CN217217014U - Mixed-compression high-frequency double-layer circuit board with heat insulation structure - Google Patents
Mixed-compression high-frequency double-layer circuit board with heat insulation structure Download PDFInfo
- Publication number
- CN217217014U CN217217014U CN202220895156.0U CN202220895156U CN217217014U CN 217217014 U CN217217014 U CN 217217014U CN 202220895156 U CN202220895156 U CN 202220895156U CN 217217014 U CN217217014 U CN 217217014U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- board main
- groups
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a mixed-pressing high-frequency double-layer circuit board with a heat insulation structure, which belongs to the technical field of double-layer circuit boards and comprises a first circuit board main body and a second circuit board main body, wherein the opposite side walls of the first circuit board main body and the second circuit board main body are respectively provided with a heat insulation layer, the opposite side walls of two groups of heat insulation layers are respectively provided with a heat absorption plate, the inner parts of the two groups of heat insulation layers are respectively provided with a plurality of groups of heat absorption sheets, one ends of the two groups of heat absorption sheets are respectively connected with the opposite side walls of the first circuit board main body and the second circuit board main body, the far side walls of the two groups of shielding layers are respectively provided with a first heat insulation layer, and the far side walls of the two groups of heat insulation layers are respectively provided with a protection layer, the service life of the double-layer circuit board is prolonged.
Description
Technical Field
The utility model relates to a double-deck circuit board technical field specifically is a thoughtlessly press high frequency double-deck circuit board with thermal-insulated structure.
Background
The double-layer circuit board has copper on both sides and metallized holes, namely, the copper on both sides, because the area of the double-layer board is doubled compared with that of a single panel, the double-layer circuit board has the advantages of convenient and concise wiring and lower wiring labor intensity, and the double-layer board with shorter circuit length solves the difficulty of wiring staggering in the single panel, and is more suitable for being used on a circuit which is more complicated than the single panel.
The existing mixed-compression high-frequency double-layer circuit board is simple in overall structure, does not have a certain heat insulation structure, and heat conduction between the double-layer circuit board and the double-layer circuit board is caused to influence the connection stability between the double-layer circuits when the double-layer circuit board is used.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a thoughtlessly press high frequency double-deck circuit board with thermal-insulated structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a thoughtlessly press high frequency double-deck circuit board with thermal-insulated structure, includes first circuit board main part and second circuit board main part, first circuit board main part and second circuit board main part relative lateral wall all are equipped with the insulating layer, and are two sets of insulating layer relative lateral wall all is equipped with the absorber plate, and is two sets of the inside multiunit absorber plate that all is equipped with of insulating layer, and is two sets of absorber plate one end is connected with first circuit board main part and second circuit board main part relative lateral wall respectively, and is two sets of the absorber plate other end is respectively with two sets of the absorber plate is kept away from the lateral wall and is connected, and is two sets of the absorber plate relative lateral wall is equipped with the heating panel, first circuit board main part and second circuit board main part keep away from the lateral wall mutually and all are equipped with the shielding layer, and two sets of the shielding layer keeps away from the lateral wall mutually and all is equipped with the protective layer.
Furthermore, the multiple groups of heat absorbing sheets are distributed in a linear array inside the heat insulation layer.
Furthermore, a heat dissipation flow channel communicated with the outside is transversely formed inside the heat dissipation plate, heat dissipation holes are uniformly formed in the upper side wall and the lower side wall of the heat dissipation plate, and the heat dissipation holes are communicated with the inside of the heat dissipation flow channel.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses can prevent first circuit board main part and the mutual heat conduction of second circuit board main part under the effect of insulating layer, improve the stability of connecting between the double-layer circuit, can prevent the external environment to carry out the condition of heat conduction to the double-layer circuit board under the effect of insulating layer one simultaneously, improve the life of double-layer circuit board, can absorb the heat that first circuit board main part and second circuit board main part produced under the effect of heat absorption piece and absorber plate, then can distribute away the heat under the effect of heating panel, can be better dispel the heat under the effect of louvre, can be quick distribute away the heat under the cooperation of heat dissipation runner, improve the radiating effect of double-layer circuit board, prevent the problem of double-layer circuit board because of the high damage of temperature, make the life of double-layer circuit board increase.
2. This practicality can shield external signal under the effect of shielding layer, prevents that external signal from influencing first circuit board main part and second circuit board main part for first circuit board main part and second circuit board main part can normally work.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic diagram of the structure of the heat dissipation plate of the present invention.
In the figure: 1. a first circuit board main body; 2. a heat dissipation plate; 3. a heat absorbing plate; 4. a thermal insulation layer; 5. a heat absorbing sheet; 6. a second circuit board main body; 7. a shielding layer; 8. a first heat insulation layer; 9. a protective layer; 10. a heat dissipation flow channel; 11. and (4) heat dissipation holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1, the present invention provides a technical solution: the utility model provides a thoughtlessly press high frequency double-deck circuit board with thermal-insulated structure, including first circuit board main part 1 and second circuit board main part 6, first circuit board main part 1 and 6 relative lateral walls of second circuit board main part all are equipped with insulating layer 4, two sets of 4 relative lateral walls of insulating layer all are equipped with absorber plate 3, two sets of 4 inside multiunit heat-absorbing fins 5 that all are equipped with of insulating layer, 5 one end of two sets of heat-absorbing fins are connected with the 6 relative lateral walls of first circuit board main part 1 and second circuit board main part respectively, two sets of 5 other ends of heat-absorbing fins are kept away from the lateral wall with two sets of absorber plate 3 respectively and are connected, 3 relative lateral walls of two sets of absorber plates are equipped with heating panel 2, first circuit board main part 1 keeps away from the lateral wall with second circuit board main part 6 mutually and all is equipped with shielding layer 7, two sets of shielding layer 7 keep away from the lateral wall mutually and all are equipped with insulating layer 8, 8 keep away from the lateral wall mutually and all are equipped with protective layer 9 for two sets of insulating layer 8.
Preferably, the plurality of groups of heat absorbing sheets 5 are distributed in a linear array inside the heat insulating layer 4, and the plurality of groups of heat absorbing sheets 5 can better absorb heat generated by the first circuit board main body 1 and the second circuit board main body 6.
Preferably, heat dissipation runner 10 that is linked together with the outside is transversely seted up to heat dissipation plate 2 inside, and louvre 11 has evenly been seted up to lateral wall about heat dissipation plate 2, and louvre 11 is linked together with heat dissipation runner 10 is inside, can be better dispel the heat under louvre 11's effect, and heat dissipation runner 10 circulates with the air to can be quick distribute away the heat that louvre 11 gived off, improve the radiating effect of double-deck circuit board.
The working principle is as follows: can prevent first circuit board main part 1 and the mutual heat conduction of second circuit board main part 6 under the effect of insulating layer 4, can prevent that external environment from carrying out the heat conduction to double-deck circuit board under the effect of insulating layer 7, can absorb the heat that first circuit board main part 1 and second circuit board main part 6 produced under the effect of heat-absorbing fin 5 and heat-absorbing fin 3, can give off the heat that heat-absorbing fin 3 and heat-absorbing fin absorbed under the effect of heating panel 23, can be better dispel the heat under the effect of louvre 11, heat dissipation channel 10 circulates with the air, thereby can be quick give off the heat that louvre 11 gived off, improve double-deck circuit board's radiating effect, can shield external signal under the effect of shielding layer 7, prevent that external signal from producing the influence to double-deck circuit board.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. The utility model provides a thoughtlessly press high frequency double-deck circuit board with thermal-insulated structure, includes first circuit board main part (1) and second circuit board main part (6), its characterized in that: the heat-insulating layers (4) are arranged on opposite side walls of the first circuit board main body (1) and the second circuit board main body (6), the heat-absorbing plates (3) are arranged on opposite side walls of the two groups of heat-insulating layers (4), a plurality of groups of heat-absorbing sheets (5) are arranged in the two groups of heat-insulating layers (4), one ends of the two groups of heat-absorbing sheets (5) are respectively connected with the first circuit board main body (1) and the opposite side walls of the second circuit board main body (6), the other ends of the two groups of heat-absorbing sheets (5) are respectively connected with the opposite side walls of the two groups of heat-absorbing plates (3) far away from the side walls, the heat-radiating plates (2) are arranged on opposite side walls of the two groups of heat-absorbing plates (3), the lateral wall is kept away from mutually to first circuit board main part (1) and second circuit board main part (6) and all is equipped with shielding layer (7), and is two sets of shielding layer (7) are kept away from the lateral wall mutually and all are equipped with insulating layer (8), and are two sets of insulating layer (8) are kept away from the lateral wall mutually and all are equipped with protective layer (9).
2. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 1, wherein: the heat absorbing sheets (5) are distributed in a linear array in the heat insulating layer (4).
3. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 1, wherein: the heat dissipation plate is characterized in that a heat dissipation flow channel (10) communicated with the outside is transversely formed in the heat dissipation plate (2), heat dissipation holes (11) are uniformly formed in the upper side wall and the lower side wall of the heat dissipation plate (2), and the heat dissipation holes (11) are communicated with the inside of the heat dissipation flow channel (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220895156.0U CN217217014U (en) | 2022-04-18 | 2022-04-18 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220895156.0U CN217217014U (en) | 2022-04-18 | 2022-04-18 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217217014U true CN217217014U (en) | 2022-08-16 |
Family
ID=82773829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220895156.0U Active CN217217014U (en) | 2022-04-18 | 2022-04-18 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217217014U (en) |
-
2022
- 2022-04-18 CN CN202220895156.0U patent/CN217217014U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203340506U (en) | Liquid cooling radiator for integrated power electronic module | |
| CN217217014U (en) | Mixed-compression high-frequency double-layer circuit board with heat insulation structure | |
| CN212517183U (en) | High-efficient heat radiation structure of IGBT module | |
| CN203133734U (en) | Completely-sealed chassis with radiating system | |
| CN201278625Y (en) | Heat radiation apparatus for power amplifier | |
| CN212727533U (en) | Multilayer PCB board convenient to heat dissipation | |
| CN219555239U (en) | High heat conduction composite epoxy aluminum plate | |
| CN211792634U (en) | Air-cooled case using vapor chamber technology | |
| CN209402952U (en) | A kind of radiator | |
| CN220340613U (en) | Heat dissipation structure | |
| CN211090356U (en) | FPC heat dissipation module for 5G communication system | |
| CN208401012U (en) | A kind of heat dissipation type coaxial load component | |
| CN218217806U (en) | Integrated circuit substrate capable of conducting heat in double layers | |
| CN221203121U (en) | Tungsten-copper alloy radiating fin | |
| CN219269449U (en) | Heat radiation plate structure | |
| CN214851999U (en) | Printed circuit board with high temperature resistance | |
| CN217563906U (en) | Laser power supply device based on high-frequency half-bridge circuit | |
| CN217825490U (en) | Multilayer printed circuit board with high heat conduction function | |
| CN217957562U (en) | Hot-press welding copper-based high-frequency heat dissipation circuit board | |
| CN211531642U (en) | Millimeter wave power amplifier | |
| CN213280191U (en) | Circuit board heat dissipation device | |
| CN218352969U (en) | High-performance 5G circuit board | |
| CN218315578U (en) | Modular wave-absorbing foam structure | |
| CN215500154U (en) | Heat dissipation module with quick and efficient heat dissipation function | |
| CN212486871U (en) | Energy-efficient printed board subassembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |