CN217985534U - Heat dissipation type double-layer circuit board - Google Patents
Heat dissipation type double-layer circuit board Download PDFInfo
- Publication number
- CN217985534U CN217985534U CN202222055181.0U CN202222055181U CN217985534U CN 217985534 U CN217985534 U CN 217985534U CN 202222055181 U CN202222055181 U CN 202222055181U CN 217985534 U CN217985534 U CN 217985534U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- heat conduction
- conduction pole
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of the circuit board, a heat dissipation type double-deck circuit board is disclosed, which comprises a circuit board, the fixed surface of circuit board installs electronic component, the surface of circuit board is provided with the louvre, the quantity of circuit board is two, two the centre of circuit board is provided with heat conduction pole one, heat conduction pole two and heat conduction pole three, two the supply has been seted up to the inboard of circuit board the standing groove that heat conduction pole one, heat conduction pole two and heat conduction pole three-phase match, this practicality sets up a plurality of evenly distributed's louvre through the circuit board, and is equipped with heat conduction silica gel in the louvre for give off the inside heat of circuit board, simultaneously, through the inside heat conduction pole three of circuit board, heat conduction pole one and heat conduction pole two, further give off the inside heat of circuit board through the radiating block, be provided with the heat-conducting layer on the circuit layer, the heat-conducting layer is used for giving off the apparent heat of altitude, and to a certain extent the radiating rate of circuit board increases electronic component's life.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, specifically be a heat dissipation type double-deck circuit board.
Background
With the progress of production technology, the volume of a control box body of part of numerical control equipment is smaller and smaller, and the control box body is developing towards light and thin; because the space is reduced and the installation space is limited, a flexible circuit board is usually adopted in the control box body to replace part of the traditional hard board; the flexible circuit board has high space utilization rate and flexible arrangement, is suitable for a control box body with narrow space, but because the space is limited, when the circuit board works, because elements can generate heat, the problem of damage caused by local overheating is easily caused, and in order to prolong the service life of electronic elements, the electronic elements on the circuit board need to be subjected to heat dissipation treatment.
Most of the existing heat dissipation modes are heat dissipation by adding a ventilation structure in a control box, but most of the circuit boards are tightly attached to the control box when being installed, and the ventilation structure cannot blow the circuit board, so that the heat dissipation of the circuit board is slow, and the normal work of elements is influenced, and therefore a heat dissipation type double-layer circuit board needs to be provided.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an: in order to solve the problems that most of the circuit boards are tightly attached to a control box when the circuit boards are installed, and a ventilation structure cannot blow the circuit boards, so that the heat dissipation of the circuit boards is slow, and the normal work of elements is influenced, the heat dissipation type double-layer circuit board is provided.
The utility model adopts the technical scheme as follows: the utility model provides a heat dissipation type double-deck circuit board, includes the circuit board, the fixed surface of circuit board installs electronic component, the surface of circuit board is provided with the louvre, the quantity of circuit board is two, two be provided with heat conduction pole one, heat conduction pole two and heat conduction pole three, two in the centre of circuit board the supply has been seted up to the inboard of circuit board the standing groove that heat conduction pole one, heat conduction pole two and heat conduction pole three-phase match, the outer end fixedly connected with radiating block of heat conduction pole three, the confession has been seted up to the outer end both sides of circuit board the outer end assorted recess of radiating block, the inboard of circuit board is provided with the circuit layer, the inboard of circuit board is provided with the heat-conducting layer.
Through adopting above-mentioned technical scheme, through the inside heat conduction pole three of circuit board, heat conduction pole one and heat conduction pole two, further give off the inside heat of circuit board through the radiating block, be provided with the heat-conducting layer on the circuit layer, the heat-conducting layer is used for giving off the apparent heat of circuit board, improves the radiating rate of circuit board to a certain extent.
In a preferred embodiment, the four ends of the circuit board are provided with mounting holes.
By adopting the technical scheme, the circuit board can be conveniently installed.
In a preferred embodiment, the heat dissipation holes are uniformly distributed on the surface of the circuit board.
In a preferred embodiment, the inner wall of the circuit board is provided with heat-conducting silica gel, and the heat-conducting silica gel and the heat dissipation holes are on the same vertical line.
Through adopting above-mentioned technical scheme, set up a plurality of evenly distributed's louvre through the circuit board, and be equipped with heat conduction silica gel in the louvre for give off the inside heat of circuit board.
In a preferred embodiment, two ends of the first heat conduction rod are connected to outer ends of the second heat conduction rod, and the second heat conduction rod is connected to an outer end of the third heat conduction rod.
Through adopting above-mentioned technical scheme, be convenient for transmit the heat.
In a preferred embodiment, the thickness of the placement groove is half of the thickness of the first heat conduction rod, the second heat conduction rod and the third heat conduction rod.
Through adopting above-mentioned technical scheme, be convenient for heat conduction pole one, heat conduction pole two and heat conduction pole three and the circuit board closely install.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
the utility model discloses in, set up a plurality of evenly distributed's louvre through the circuit board, and be equipped with heat conduction silica gel in the louvre for give off the inside heat of circuit board, simultaneously, through the inside heat conduction pole three of circuit board, heat conduction pole one and heat conduction pole two, further give off the inside heat of circuit board through the radiating block, be provided with the heat-conducting layer on the circuit layer, the heat-conducting layer is used for giving off the apparent heat of circuit board, improves the radiating rate of circuit board to a certain extent, increases electronic component's life.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the circuit board of the present invention;
fig. 3 is a schematic view of the structure of the middle heat conducting rod of the present invention.
The labels in the figure are: 1. a circuit board; 2. a groove; 3. mounting holes; 4. heat dissipation holes; 5. an electronic component; 6. heat conducting silica gel; 7. a third heat conducting rod; 8. a first heat conducting rod; 9. a second heat conducting rod; 10. a heat conducting layer; 11. a circuit layer; 12. and a heat dissipation block.
Detailed Description
To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
A heat dissipation type double-layer circuit board according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 3.
The embodiment is as follows:
the embodiment of the utility model provides a heat dissipation type double-layer circuit board, refer to fig. 1 and fig. 2, including circuit board 1, the fixed surface of circuit board 1 installs electronic component 5, and the surface of circuit board 1 is provided with louvre 4, and the inboard of circuit board 1 is provided with circuit layer 11, and the inboard of circuit board 1 is provided with heat-conducting layer 10, and heat-conducting layer 10 is used for giving off the apparent heat of circuit board 1, improves the radiating rate of circuit board 1 to a certain extent;
Referring to fig. 1, 2 and 3, the number of the circuit boards 1 is two, a first heat conducting rod 8, a second heat conducting rod 9 and a third heat conducting rod 7 are arranged in the middle of the two circuit boards 1, two ends of the first heat conducting rod 8 are connected with the outer end of the second heat conducting rod 9, the second heat conducting rod 9 is connected with the outer end of the third heat conducting rod 7, placing grooves for matching the first heat conducting rod 8, the second heat conducting rod 9 and the third heat conducting rod 7 are formed in the inner sides of the two circuit boards 1, the outer end of the third heat conducting rod 7 is fixedly connected with a heat dissipation block 12, and heat inside the circuit board 1 is further dissipated through the heat dissipation block 12 through the third heat conducting rod 7, the first heat conducting rod 8 and the second heat conducting rod 9 inside the circuit board 1;
outer end assorted recess 2 that supplies radiating block 12 is seted up to the outer end both sides of circuit board 1, and the thickness of standing groove is half the thickness of heat conduction pole one 8, two 9 and three 7 of heat conduction pole, and the heat conduction pole one 8, two 9 and three 7 of heat conduction pole of being convenient for are closely installed with circuit board 1.
The implementation principle of a heat dissipation type double-layer circuit board of this application embodiment does:
offer a plurality of evenly distributed's louvre 4 through circuit board 1, and be equipped with heat conduction silica gel 6 in the louvre 4, a heat for giving off 1 inside heat of circuit board, and simultaneously, three 7 through 1 inside heat conduction poles of circuit board, heat conduction pole one 8 and heat conduction pole two 9, further give off 1 inside heat of circuit board through radiating block 12, be provided with heat-conducting layer 10 on the circuit layer 11, heat-conducting layer 10 is used for giving off 1 apparent heat of circuit board, the radiating rate of circuit board 1 is improved to a certain extent, increase electronic component's life.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (6)
1. The utility model provides a double-deck circuit board of heat dissipation type, includes circuit board (1), its characterized in that: the fixed surface of circuit board (1) installs electronic component (5), the surface of circuit board (1) is provided with louvre (4), the quantity of circuit board (1) is two, two be provided with heat conduction pole one (8), two (9) and three (7) of heat conduction pole in the centre of circuit board (1), two the confession has been seted up to the inboard of circuit board (1) heat conduction pole one (8), two (9) and three (7) assorted standing grooves of heat conduction pole, the outer end fixedly connected with radiating block (12) of three (7) of heat conduction pole, the confession has been seted up to the outer end both sides of circuit board (1) the outer end assorted recess (2) of radiating block (12), the inboard of circuit board (1) is provided with circuit layer (11), the inboard of circuit board (1) is provided with heat-conducting layer (10).
2. The heat dissipation type double-layer circuit board of claim 1, wherein: four ends of the circuit board (1) are provided with mounting holes (3).
3. The heat dissipation type double-layer wiring board according to claim 1, wherein: the radiating holes (4) are uniformly distributed on the surface of the circuit board (1).
4. The heat dissipation type double-layer circuit board of claim 1, wherein: the inner wall of circuit board (1) is provided with heat conduction silica gel (6), heat conduction silica gel (6) and louvre (4) are on same vertical line.
5. The heat dissipation type double-layer circuit board of claim 1, wherein: the two ends of the first heat conducting rod (8) are connected with the outer end of the second heat conducting rod (9), and the second heat conducting rod (9) is connected with the outer end of the third heat conducting rod (7).
6. The heat dissipation type double-layer circuit board of claim 1, wherein: the thickness of the placing groove is half of the thickness of the first heat conducting rod (8), the second heat conducting rod (9) and the third heat conducting rod (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222055181.0U CN217985534U (en) | 2022-08-05 | 2022-08-05 | Heat dissipation type double-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222055181.0U CN217985534U (en) | 2022-08-05 | 2022-08-05 | Heat dissipation type double-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217985534U true CN217985534U (en) | 2022-12-06 |
Family
ID=84255231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222055181.0U Active CN217985534U (en) | 2022-08-05 | 2022-08-05 | Heat dissipation type double-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217985534U (en) |
-
2022
- 2022-08-05 CN CN202222055181.0U patent/CN217985534U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN217985534U (en) | Heat dissipation type double-layer circuit board | |
| CN209402925U (en) | A kind of two-side radiation device of pcb board | |
| CN212588442U (en) | Multifunctional gateway | |
| CN210444231U (en) | Power amplifier with good heat dissipation | |
| CN210093835U (en) | A heat abstractor and car machine for car machine | |
| CN219181962U (en) | Circuit device for improving heating | |
| CN217714865U (en) | Heat dissipation base plate with two-sided water-cooling heat radiation structure | |
| CN211297435U (en) | Distribution circuit board on new energy automobile | |
| CN219555492U (en) | Multilayer heat conduction circuit board | |
| CN218941426U (en) | Vehicle communication device | |
| CN219660293U (en) | Module power supply heat dissipation assembly | |
| US11662087B2 (en) | Power supply device and high-power illumination system | |
| CN214800429U (en) | Heat radiation structure | |
| CN216818051U (en) | A laminating formula fin for plastic network transformer | |
| CN221653018U (en) | Vertical power radiator | |
| CN209151189U (en) | A kind of convection heat-dissipation intelligent router | |
| CN220340641U (en) | Rack-mounted server case | |
| CN214627470U (en) | High-efficient heat dissipation circuit board of multilayer | |
| CN211019802U (en) | Linear power source of electric power system | |
| CN217362883U (en) | High-efficient heat dissipation converter | |
| CN219761714U (en) | Low-thermal-resistance heat conducting fin with corrosion resistance function for power module | |
| CN209992944U (en) | Stimulating coil module mainboard | |
| CN212752734U (en) | Double-sided tin spraying circuit board | |
| CN209882213U (en) | Labyrinth type high-efficiency heat dissipation printed circuit board | |
| CN217333244U (en) | Intelligent embedded waterproof industrial personal computer with passive heat dissipation and electromagnetic protection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |