CN214800034U - High-efficient heat dissipation printed circuit board - Google Patents
High-efficient heat dissipation printed circuit board Download PDFInfo
- Publication number
- CN214800034U CN214800034U CN202121349324.8U CN202121349324U CN214800034U CN 214800034 U CN214800034 U CN 214800034U CN 202121349324 U CN202121349324 U CN 202121349324U CN 214800034 U CN214800034 U CN 214800034U
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- heat
- frame body
- outer frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000741 silica gel Substances 0.000 claims abstract description 16
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 16
- 239000000110 cooling liquid Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of printed circuit boards, and discloses a high-efficiency heat dissipation printed circuit board, which comprises an outer frame body, wherein a printed circuit board is fixedly arranged inside the outer frame body, a cooling circulating pump is fixedly arranged in the middle of the lower surface of the inner wall of the outer frame body, the high-efficiency heat dissipation printed circuit board is characterized in that the outer frame body is arranged outside the printed circuit board, then a plurality of heat conducting rods which can independently move up and down are movably arranged above the printed circuit board by penetrating through the top end of the outer frame body, and the bottom end of each heat conducting rod is provided with a heat conducting silica gel sheet, so that the upper surface of the printed circuit board is attached with the silica gel sheet for heat conduction with high coverage rate, heat can be quickly conducted to the low-temperature area at the top end through the heat conducting rods after being conducted by the heat conducting silica gel sheet, the quick conduction of the heat generated by the printed circuit board is realized, and the heat dissipation of the circulating flow of cooling liquid at the bottom end is combined simultaneously, the heat dissipation efficiency of the printed circuit board is greatly improved.
Description
Technical Field
The utility model relates to a printed circuit board technical field specifically is a high-efficient heat dissipation printed circuit board.
Background
Printed circuit boards, also known as printed circuit boards, are important electronic components, support bodies for electronic components, carriers for electrical interconnection of electronic components, and printed circuit boards are used for electrical connection of various electronic devices, including watches, calculators, computers, communication electronic devices, and the like, as long as integrated circuits and other electronic components are provided.
Along with the rapid development of science and technology, the integration degree of the printed circuit board is higher and higher, so that a large number of electronic components are integrated on the circuit board, each electronic component can generate heat in the use process, the larger the electronic component generates heat, and the larger the electronic component generates heat, in addition, the large number of the electronic components integrated on the circuit board can generate large amount of heat in the use process of the printed circuit board, most of the heat dissipation modes of the existing printed circuit board in the use process are that heat generated by the electronic components is absorbed and dissipated through an external heat dissipation fan, and some of the heat dissipation modes also perform auxiliary heat dissipation by attaching heat-conducting silica gel sheets on certain larger electronic components with flat surfaces, and the modes can not rapidly conduct the heat generated by the electronic components away from the vicinity of the surfaces of the electronic components, but conduct the heat by utilizing the flow of air, such heat conduction efficiency is very low, leads to the inside heat of equipment can't be in time scattered very easily and at equipment internal circulation for the heat that printed circuit board produced produces the circulation influence each other, can not be fine to every electronic components on the printed circuit board simultaneously dispels the heat, and the heat dissipation silica gel piece is only to partial electronic components, thereby leads to whole printed circuit board's radiating effect poor, for this reason we propose a high-efficient heat dissipation printed circuit board.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a high-efficient heat dissipation printed circuit board possesses the advantage that the radiating efficiency is high, has solved the problem that proposes in the above-mentioned background art.
The utility model provides a following technical scheme: the utility model provides a high-efficient heat dissipation printed circuit board, includes the outer frame body, the inside fixed mounting of outer frame body has printed circuit board, the lower surface middle part fixed mounting of outer frame body inner wall has cooling circulation pump, cooling circulation pump's both ends fixedly connected with cooling circulation pipe, swing joint has the heat conduction stick in outer frame body top run through, the top swing joint of outer frame body surface has neat board, there are the curb plate, two in both sides of neat board upper surface fixed mounting respectively the spout has been seted up on the facade of curb plate respectively, there is the pulling handle, two at the both ends of neat board respectively fixed mounting be located swing joint in the spout between the curb plate and have the roof, the upper surface middle part fixed mounting who goes up the roof has the pull ring, the lower fixed surface who goes up the roof installs the elasticity soft layer.
Preferably, the cooling circulation pipe is in a snake-shaped folding type and is tightly attached to the lower surface of the printed circuit board, and the cooling circulation pump and the cooling circulation pipe are filled with oil cooling liquid.
Preferably, the quantity of heat conduction stick is a plurality of and intensive respectively outside framework top movable mounting, the bottom of heat conduction stick is fixed mounting respectively has heat conduction silica gel piece and the lower surface of heat conduction silica gel piece is attached to have the smooth paper layer in surface.
Preferably, the heat conducting rod penetrates through the leveling plate and is movably connected with the leveling plate, the top end of the heat conducting rod is provided with a limiting ring, the diameter of the limiting ring is larger than that of the straight rod part of the heat conducting rod, and the straight rod part of the heat conducting rod is in friction contact with the outer frame body and the leveling plate.
Preferably, the elastic soft layer is a sponge material which is soft in texture and has a very large scalability range.
Compared with the prior art, the utility model discloses possess following beneficial effect:
the high-efficiency heat dissipation printed circuit board is characterized in that an outer frame body is arranged outside the printed circuit board, and a plurality of heat conducting rods capable of independently moving up and down are movably arranged above the printed circuit board by penetrating through the top end of the outer frame body, so that after different printed circuit boards are arranged in each outer frame body, each heat conducting rod is pressed down to the bottom end to contact the printed circuit board by pressing down the upper top plate and utilizing the high compressibility of the elastic soft layer, and the bottom end of each heat conducting rod is provided with a heat conducting silica gel sheet, thereby leading the upper surface of the printed circuit board to be adhered with the heat-conducting silica gel sheet for heat conduction with high coverage rate, leading the heat to be quickly conducted to the low-temperature area at the top end through the heat-conducting rod after being conducted by the heat-conducting silica gel sheet, realizing the quick conduction of the heat generated by the printed circuit board, meanwhile, the heat dissipation efficiency of the printed circuit board is greatly improved by combining the heat dissipation of the circulating flow of the cooling liquid at the bottom end.
Drawings
FIG. 1 is a schematic front sectional view of the present invention;
fig. 2 is an enlarged schematic structural diagram of a point a in fig. 1 according to the present invention.
In the figure: 1. an outer frame body; 2. a printed circuit board; 3. a cooling circulation pump; 4. a cooling circulation pipe; 5. a heat conducting rod; 6. trimming the plate; 7. a side plate; 8. a chute; 9. pulling the handle; 10. an upper top plate; 11. a pull ring; 12. an elastic soft layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a high-efficiency heat dissipation printed circuit board comprises an outer frame body 1, a printed circuit board 2 is fixedly mounted inside the outer frame body 1, a cooling circulating pump 3 is fixedly mounted in the middle of the lower surface of the inner wall of the outer frame body 1, cooling circulating pipes 4 are fixedly connected to the two ends of the cooling circulating pump 3, a heat conducting rod 5 is movably connected to the top end of the outer frame body 1 in a penetrating manner, an aligning plate 6 is movably connected to the top end of the outer surface of the outer frame body 1, side plates 7 are respectively and fixedly mounted on the two sides of the upper surface of the aligning plate 6, sliding grooves 8 are respectively formed in the opposite surfaces of the two side plates 7, pulling handles 9 are respectively and fixedly mounted at the two ends of the aligning plate 6, an upper top plate 10 is movably connected to the sliding grooves 8 between the two side plates 7, a pull ring 11 is fixedly mounted in the middle of the upper surface of the upper top plate 10, and an elastic soft layer 12 is fixedly mounted on the lower surface of the upper top plate 10.
Wherein, cooling circulation pipe 4 is snakelike formula of turning back and hugs closely in printed circuit board 2's lower surface, injects oil cooling liquid in cooling circulation pump 3 and the cooling circulation pipe 4, moves some coolants in cooling circulation pump 3 and the cooling circulation pipe 4 through cooling circulation pump 3 pump and carries out the circulation flow to the repetition after the drive cooling treatment carries out heat exchange with the contact of printed circuit board 2 lower surface, improves this printed circuit board's radiating effect.
Wherein, the quantity of heat conduction stick 5 is a plurality of and intensive respectively at 1 top movable mounting of outer frame body, the bottom of heat conduction stick 5 is fixed mounting respectively has heat conduction silica gel piece and the lower surface of heat conduction silica gel piece is attached with the surface smoothness and pastes the paper layer, a plurality of heat conduction sticks 5 can reciprocate different distances respectively at the top of outer frame body 1 like this, its distance can be according to the high decision of welded electrical components on the printed circuit board 2 of inside, make every electrical components top all attached with heat conduction silica gel and can not bond, thereby make the heat dispersion of every electrical components reach maximum efficiency, and then embody the efficient heat dispersion of this printed circuit board.
Wherein, heat conduction stick 5 runs through neat whole 6 swing joint of board, the top of heat conduction stick 5 has spacing ring and the diameter of this ring to be greater than the diameter of the straight pole portion of heat conduction stick 5, it is friction contact between the straight pole portion of heat conduction stick 5 and outer frame body 1 and neat board 6, can dismantle like this when needs, can drive neat whole board 6 rebound through upwards pulling up pulling handle 9, can drive heat conduction stick 5 rebound at this in-process, and can reach all top subsides of heat conduction stick 5 in the upper surface of neat whole board 6 and the bottom of heat conduction stick 5 can be pasted in outer frame body 1 inner wall upper surface at final, thereby pull up all heat conduction sticks 5 that are used for the heat dissipation, be convenient for to dismantle or overhaul work such as to it, embody the device's practicality.
Wherein, the soft layer 12 of elasticity is the soft and very big sponge material of scalability scope of texture, can install in outer framework 1 like this and press roof 10 through pushing down after the new printed circuit board, thereby drive all heat conduction stick 5 and move down, can stop to continue to move when the lower surface of heat conduction stick 5 contacts printed circuit board or its surperficial electrical components, the soft layer 12 of elasticity that can compress when continuing to press like this continues to take place compression deformation, accomplish the arrangement to the heat radiation structure promptly until all 5 lower surfaces of heat conduction stick all contact printed circuit board, and a plurality of intensive distribution's heat conduction stick 5 can greatly increased the device to the heat radiating area of printed circuit board, thereby improve printed circuit board's radiating effect greatly.
The working principle is as follows: during the use, install printed circuit board 2 in outer frame 1, hold pull ring 11 and push down roof 10, it can drive elasticity soft layer 12 together and push down heat conduction stick 5 to go up roof 10, stop pushing down when pushing down even printed circuit board 2 upper surface contact of all heat conduction stick 5 lower surfaces, pull up roof 10 again to the highest point, start cooling circulation pump 3 when printed circuit board 2 uses, the heat that produces on printed circuit board 2 partly can be absorbed by the circulating cooling liquid of bottom and fall and dispel the heat, another part is then absorbed through the heat conduction silica gel piece of heat conduction stick 5 bottom and then conduct the straight pole portion of heat conduction stick 5 fast and carry out heat-conduction towards the low temperature district at top by the high temperature district of bottom, thereby realize the high-efficient heat dissipation to the heat that produces on printed circuit board 2.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Also in the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and for simplicity of description, and do not indicate or imply that the equipment or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. In addition, in the drawings of the present invention, the filling pattern is only for distinguishing the pattern layer, and is not limited to any other pattern.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a high-efficient heat dissipation printed circuit board, includes outer frame body (1), its characterized in that: the inner part of the outer frame body (1) is fixedly provided with a printed circuit board (2), the middle part of the lower surface of the inner wall of the outer frame body (1) is fixedly provided with a cooling circulating pump (3), two ends of the cooling circulating pump (3) are fixedly connected with a cooling circulating pipe (4), the top end of the outer frame body (1) is movably connected with a heat conducting rod (5), the top end of the outer surface of the outer frame body (1) is movably connected with a leveling plate (6), two sides of the upper surface of the leveling plate (6) are respectively and fixedly provided with a side plate (7), two opposite surfaces of the side plates (7) are respectively provided with a sliding groove (8), two ends of the leveling plate (6) are respectively and fixedly provided with a pulling handle (9), an upper top plate (10) is movably connected in the sliding groove (8) between the two side plates (7), and a pull ring (11) is fixedly arranged in the middle part of the upper surface of the upper top plate (10), and an elastic soft layer (12) is fixedly arranged on the lower surface of the upper top plate (10).
2. A high efficiency heat dissipating printed circuit board as claimed in claim 1, wherein: the cooling circulation pipe (4) is in a snake-shaped turn-back type and is tightly attached to the lower surface of the printed circuit board (2), and oil cooling liquid is injected into the cooling circulation pump (3) and the cooling circulation pipe (4).
3. A high efficiency heat dissipating printed circuit board as claimed in claim 1, wherein: the quantity of heat conduction stick (5) is a plurality of and intensive respectively at outer framework (1) top movable mounting, the bottom of heat conduction stick (5) is fixed mounting respectively has heat conduction silica gel piece and the lower surface of heat conduction silica gel piece is attached to have the smooth wainscot layer in surface.
4. A high efficiency heat dissipating printed circuit board as claimed in claim 1, wherein: the heat conducting rod (5) penetrates through the leveling plate (6) to be movably connected, a limiting circular ring is arranged at the top end of the heat conducting rod (5), the diameter of the circular ring is larger than that of a straight rod part of the heat conducting rod (5), and the straight rod part of the heat conducting rod (5) is in friction contact with the outer frame body (1) and the leveling plate (6).
5. A high efficiency heat dissipating printed circuit board as claimed in claim 1, wherein: the flexible soft layer (12) is a sponge material which is soft in texture and has a very large scalability range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121349324.8U CN214800034U (en) | 2021-06-17 | 2021-06-17 | High-efficient heat dissipation printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121349324.8U CN214800034U (en) | 2021-06-17 | 2021-06-17 | High-efficient heat dissipation printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214800034U true CN214800034U (en) | 2021-11-19 |
Family
ID=78713205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121349324.8U Expired - Fee Related CN214800034U (en) | 2021-06-17 | 2021-06-17 | High-efficient heat dissipation printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214800034U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114786392A (en) * | 2022-05-16 | 2022-07-22 | 深圳市润达通电子有限公司 | Prevent rupture PCBA mainboard that has heat dissipation circulation function |
-
2021
- 2021-06-17 CN CN202121349324.8U patent/CN214800034U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114786392A (en) * | 2022-05-16 | 2022-07-22 | 深圳市润达通电子有限公司 | Prevent rupture PCBA mainboard that has heat dissipation circulation function |
| CN114786392B (en) * | 2022-05-16 | 2024-01-26 | 深圳市润达通电子有限公司 | Prevent PCBA mainboard that breaks has heat dissipation circulation function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211119 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |