore, the high heat generated when driving the driver IC 25 is radiated to the cover plate 31 and the heat sink 37 through the heat conductive sheet 35, and radiated to the reinforcing member 129 through the thermal grease 34. do.

On the other hand, the address buffer board 215 includes several elements 38 to reduce EMI in a circuit configuration. These elements 38 place long protruding elements 38 protruding on the address buffer board 215 at a position far from the driver IC 25.

This arrangement improves the heat dissipation performance of the driver IC 25 through the heat sink 37 and prevents spatial interference with the elements 38 and the cover plate 31 or the heat sink 37.

In addition, when the heat sink 37 is formed to be longer than the inclined length of the cover plate 31, the heat sink 37 and the elements 38 do not spatially interfere, and the heat dissipation performance of the driver IC 25 Can be further improved.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, a reinforcing member is provided at the long side end of the chassis base, the driver IC is provided in the TCP state on the reinforcing member, and the TCP is covered with the cover plate. Since the cover plate is formed to be inclined and a heat sink is provided on the outer surface of the cover plate, the heat dissipation performance of the driver IC is improved, and the effect of preventing spatial interference between the top of the cover plate and the elements provided in the address buffer board is provided. There is.

Claims (11)

A plasma display panel; A chassis base attaching the plasma display panel to the front surface and mounting the circuit board assembly to the rear; A driver integrated circuit package having a driver integrated circuit connecting a terminal of an electrode withdrawn from the plasma display panel to the circuit board assembly and generating a pulse to be selectively applied to an electrode of the plasma display panel; A cover plate provided at a rear end of the chassis base to cover the driver integrated circuit package and to be inclined from the end of the chassis base toward the circuit board assembly; And And a heat sink provided on the cover plate. The method of claim 1, The driver integrated circuit package is formed of a tape carrier package (Tape Carrier Package). The method of claim 1, And said chassis base has a reinforcing member at its rear end. The method of claim 3, The driver integrated circuit package is provided between the reinforcing member and the cover plate. The method of claim 1, And the cover plate is formed of an aluminum material. The method of claim 1, The cover plate, An inner surface formed in parallel with the driver integrated circuit, An outer surface formed integrally with the inner surface and inclined with the driver integrated circuit; And a thickness formed between the inner surface and the outer surface gradually increases from the bottom to the top. The method of claim 6, And the cover plate includes an extension part formed in a line with the outer surface and provided at a rear side of the circuit board assembly. The method of claim 1, And a plurality of heat sinks disposed along a length direction of the cover plate. The method of claim 3, The driver integrated circuit and the reinforcing member are interposed therebetween by thermal grease, And the driver integrated circuit and the cover plate interpose a thermally conductive sheet therebetween. The method of claim 1, And the circuit board assembly disposing elements having a long protruding length among the elements installed therein at a position far from the driver integrated circuit. The method of claim 10, And the circuit board assembly is an address buffer board.

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