CN214627470U

CN214627470U - High-efficient heat dissipation circuit board of multilayer

Info

Publication number: CN214627470U
Application number: CN202120389876.5U
Authority: CN
Inventors: 黄诚
Original assignee: Suzhou Hitace Semiconductor Testing Equipment Co ltd
Current assignee: Suzhou Hitace Semiconductor Testing Equipment Co ltd
Priority date: 2021-02-22
Filing date: 2021-02-22
Publication date: 2021-11-05
Anticipated expiration: 2031-02-22

Abstract

The utility model discloses a high-efficient heat dissipation circuit board of multilayer in circuit board technical field, including two sets of multilayer circuit board bodies and box, the upper and lower terminal surface of box all is provided with the heat-conducting plate, and is two sets of heat-conducting plate and box fixed connection, it is two sets of the heat-conducting plate stretches into the inner chamber to the box, the intercommunication pipeline of the equal fixedly connected with inner chamber intercommunication of both sides terminal surface of box, the equal symmetry of top face and the bottom face of box is provided with two sets of restriction screw rods, four groups restriction screw rod and box fixed connection, every group all be provided with swing joint's clamp plate on the restriction screw rod, every group the multilayer circuit board body passes through the clamp plate and installs the surface at the heat-conducting plate, the utility model discloses aim at solving and vibrate the problem that causes the multilayer circuit board to damage easily.

Description

High-efficient heat dissipation circuit board of multilayer

Technical Field

The utility model relates to a circuit board technical field specifically is a high-efficient heat dissipation circuit board of multilayer.

Background

The double-sided board is middle one deck medium, both sides all are the routing layer, the multiply wood is the multilayer routing layer, be the dielectric layer between per two-layer, the dielectric layer can be done very thin, the multilayer circuit board has three conducting layers at least, wherein two-layer is on the surface outward, and remaining one deck is synthesized in the insulation board, electrical connection between them is realized through the plated through hole on the circuit board cross section usually, and current multilayer circuit board dispels the heat through the forced air cooling mostly when using, but when current forced air cooling dispels the heat, wind-force blows the circuit board and can cause the circuit board to vibrate, the use of circuit board has been influenced then, greatly reduced multilayer circuit board's life.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-efficient radiating circuit board of multilayer to the shock of proposing causes the problem that multilayer circuit board damaged easily in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient radiating circuit board of multilayer, includes two sets of multilayer circuit board bodies and box, the upper and lower terminal surface of box all is provided with the heat-conducting plate, and is two sets of heat-conducting plate and box fixed connection, it is two sets of the heat-conducting plate stretches into the inner chamber to the box, the intercommunication pipeline of the equal fixedly connected with inner chamber intercommunication of both sides terminal surface of box, the equal symmetry of top face and the bottom face of box is provided with two sets of restriction screw rods, four groups restriction screw rod and box fixed connection, every group all be provided with swing joint's clamp plate, every group on the restriction screw rod multilayer circuit board body passes through the clamp plate and installs the surface at the heat-conducting plate.

Preferably, every group all cup joints and is provided with the screw thread sleeve pipe on the outer wall of restriction screw, screw thread sleeve pipe and restriction screw threaded connection, the movable sleeve pipe that is provided with the bearing connection is cup jointed to the screw thread sleeve pipe's outer wall, movable sleeve pipe's right side terminal surface fixedly connected with fixed plate, the bottom face at the fixed plate is installed through the bolt to the clamp plate.

Preferably, the bottom end face of the pressing plate is provided with a protective pad, and the protective pad is fixedly connected with the pressing plate.

Preferably, the pressing plate comprises two groups of mounting holes, and the pressing plate and the protective pad comprise a plurality of groups of air holes.

Preferably, two sets of heat-conducting plates all are provided with multiunit fin at the terminal surface of box inner chamber, and fin and heat-conducting plate fixed connection.

Preferably, the bottom end surface of the protection pad is provided with corrugations.

Compared with the prior art, the beneficial effects of the utility model are that: two sets of intercommunication pipelines that the box set up can be connected with the liquid cooling equipment of peripheral hardware by effectual convenience, and the heat-conducting plate of setting can be effectual with the heat conduction on the multilayer circuit board body in to the box, then can effectually dispel the heat through the coolant liquid, then can effectually prevent that multilayer circuit board body from appearing rocking the phenomenon, then can the effectual life who improves multilayer circuit board body, and the cooperation between the threaded sleeve pipe that sets up and the limiting screw, can effectually drive the clamp plate and carry out altitude mixture control, then can effectually conveniently adapt to the multilayer circuit board body of different specifications, the holistic practicality has been improved greatly.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of the present invention at A in FIG. 1;

fig. 3 is a schematic view of the position of the ventilation holes of the present invention.

In the figure: 1. a multilayer circuit board body; 2. a box body; 3. a communicating pipe; 4. a heat conducting plate; 5. a fin; 6. a restraining screw; 7. a threaded bushing; 8. an active cannula; 9. a fixing plate; 10. pressing a plate; 101. mounting holes; 11. a protective pad; 12. and (4) air holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1:

referring to fig. 1-3, the present invention provides a technical solution: a multilayer efficient heat dissipation circuit board, please refer to fig. 1, comprises two sets of multilayer circuit board bodies 1 and a box body 2, wherein heat conduction plates 4 are arranged on the upper end surface and the lower end surface of the box body 2, the two sets of heat conduction plates 4 are fixedly connected with the box body 2, the two sets of heat conduction plates 4 extend into the inner cavity of the box body 2, and heat can be effectively conducted into the inner cavity of the box body 2 through the heat conduction plates 4.

Referring to fig. 1, both side end surfaces of the box body 2 are fixedly connected with communicating pipes 3 communicated with the inner cavity, and the communicating pipes 3 can be conveniently connected with external liquid cooling equipment, so that cooling liquid can effectively and conveniently enter the inner cavity of the box body 2.

Referring to fig. 1, two sets of limiting screws 6 are symmetrically arranged on the top end surface and the bottom end surface of the box body 2, the four sets of limiting screws 6 are fixedly connected with the box body 2, a pressing plate 10 is movably connected to each set of limiting screw 6, each set of multilayer circuit board body 1 is installed on the surface of the heat conducting plate 4 through the pressing plate 10, and the multilayer circuit board body 1 can be effectively installed on the surface of the heat conducting plate 4 through the arranged pressing plate 10, so that the heat dissipation work can be effectively and conveniently performed.

Please refer to fig. 1 and 2, the outer wall of every group restriction screw 6 all cup joints and is provided with threaded sleeve 7, threaded sleeve 7 and restriction screw 6 threaded connection, threaded sleeve 7's outer wall cup joints movable sleeve 8 that is provided with the bearing and connects, movable sleeve 8's right side terminal surface fixedly connected with fixed plate 9, clamp plate 10 passes through the bolt and installs the bottom face at fixed plate 9, through threaded sleeve 7, cooperation between the restriction screw 6, can effectually drive fixed plate 9 and go up and down, then can effectually drive clamp plate 10 and go up and down, then can effectually conveniently adapt to the multilayer circuit board body 1 of different specifications.

Example 2:

as shown in fig. 2 and fig. 3, different from the previous embodiment 1, the bottom end surface of the pressing plate 10 is provided with a protection pad 11, the protection pad 11 is fixedly connected with the pressing plate 10, the multilayer circuit board body 1 can be effectively protected by the protection pad 11, and then the service life of the multilayer circuit board body 1 can be effectively prolonged.

As shown in fig. 2 and 3, the pressing plate 10 includes two sets of mounting holes 101, the pressing plate 10 and the protection pad 11 include a plurality of sets of ventilation holes 12, and the overall heat dissipation performance can be effectively improved through the ventilation holes 12.

As shown in fig. 1, two sets of heat conducting plates 4 are provided with a plurality of groups of fins 5 on one end face of the inner cavity of the box body 2, the fins 5 are fixedly connected with the heat conducting plates 4, the heat radiating area of the heat conducting plates 4 can be effectively improved through the arranged fins 5, and then the heat radiating efficiency can be effectively improved.

As shown in fig. 2 and 3, the bottom end surface of the protection pad 11 is provided with corrugations, which can effectively increase the friction of the protection pad 11, and then can effectively improve the stability of the multilayer circuit board body 1 during installation.

Wherein the content of the first and second substances,

the working principle is as follows: when using, place multilayer circuit board body 1 on heat-conducting plate 4's surface, later through threaded sleeve 7, restriction screw rod cooperation between 6, can effectually drive fixed plate 9 and descend, then can effectually drive clamp plate 10 and descend, then can effectually fix multilayer circuit board body 1, later be connected with the liquid cooling equipment of peripheral hardware through communicating pipe 3, the circulation through the coolant liquid carries out the heat dissipation that lasts, and because whole can not produce the vibration, then can effectual improvement multilayer circuit board body 1's life.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-efficient heat dissipation circuit board of multilayer, includes two sets of multilayer circuit board bodies (1) and box (2), its characterized in that: the upper and lower terminal surface of box (2) all is provided with heat-conducting plate (4), and is two sets of heat-conducting plate (4) and box (2) fixed connection, it is two sets of heat-conducting plate (4) stretch into the inner chamber to box (2), intercommunication pipeline (3) of the equal fixedly connected with inner chamber intercommunication of both sides terminal surface of box (2), the equal symmetry of top face and the bottom face of box (2) is provided with two sets of restriction screw rods (6), four groups restriction screw rod (6) and box (2) fixed connection, every group all are provided with swing joint's clamp plate (10), every group on restriction screw rod (6) multilayer circuit board body (1) is installed on the surface of heat-conducting plate (4) through clamp plate (10).

2. The multilayer high-efficiency heat dissipation circuit board of claim 1, wherein: every group the outer wall of restriction screw rod (6) all cup joints and is provided with threaded sleeve pipe (7), threaded sleeve pipe (7) and restriction screw rod (6) threaded connection, the outer wall of threaded sleeve pipe (7) cup joints movable sleeve pipe (8) that is provided with the bearing and connects, the right side terminal surface fixedly connected with fixed plate (9) of movable sleeve pipe (8), clamp plate (10) are installed at the bottom face of fixed plate (9) through the bolt.

3. The multilayer high-efficiency heat dissipation circuit board of claim 1, wherein: the bottom end face of the pressing plate (10) is provided with a protective pad (11), and the protective pad (11) is fixedly connected with the pressing plate (10).

4. The multilayer high-efficiency heat dissipation circuit board of claim 3, wherein: the pressing plate (10) comprises two groups of mounting holes (101), and the pressing plate (10) and the protective pad (11) comprise a plurality of groups of air holes (12).

5. The multilayer high-efficiency heat dissipation circuit board of claim 1, wherein: two sets of heat-conducting plates (4) all are provided with multiunit fin (5) at the terminal surface of box (2) inner chamber, and fin (5) and heat-conducting plate (4) fixed connection.

6. The multilayer high-efficiency heat dissipation circuit board of claim 3, wherein: the bottom end surface of the protective pad (11) is provided with ripples.