CN211240608U

CN211240608U - Radiator for electronic device

Info

Publication number: CN211240608U
Application number: CN201922334410.0U
Authority: CN
Inventors: 邱珍华; 邱嘉龙; 刘亚坤
Original assignee: Zhejiang Tianyi Semiconductor Technology Co ltd
Current assignee: Zhejiang Tianyi Semiconductor Technology Co ltd
Priority date: 2019-12-20
Filing date: 2019-12-20
Publication date: 2020-08-11
Anticipated expiration: 2029-12-20

Abstract

The utility model discloses a radiator for electronic device relates to the radiator, aims at solving the not good problem of radiator radiating effect, and its technical scheme main points are: the bottom plate is provided with a plurality of threaded holes along the thickness direction, the threaded holes are used for connecting a radiator and an electronic device, a radiating fin group is fixedly connected to the bottom plate, the bottom plate is disc-shaped, a ring block is integrally formed on the peripheral wall of the bottom plate, the length of the ring block is larger than the thickness of the bottom plate, the fin group comprises a plurality of fin groups I and a plurality of fin groups II, the fin groups I and the fin groups II are radiating blocks of a plurality of linear arrays, the radiating blocks are of cuboid structures, adjacent fin groups I and fin groups II are alternated, a plurality of radiating blocks located on the fin groups I and a plurality of radiating blocks located on the fin groups II are arranged in a. The utility model discloses have and carry out the effect of heat exchange better with the air.

Description

Radiator for electronic device

Technical Field

The present invention relates to a heat sink, and more particularly, to a heat sink for an electronic device.

Background

In recent years, with the increasing of the conversion capability of a power circuit, the power consumption is increased, various electronic devices generate huge heat, the heat dissipation problem is caused, a heat radiator is generated, and the heat radiator is correctly selected and used, so that the economic index and the operation effect of the system are related. Generally, the heat radiator is composed of a bottom plate connected with an electronic device and heat radiating fins which are fixedly connected to the bottom plate and distributed in a linear array, and due to the fact that the arrangement positions of the heat radiating fins and the bottom plate are single, heat between adjacent heat radiating fins cannot circulate, the heat radiator cannot effectively exchange heat between the gathered heat and air, and the heat radiating effect is poor.

Therefore, a new solution is needed to solve this problem.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art exists, the utility model aims to provide a radiator for electronic device, through setting up a plurality of radiating blocks and the heat dissipation strip of annular array on the bottom plate of crisscross distribution, increase thermal circulation space to realize the effective heat dissipation of radiator.

The above technical purpose of the present invention can be achieved by the following technical solutions: the utility model provides a radiator for electronic device, comprising a base plate, the bottom plate has seted up a plurality of screw holes along its thickness direction, the screw hole is used for connecting radiator and electronic device, fixedly connected with is used for radiating piece group on the bottom plate, the bottom plate is discoid and integrated into one piece has the ring piece on its periphery wall, the length of ring piece is greater than the thickness of bottom plate, piece group includes a plurality of piece group one and a plurality of piece group two, piece group one and piece group two are the radiating block of a plurality of linear array, the radiating block is the cuboid structure, adjacent piece group one and piece group two are in turn, the radiating block in piece group one sets up with the radiating block in piece group two is crisscross, a.

Through adopting above-mentioned technical scheme, through the ring piece that outside extension integrated into one piece becomes in discoid bottom plate outside, make electron device's heat conduct on the bottom plate, because bottom plate and ring piece integrated into one piece, so make on the bottom plate heat conduct on the ring piece, and directly take place the heat exchange with the air through the ring piece, through setting up the radiating block that interlocks each other, the area of radiating block with the air contact has been increased on the one hand, the crisscross setting up of on the other hand makes the heat that is located different radiating block peripheries can circulate each other, it shelters from the route that the heat flows to dredge the radiating block, thereby make high heat can be through the spontaneous orientation motion towards low heat in crisscross space, make things convenient for the more even heat dissipation of radiator.

The utility model discloses further set up to: one side fixedly connected with a plurality of heat dissipation strips of ring piece far away from the bottom plate, the axis annular array distribution of heat dissipation strip along the bottom plate is equipped with the space between the adjacent heat dissipation strip.

Through adopting above-mentioned technical scheme, through set up the heat dissipation strip that distributes around bottom plate axis annular array on the ring piece for heat dissipation strip can continue to take place heat exchange with the air with the heat on the ring piece, sets up the space between the heat dissipation strip and is favorable to the air admission, thereby makes the heat dissipation strip contact with the air more fully.

The utility model discloses further set up to: the sum of the lengths of the ring block and the heat dissipation strip is equal to the lengths of the heat dissipation blocks.

Through adopting above-mentioned technical scheme, the length sum that sets up ring block and radiating strip equals the length of radiating block to make the radiating block that the radiating strip is located the ring block protect, prevent that the radiating block from taking place deformation and damage under the effect of external force because of thickness is not enough.

The utility model discloses further set up to: one side of the heat dissipation strip, which is far away from the ring block, is provided with a cavity.

Through adopting above-mentioned technical scheme, the cavity is seted up to the through-hole in the heat dissipation strip, save material on the one hand, and on the other hand makes things convenient for the air to get into from the cavity to the interior outer wall that makes the heat dissipation strip all carries out the heat exchange with the air.

The utility model discloses further set up to: the heat dissipation strip is internally provided with a reinforcing rib which is positioned in the cavity.

Through adopting above-mentioned technical scheme, through set up the strengthening rib in the cavity of heat dissipation strip to consolidate the heat dissipation strip, and then be difficult for taking place deformation.

The utility model discloses further set up to: the connection part of the bottom plate and the ring block is in arc transition.

Through adopting above-mentioned technical scheme, through setting up the circular arc transition for whole radiator is more convenient for install, simultaneously, and the radiator takes place the damage phenomenon to the human body when also being favorable to preventing the installation.

The utility model discloses further set up to: the threaded holes are four and distributed in an annular array along the axis direction of the bottom plate, and the threaded holes are located between the radiating blocks and the annular block.

Through adopting above-mentioned technical scheme, through set up the screw hole between ring piece and radiating block to make things convenient for the screwdriver to get into and install the radiator in the ring piece.

The utility model discloses further set up to: the bottom plate, the ring block, the heat dissipation block and the heat dissipation strip are all made of aluminum materials.

By adopting the technical scheme, the aluminum has good heat dissipation and obvious energy-saving characteristics, and meanwhile, the aluminum has good oxidation corrosion resistance, no additive is added, once the aluminum meets oxygen in the air, an oxidation film is generated, and the oxidation film is tough and compact and prevents further corrosion to the body material.

To sum up, the utility model discloses following beneficial effect has:

through outwards extending the ring piece that forms integrated into one piece in discoid bottom plate outside, make on electron device's heat can conduct the bottom plate, because bottom plate and ring piece integrated into one piece, so make on the bottom plate heat can conduct on the ring piece, and directly take place the heat exchange with the air through the ring piece, through setting up the radiating block that interlocks each other, the area of radiating block with the air contact has been increased on the one hand, the crisscross setting of on the other hand makes and is located the peripheral heat of different radiating blocks and can circulate each other, it shelters from the route that the heat flows to reduce the radiating block, thereby make high heat can be through the spontaneous orientation motion towards low heat in crisscross space, make things convenient for the more even heat dissipation of radiator.

Drawings

Fig. 1 is a first schematic structural diagram of the present invention;

FIG. 2 is a second schematic structural view of the present invention;

fig. 3 is a third schematic structural view of the present invention;

fig. 4 is a fourth schematic structural diagram of the present invention.

In the figure: 1. a base plate; 2. a ring block; 3. a heat dissipating strip; 4. a cavity; 5. reinforcing ribs; 6. a heat dissipating block; 7. a threaded bore.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings and examples.

A radiator for an electronic device comprises a disc-shaped bottom plate 1, wherein a fin group for radiating heat is fixedly connected to the bottom plate 1, the fin group comprises a plurality of fin groups I and a plurality of fin groups II, the fin groups I and the fin groups II are radiating blocks 6 in a plurality of linear arrays, the radiating blocks 6 are of cuboid structures, the adjacent fin groups I and the fin groups II are alternated, the radiating blocks 6 in the fin groups I and the radiating blocks 6 in the fin groups II are arranged in a staggered mode, a ring block 2 is integrally formed on the outer peripheral wall of the bottom plate 1, the connecting part of the bottom plate 1 and the ring block 2 is in arc transition, the length of the ring block 2 is larger than the thickness of the bottom plate 1, the radiating blocks 6 are positioned in the ring block 2, a side, far away from the bottom plate 1, of the ring block 2 is fixedly connected with a plurality of radiating strips 3, the radiating strips 3 are distributed in an annular array along the axis of the bottom plate 1, gaps are arranged between the adjacent radiating strips 3, one side of the radiating strip 3, which is far away from the ring block 2, is provided with a cavity 4, reinforcing ribs 5 are welded in the cavity 4, four threaded holes 7 are formed in the bottom plate 1 along the thickness direction of the bottom plate, the threaded holes 7 are distributed along the axis direction of the bottom plate 1 in an annular array mode, the threaded holes 7 are used for connecting a radiator and an electronic device, the four threaded holes 7 are located between the radiating blocks 6 and the ring block 2, and the bottom plate 1, the ring block 2, the radiating blocks 6 and the radiating strip 3 are made of aluminum materials due to the fact that the aluminum is good in radiating performance of numerous metals, low in price and low in.

In a specific implementation, the heat sink is first mounted by screwing screws with a screwdriver through the threaded holes 7 in the base plate 1 to the electronic device. When an electronic device generates heat, the bottom plate 1 is fixedly connected with the electronic device through screws, so that the heat on the electronic device is mainly conducted to the bottom plate 1 made of aluminum materials, the bottom plate 1 and the ring block 2 are integrally formed, the top surface of the bottom plate 1 and the inner and outer side walls of the ring block 2 are both contacted with air for heat dissipation, in order to increase the contact area between the bottom plate 1 and the ring block 2 and the air, a plurality of heat dissipation blocks 6 are arranged on the top surface of the bottom plate 1, so that the heat on the bottom plate 1 can also be dissipated through the heat dissipation blocks 6, the heat dissipation blocks 6 which are arranged in a mutually staggered mode are arranged, so that the heat of the heat dissipation blocks 6 is not gathered together, when the heat at local positions on the radiator is overhigh, the heat can not only be exchanged with the air through the length direction of the heat dissipation blocks 6, but also can be circulated from gaps among the heat dissipation blocks 6 which are mutually staggered, so, prevent that the radiator from not needing to produce expend with heat and contract with cold further because of the heat, influence radiator and electron device's connectivity, through set up hollow radiating strip 3 on ring piece 2 for radiating strip 3 carries out the contact of bigger area and heat dissipation with the air, owing to welding strengthening rib 5 in cavity 4 of radiating strip 3, thereby make the radiating strip 3 that is located the 6 outsides of a plurality of radiating blocks have certain intensity, and then can protect radiating block 6 to take place deformation and damage. Because the utility model discloses an outwards extend the ring piece 2 that forms integrated into one piece in discoid bottom plate 1 outside, make electron device's heat conduct on bottom plate 1, because bottom plate 1 and ring piece 2 integrated into one piece, so make heat on the bottom plate 1 conduct on ring piece 2, and take place heat exchange through ring piece 2 is direct with the air, through setting up the radiating block 6 that interlocks each other, radiating block 6 and air contact's area has been increased on the one hand, the crisscross setting of on the other hand makes and is located 6 peripheral heat energy of different radiating blocks and can circulate each other, it shelters from the route that the heat flows to reduce radiating block 6, thereby make high heat can be through the spontaneous orientation motion towards low heat in crisscross space, make things convenient for the more even heat dissipation of radiator.

It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a radiator for electronic device, includes bottom plate (1), a plurality of screw holes (7) have been seted up along its thickness direction in bottom plate (1), screw hole (7) are used for connecting radiator and electronic device, fixedly connected with is used for radiating piece group on bottom plate (1), its characterized in that: the heat dissipation structure is characterized in that the base plate (1) is disc-shaped, a ring block (2) is integrally formed on the peripheral wall of the base plate, the length of the ring block (2) is larger than the thickness of the base plate (1), the fin group comprises a plurality of fin groups I and a plurality of fin groups II, the fin groups I and the fin groups II are heat dissipation blocks (6) of a plurality of linear arrays, the heat dissipation blocks (6) are of cuboid structures and are adjacent to each other, the fin groups I and the fin groups II alternate, the heat dissipation blocks (6) in the fin groups I and the heat dissipation blocks (6) in the fin groups II are arranged in a staggered mode, and the heat dissipation blocks (6) are located in.

2. A heat sink for electronic devices according to claim 1, wherein: one side fixedly connected with a plurality of heat dissipation strips (3) of bottom plate (1) are kept away from in ring piece (2), heat dissipation strip (3) distribute along the axis annular array of bottom plate (1), and are adjacent be equipped with the space between heat dissipation strip (3).

3. A heat sink for electronic devices according to claim 2, wherein: the sum of the lengths of the ring block (2) and the heat dissipation strip (3) is equal to the lengths of the heat dissipation blocks (6).

4. A heat sink for electronic devices according to claim 3, wherein: and a cavity (4) is formed in one side of the heat dissipation strip (3) far away from the ring block (2).

5. The heat sink for electronic devices as claimed in claim 4, wherein: and a reinforcing rib (5) is arranged in the heat dissipation strip (3), and the reinforcing rib (5) is positioned in the cavity (4).

6. A heat sink for electronic devices according to claim 1, wherein: the connection part of the bottom plate (1) and the ring block (2) is in arc transition.

7. A heat sink for electronic devices according to claim 1, wherein: the four threaded holes (7) are distributed in an annular array along the axial direction of the base plate (1), and the plurality of threaded holes (7) are located between the plurality of radiating blocks (6) and the ring block (2).

8. A heat sink for electronic devices according to claim 2, wherein: the bottom plate (1), the ring block (2), the heat dissipation block (6) and the heat dissipation strip (3) are all made of aluminum materials.