CN217563906U - Laser power supply device based on high-frequency half-bridge circuit - Google Patents

Laser power supply device based on high-frequency half-bridge circuit Download PDF

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CN217563906U
CN217563906U CN202220968842.6U CN202220968842U CN217563906U CN 217563906 U CN217563906 U CN 217563906U CN 202220968842 U CN202220968842 U CN 202220968842U CN 217563906 U CN217563906 U CN 217563906U
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power supply
circuit board
heat
supply box
heat dissipation
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CN202220968842.6U
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丁磊
孙权威
许儒
高洁
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Radium Cloud Nanjing Intelligent Manufacturing Co ltd
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Radium Cloud Nanjing Intelligent Manufacturing Co ltd
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Abstract

The utility model relates to the technical field of high-performance automatic constant current power supplies, in particular to a laser power supply device based on a high-frequency half-bridge circuit, which comprises a mounting plate, a circuit board and a power supply box, wherein the circuit board and the power supply box are both arranged on the mounting plate, and the laser power supply device also comprises a heat dissipation unit which is arranged on the mounting plate; the heat dissipation unit comprises two heat absorption plates, a plurality of heat conduction pipes and a plurality of heat dissipation fins, the two heat absorption plates are respectively detachably connected with the circuit board and the power supply box, two ends of the plurality of heat conduction pipes are respectively fixedly connected with the two heat absorption plates, and the plurality of heat dissipation fins are respectively fixedly connected with the plurality of heat conduction pipes; through the arrangement of the structure, the mounting plate is used for mounting the circuit board and the power supply box, the power supply box provides power for the circuit board, the heat dissipation unit is used for cooling the circuit board and the power supply box, the heat absorption plate and the heat conduction pipe are good in heat conduction performance, a large amount of heat generated by the circuit board and the power supply box can be conducted to the heat dissipation plate, the contact area of the heat dissipation plate and air is large, and heat dissipation can be conducted quickly.

Description

Laser power supply device based on high-frequency half-bridge circuit
Technical Field
The utility model relates to a high performance automatic constant current power supply technical field especially relates to a laser power supply device based on high frequency half-bridge circuit.
Background
Compared with a full-bridge circuit, a half-bridge circuit has the advantages of low cost, simple structure and the like, so that the half-bridge circuit is widely applied, but under the condition of long-time load, the circuit and a power box can be overheated.
At present, a heat radiator is arranged between a half-bridge circuit and a power supply box to cool the half-bridge circuit and the power supply box.
However, the heat dissipation effect of the conventional heat sink is not good enough.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a laser power supply device based on high frequency half-bridge circuit aims at solving the not good enough technical problem of radiating effect of the radiator among the prior art.
In order to achieve the above purpose, the laser power supply device based on the high-frequency half-bridge circuit adopted by the utility model comprises a mounting plate, a circuit board and a power supply box, wherein the circuit board and the power supply box are both mounted on the mounting plate and are respectively positioned at two ends of the mounting plate, and the laser power supply device further comprises a heat dissipation unit which is mounted on the mounting plate and is positioned between the circuit board and the power supply box; the heat dissipation unit comprises two heat absorption plates, a plurality of heat conduction pipes and a plurality of heat dissipation fins, wherein the two heat absorption plates are detachably connected with the circuit board and the power supply box respectively and are located between the circuit board and the power supply box, two ends of the plurality of heat conduction pipes are fixedly connected with the two heat absorption plates respectively, and the plurality of heat dissipation fins are fixedly connected with the plurality of heat conduction pipes and are located in the middle of the plurality of heat conduction pipes.
The heat dissipation unit further comprises two fixing plates, and the two fixing plates are detachably connected with the circuit board and the power supply box respectively and are coated on the outer walls of the two heat absorption plates respectively.
The heat dissipation unit further comprises eight first bolts, the circuit board and the power supply box are provided with four first threaded holes, the two fixing plates are provided with four through holes, and the eight first bolts penetrate through the corresponding through holes and are in threaded connection with the corresponding first threaded holes.
The fixing plate comprises a fixing ring and four fixing pieces, the fixing pieces are provided with the through holes, the fixing ring is wrapped on the outer wall of the corresponding heat absorbing plate, and the fixing pieces are fixedly connected with the fixing ring and located at four outer end corners of the fixing ring respectively.
The heat absorption plate comprises plate bodies and a plurality of heat absorption rods, the circuit board and the power box are respectively provided with a plurality of round holes, the two plate bodies are respectively abutted against the circuit board and the power box, the heat absorption rods are fixedly connected with the plate bodies, and the heat absorption rods are respectively inserted into the corresponding round holes.
The laser power supply device based on the high-frequency half-bridge circuit further comprises two groups of air blowing units, wherein the two groups of air blowing units are fixedly connected with the mounting plate and symmetrically arranged at two ends of the plurality of radiating fins adjacent to the power supply box.
The blowing unit comprises a fixing block, a fan and four second bolts, the fixing block is provided with four second threaded holes, the fan is provided with four connecting holes, the fixing block is fixedly connected with the mounting plate, the fan is located above the fixing block, and the four second bolts respectively penetrate through the corresponding connecting holes and are in threaded connection with the corresponding second threaded holes.
The utility model discloses a laser power supply unit based on high frequency half-bridge circuit, the mounting panel is used for the installation the circuit board reaches the power pack, the power pack does the circuit board provides the power, the radiating element is used for doing the circuit board reaches the power pack cooling, the absorber plate reaches the heat conductivility preferred of heat pipe can with the circuit board reaches a large amount of heats that the power pack produced lead to on the fin, the fin is big with the area of contact of air, can dispel the heat fast.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention.
Fig. 2 is a front view of the first embodiment of the present invention.
Fig. 3 isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A of fig. 2 of the present invention.
Fig. 4 is a B-B sectional view of fig. 2 of the present invention.
Fig. 5 is a schematic structural diagram of a second embodiment of the present invention.
Fig. 6 is a front view of a second embodiment of the present invention.
Fig. 7 is a cross-sectional view of fig. 6C-C of the present invention.
Fig. 8 is a cross-sectional view of fig. 6D-D according to the present invention.
101-mounting plate, 102-circuit board, 103-power supply box, 104-heat dissipation unit, 105-heat absorption plate, 106-heat conduction pipe, 107-heat dissipation plate, 108-fixing plate, 109-first bolt, 110-first threaded hole, 111-through hole, 112-fixing ring, 113-fixing plate, 114-plate body, 115-heat absorption rod, 116-round hole, 201-air blowing unit, 202-fixing block, 203-fan, 204-second bolt, 205-second threaded hole and 206-connecting hole.
Detailed Description
The embodiments of the invention will be described in detail hereinafter, examples of which are illustrated in the accompanying drawings, and the embodiments described hereinafter with reference to the drawings are exemplary and intended to be illustrative of the invention and should not be construed as limiting the invention.
The first embodiment of the present application is:
referring to fig. 1 to 4, wherein fig. 1 is a schematic diagram of an overall structure of a laser power supply device based on a high-frequency half-bridge circuit, fig. 2 is a schematic diagram of a front structure of the laser power supply device based on the high-frequency half-bridge circuit, fig. 3 is a schematic diagram of a transverse section structure of the laser power supply device based on the high-frequency half-bridge circuit along the heat absorbing rod, fig. 4 is a schematic diagram of a transverse section structure of the laser power supply device based on the high-frequency half-bridge circuit along the first bolt, the present invention provides a laser power supply device based on the high-frequency half-bridge circuit: the heat dissipation device comprises a mounting plate 101, a circuit board 102, a power supply box 103, a heat dissipation unit 104, a heat absorption plate 105, a heat conduction pipe 106, a heat dissipation fin 107, a fixing plate 108, a first bolt 109, a first threaded hole 110, a through hole 111, a fixing ring 112, a fixing plate 113, a plate body 114, a heat absorption rod 115 and a round hole 116;
for the present embodiment, the mounting plate 101 is used for mounting the circuit board 102 and the power supply box 103, the power supply box 103 provides power for the circuit board 102, the heat dissipation unit 104 is used for cooling the circuit board 102 and the power supply box 103, the heat absorption plate 105 and the heat conduction pipe 106 have good heat conduction performance, a large amount of heat generated by the circuit board 102 and the power supply box 103 can be conducted to the heat dissipation plate 107, the contact area of the heat dissipation plate 107 and air is large, and heat dissipation can be performed quickly.
The two fixing plates 108 are detachably connected to the circuit board 102 and the power supply box 103, and respectively cover the outer walls of the two heat absorbing plates 105, and the two fixing plates 108 are respectively used for fixing the corresponding heat absorbing plates 105 on the circuit board 102 and the power supply box 103.
Next, eight first bolts 109 respectively penetrate through the corresponding through holes 111 and are in threaded connection with the corresponding first threaded holes 110, and the eight first bolts 109 are matched with the corresponding first threaded holes 110 to fix the two fixing plates 108 on the circuit board 102 and the power supply box 103, so that the two heat absorbing plates 105 are fixed.
Meanwhile, the fixing ring 112 covers the outer wall of the corresponding heat absorbing plate 105, the four fixing pieces 113 are fixedly connected with the fixing ring 112 and are respectively located at the four outer end corners of the fixing ring 112, and the fixing ring 112 covers the outer wall of the heat absorbing plate 105, so that the heat conducting pipe 106 is not interfered with and connected with the heat absorbing plate 105 while the heat absorbing plate 105 is fixed.
Finally, the two plate bodies 114 are respectively abutted against the circuit board 102 and the power supply box 103, the heat absorption rods 115 are fixedly connected with the plate bodies 114, the heat absorption rods 115 are further respectively inserted into the corresponding round holes 116, the plate bodies 114 and the heat absorption rods 115 play a role in rapid heat dissipation, the heat absorption rods 115 are inserted into the corresponding round holes 116, the contact area between the heat absorption rods and the circuit board 102 and the power supply box 103 is increased, and therefore the purpose of rapid heat dissipation is achieved.
In order to improve the heat dissipation efficiency, the plurality of heat absorption rods 115 are fixed on the plate body 114, and the plurality of heat absorption rods 115 are inserted into the corresponding round holes 116, so that the contact area between the circuit board 102 and the power supply box 103 is increased, and the purpose of accelerating heat dissipation is achieved.
The second embodiment of the present application is:
on the basis of the first embodiment, please refer to fig. 5 to 8, wherein fig. 5 is a schematic diagram of an overall structure of the laser power supply device based on the high-frequency half-bridge circuit, fig. 6 is a schematic diagram of a front structure of the laser power supply device based on the high-frequency half-bridge circuit, fig. 7 is a schematic diagram of a transverse cross-section structure of the laser power supply device based on the high-frequency half-bridge circuit along the heat absorbing rod, and fig. 8 is a schematic diagram of a transverse cross-section structure of the laser power supply device based on the high-frequency half-bridge circuit along the first bolt, the utility model provides a laser power supply device based on the high-frequency half-bridge circuit, further comprising: a blower unit 201, a fixing block 202, a fan 203, a second bolt 204, a second screw hole 205, and a connection hole 206.
In the present embodiment, two sets of the blower units 201 are installed on both sides of the plurality of the heat dissipation fins 107, so that air around the plurality of the heat dissipation fins 107 is rapidly circulated, thereby improving heat dissipation efficiency.
The fixing block 202 is fixedly connected to the mounting plate 101, the fan 203 is located above the fixing block 202, and the fixing block 202 is used for bearing the fan 203.
Next, the four second bolts 204 respectively penetrate through the corresponding connecting holes 206 and are in threaded connection with the corresponding second threaded holes 205, and the second bolts 204 are matched with the corresponding second threaded holes 205 to tightly fix the fan 203 on the fixing block 202.
The two air blowing units 201 are installed at both sides of the plurality of heat radiating fins 107 to blow air to the heat radiating fins 107, thereby improving heat radiating efficiency.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Claims (7)

1. A laser power supply device based on a high-frequency half-bridge circuit comprises a mounting plate, a circuit board and a power supply box, wherein the circuit board and the power supply box are both mounted on the mounting plate and are respectively positioned at two ends of the mounting plate,
the heat dissipation unit is arranged on the mounting plate and is positioned between the circuit board and the power supply box;
the heat dissipation unit comprises two heat absorption plates, a plurality of heat conduction pipes and a plurality of heat dissipation fins, the two heat absorption plates are detachably connected with the circuit board and the power supply box respectively and are located between the circuit board and the power supply box, two ends of the plurality of heat conduction pipes are fixedly connected with the two heat absorption plates respectively, and the plurality of heat dissipation fins are fixedly connected with the plurality of heat conduction pipes and are located in the middle of the plurality of heat conduction pipes.
2. A high frequency half bridge circuit based laser power supply apparatus as claimed in claim 1,
the heat dissipation unit further comprises two fixing plates, and the two fixing plates are detachably connected with the circuit board and the power supply box respectively and are coated on the outer walls of the two heat absorption plates respectively.
3. A high frequency half bridge circuit based laser power supply apparatus as claimed in claim 2,
the heat dissipation unit further comprises eight first bolts, the circuit board and the power supply box are provided with four first threaded holes, the two fixing plates are provided with four through holes, and the eight first bolts penetrate through the corresponding through holes respectively and are in threaded connection with the corresponding first threaded holes.
4. A high frequency half bridge circuit based laser power supply apparatus as claimed in claim 3,
the fixed plate comprises a fixed ring and four fixed plates, the four fixed plates are provided with the through holes, the fixed ring is wrapped on the outer wall of the corresponding heat absorbing plate, and the four fixed plates are fixedly connected with the fixed ring and are respectively positioned at four outer end corners of the fixed ring.
5. A high frequency half bridge circuit based laser power supply apparatus as claimed in claim 4,
the heat absorption plate comprises plate bodies and a plurality of heat absorption rods, the circuit board and the power supply box are provided with a plurality of round holes, the two plate bodies are respectively abutted against the circuit board and the power supply box, the heat absorption rods are fixedly connected with the plate bodies, and the heat absorption rods are respectively inserted into the corresponding round holes.
6. A high frequency half bridge circuit based laser power supply apparatus as claimed in claim 5,
the laser power supply device based on the high-frequency half-bridge circuit further comprises two groups of air blowing units, wherein the two groups of air blowing units are fixedly connected with the mounting plate and are symmetrically arranged at two ends, adjacent to the power supply box, of the plurality of radiating fins.
7. A high frequency half bridge circuit based laser power supply apparatus as set forth in claim 6,
the blowing unit comprises a fixed block, a fan and four second bolts, the fixed block is provided with four second threaded holes, the fan is provided with four connecting holes, the fixed block is fixedly connected with the mounting plate, the fan is positioned above the fixed block, and the four second bolts respectively penetrate through the corresponding connecting holes and are in threaded connection with the corresponding second threaded holes.
CN202220968842.6U 2022-04-25 2022-04-25 Laser power supply device based on high-frequency half-bridge circuit Active CN217563906U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220968842.6U CN217563906U (en) 2022-04-25 2022-04-25 Laser power supply device based on high-frequency half-bridge circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220968842.6U CN217563906U (en) 2022-04-25 2022-04-25 Laser power supply device based on high-frequency half-bridge circuit

Publications (1)

Publication Number Publication Date
CN217563906U true CN217563906U (en) 2022-10-11

Family

ID=83471689

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220968842.6U Active CN217563906U (en) 2022-04-25 2022-04-25 Laser power supply device based on high-frequency half-bridge circuit

Country Status (1)

Country Link
CN (1) CN217563906U (en)

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