CN210075912U - Radiator and electronic equipment with same - Google Patents

Abstract

The utility model discloses a radiator and electronic equipment with the radiator, which comprises a heat dissipation box, wherein the interior of the heat dissipation box is provided with a device cavity, the bottom surface of the device cavity is fixedly provided with a plurality of groups of calabash-shaped capacitor cylinders, two inner side walls of the device cavity are uniformly and fixedly provided with a plurality of groups of first heat dissipation fins, the interior of the fan box is fixedly provided with a fan, the bottom surface of the device cavity is fixedly provided with second heat dissipation fins at the positions between the calabash-shaped capacitor cylinders and the fan box, the bottom surface of the device cavity is fixedly provided with a third heat dissipation fin between the plurality of groups of second heat dissipation fins, and the bottom surface of the device cavity is fixedly provided with a plurality of groups of fourth heat dissipation fins, the heat that can quick absorption electric capacity alone gived off avoids the influence of the heat that the electric capacity gived off to other heat source spare in the equipment.

Description

A radiator and electronic equipment with the radiator

technical field

The utility model relates to the technical field of radiator equipment, in particular to a radiator and an electronic device having the radiator.

Background technique

After the electronic device is used for a long time, the components in the electronic product will generate a lot of heat, and the temperature change caused by the heat will affect the performance of the electronic product, especially the capacitor bank in the electronic device, the heat is particularly high, When the heat of the capacitor bank rises to a certain level, it is easy to cause damage to the capacitor. There is no heat sink in the prior art that can efficiently dissipate heat from the capacitor. The generated heat is conducted to the thermally sensitive device, which affects the performance and service life of the thermally sensitive device.

Utility model content

The purpose of the present invention is to provide a radiator and an electronic device having the radiator.

In order to achieve the above purpose, the technical solution adopted by the present invention is as follows: a radiator, including a heat dissipation box, the interior of the heat dissipation box is a device cavity, the four corner ends of the bottom surface of the device cavity are provided with threaded holes, and one end of the bottom plate of the heat dissipation box is uniform There are multiple groups of gourd-shaped groove openings, and a plurality of groups of gourd-shaped capacitor cylinders are fixed on the bottom surface of the device cavity at the position of the gourd-shaped groove opening. A plurality of groups of first heat dissipation fins are uniformly fixed and installed on the wall, a fan box is fixedly installed in the middle of the bottom surface of the device cavity, a fan is fixedly installed inside the fan box, and air inlet openings are opened on the upper surface and side surface of the fan box. Second heat dissipation fins are fixedly installed on the bottom surface between the gourd-shaped capacitor cylinder and the fan box, and one end of the plurality of sets of second heat dissipation fins is fixedly connected to the outer side wall of the gourd-shaped capacitor cylinder at the corresponding position. The bottom surface of the cavity is fixedly installed with third heat dissipation fins between the plurality of groups of the second heat dissipation fins, and the bottom surface of the device cavity is evenly fixed to the opposite side of the gourd-type capacitor cylinder. A plurality of groups of fourth heat dissipation fins are evenly fixed on the surface between the terminal and the fan box, and the middle parts of the first heat dissipation fin, the second heat dissipation fin, the third heat dissipation fin and the fourth heat dissipation fin are all uniform. A circular rib with an integrated structure is provided, both outer surfaces of the heat dissipation box are provided with first ventilation openings penetrating the device cavity, and an outer surface of the cooling box located at the position of the gourd capacitor cylinder is uniformly opened with second ventilation openings.

Preferably, the bottom surface of the bottom plate of the heat dissipation box is provided with a galvanized coating, the four corner ends of the bottom surface of the bottom surface of the heat dissipation box are fixedly provided with positioning posts, and the surfaces of the positioning posts are all provided with positioning holes.

Preferably, two inner side walls of the device cavity are fixedly provided with reinforced inclined rib plates of an integrated structure at the position of the terminal head.

Preferably, the upper surfaces of the two side edges of the heat dissipation box are provided with notches along the length direction of the plate.

An electronic device with a radiator, the electronic device comprising: a device mounting shell, a circuit board and a radiator, the circuit board is mounted on the surface of the device mounting shell, a capacitor group is arranged on the circuit board, and the radiator includes The inside of the cooling box is a device cavity, and the four corner ends of the bottom surface of the device cavity are provided with threaded holes. The cooling box is fixed and installed on the surface of the equipment installation shell by screws, and one end of the bottom plate of the cooling box is evenly provided with multiple groups of gourd-shaped recesses. A slot, the bottom surface of the device cavity is fixedly provided with multiple groups of gourd-shaped capacitor cylinders at the position of the gourd-shaped groove mouth, and the gourd-shaped capacitor cylinder and the heat dissipation box are integrated into a structure, and the two inner side walls of the device cavity are evenly fixed and installed with multiple groups of The first radiating fin, a fan box is fixedly installed in the middle of the bottom surface of the device cavity, a fan is fixedly installed inside the fan box, and air inlet openings are opened on the upper surface and side surface of the fan box, and the bottom surface of the device cavity is in the gourd-type capacitor cylinder. The second heat dissipation fins are fixedly installed at the positions between the fan box and the fan box. One end of the plurality of sets of the second heat dissipation fins is fixedly connected to the outer side wall of the gourd-shaped capacitor cylinder at the corresponding position. The bottom surface of the device cavity is in the plurality of groups. The third heat dissipation fins are fixedly installed between the second heat dissipation fins, the bottom surface of the device cavity and the opposite side of the gourd-type capacitor cylinder are evenly fixed and installed with multiple groups of terminals, and the bottom surface of the device cavity is between the terminal heads and the fan. A plurality of sets of fourth heat dissipation fins are evenly and fixedly installed between the boxes. Both outer surfaces of the heat dissipation box are provided with first ventilation openings penetrating through the device cavity. There is a second vent.

Preferably, the bottom surface of the bottom plate of the heat dissipation box is provided with a galvanized coating, the four corner ends of the bottom surface of the bottom surface of the heat dissipation box are fixedly provided with positioning posts, and the surfaces of the positioning posts are all provided with positioning holes.

Preferably, two inner side walls of the device cavity are fixedly provided with reinforced inclined rib plates of an integrated structure at the position of the terminal head.

Preferably, the upper surfaces of the two side edges of the heat dissipation box are provided with notches along the length direction of the plate.

Compared with the prior art, the advantages of the present utility model are:

The utility model has a simple structure. When the heat dissipation box is installed on the equipment, the fan is started, and the heat dissipation of the bottom plate of the heat dissipation box can be improved through the first heat dissipation fin, the second heat dissipation fin, the third heat dissipation fin and the fourth heat dissipation fin. Reduce the temperature inside the device and its internal circuit board. By setting the gourd-shaped capacitor cylinder, the heat emitted by the capacitor can be quickly absorbed independently, avoiding the influence of the heat emitted by the capacitor on other heat source components inside the device. The function of the third heat dissipation fin can improve the dissipation of heat absorbed by the gourd-shaped capacitor cylinder.

Description of drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

1 is a perspective view of a radiator of the present invention;

Figure 2 is a front view of a radiator of the present invention;

3 is a rear view of a radiator of the present invention;

4 is a cross-sectional view of an electronic device with a heat sink according to the present invention.

In the figure: 1 cooling box, 2 device cavity, 3 notch opening, 4 first vent opening, 5 second vent opening, 6 gourd-shaped groove opening, 7 gourd-shaped capacitor tube, 8 first cooling fin, 9th 2 cooling fins, 10 third cooling fins, 11 fan boxes, 12 fans, 13 fourth cooling fins, 14 round ribs, 15 threaded holes, 16 terminals, 17 reinforced inclined ribs, 18 positioning columns, 19 Equipment mounting housing.

Detailed ways

The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the protection scope of the present invention can be more clearly defined.

Referring to Figure 1, Figure 2 and Figure 3, the present invention provides a radiator, comprising a radiator box 1, the inside of the radiator box 1 is a device cavity 2, and the four corner ends of the bottom surface of the device cavity 2 are provided with threaded holes 15 to dissipate heat. One end of the bottom plate of the box 1 is evenly provided with multiple groups of gourd-shaped groove openings 6, and the bottom surface of the device cavity 2 is fixedly provided with multiple groups of gourd-shaped capacitor cylinders 7 at the positions of the gourd-shaped groove openings 6, the gourd-shaped capacitor cylinder 7 and the heat dissipation box 1. It has an integrated structure. Multiple sets of first heat dissipation fins 8 are evenly fixed on both inner walls of the device cavity 2. A fan box 11 is fixedly installed in the middle of the bottom surface of the device cavity 2. The fan box 11 is fixedly installed with a fan 12. Both the surface and the side surface are provided with air inlet openings. The bottom surface of the device cavity 2 is fixedly installed with second heat dissipation fins 9 at the position between the gourd-shaped capacitor cylinder 7 and the fan box 11. It is fixedly connected with the outer side wall of the gourd-type capacitor cylinder 7 at the corresponding position. The bottom surface of the device cavity 2 is fixedly installed with a third heat dissipation fin 10 between the multiple groups of second heat dissipation fins 9. The bottom surface of the device cavity 2 is connected to the gourd-type capacitor. The opposite side of the cylinder 7 is evenly and fixedly installed with a plurality of groups of terminal heads 16, and the bottom surface of the device cavity 2 is evenly fixed and fixed with a plurality of groups of fourth heat dissipation fins 13 between the terminal heads 16 and the fan box 11. The first heat dissipation fin The central part of the fins 8, the second fins 9, the third fins 10 and the fourth fins 13 are all provided with circular ribs 14 with an integrated structure. The area of the heat dissipation box 1 improves the heat exchange efficiency of the first heat dissipation fins 8, the second heat dissipation fins 9, the third heat dissipation fins 10 and the fourth heat dissipation fins 13 with the air. The first vent 4 of the cavity 2, the outer surface of the heat dissipation box 1 at the position of the gourd-type capacitor cylinder 7 is evenly opened with a second vent 5, as shown in Figure 2, when the fan is started, the outside air quickly passes through the first vent 4 and the second vent 5 enter the device cavity 2 in the direction of the arrow, so that the heat absorbed by the bottom plate of the heat dissipation box 1 and the gourd-shaped capacitor tube 7 can be discharged through the fan 12 .

In this embodiment, the bottom surface of the bottom plate of the heat dissipation box 1 is provided with a galvanized coating. When the heat dissipation box 1 is connected to the equipment that needs heat dissipation, the heat dissipated in the equipment can be quickly absorbed by the galvanized bottom plate. The four corners of the bottom surface of the bottom plate of the heat dissipation box 1 Positioning posts 18 are fixed at the ends, and positioning holes are provided on the surfaces of the positioning posts 18 to facilitate the connection of the heat dissipation box 1 to external equipment.

In this embodiment, two inner side walls of the device cavity 2 are fixedly provided with reinforced inclined rib plates 17 of an integrated structure at the positions of the terminals 16 , which improves the structural strength of the heat dissipation box 1 .

In this embodiment, the upper surfaces of the two side plates of the heat dissipation box 1 are provided with notches 3 along the length direction of the plate, which further improves the heat dissipation of the side plates of the heat dissipation box 1 .

Referring to FIG. 4, an electronic device with a heat sink includes: a device mounting housing 19, a circuit board and a heat sink, the circuit board is mounted on the surface of the device mounting housing 19, and a capacitor bank is provided on the circuit board , the radiator includes a heat dissipation box 1, as shown in Figures 1 to 3, the interior of the heat dissipation box 1 is a device cavity 2, and the four corner ends of the bottom surface of the device cavity 2 are provided with threaded holes 15, and the heat dissipation box 1 is fixed by screws. On the surface of the shell 19, the bottom end of the heat dissipation box 1 is evenly provided with multiple groups of gourd-shaped groove openings 6, and the bottom surface of the device cavity 2 is fixedly provided with multiple groups of gourd-shaped capacitor cylinders 7 at the position of the gourd-shaped groove openings 6. The cylinder 7 and the heat dissipation box 1 have an integral structure. When the heat dissipation box 1 is installed on the equipment installation housing 19, the capacitor group on the circuit board can be inserted into the hoist type capacitor cylinder 7, and the two inner walls of the device cavity 2 are evenly fixed and installed. There are multiple sets of first heat dissipation fins 8, a fan box 11 is fixedly installed in the middle of the bottom surface of the device cavity 2, a fan 12 is fixedly installed inside the fan box 11, and the upper surface and the side surface of the fan box 11 are provided with air inlet openings. 2. The second heat dissipation fins 9 are fixedly installed on the bottom surface between the gourd-type capacitor cylinder 7 and the fan box 11, and one end of the plurality of second heat dissipation fins 9 is fixedly connected to the outer side wall of the gourd-type capacitor cylinder 7 at the corresponding position. , the bottom surface of the device cavity 2 is fixedly installed with third heat dissipation fins 10 between the multiple groups of second heat dissipation fins 9, and the bottom surface of the device cavity 2 is evenly fixed to the opposite side of the gourd-type capacitor cylinder 7. Multiple groups of terminals are fixedly installed Head 16, the internal circuit of the device is connected to the external power supply through the terminal head, and the bottom surface of the device cavity 2 is evenly and fixedly installed between the terminal head 16 and the fan box 11. Multiple groups of fourth heat dissipation fins 13, the first heat dissipation fin 8. The middle of the second heat dissipation fin 9, the third heat dissipation fin 10 and the fourth heat dissipation fin 13 are all provided with a circular rib 14 with an integrated structure, and the surface area is increased by the circular rib 14, thereby increasing the area in contact with the space , to improve the efficiency of heat exchange between the first heat dissipation fin 8, the second heat dissipation fin 9, the third heat dissipation fin 10 and the fourth heat dissipation fin 13 and the air, and the two outer surfaces of the heat dissipation box 1 are provided with a hole through the device cavity. The first vent 4 of 2, an outer surface of the heat dissipation box 1 at the position of the gourd-type capacitor cylinder 7 is evenly provided with a second vent 5, and when the fan is started, the outside air quickly passes through the first vent 4 and the second vent 5. Enter the device cavity 2, because the capacitor group is inserted in the gourd-type capacitor cylinder 7, when the capacitor group heats up, the gourd-type capacitor cylinder 7 absorbs heat, and the heat on the surface of the gourd-type capacitor cylinder 7 flows with the second vent 5 at this time. The radiated air conducts heat exchange, and then is discharged through the fan 12. The first cooling fin 8, the second cooling fin 9, the third cooling fin 10 and the fourth cooling fin 13 can ensure the heat dissipation of the bottom plate of the cooling box 1, thereby Reduce heat inside electronic equipment and circuit boards.

In this embodiment, the bottom surface of the bottom plate of the heat dissipation box 1 is provided with a galvanized coating, and the galvanized bottom plate can quickly absorb the heat emitted by the circuit board of the equipment. The four corner ends of the bottom surface of the bottom plate of the heat dissipation box 1 are fixedly provided with positioning columns 18. The positioning columns 18 are provided with positioning holes on the surface.

In this embodiment, two inner side walls of the device cavity 2 are fixedly provided with reinforced inclined rib plates 17 of an integrated structure at the positions of the terminals 16 , which improves the structural strength of the heat dissipation box 1 .

In this embodiment, both sides of the heat dissipation box 1 are provided with a notch 3 along the length of the board. When the bottom plate of the heat dissipation box 1 absorbs heat, the heat will be conducted to the side plates of the heat dissipation box 1. The port 3 improves the heat dissipation of the side plate of the heat dissipation box 1 .

Although the embodiments of the present invention are described in conjunction with the accompanying drawings, the patent owner can make various changes or modifications within the scope of the appended claims, as long as the protection scope described in the claims of the present invention is not exceeded, All should fall within the protection scope of the present invention.

Claims (8)

1. A radiator, comprising a radiator box, the interior of the radiator box is a device cavity, the four corner ends of the bottom surface of the device cavity are all provided with threaded holes, and one end of the bottom plate of the radiator box is evenly provided with multiple groups of gourd-shaped grooves, which is characterized by: In that: the bottom surface of the device cavity is fixedly provided with a plurality of groups of gourd-shaped capacitor cylinders at the position of the gourd-shaped groove opening, and the gourd-type capacitor cylinder and the heat dissipation box are integrated into a structure, and the two inner side walls of the device cavity are evenly fixed and installed with multiple groups of first capacitors. A cooling fin, a fan box is fixedly installed in the middle of the bottom surface of the device cavity, a fan is fixedly installed inside the fan box, and air inlet openings are opened on the upper surface and side surface of the fan box, and the bottom surface of the device cavity is between the gourd-shaped capacitor tube and the The second heat dissipation fins are fixedly installed between the fan boxes, and one end of the second heat dissipation fins of the multiple groups is fixedly connected to the outer side wall of the gourd-shaped capacitor cylinder at the corresponding position. The third heat dissipation fins are fixedly installed between the second heat dissipation fins, the bottom surface of the device cavity and the opposite side of the gourd capacitor cylinder are evenly fixed and installed with multiple sets of terminals, and the bottom surface of the device cavity is between the terminal heads and the fan box. A plurality of groups of fourth heat dissipation fins are evenly and fixedly installed between them, and the first heat dissipation fins, the second heat dissipation fins, the third heat dissipation fins and the fourth heat dissipation fins are all provided with circular ribs with an integrated structure. The two outer surfaces of the heat dissipation box are provided with a first ventilation opening that penetrates through the device cavity, and an outer surface of the heat dissipation box located at the position of the gourd-shaped capacitor cylinder is evenly provided with a second ventilation opening. 2. A radiator according to claim 1, characterized in that: the bottom surface of the bottom plate of the heat dissipation box is provided with a galvanized coating, the four corner ends of the bottom surface of the bottom surface of the heat dissipation box are fixedly provided with positioning columns, and the surfaces of the positioning columns are There are positioning holes. 3 . The radiator according to claim 1 , wherein the two inner side walls of the device cavity are fixedly provided with reinforced inclined rib plates of an integrated structure at the position of the terminal head. 4 . 4 . The radiator according to claim 1 , wherein the upper surfaces of the two side edges of the heat dissipation box are provided with notches along the length direction of the plate. 5 . 5. An electronic device with a radiator, the electronic device comprising: a device mounting shell, a circuit board and a radiator, wherein the circuit board is mounted on the surface of the device mounting shell, and a capacitor bank is provided on the circuit board , the radiator includes a heat dissipation box, the interior of the heat dissipation box is a device cavity, the four corner ends of the bottom surface of the device cavity are provided with threaded holes, the heat dissipation box is fixedly installed on the surface of the equipment installation shell by screws, and one end of the bottom plate of the heat dissipation box is evenly opened There are multiple groups of gourd-shaped groove openings, and a plurality of groups of gourd-shaped capacitor cylinders are fixed on the bottom surface of the device cavity at the position of the gourd-shaped groove opening. A plurality of sets of first heat dissipation fins are evenly and fixedly installed, a fan box is fixedly installed in the middle of the bottom surface of the device cavity, a fan is fixedly installed inside the fan box, and air inlet openings are opened on the upper surface and side surface of the fan box. Second heat dissipation fins are fixedly installed on the surface between the gourd-shaped capacitor cylinder and the fan box, and one end of the second heat dissipation fins of the plurality of groups is fixedly connected with the outer side wall of the gourd-shaped capacitor cylinder at the corresponding position. The bottom surface is fixedly installed with third heat dissipation fins between the plurality of groups of the second heat dissipation fins, the bottom surface of the device cavity and the opposite side of the gourd-type capacitor cylinder are evenly fixed and installed with multiple groups of terminals, and the bottom surface of the device cavity is evenly fixed and installed. A plurality of sets of fourth heat dissipation fins are evenly and fixedly installed between the terminal and the fan box, and the first heat dissipation fins, the second heat dissipation fins, the third heat dissipation fins and the fourth heat dissipation fins are all arranged in the middle There are round rib with integral structure, both outer surfaces of the heat dissipation box are provided with first ventilation openings penetrating through the device cavity, and an outer surface of the cooling box located at the position of the gourd-shaped capacitor cylinder is evenly provided with second ventilation openings. 6. An electronic device with a radiator according to claim 5, characterized in that: the bottom surface of the bottom plate of the heat dissipation box is provided with a galvanized coating, and the four corner ends of the bottom surface of the bottom surface of the heat dissipation box are fixedly provided with positioning posts, The surface of the positioning column is provided with positioning holes. 7 . The electronic device with a heat sink according to claim 5 , wherein the two inner side walls of the device cavity are fixedly provided with reinforced inclined rib plates of an integrated structure at the positions of the terminals. 8 . 8 . The electronic device with a heat sink according to claim 5 , wherein the upper surfaces of the two side edges of the heat dissipation box are provided with notches along the length direction of the plate. 9 .

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