CN217957562U

CN217957562U - Hot-press welding copper-based high-frequency heat dissipation circuit board

Info

Publication number: CN217957562U
Application number: CN202220895160.7U
Authority: CN
Inventors: 李立远
Original assignee: Putian Hanjiang Huaguang Electronic Co ltd
Current assignee: Putian Hanjiang Huaguang Electronic Co ltd
Priority date: 2022-04-18
Filing date: 2022-04-18
Publication date: 2022-12-02
Anticipated expiration: 2032-04-18

Abstract

The utility model discloses a circuit board technical field's a hot press welding copper base high frequency heat dissipation circuit board, including first circuit board main part and second circuit board main part, first circuit board main part bottom is connected, six sets of absorber plate relative lateral walls in both sides all are equipped with the heating panel around, the right side is equipped with the heat dissipation fan between first circuit board main part and the second circuit board main part relative lateral wall, the jack has all been seted up to the lateral wall around the heat dissipation fan, the two sets of fixed column relative lateral walls in right side all are equipped with the connecting rod, the utility model discloses can produce heat with first circuit board main part and second circuit board main part and absorb under the effect of multiunit absorber plate, then distribute away the absorbed heat of absorber plate under the effect of heating panel, can quick the giving off under the effect of louvre, then can be with the timely discharge of the heat that gives off under the cooperation of heat dissipation fan, can improve the effect that the heat dissipation fan gave off the heat simultaneously under the effect of ventilation runner.

Description

Hot-press welding copper-based high-frequency heat dissipation circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is a hot-press welding copper base high frequency heat dissipation circuit board.

Background

The production of the metal-based circuit board at the present stage mainly takes an aluminum-based single-sided circuit board as the aluminum metal is cheaper and easy to process, and the insulating layer is mainly filled with cheap epoxy resin and ceramic powder.

The existing circuit board has poor heat dissipation effect, is easy to damage due to overhigh temperature when in use, and reduces the service life of the circuit board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a hot-pressing welding copper base high frequency heat dissipation circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a hot-press welding copper-based high-frequency heat dissipation circuit board comprises a first circuit board main body and a second circuit board main body, wherein first air holes are uniformly formed in the upper surface of the first circuit board main body, second air holes are uniformly formed in the upper surface of the second circuit board main body, four groups of fixed columns are arranged at the top of the second circuit board main body, the four groups of fixed columns are distributed at the top of the second circuit board main body in a rectangular array mode, the bottom of the first circuit board main body is connected with the tops of the four groups of fixed columns, six groups of heat absorption plates are arranged on the front side and the rear side of the top of the second circuit board main body, the top of each heat absorption plate is connected with the bottom of the first circuit board main body, heat dissipation plates are arranged on the front side and the rear side of the six groups of opposite side walls of the heat absorption plates, a heat dissipation fan is arranged on the right side between the first circuit board main body and the opposite side walls of the second circuit board main body, jacks are formed in the front side wall and the rear side wall of the heat dissipation fan, connecting rods are arranged on the two groups of opposite side walls, cavities are formed in the two groups of opposite ends of the connecting rods, and clamping components matched with the jacks are arranged in the cavities are arranged in the two groups of opposite ends of the cavities.

Further, the buckle subassembly includes the fly leaf that sliding connection was equipped with in the cavity, the lateral wall is equipped with the pull rod before the fly leaf, the right side wall is equipped with the telescopic link in the cavity, telescopic link one end is connected with fly leaf right side wall, the telescopic link outer wall cup joints and is equipped with the spring, spring one end is connected with fly leaf right side wall, the spring other end is connected with the right side wall in the cavity, the fly leaf left side wall is equipped with the inserted bar, left side wall and jack phase-match in the cavity are run through to inserted bar one end.

Furthermore, the upper side wall and the lower side wall in the cavity are both provided with limiting grooves, and the upper side wall and the lower side wall of the movable plate are both provided with limiting blocks matched with the limiting grooves.

Furthermore, the side wall has seted up the spout before the connecting rod, pull rod and spout sliding connection.

Furthermore, the six groups of heat absorbing plates on the front side and the rear side are distributed on the top of the second circuit board main body in a linear array mode, the heat absorbing plates are arranged in an inclined mode, and ventilation channels are formed between opposite side walls of the six groups of heat absorbing plates on the front side and the rear side.

Furthermore, heat dissipation holes are uniformly formed in the outer wall of the heat dissipation plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this practicality can absorb first circuit board main part and second circuit board main part production of heat under the effect of multiunit absorber plate, then distribute away the absorptive heat of absorber plate under the effect of heating panel, the giveaway that can be quick under the effect of louvre, then can be with the timely discharge of the heat that distributes under the cooperation of heat dissipation fan, can improve the heat dissipation fan under the effect of ventilation runner and distribute thermal effect simultaneously.

2. This practicality can conveniently carry out the dismouting to the heat dissipation fan under the effect of jack, inserted bar, fly leaf, pull rod, spring and telescopic link, prevents that the heat dissipation fan from damaging inconvenient quick replacement of carrying on and influence the heat dissipation of circuit board, improves the practicality.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a right side view of the structure of the present invention;

fig. 3 is a schematic view of the connection structure of the heat dissipation fan and the connecting rod of the present invention.

In the figure: 1. a first circuit board main body; 2. a first air vent; 3. a second circuit board main body; 4. a second air hole; 5. a heat dissipation plate; 6. heat dissipation holes; 7. a heat absorbing plate; 8. a heat dissipation fan; 9. a connecting rod; 10. fixing a column; 11. a cavity; 12. a jack; 13. a buckle assembly; 14. a rod is inserted; 15. a movable plate; 16. a pull rod; 17. a spring; 18. a telescopic rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1:

referring to fig. 1, the present invention provides a technical solution: the utility model provides a hot pressure welding copper base high frequency heat dissipation circuit board, including first circuit board main part 1 and second circuit board main part 3, first bleeder vent 2 has evenly been seted up to 1 upper surface of first circuit board main part, second bleeder vent 4 has evenly been seted up to 3 upper surfaces of second circuit board main part, 3 tops of second circuit board main part are equipped with four groups of fixed columns 10, four groups of fixed columns 10 are the rectangular array at 3 tops of second circuit board main part and distribute, 1 bottom of first circuit board main part is connected with four groups of fixed column 10 tops, both sides all are equipped with six groups of absorber plates 7 around 3 tops of second circuit board main part, absorber plate 7 tops are connected with 1 bottom of first circuit board main part, six groups of absorber plate 7 relative lateral walls all are equipped with heating panel 5 around both sides, right side is equipped with heat dissipation fan 8 between first circuit board main part 1 and second circuit board main part 3 relative lateral walls, lateral wall has all seted up jack 12 around heat dissipation fan 8, two groups of right side relative lateral wall all is equipped with connecting rod 9, cavity 11 has all been seted up to two groups of 9 relative end insides, all be equipped with jack and 12 assorted buckle subassembly 13 in two groups of cavity 11.

Preferably, six groups of heat absorbing plates 7 on the front side and the rear side are distributed on the top of the second circuit board main body 3 in a linear array manner, heat generated by the first circuit board main body 1 and the second circuit board main body 3 can be better absorbed, the heat absorbing plates 7 are arranged in an inclined manner, a ventilation flow channel is formed between opposite side walls of the six groups of heat absorbing plates 7 on the front side and the rear side, and heat dissipated by the heat dissipation plate 5 can be timely and quickly discharged under the effect of the ventilation flow channel.

Preferably, the heat dissipation holes 6 are uniformly formed in the outer wall of the heat dissipation plate 5, and heat can be quickly dissipated under the action of the heat dissipation holes 6.

Example 2:

referring to fig. 3, this embodiment is different from the first embodiment in that: buckle subassembly 13 includes the fly leaf 15 that sliding connection was equipped with in the cavity 11, the lateral wall is equipped with pull rod 16 before the fly leaf 15, the right side wall is equipped with telescopic link 18 in the

cavity

11, 18 one end of telescopic link is connected with the 15 right side wall of fly leaf, 18 outer walls of telescopic link cup joint and are equipped with spring 17, spring 17 one end is connected with the 15 right side wall of fly leaf, the spring 17 other end is connected with the 11 right side wall of cavity, the 15 left side wall of fly leaf is equipped with inserted bar 14, the 14 one end of inserted bar runs through the 11 interior left side wall of cavity and jack 12 phase-matches, staff's pulling pull rod 16 drives fly leaf 15 and extrudees telescopic link 18, thereby fly leaf 15 extrudees spring 17, fly leaf 15 removes inserted bar 14 inside the cavity 11, make inserted bar 4 and jack 12 phase separation, can conveniently dismantle the change maintenance to heat dissipation fan 8.

The limiting groove has all been seted up to lateral wall about in the cavity 11, lateral wall all be equipped with limiting groove assorted stopper about the fly leaf 15, make the fly leaf 15 remove about in cavity 11 more stable under the effect of limiting groove and stopper.

The connecting rod 9 has a chute in the front side wall, the pull rod 16 is connected with the chute in a sliding manner, and the pull rod 16 is more stable in left-right movement under the action of the chute, so that the pull rod 16 drives the movable plate 15 to move more stably in the cavity 11 in the left-right direction.

The working principle is as follows: can absorb first circuit board main part 1 and the heat production of second circuit board main part 3 under the effect of multiunit absorber plate 7, then distribute away the absorbed heat of absorber plate 7 under the effect of heating panel 5, simultaneously can be quick under the effect of louvre 6 give off, then heat dissipation fan 8 carries out work, the timely discharge of heat that cooperation ventilation runner can give off heating panel 5 simultaneously, staff's pulling pull rod 16 drives fly leaf 15 and extrudes telescopic link 18, thereby fly leaf 15 extrudes spring 17, fly leaf 15 removes inserted bar 14 to inside cavity 11, make inserted bar 4 and jack 12 phase separation, can conveniently dismantle change maintenance to heat dissipation fan 8.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a hot pressure welding copper base high frequency heat dissipation circuit board, includes first circuit board main part (1) and second circuit board main part (3), its characterized in that: the heat dissipation device is characterized in that first air holes (2) are uniformly formed in the upper surface of the first circuit board main body (1), second air holes (4) are uniformly formed in the upper surface of the second circuit board main body (3), four groups of fixing columns (10) are arranged at the top of the second circuit board main body (3), the four groups of fixing columns (10) are distributed at the top of the second circuit board main body (3) in a rectangular array manner, the bottom of the first circuit board main body (1) is connected with the tops of the four groups of fixing columns (10), six groups of heat absorption plates (7) are arranged on the front side and the rear side of the top of the second circuit board main body (3), the top of each heat absorption plate (7) is connected with the bottom of the first circuit board main body (1), heat dissipation plates (5) are arranged on the opposite side walls of the six groups of heat absorption plates (7) on the front side and the rear side, a heat dissipation fan (8) is arranged on the right side between the opposite side walls of the first circuit board main body (1) and the second circuit board main body (3), jacks (12) are formed in the front side and rear side walls of the heat dissipation fan (8), connecting rods (9) are arranged on the opposite side walls of the opposite sides of the two groups of the right side, connecting rods (9) are respectively provided with connecting rods (9), opposite ends, connecting rods (9) are respectively, cavity (9) are respectively provided with opposite ends, and buckles (13) matched with jack assemblies (11) in the cavity (11).

2. A thermocompression bonding copper-based high-frequency heat dissipation circuit board according to claim 1, characterized in that: buckle subassembly (13) are including fly leaf (15) that sliding connection was equipped with in cavity (11), the lateral wall is equipped with pull rod (16) before fly leaf (15), the right side wall is equipped with telescopic link (18) in cavity (11), telescopic link (18) one end and fly leaf (15) right side wall are connected, telescopic link (18) outer wall cup joints and is equipped with spring (17), spring (17) one end and fly leaf (15) right side wall are connected, the spring (17) other end and cavity (11) interior right side wall are connected, fly leaf (15) left side wall is equipped with inserted bar (14), left side wall and jack (12) phase-match in inserted bar (14) one end runs through cavity (11).

3. A thermocompression bonding copper-based high-frequency heat dissipation circuit board according to claim 2, characterized in that: the limiting groove is formed in the upper side wall and the lower side wall in the cavity (11), and the limiting blocks matched with the limiting grooves are arranged on the upper side wall and the lower side wall of the movable plate (15).

4. A thermocompression bonding copper-based high-frequency heat dissipation circuit board according to claim 2, characterized in that: the front side wall of the connecting rod (9) is provided with a sliding groove, and the pull rod (16) is connected with the sliding groove in a sliding manner.

5. The thermocompression bonding copper-based high-frequency heat dissipation circuit board according to claim 1, characterized in that: the six groups of heat absorbing plates (7) on the front side and the rear side are distributed on the top of the second circuit board main body (3) in a linear array mode, the heat absorbing plates (7) are arranged in an inclined mode, and ventilation flow channels are formed between opposite side walls of the six groups of heat absorbing plates (7) on the front side and the rear side.

6. The thermocompression bonding copper-based high-frequency heat dissipation circuit board according to claim 1, characterized in that: radiating holes (6) are uniformly formed in the outer wall of the radiating plate (5).